1-52. (canceled)
53. Method for the in-register arrangement of at least two printing plates (73) on at least two plate cylinders (07) of a printing press (01) to each other, where the printing press (01) has at least one printing unit (02), which has at least one transfer cylinder (06) in the contact area of which a print gap (16) is established with a further cylinder and where the at least one transfer cylinder (06) is in contact with a plurality of plate cylinders (07) and where in dependence on at least one print image printed on a print substrate (09) adjustments for at least one temperature of at least one printing plate (73) arranged on at least one of the at least two plate cylinders (07) andor at least one cylinder barrel (12) of the at least one plate cylinder (07) andor at least one temperature control means interacting with this printing plate (73) andor this at least one plate cylinder (07) are determined and the at least one temperature of this at least one printing plate (73) andor this at least one cylinder barrel (12) andor this at least one temperature control means is changed in accordance with the adjustments and where the at least one plate cylinder (07) has at least one channel (13), in which is arranged at least one tensioning device (101), which contains at least one front clamping device (21), in which a front end (74) of a respective printing plate (73) is clamped and has at least one rear clamping device (61), in which a rear end (76) of this respective printing plate (73) is clamped and where at least one register pattern (151) of the print substrate (09) is recorded and in dependence thereon adjustments for at least one adjusting element (39; 41; 131; 144) of the at least one tensioning device (101) are determined, where the at least one adjusting element (39; 41) of the at least one tensioning device (101) is designed as at least one front contact body (39; 41), by means of which a distance of the at least one front clamping device (21) from the first channel (18) of the at least one channel (13) is adjustable andor is designed as at least one rear spacer (131), by means of which a distance of the at least one rear clamping device (61) from the second channel wall (19) of the at least one channel (13) is adjustable andor is designed as at least one axial drive (144), by means of which a position of the at least one rear clamping device (61) is adjustable with respect to the axial direction (A) parallel to an axis of rotation (11) of the respective plate cylinder (07).
54. Method according to claim 53, characterized in that the at least one temperature of this at least one printing plate (73) andor this at least one cylinder barrel (12) andor this at least one temperature control means is changed according to the adjustments in such a way that thereafter at least one image form element arranged on the at least one printing plate (73) and at least one image form element arranged on another of the at least two printing plates (73) are found in a specified relative position to one another at least with respect to an axial direction (A) relative to at least one plate cylinder (07).
55. Method according to claim 54, characterized in that this relative position to one another based at least on the axial direction (A) is specified independently of a recording of the at least one print image applied to the print substrate (09) andor that this relative position to one another at least with regard to the axial direction (A) is already specified before a recording of the at least one print image applied to the print substrate (09).
56. Method according to claim 53, characterized in that the at least one image form element arranged on the at least one printing plate (73) and the at least one image form element arranged on the other of the at least two printing plates (73) are found in the specified relative position to one another only after the change of the at least one temperature of this at least one printing plate (73) andor this at least one cylinder barrel (12) andor this at least one temperature control means at least with respect to the axial direction (A) relative to the at least one plate cylinder (07).
57. Method according to claim 53, characterized in that in an inspection process the at least one print image printed on the print substrate (09) is recorded and in dependence thereon in an evaluation process the adjustments for the at least one temperature of the at least one printing plate (73) arranged on the at least one plate cylinder (07) andor of the at least one cylinder barrel (12) of the at least one plate cylinder (07) andor of the at least one temperature control means interacting with this printing plate (73) andor this at least one plate cylinder (07) are determined and in an adjustment process the at least one temperature of this at least one printing plate (73) andor this at least one cylinder barrel (12) andor this at least one temperature control means is changed in accordance with the adjustments.
58. Method according to claim 53, characterized in that on the print substrate (09) is printed at least one print image, which in each case has at least two reference elements (152), which originate from different printing plates (73) and in that in an inspection process actual positions of all reference elements (152) of the at least one print image are recorded.
59. Method according to claim 53, characterized in that in at least one sample printing operation at least two print images are printed on the print substrate (09), which in each case contain at least two reference elements (152) originating from at least two different printing plates (73) andor that in at least one sample printing operation at least two register patterns (151) are printed on the print substrate (09), which are composed in each case of at least two reference elements (152) originating from at least two different printing plates (73).
60. Method according to claim 53, characterized in that at least two print images spaced from one another transverse to a transport direction of the print substrate (09) andor parts of at least one print image andor at least two print images andor parts at least of one print image spaced from one another along the transport direction andor parts at least of one print image are recorded in an inspection process and processed in an evaluation process.
61. Method according to claim 53, characterized in that at least two register patterns (151) spaced from one another transverse to a transport direction of the print substrate (09) andor at least two register patterns (151) spaced from one another along the transport direction are recorded in an inspection operation and are processed in an evaluation process.
62. Method according to claim 53, characterized in that at least a temperature of at least a further printing plate (73) andor at least a temperature of at least a cylinder barrel (12) of a further plate cylinder (07) andor at least a temperature of at least a temperature control means of another plate cylinder (07) andor an ambient temperature of the printing press (01) andor a temperature of the print substrate (09) equilibrates in the determination of the adjustments for the at least one temperature of the at least one printing plate (73) andor of the at least one cylinder barrel (12) andor of the at least one temperature control means.
63. Method according to claim 53, characterized in that at least two print images andor parts of print images are recorded, which in each case have at least one reference element (152) originating from an identical printing plate (73) andor that at least two register patterns (151) are recorded, which in each case have at least one reference element (152) originating from an identical printing plate (73).
64. Method according to claim 57, characterized in that in the adaptation process a tension within the at least one printing plate (73) is maintained unchanged with respect to a circumferential direction (D).
65. System for register control, where the system has at least one printing press (01), at least one machine control of the at least one printing press (01) and at least one data input of the machine control for the recording of register data of a print image printed on a print substrate on at least one printing plate (73) of the printing press (01) and where the printing press (01) has at least one printing unit (02) which has at least one transfer cylinder (06), in the contact area of which with a further cylinder a print gap (16) is established and where at least one transfer cylinder (06) is in contact with a plurality of plate cylinders (07) and where the system has at least one temperature control system connected by circuitry to the machine control, by means of which at least one temperature of the at least one printing plate (73) arranged on at least one of the plate cylinders (07) of the printing press (01) andor at least a cylinder barrel (12) of the at least one plate cylinder (07) andor at least a temperature control means interacting with the at least one printing plate (73) andor this at least one plate cylinder (07) is controllable andor regulable in dependence on the register data recorded and where in at least one channel (13) of the at least one plate cylinder (07) is arranged at least one tensioning device (101) of the plate cylinder (07), which has at least one front clamping device (21) and at least one rear clamping device (61) and
where at least one adjusting element (39; 41) of the at least one tensioning device (101) is designed as at least one front contact body (39; 41), by means of which a distance of the at least one front clamping device (21) from the first channel wall (18) of the at least one channel (13) is adjustable andor
where at least one adjusting element (144) of the at least one tensioning device (101) is designed as at least one axial drive (144), by means of which a position of the at least one rear clamping device (61) with respect to the axial direction (A) parallel to an axis of rotation (11) of the respective plate cylinder (07) is adjustable andor
where the at least one rear clamping device (61) is part at least of a slot (102) of the at least one tensioning device (101) and the at least one slot (102) is arranged to be movable by means of at least one tensioning drive (104) within the at least one channel (13) along a tensioning path to the at least one front clamping device (21) and at least one adjusting element (131) of the at least one tensioning device (101) is designed as at least one rear spacer (131), by means of which a distance of the at least one rear clamping device (61) from a second the channel wall (19) of the at least one channel (13) is adjustable.
66. System according to claim 65, characterized in that the printing press (01) has at least one printing unit (02), which has at least a pair of transfer cylinders (06), by means of which common contact area a print gap (16) is established.
67. System according to claim 66, characterized in that each of the at least two transfer cylinders (06) is in contact with a plurality of plate cylinders (07).
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor apparatus, comprising:
a substrate;
a plurality of transistor devices formed on the substrate, each transistor device including a control terminal being inputted with a control signal and first and second terminals through which a current flows according to the control signal; and
a plurality of substrate conductive portions each formed in a region different from a region where the plurality of transistor devices are formed therein, each of the plurality of substrate conductive portions connecting the substrate through a ballast resistor,
wherein the plurality of transistor devices are connected to the plurality of substrate conductive portions,
wherein each of the plurality of substrate conductive portions includes a semiconductor layer separated from other substrate conductive portions by a Deep Trench Isolation device, and
wherein the semiconductor layer has a same conductivity type as the substrate.
2. The semiconductor apparatus according to claim 1, wherein the plurality of substrate conductive portions comprise low resistance layers having resistances lower than the separated semiconductor layer.
3. The semiconductor apparatus according to claim 2, wherein each of the low resistance layers is placed between each of the plurality of substrate conductive portions.
4. The semiconductor apparatus according to claim 3, wherein the separated semiconductor layer is an upper layer with respect to said each of the low resistance layers.
5. The semiconductor apparatus according to claim 4, wherein each of the plurality of substrate conductive portions comprises an electrode portion connected by the first terminal and a conductive layer, and
wherein each of the separated semiconductor layers contacts the electrode portion.
6. The semiconductor apparatus according to claim 5, wherein the electrode portion comprises a polysilicon layer contacting each of the separated semiconductor layers.
7. The semiconductor apparatus according to claim 6, wherein the electrode portion comprises an external electrode placed on the polysilicon layer, and
wherein an area at which the external electrode contacts the polysilicon layer is horizontally shifted with respect to an area at which the polysilicon layer contacts said each of said plurality of die substrate conductive portions.
8. The semiconductor apparatus according to claim 7, wherein the semiconductor substrate is connected to ground.
9. The semiconductor apparatus according to claim 7, wherein unit devices as a part of die semiconductor apparatus are multi-cell.
10. The semiconductor device according to claim 1, wherein each of the plurality of substrate conductive portions comprises an electrode portion connected by the first terminal and a conductor layers, and
wherein each of the separated semiconductor layer contacts the electrode portion.
11. The semiconductor apparatus according to claim 10, wherein the electrode portion comprises a polysilicon layer contacting each of the separated semiconductor layers.
12. The semiconductor apparatus according to claim 11, wherein the electrode portion comprises an external electrode placed on the polysilicon layer, and
wherein art area at which the external electrode contacts the polysilicon layer is horizontally shifted with respect to an area at which the polysilicon layer contacts said each of said plurality of the substrate conductive portions.
13. The semiconductor apparatus according to claim 1, wherein the semiconductor substrate is connected to ground.
14. The semiconductor apparatus according to claim 1, wherein unit devices as a part of the semiconductor apparatus are multi-cell.
15. The semiconductor apparatus according to claim 1,
wherein
said plurality of transistor devices comprise bipolar transistor devices,
wherein the control terminal, the first terminal, and the second terminal are a base terminal, an emitter terminal, and a collector terminal, respectively, and
wherein the emitter terminal is connected to the substrate conductive portion.
16. The semiconductor apparatus according to claim 1, wherein said semiconductor layer is other than being in direct contact with said substrate.
17. A semiconductor apparatus comprising:
a substrate;
a plurality of transistor devices formed on the substrate, each transistor device including a control terminal being inputted with a control signal and first and second terminals through which a current flows according to the control signal;
a plurality of substrate conductive portions each formed in a region different from a region where the plurality of transistor devices are formed therein, each of the plurality of substrate conductive portions connecting the substrate through a ballast resistor;
a plurality of polysilicon layers contacting the substrate conductive portions; and
external electrodes placed on the polysilicon layers,
wherein the plurality of transistor devices are connected to the different external electrodes, and
wherein an area at which the external electrode contacts the polysilicon layer is horizontally shifted with respect to an area at which the polysilicon layer contacts each of said plurality of the substrate conductive portions.
18. The semiconductor apparatus according to claim 17, wherein the semiconductor substrate is connected to ground.
19. The semiconductor apparatus according to claim 17, wherein unit devices as a part of the semiconductor apparatus are multi-cell.
20. The semiconductor apparatus according to claim 17, wherein each of the plurality of substrate conductive portions includes a semiconductor layer separated from other substrate conductive portions by a Deep Trench Isolation device.