1. A method for receiving and processing data to provide executable content to portions of a facsimile document comprising:
receiving data using a facsimile reception protocol, said received data having one or more portions associated with virtual machine instruction code;
identifying the portions of the received facsimile data associated with the virtual machine instruction code;
using the received facsimile data to acquire the associated virtual machine instruction code;
displaying the received facsimile data;
executing the virtual machine instruction code in connection with the portion of the displayed facsimile data associated therewith;
acquiring scripting language instruction code, and
using the scripting language instruction code in connection with the facsimile data.
2. An apparatus for receiving and processing data to provide executable content to portions of a facsimile document comprising:
means for receiving data using a facsimile reception protocol, said received data having one or more portions associated with virtual machine instruction code;
means for identifying the portions of the received facsimile data associated with the virtual machine instruction code;
means for using the received facsimile data to acquire the associated virtual machine instruction code;
means for displaying the received facsimile data;
means for executing the virtual machine instruction code in connection with the portion of the displayed facsimile data associated therewith;
means for acquiring scripting language instruction code, and
means for using the scripting language instruction code in connection with the facsimile data.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A heat dissipation package structure, comprising:
a chip carrier;
a semiconductor chip having an active surface and a relative inactive surface, the semiconductor chip being mounted on and electrically connected to the chip carrier through the active surface;
a heat dissipation member having a heat dissipation section, a supporting section extending downward from the heat dissipation section, and an opening formed in the heat dissipation section, wherein, the heat dissipation member is supported on the chip carrier through the supporting section, the semiconductor chip is received in the space formed by the heat dissipation section and the supporting section, and top surface of the heat dissipation section is flush with the inactive surface of the semiconductor chip; and
an encapsulant formed on the chip carrier for encapsulating the semiconductor chip and the heat dissipation member, the inactive surface of the semiconductor chip and the top surface of the heat dissipation section being exposed from the encapsulant.
2. The heat dissipation package structure of claim 1, wherein, the chip carrier is one of a substrate and a leadframe.
3. The heat dissipation package structure of claim 1, wherein, the chip carrier is one of a ball grid array (BGA) substrate and a land grid array (LGA) substrate.
4. The heat dissipation package structure of claim 1, wherein the semiconductor chip is electrically connected to the chip carrier through the active surface via a plurality of conductive bumps.
5. The heat dissipation package structure of claim 1, wherein, size of the opening of the heat dissipation section is greater than planar size of the semiconductor chip.
6. The heat dissipation package structure of claim 1 further comprising a passivation layer formed on the top surface of the heat dissipation section exposed from the encapsulant.
7. The heat dissipation package structure of claim 6, wherein, the passivation layer is made of ink.