1. A method of manufacturing an optical data carrier, comprising:
providing an essentially uncured resin layer on a side of said optical data carrier;
embossing said essentially uncured resin layer with a relief pattern, wherein said relief pattern defines a graphic.
2. The method according to claim 1, wherein a stamper is used for embossing, and wherein said stamper is removed after a start of a curing process of said essentially uncured resin layer.
3. The method according to claim 1, wherein a stamper is used for embossing, the stamper being pressed onto the uncured resin layer with a force in the range of 0.45 Ncm2 to 17.70 Ncm2.
4. The method according to claim 1, wherein a stamper is used for embossing, and wherein said stamper is removed a predefined time period before starting a curing process of said essentially uncured resin layer.
5. The method according to claim 1, wherein said side is opposite of a readingwriting side of said optical data carrier.
6. The method according to claim 5, wherein, while embossing, said readingwriting side is placed on a transparent carrier, and said curing process comprises applying UV light to said essentially uncured resin layer through said transparent carrier.
7. The method according to claim 1, wherein a stamper is used for embossing, and a pressure applied onto said stamper for embossing depends on a viscosity of said essentially uncured resin layer.
8. The method according to claim 1, wherein said optical data carrier is disc shaped.
9. The method according to claim 1, wherein a further resin layer is provided on a lower layer of said optical data carrier, said further resin layer being sandwiched between said lower layer and said essentially uncured resin layer, wherein said essentially uncured resin layer, said further resin layer, and said lower layer comprises a first, second, and third material, respectively, wherein a first adhesion force between said first and second material and a second adhesion force between said second and third material are larger than a third adhesion force between said first and third material.
10. The method according to claim 1, wherein said embossing is at least partly performed in a vacuum.
11. A method of manufacturing an optical data carrier, comprising:
providing an essentially uncured resin layer on a side of said optical data carrier;
embossing said essentially uncured resin layer with a relief pattern, wherein said relief pattern defines a graphic; and
wherein a stamper is used for embossing, the stamper being pressed onto the uncured resin layer with a force in the range of 0.45 Ncm2 to 17.70 Ncm2.
12. An optical data carrier comprising:
a resin layer with an embossed relief pattern, wherein said embossed relief pattern defines a graphic, and wherein a first level of molecular stress of said resin layer is below a second level of molecular stress that occurs when embossing a cured resin layer with a relief pattern.
13. The optical data carrier according to claim 12, wherein said resin layer is provided on further layers of said optical data carrier, said further layers having respective third levels of molecular stresses which are respectively lower than respective molecular stresses that occur within said further layers when embossing a cured resin layer with a relief pattern thereby applying a force to said further layers causing said respective molecular stresses.
14. The optical data carrier according to claim 12, wherein said resin layer has no undesired embossing artifacts that would occur if said resin layer were embossed with said relief pattern in a cured state.
15. The optical data carrier according to claim 12, wherein a further resin layer is sandwiched between said resin layer and a lower layer, wherein said resin layer, said further resin layer, and said lower layer comprise a first, second, and third material, respectively, wherein a first adhesion force between said first and second material and a second adhesion force between said second and third material are larger than a third adhesion force between said first and third material.
16. An optical data carrier comprising:
a resin layer with an embossed relief pattern, wherein said embossed relief pattern defines a graphic, and wherein a first level of molecular stress of said resin layer is below a second level of molecular stress that occurs when embossing a cured resin layer with a relief pattern under high pressure of 88.6 Ncm2 or more.
17. An apparatus, comprising:
a support member having a first side adapted to support an optical data carrier, said support member being made of a transparent material;
a stamper comprising a relief pattern defining a graphic, wherein said stamper is adapted to emboss an essentially uncured resin layer of said optical data carrier with said relief pattern; and
a light source located on a second side of said support member and adapted to provide curing light, wherein said second side is opposite of said first side and said curing light passes through said support member.
18. The apparatus according to claim 17, wherein said light source is adapted to provide said curing light while said stamper is in an embossing position in which said stamper is in contact with said essentially uncured resin layer.
19. The apparatus according to claim 17, wherein said stamper is adapted to be removed a predefined time period before starting a curing process of said essentially uncured resin layer.
20. The apparatus according to claim 17, wherein a pressure applied by said stamper for embossing depends on a viscosity of said essentially uncured resin layer.
21. The apparatus according to claim 17, comprising means for providing said essentially uncured resin layer on said optical data carrier.
22. The apparatus according to claim 21, comprising means for providing a further resin layer on a lower layer of said optical data carrier, said further resin layer being sandwiched between said lower layer and said essentially uncured resin layer, wherein said essentially uncured resin layer, said further resin layer, and said lower layer comprise a first, second, and third material, respectively, wherein a first adhesion force between said first and second material and a second adhesion force between said second and third material are larger than a third adhesion force between said first and third material.
23. The apparatus according to claim 17, comprising a vacuum chamber adapted to provide a vacuum at least between said stamper and said essentially uncured resin layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An anti-tip device, especially for information technology cabinets, having a support rail comprising a foot area for support on a floor surface, wherein
the support rail comprises a displacement area which can be displaced along a guide rail,
the support rail can be adjusted between a support position, in which the support rail is moved out at an angle to the guide rail, and a withdrawn position, in which the support rail is pivoted in towards the guide rail, and
the support rail can be fixed in the support position, wherein
two support struts are provided which are hinged to the guide rail and to the support rail,
a receiving area for receiving the support rail is formed between the support struts,
in the withdrawn position the support struts are arranged to the side of the support rail, and
the displacement area of the support rail comprises a detent device for fixing the support rail on the guide rail.
2. The anti-tip device according to claim 1, wherein
the support rail is received in the withdrawn position in the guide rail.
3. The anti-tip device according to claim 1, wherein
the displacement area comprises a sliding block which is hinged to the support rail, and
the sliding block is displaceably guided on the guide rail.
4. The anti-tip device according to claim 3, wherein
a detent device is provided, by means of which the sliding block can be fixed on the guide rail.
5. The anti-tip device according to claim 1, wherein
the support struts are hinged to the support rail approximately centrally between the foot area and displacement area.
6. The anti-tip device according to claim 1, wherein
the support struts have a length which corresponds essentially to half the length of the support rail.
7. The anti-tip device according to claim 1, wherein
the support struts are orientated essentially at a right angle to the guide rail in the support position.
8. The anti-tip device according to claim 1, wherein
the guide rail comprises a guide area and a receiving area,
the support rail is displaceably guided in the guide area, and
the receiving area is designed to receive the support struts.
9. The anti-tip device according to claim 8, wherein
the guide area has an essentially C-shaped cross-section and the receiving area has an essentially U-shaped cross-section.
10. A cabinet, wherein
an anti-tip device is arranged according to claim 1.
11. The cabinet according to claim 10, wherein
the guide rail is arranged on a vertical beam, in particular on the front side, of the cabinet.
12. The cabinet according to claim 10, wherein
the guide rail is arranged in a depression of a vertical beam of the cabinet.
13. The cabinet according to claim 10, wherein
at least two anti-tip devices are provided.