1. A cooling apparatus for cooling a plurality of electronic devices mounted on a circuit board, comprising a plurality of thermal conductors mounted on the electronic devices and formed with thermal conductive fins, a housing formed with fins fitted with the fins of the thermal conductors, and cooling means mounted on the housing for removing heat from the electronic devices, wherein a plane heat pipe is formed in the housing.
2. A cooling apparatus for cooling a plurality of electronic devices mounted on a circuit board, comprising a plurality of thermal conductors mounted on the electronic devices and formed with heat conductive fins, a housing having fins fitted with the fins of the thermal conductors, a heat pipe embedded in a recess in an upper part of the housing, and cooling means mounted on the heat pipe, for removing heat from the electronic devices.
3. A cooling apparatus as set forth in claim 1, wherein the cooling means for removing heat from the electronic devices is a heat sink or a water cooling jacket.
4. A cooling apparatus as set forth in claim 2, wherein the cooling means for removing heat from the electronic devices is a heat sink or a water cooling jacket.
5. A cooling apparatus as set forth in claim 1, wherein a heat conductive medium is interposed between the electronic devices and the thermal conductors andor between the thermal conductive fins of the thermal conductors and the fins formed on the housing.
6. A cooling apparatus as set forth in claim 2, wherein a heat conductive medium is interposed between the electronic devices and the thermal conductors andor between the thermal conductive fins of the thermal conductors and the fins formed on the housing.
7. A cooling apparatus as set forth in claim 3, wherein a heat conductive medium is interposed between the electronic devices and the thermal conductors andor between the thermal conductive fins of the thermal conductors and the fins formed on the housing.
8. A cooling apparatus as set forth in claim 4, wherein a heat conductive medium is interposed between the electronic devices and the thermal conductors andor between the thermal conductive fins of the thermal conductors and the fins formed on the housing.
9. A cooling apparatus as set forth in claim 2, wherein the heat pipe embedded in the recess in the upper part of the housing is a plane heat-pipe.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. The electronic component comprising:
a first electrode conductor section formed of the non-photosensitive conductive paste on a surface connected with a principal surface, an end portion at the principal surface side being made taper shape; and
a second electrode conductor section having the photosensitive conductive paste exposed and developed on said principal surface;
wherein the end portion of the first electrode conductor section having a taper shape is overlapped at least a part of the second electrode conductor.
2. The electronic component according to claim 1, wherein the first electrode conductor section formed of said non-photosensitive conductive paste constitutes an end face electrode or a side face electrode on an end face or a side face of said component.
3. The electronic component according to claim 1, wherein said surface connecting with said principal surface has a taper connection face, and the second electrode conductor formed by said photosensitive conductive extends from said principal plane to said taper connection face to overlap each other.
4. An electronic component comprising:
a first electrode conductor section formed of said non-photosensitive conductive paste on a principal surface; and
a second electrode conductor having said photosensitive conductive paste exposed and developed, and being at least partly overlapped on said first electrode conductor,
wherein contours of the overlapped areas of both first and second electrode conductor sections being coincident.
5. The electronic component according to claim 4, wherein the contours of the overlapped areas of both electrode conductor sections are coincident and constitute the bumps.
6. An electronic component comprising:
a first electrode conductor section having said photosensitive conductive paste exposed and developed, by which an electrode area is defined; and
a second electrode conductor section formed of a non-photosensitive conductive paste, which is formed in the electrode area defined by said first electrode conductor section.
7. An electronic component comprising:
a dielectric block;
a first electrode conductor section having a photosensitive conductive paste exposed and developed on a principal surface of said dielectric block; and
an inner peripheral electrode conductor section formed of a non-photosensitive conductive paste on an inner peripheral face of a through hole that is opened through said principal surface,
wherein both electrode conductor sections are overlapped at least partly near an opening portion of said through hole on said principal plane to electrically conducts to make up a dielectric filter.
8. The electronic component according to any one of claims 1 to 7, wherein the electrode conductor section formed of said photosensitive conductive paste and the electrode conductor section formed of said non-photosensitive conductive paste are at least partly overlapped with each other and sintered.
9. A method for manufacturing an electronic component comprising: the steps of:
forming a first electrode conductor section of a non-photosensitive conductive pattern on a surface connected with a principal surface, an end portion at the principal surface side being made taper shape the other plane;
forming a second electrode conductor section having a photosensitive conductive paste exposed and developed on said principal surface;
wherein the end portion of the first electrode conductor section having a taper shape is overlapped at least a part of the second electrode conductor
10. The method for manufacturing the electronic component according to claim 9, said surface connecting with said principal surface has a taper connection face, and the second electrode conductor formed by said photosensitive conductive extends from said principal plane to said taper connection face to overlap each other.
11. A method for manufacturing the electronic component comprising the steps of:
forming a first electrode conductor section of a non-photosensitive conductive pattern on a principal surface;
forming a second electrode conductor section having a photosensitive conductive paste exposed and developed on said principal surface, the second electrode conductor section being at least partly overlapped on said first electrode conductor section;
patterning said first electrode conductor section of the non-photosensitive conductive paste using said second electrode conductor section as a mask.