What is claimed is:
1. A collapsible container, comprising:
a cylindrical sidewall formed of a flexible material, the sidewall having an upper end adjacent a top of the container and a lower end adjacent a bottom of the container;
a coil spring biasing the container to an expanded configuration, the coil spring having a top coil adjacent the top of the container and a bottom coil adjacent the bottom of the container;
a durable bottom layer secured to the bottom of the container by stitching.
2. The container of claim 1, wherein the flexible sidewall material is a fabric.
3. The container of claim 2, wherein the fabric is coated or impregnated with a plastic.
4. The container of claim 2, wherein the fabric is vinyl coated scrim.
5. The container of claim 1, wherein the coil spring extends around an outer surface of the flexible sidewall material.
6. The container of claim 5, wherein the coil spring is secured to the outer surface of the flexible sidewall material by one or more strips of material sewn to the flexible sidewall material with the spring positioned between the flexible sidewall material and the one or more strips.
7. The container of claim 8, wherein the strips of material are a woven fabric.
8. The container of claim 1, wherein the durable bottom layer is a fabric layer which is relatively inflexible compared to the flexible sidewall material.
9. The container of claim 1, wherein the durable bottom layer has a thickness of between about 0.01 and 0.02 inches.
10. The container of claim 1, wherein the durable bottom layer is a plastic material.
11. The container of claim 10, wherein the plastic material is selected from polystyrene or polypropylene.
12. The container of claim 1, wherein the durable bottom layer includes one or more drainage holes.
13. The container of claim 1, further including means for maintaining the container in the closed configuration.
14. The container of claim 13, wherein the maintaining means comprises fabric loops and T-straps, or a hook.
15. The container of claim 1, wherein the durable bottom layer has a thickness of between about 0.05 to 0.20 inches.
16. The container of claim 1, wherein the stitches comprises at least one line of stitches that substantially circumscribes the bottom of the container at a location substantially underlying the bottom coil.
17. The container of claim 1, wherein the bottom coil is captured between an outer surface of the flexible sidewall material and an inner surface of a bottom strip of material sewn to the flexible sidewall material, and wherein the stitching used for securing the durable bottom layer to the bottom of the container affixes the durable bottom layer to the bottom strip of material.
18. A collapsible container having an expanded configuration and a collapsed configuration, comprising:
a sidewall formed of a flexible material, the sidewall having an upper end adjacent a top of the container and a lower end adjacent a bottom of the container;
a coil spring biasing the container to the expanded configuration, the coil spring having a top coil adjacent the top of the container and a bottom coil adjacent the bottom of the container;
a durable bottom layer for protecting the bottom of the container; and
at least one line of stitches for securing the durable bottom layer to the bottom of the container.
19. The container of claim 19, wherein the durable bottom layer includes one or more drainage holes.
20. The container of claim 19, wherein the durable bottom layer has a thickness of between about 0.01 and 0.02 inches.
21. The container of claim 19, wherein the bottom coil is captured between an outer surface of the flexible sidewall material and an inner surface of a bottom strip of material sewn to the flexible sidewall material, and wherein the at least one line of stitches affixes the durable bottom layer to the bottom strip of material.
22. A collapsible container having an expanded configuration and a collapsed configuration, comprising:
a cylindrical sidewall formed of a flexible material, the sidewall having an upper end adjacent a top of the container and a lower end adjacent a bottom of the container, the sidewall being collapsible and expandable along an axis extending between the top and the bottom of the container; and
a durable plastic layer secured to the bottom of the container by stitches.
23. The container of claim 23, wherein the durable plastic layer includes one or more drainage holes.
24. The container of claim 23, wherein the durable plastic layer has a thickness of between about 0.01 and 0.02 inches.
25. The container of claim 23, wherein the bottom coil is captured between an outer surface of the flexible sidewall material and an inner surface of a bottom strip of material sewn to the flexible sidewall material, and wherein the stitches used for securing the durable bottom layer to the bottom of the container affixes the durable plastic layer to the bottom strip of material.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A microelectronic package, comprising:
a first semiconductor chip;
a fluid-carrying cooling tube disposed in proximity to a first surface of said first semiconductor chip;
a thermally conductive bonding material directly electrically interconnecting said cooling tube and the first surface of said first semiconductor chip, mechanically and thermally bonding said cooling tube to said first surface; and
a plastic encapsulant molded over said first semiconductor chip and portions of said cooling tube in proximity to said chip.
2. The microelectronic package of claim 1, wherein said cooling tube is copper and said thermally conductive bonding material is indium solder.
3. A microelectronic package, comprising:
a first semiconductor chip;
a fluid-carrying cooling tube disposed in proximity to a first surface of said first semiconductor chip;
a thermally conductive bonding material disposed between said cooling tube and the first surface of said first semiconductor chip, thermally bonding said cooling tube to said first surface; and
a plastic encapsulant molded over said first semiconductor chip and portions of said cooling tube in proximity to said chip,
wherein said first surface of said first semiconductor chip is an active surface, and said cooling tube is utilized as an electrical terminal of said first semiconductor chip.
4. A microelectronic package, comprising:
a first semiconductor chip;
a fluid-carrying cooling tube disposed in proximity to a first surface of said first semiconductor chip;
a thermally conductive bonding material disposed between said cooling tube and the first surface of said first semiconductor chip, thermally bonding said cooling tube to said first surface; and
a plastic encapsulant molded over said first semiconductor chip and portions of said cooling tube in proximity to said chip,
wherein said first surface of said first semiconductor chip is an active surface, and said microelectronic package comprises:
a shunt element disposed adjacent said semiconductor chip and electrically coupled to said cooling tube to form an electrical circuit including said first surface, said cooling tube and said shunt element.
5. The microelectronic package of claim 4, where said shunt element is a copper slug soldered to said cooling tube and to a terminal of said package.
6. A microelectronic package, comprising:
a first semiconductor chip;
a fluid-carrying cooling tube disposed in proximity to a first surface of said first semiconductor chip;
a thermally conductive bonding material disposed between said cooling tube and the first surface of said first semiconductor chip, thermally bonding said cooling tube to said first surface; and
a plastic encapsulant molded over said first semiconductor chip and portions of said cooling tube in proximity to said chip,
wherein said first surface of said first semiconductor chip is an active surface, and said microelectronic package further comprises:
a second semiconductor chip having a first active surface; and
said fluid-carrying cooling tube includes a first electrically conductive segment thermally bonded to the first surface of said first semiconductor chip, a second electrically conductive segment thermally bonded to the first surface of said second semiconductor chip, and an electrically non-conductive joint coupling said first and second segments to permit fluid transfer therebetween while providing electrical isolation between said first and second semiconductor chips.
7. The microelectronic package of claim 6, wherein said joint is a thermoplastic tube.
8. The microelectronic package of claim 6, wherein said joint is a void in said encapsulant between said first and second electrically conductive segments.