1. A vehicle weight classification system comprising:
a seat assembly having a seat frame for supporting a seat bottom;
a seat belt assembly for securing a seat occupant to said seat assembly;
a rigid member attached to said seat belt assembly, said rigid member comprising a single-piece component having a first end for supporting a seat belt portion and a second end integrally formed with said first end for attachment to a vehicle structure;
a plurality of weight sensors mounted to said seat frame for generating a plurality of weight signals in response to a weight force applied to said seat bottom;
at least one seat belt force sensor for generating a seat belt force signal, said seat belt force sensor being mounted directly to said rigid member between said first and second ends for measuring a force exerted on said rigid member by a tension force applied to said seat belt portion;
an electronic control unit for receiving said weight signals and seat belt force signals to determine occupant weight and center of gravity, generating an occupant classification based on said occupant weight and center of gravity, and transmitting an output control signal based on said occupant classification; and
an airbag module for receiving said output control signal to control airbag deployment based on said occupant classification.
2. A system according to claim 1 wherein said seat assembly includes a seat mount for attachment to a vehicle floor and said plurality of weight sensors comprises a first sensor mounted at a front right side corner of said seat bottom between said seat frame and said seat mount, a second sensor mounted at a front left side corner of said seat bottom between said seat frame and said seat mount, a third sensor mounted at a rear right side corner of said seat bottom between said seat frame and said seat mount, and a fourth sensor mounted at a rear left side corner of said seat bottom between said seat frame and said seat mount.
3. A vehicle weight classification system comprising:
a seat assembly having a seat frame for supporting a seat bottom;
a seat belt assembly for securing a seat occupant to said seat assembly;
a rigid member comprising a single-piece component having a body portion, a first end for supporting a seat belt portion of said seat belt assembly and a second end adapted for attachment to a fixed structure wherein said first and second ends are integrally formed with said body portion;
a plurality of weight sensors mounted to said seat frame for generating a plurality of weight signals in response to a weight force applied to said seat bottom;
at least one seat belt force sensor for generating a seat belt force signal, said seat belt force sensor being mounted on said body portion of said rigid member between said first and second ends for measuring a force exerted on said rigid member by a tension force applied to said seat belt portion; and
an electronic control unit for receiving said weight signals and seat belt force signals to determine occupant weight and center of gravity, generating an occupant classification based on said occupant weight and center of gravity, and transmitting an output control signal based on said occupant classification to control airbag deployment based on said occupant classification.
4. A system according to claim 1 wherein said first end includes a first opening to receive a portion of seat belt material in a looped connection, and wherein said second end includes a second opening to receive a fastener to secure said rigid member to the vehicle structure.
5. A system according to claim 4 wherein said first and second ends are non-coplanar.
6. A system according to claim 1 wherein said first end of said rigid member extends at an oblique angle relative to said second end of said rigid member.
7. A system according to claim 1 wherein said rigid member comprises a single plate with said at least one seat belt force sensor being directly mounted to said single plate.
8. A system according to claim 7 wherein said single plate includes a narrowing neck portion to which said at least one seat belt force sensor is mounted.
9. A system according to claim 3 wherein said single-piece component comprises a single plate with said at least one seat belt force sensor being directly mounted to said single plate.
10. A system according to claim 9 wherein said single plate includes a narrowing neck portion that supports said at least one seat belt force sensor.
11. A system according to claim 9 wherein said first end of said single plate extends at an oblique angle relative to said second end of said single plate.
12. A system according to claim 1 wherein said second end is to be directly attached to the vehicle structure.
13. A system according to claim 1 wherein said rigid member has a first surface to face the vehicle structure and a second surface facing opposite said first surface, and wherein said at least one seat belt force sensor is mounted to said second surface.
14. A system according to claim 13 wherein said rigid member includes a first opening to receive said seat belt assembly and a second opening to receive a fastener for attachment to the vehicle structure, and wherein said at least one seat belt force sensor is centrally positioned on said second surface and spaced apart from said first and said second openings.
15. A system according to claim 3 wherein said second end is to be directly attached to the fixed structure.
16. A system according to claim 3 wherein said body portion has a first surface to face the fixed structure and a second surface facing opposite said first surface, and wherein said at least one seat belt force sensor is mounted to said second surface.
17. A system according to claim 16 wherein said body portion includes a first opening at said first end to receive the seat belt portion and a second opening at said second end to receive a fastener for attachment to the fixed structure, and wherein said at least one seat belt force sensor is centrally positioned on said second surface and spaced apart from said first and said second openings.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method of forming package board, comprising the steps of:
providing a substrate board;
forming a plurality of through vias in the substrate board;
forming patterned conductive line layers on the substrate board such that a plurality of ball grid pad regions on the conductive line layers is patterned by the vias; and
forming a soldering mask that covers a portion of the conductive line layers while exposing a plurality of bonding pad regions.
2. The method of claim 1, wherein the substrate board has an electroplated layer thereon.
3. The method of claim 1, wherein the step of forming the through vias includes using a mechanical punching method.
4. The method of claim 2, wherein after the formation of vias but before the formation of conductive line layers, further includes removing the electroplated layer.
5. The method of claim 4, wherein the step of removing the electroplated layer includes using a wet etching method.
6. The method of claim 1, wherein the step of forming conductive line layers on the substrate board includes the sub-steps of:
forming a glue layer over the substrate board;
attaching a conductive layer onto the glue layer; and
patterning the conductive layer to form the patterned conductive line layers.
7. The method of claim 1, wherein the step of forming the conductive line layers includes using a wet etching method.
8. The method of claim 1, wherein the step of forming the soldering mask includes using a roller coating method.
9. The method of claim 1, wherein the step of forming the soldering mask includes using a curtain coating method.
10. The method of claim 1, wherein the step of forming the soldering mask includes using a screen printing method.
11. The method of claim 1, wherein the step of forming the soldering mask includes using a dry film method.
12. The method of claim 1, wherein after the formation of the soldering mask, further includes forming an electroplated bond pad layer over the bonding pad region.
13. A method of forming package board, comprising the steps of:
providing a substrate board having a first electroplated layer over a first surface of the substrate board and a second electroplated layer over a second surface of the substrate board;
patterning the first electroplated layer and the second electroplated layer to form conductive line layers and an intermediate electroplated layer, respectively, so that a portion of the substrate board is exposed, and the intermediate electroplated layer is used to pattern out ball grid pad regions;
removing some substrate board material within the ball grid pad regions to form a plurality of ball grid pad openings that expose a portion of the conductive line layer;
removing the intermediate electroplated layer to expose the second surface of the substrate board; and
forming a soldering mask that covers a portion of the conductive line layers while exposing a plurality of bonding pad regions.
14. The method of claim 13, wherein the step of forming the conductive line layers and the intermediate electroplated layer includes conducting photolithographic and etching operations.
15. The method of claim 13, wherein the step of forming the ball grid pad openings includes using laser ablation.
16. The method of claim 13, wherein the step of removing the intermediate electroplated layer includes wet etching.
17. The method of claim 13, wherein the step of forming the soldering mask includes roller coating.
18. The method of claim 13, wherein the step of forming the soldering mask includes curtain coating.
19. The method of claim 13, wherein the step of forming the soldering mask includes screen printing.
20. The method of claim 13, wherein the step of forming the soldering mask includes using dry film.
21. The method of claim 13, wherein after the formation of the soldering mask, further includes forming an electroplated bond pad layer over the bonding pad region.
22. A package board structure, comprising:
a substrate board having a plurality of through vias, wherein the substrate board is made using glass epoxy resin or bismaleimide-triazine (BT);
a patterned conductive line layer on the substrate board that also covers the through vias; and
a soldering mask covering a portion of the conductive line layer and exposing a bonding pad region of the conductive line layer.
23. The structure of claim 22, wherein the material for forming the conductive line layer includes copper.
24. The structure of claim 22, wherein the material for forming the soldering mask includes an ultraviolet-sensitive compound.
25. The structure of claim 22, wherein the material for forming the soldering mask includes a bake-hardened compound.
26. The structure of claim 22, wherein the structure further includes a glue layer between the substrate board and the conductive line layer.
27. The structure of claim 22, wherein the bonding pad region has an electroplated layer above the bonding pad region.
28. The structure of claim 27, wherein the metal for forming the electroplated layer is selected from a group that includes gold, silver, palladium, nickel and a combination of the above listed metals.
29. A semiconductor package, comprising:
a substrate board having a plurality of through vias, wherein the substrate board is made using glass epoxy resin or bismaleimide-triazine (BT);
a patterned conductive line layer on the substrate board that also covers the through vias;
a soldering mask covering a portion of the conductive line layer and exposing a bonding pad region of the conductive line layer;
a silicon chip fixed onto the surface of the soldering mask and electrically connected to the bonding pads through conductive wires; and
an insulation material that encloses the silicon chip, the conductive wires, the soldering mask, the conductive line layer and a portion of the substrate board.
30. The package of claim 29, wherein the material for forming the conductive line layer includes copper.
31. The package of claim 29, wherein the material for forming the soldering mask includes an ultraviolet-sensitive compound.
32. The package of claim 29, wherein the material for forming the soldering mask includes a bake-hardened compound.
33. The package of claim 29, wherein the metal for forming the conductive wires is selected from a group that includes gold, aluminum and copper.
34. The package of claim 29, wherein the insulation material includes resin.
35. The package of claim 29, wherein the insulation material includes epoxy resin.
36. The package of claim 29, wherein the package further includes a plurality of solder balls inserted inside the through vias electrically connected with the conductive line layer.
37. The package of claim 29, wherein the package further includes a plurality of copper balls inserted inside the through vias electrically connected with the conductive line layer.
38. The package of claim 29, wherein the package further includes a glue layer between the conductive line layer and the substrate board.
39. The package of claim 29, wherein the bonding pad region has an electroplated layer above the bonding pad region.
40. The structure of claim 39, wherein the metal for forming the electroplated layer is selected from a group that includes gold, silver, palladium, nickel and a combination of the above listed metals.