1. A method comprising:
generating operational settings tailored for a gaming application;
storing the operational settings in a first peripheral device;
receiving operational inputs associated with the operational settings;
interacting with the gaming application using the first peripheral device and the operational inputs; and
sharing the operational settings with a second peripheral device for use with the gaming application.
2. The method of claim 1, wherein the first and second peripheral devices comprise at least one of a mouse, a joystick, a gaming pad, and a gaming console controller.
3. The method of claim 1, comprising sharing the operational settings by a wireless transmission between the first and second peripheral devices.
4. The method of claim 3, wherein the wireless transmission is according to a protocol associated with at least one of WiFi, Bluetooth, Infrared, RFID, and wireless USB.
5. The method of claim 1, comprising sharing the operational settings using a removable memory device that directly and selectively connects with the first and second peripheral devices.
6. The method of claim 1, comprising generating the operational settings at a server remote from the first peripheral device and transmitting the operational settings to the first peripheral device.
7. The method of claim 6, wherein the server is remote from a gaming console hosting the gaming application.
8. A first peripheral device, comprising a controller to:
store operational settings tailored for a gaming application;
interact with the gaming application using the operational settings and user inputs; and
share the operational settings with a second peripheral device for use with the gaming application.
9. The first peripheral device of claim 8, wherein the controller is adapted to generate the operational settings.
10. The first peripheral device of claim 9, wherein the operational settings are generated using a graphical user interface presented by a gaming console hosting the gaming application.
11. The first peripheral device of claim 8, wherein the controller is adapted to receive the operational settings from a server that is remote from a gaming console hosting the gaming application.
12. The first peripheral device of claim 8, wherein the controller is adapted to wirelessly transmit the operational settings to the second peripheral device.
13. The first peripheral device of claim 8, wherein the controller is a multimode device capable of transmitting the operational settings using a plurality of different communication protocols.
14. A computer readable storage medium comprising computer instructions for:
storing operational settings in a first peripheral device, wherein the operational settings are tailored for a gaming application;
receiving operational inputs associated with the operational settings;
interacting with the gaming application using the first peripheral device and the operational inputs; and
performing at least one of:
sharing the operational settings with a second peripheral device for use with the gaming application; and
receiving the operational settings at the first peripheral device from a server that is remote from a gaming console that is hosting the gaming application
15. The storage medium of claim 14, comprising computer instructions for generating the operational settings at the first peripheral device.
16. The storage medium of claim 14, wherein the first and second peripheral devices comprise at least one of a mouse, a joystick, a gaming pad, and a gaming console controller.
17. The storage medium of claim 14, comprising transmitting the operational settings by a wireless transmission from the first peripheral device to the second peripheral device.
18. The storage medium of claim 14, comprising sharing the operational settings using a removable memory device that directly and selectively connects with the first and second peripheral devices.
19. The storage medium of claim 14, comprising generating the operational settings at the first peripheral device using a graphical user interface that is presented by the gaming console.
20. The storage medium of claim 14, comprising generating the operational settings at the server using a graphical user interface that is presented by the server.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A deposition donor substrate comprising:
light-absorbing layers on a substrate;
partition layers each between the light-absorbing layers; and
material layers on the light-absorbing layers and on the partition layers so that the material layers are separated from each other,
wherein each partition layer has a thickness larger than a sum of thickness of each light-absorbing layer and thickness of each material layer.
2. The deposition donor substrate according to claim 1, wherein each light-absorbing layer comprises any of titanium nitride, tantalum nitride, molybdenum nitride, tungsten nitride, chromium nitride, titanium, molybdenum, tungsten, or carbon.
3. The deposition donor substrate according to claim 1, wherein each material layer comprises an organic compound.
4. The deposition donor substrate according to claim 1, wherein each material layer comprises one or both of a light-emitting material and a carrier-transport material.
5. The deposition donor substrate according to claim 1, wherein, in each partition layer, an angle between a side in contact with the substrate and a sidewall is greater than or equal to 100\xb0 and less than or equal to 130\xb0.
6. The deposition donor substrate according to claim 1, wherein a thickness of each light-absorbing layer is greater than or equal to 100 nm and less than or equal to 500 nm and a thickness of each partition layer is greater than or equal to 1 \u03bcm and less than or equal to 2 \u03bcm.
7. The deposition donor substrate according to claim 1, wherein thermal conductivity of each partition layer is lower than thermal conductivity of each light-absorbing layer.
8. A deposition donor substrate comprising:
light-absorbing layers separated from each other on a substrate;
partition layers each formed between the light-absorbing layers; and
material layers formed on the light-absorbing layers and on the partition layers so that the material layers are separated from each other,
wherein each partition layer has an inverse taper shape and has a thickness larger than a sum of thickness of each light-absorbing layer and thickness of each material layer.
9. The deposition donor substrate according to claim 8, wherein each light-absorbing layer comprises any of titanium nitride, tantalum nitride, molybdenum nitride, tungsten nitride, chromium nitride, titanium, molybdenum, tungsten, or carbon.
10. The deposition donor substrate according to claim 8, wherein each material layer comprises an organic compound.
11. The deposition donor substrate according to claim 8, wherein each material layer comprises one or both of a light-emitting material and a carrier-transport material.
12. The deposition donor substrate according to claim 8, wherein, in each partition layer, an angle between a side in contact with the substrate and a sidewall is greater than or equal to 100\xb0 and less than or equal to 130\xb0.
13. The deposition donor substrate according to claim 8, wherein a thickness of each light-absorbing layer is greater than or equal to 100 nm and less than or equal to 500 nm and a thickness of each partition layer is greater than or equal to 1 \u03bcm and less than or equal to 2 \u03bcm.
14. The deposition donor substrate according to claim 8, wherein thermal conductivity of each partition layer is lower than thermal conductivity of each light-absorbing layer.
15. A deposition donor substrate comprising:
light-absorbing layers separated from each other on a substrate;
partition layers each formed between the light-absorbing layers;
reflective layers formed on the light-absorbing layers and on the partition layers so that the reflective layers are separated from each other; and
material layers separated from each other on the reflective layers,
wherein each partition layer has an inverse taper shape and has a thickness larger than a sum of thickness of each light-absorbing layer and thickness of each material layer.
16. The deposition donor substrate according to claim 15, wherein each reflective layer comprises any of silver, gold, platinum, copper, an alloy containing aluminum, an alloy containing silver, or indium oxide-tin oxide.
17. The deposition donor substrate according to claim 15, wherein each light-absorbing layer comprises any of titanium nitride, tantalum nitride, molybdenum nitride, tungsten nitride, chromium nitride, titanium, molybdenum, tungsten, or carbon.
18. The deposition donor substrate according to claim 15, wherein each material layer comprises an organic compound.
19. The deposition donor substrate according to claim 15, wherein each material layer comprises one or both of a light-emitting material and a carrier-transport material.
20. The deposition donor substrate according to claim 15, wherein, in each partition layer, an angle between a side in contact with the substrate and a sidewall is greater than or equal to 100\xb0 and less than or equal to 130\xb0.
21. The deposition donor substrate according to claim 15, wherein a thickness of each light-absorbing layer is greater than or equal to 100 nm and less than or equal to 500 nm and a thickness of each partition layer is greater than or equal to 1 \u03bcm and less than or equal to 2 \u03bcm.
22. The deposition donor substrate according to claim 15, wherein thermal conductivity of each partition layer is lower than thermal conductivity of each light-absorbing layer.
23. A method for manufacturing a light-emitting device, comprising the steps of:
disposing one surface of a first substrate to face a deposition target surface of a second substrate, wherein the first substrate comprises at least light-absorbing layers separated from each other, partition layers each formed between the light-absorbing layers and having an inverse taper shape, and material layers formed on the light-absorbing layers and on the partition layers so that the material layers are separated from each other;
performing light irradiation from the other surface of the first substrate;
heating the material layers in regions overlapped with the light-absorbing layers; and
evaporating the material layers in regions overlapped with the light-absorbing layers to the deposition target surface of the second substrate.
24. The method for manufacturing a light-emitting device, according to claim 23, wherein each light-absorbing layer has a reflectance less than or equal to 70 % for light.
25. The method for manufacturing a light-emitting device, according to claim 23, wherein a thickness of each light-absorbing layer is greater than or equal to 100 nm and less than or equal to 500 nm and a thickness of each partition layer is greater than or equal to 1 \u03bcm and less than or equal to 2 \u03bcm.
26. The method for manufacturing a light-emitting device, according to claim 23, wherein the light is infrared light.
27. The method for manufacturing a light-emitting device, according to claim 23, wherein each light-absorbing layer comprises any of titanium nitride, tantalum nitride, molybdenum nitride, tungsten nitride, chromium nitride, titanium, molybdenum, tungsten, or carbon.
28. The method for manufacturing a light-emitting device, according to claim 23, wherein each partition layer comprises any of a photocurable resin, a thermosetting resin, or an inorganic compound.
29. The method for manufacturing a light-emitting device, according to claim 23, wherein each material layer comprises an organic compound.
30. The method for manufacturing a light-emitting device, according to claim 23, wherein each material layer comprises one or both of a light-emitting material and a carrier-transport material.
31. A method for manufacturing a light-emitting device, comprising the steps of:
disposing one surface of a first substrate to face a deposition target surface of a second substrate, wherein the first substrate comprises at least light-absorbing layers separated from each other, partition layers each formed between the light-absorbing layers and having an inverse taper shape, reflective layers formed on the light-absorbing layers and on the partition layers so that the reflective layers are separated from each other, and material layers separated from each other on the light-absorbing layers and on the partition layers with the reflective layers interposed therebetween;
performing light irradiation from the other surface of the first substrate;
heating the material layers in regions overlapped with the light-absorbing layers; and
evaporating the material layers in regions overlapped with the light-absorbing layers to the deposition target surface of the second substrate.
32. The method for manufacturing a light-emitting device, according to claim 31, wherein each light-absorbing layer has a reflectance less than or equal to 70% for light.
33. The method for manufacturing a light-emitting device, according to claim 31, wherein a thickness of each light-absorbing layer is greater than or equal to 100 nm and less than or equal to 500 \u03bcm and a thickness of each partition layer is greater than or equal to 1 \u03bcm and less than or equal to 2 \u03bcm.
34. The method for manufacturing a light-emitting device, according to claim 31, wherein the light is infrared light.
35. The method for manufacturing a light-emitting device, according to claim 31, wherein each light-absorbing layer comprises any of titanium nitride, tantalum nitride, molybdenum nitride, tungsten nitride, chromium nitride, titanium, molybdenum, tungsten, or carbon.
36. The method for manufacturing a light-emitting device, according to claim 31, wherein each partition layer comprises any of a photocurable resin, a thermosetting resin, or an inorganic compound.
37. The method for manufacturing a light-emitting device, according to claim 31, wherein each material layer comprises an organic compound.
38. The method for manufacturing a light-emitting device, according to claim 31, wherein each material layer comprises one or both of a light-emitting material and a carrier-transport material.