1. A method for encapsulating a semiconductor device, the method comprising:
providing a semiconductor device with a top surface and a bottom surface;
positioning the bottom surface adjacent to a first mold portion comprising a separation component which separates a first pressure region adjacent to the bottom surface and a second pressure region adjacent to the top surface;
reducing a pressure in the first pressure region along the bottom surface to affix the bottom surface to the first mold portion;
positioning a second mold portion over the first mold portion and the semiconductor device, the second mold portion and the first mold portion defining a cavity enclosing the semiconductor device;
evacuating gasses in the second pressure region adjacent to the top surface of the semiconductor device through a first vacuum hole; and
applying an encapsulant to the top surface of the semiconductor device.
2. The method of claim 1, further comprising ejecting the semiconductor device after the applying the encapsulant, the ejecting being performed by engaging ejection pins located in the first mold portion.
3. The method of claim 1, wherein a release film is located on the second mold portion.
4. The method of claim 1, wherein the reducing the pressure along the bottom surface is performed by evacuating an ambient atmosphere through a second vacuum hole located through the first mold portion.
5. The method of claim 1, further comprising curing the encapsulant.
6. The method of claim 1, wherein the separation component has a circular shape.
7. A method of manufacturing a semiconductor device, the method comprising:
placing a semiconductor device onto a first molding piece, the semiconductor device and the first molding piece delineating a first pressure region between them;
sealing the semiconductor device into a molding chamber using a second molding piece, the molding chamber having a second pressure region outside the first pressure region;
reducing a first pressure in the first pressure region without affecting a second pressure in the second pressure region;
reducing the second pressure in the second pressure region without affecting the first pressure in the first pressure region; and
encapsulating the semiconductor device within the mold.
8. The method of claim 7, further comprising ejecting the semiconductor device after the encapsulating the semiconductor device, the ejecting being performed by engaging ejection pins located in the first molding piece.
9. The method of claim 7, wherein a release film is located on the second molding piece.
10. The method of claim 7, wherein the reducing the second pressure is performed by reducing the second pressure through a first vacuum hole located through the first molding piece.
11. The method of claim 10, wherein the reducing the first pressure is performed by evacuating an ambient atmosphere through a second vacuum hole located through the first molding piece.
12. The method of claim 7, further comprising curing the encapsulant.
13. The method of claim 7, wherein the first molding piece comprises a separating material between the first pressure region and the second pressure region.
14. A method of manufacturing a device, the method comprising:
providing a molding chamber with a top piece and a bottom piece, the bottom piece having a first opening and a second opening separated by a barrier material;
placing a semiconductor device onto the bottom piece, the placing the semiconductor device forming a first region operationally connected to the first opening and a second region operationally connected to the second opening;
sealing the molding chamber by connecting the top piece to the bottom piece;
removing a first atmosphere in the first region through the first opening;
separately removing a second atmosphere in the second region through the second opening; and
encapsulating the semiconductor device after the removing the first atmosphere and the second atmosphere.
15. The method of claim 14, further comprising ejecting the semiconductor device after the encapsulating the semiconductor device, the ejecting being performed by engaging ejection pins located in the bottom piece.
16. The method of claim 14, wherein a release film is located on the top piece.
17. The method of claim 14, wherein the barrier material comprises a first concentric ring separating the first region from the second region.
18. The method of claim 17, wherein the bottom piece comprises a second concentric ring separating the first region into a third region and a fourth region.
19. The method of claim 14, further comprising curing the encapsulant.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A uniplanar bone screw for adjusting a position of a rod, comprising: a main body having a shaft with a threaded part; a rocker coupled to and moveable relative to the main body, wherein the rocker is configured to at least partially receive the rod; a rod-securing element configured to secure the rod between the rocker and the rod-securing element and relative to the main body, wherein the rod-securing element includes a fulcrum serving as an axis of rotation about which the rod rotates, wherein the rod-securing element comprises a screw directly abuts the rod, wherein the main body includes a screw head coupled to the shaft, wherein the screw head includes a slot configured to at least partially receive the rod and the rocker; and a guide feature in one of the slot and the rocker and a guide channel in the other of the slot and the rocker, wherein the guide channel is configured to receive the guide feature to guide movement of the rocker relative to the main body.
2. The uniplanar bone screw of claim 1, wherein the threaded portion is configured to at least partially be received within a spine.
3. The uniplanar bone screw of claim 1, wherein the guide feature comprises a projection.
4. The uniplanar bone screw of claim 1, wherein the slot includes a first interior sidewall and a second interior sidewall and a bottom surface that extends from the first interior sidewall to the second interior sidewall.
5. The uniplanar bone screw of claim 4, wherein the bottom surface of the slot supports the rocker.
6. The uniplanar bone screw of claim 4, wherein the bottom surface of the slot and a surface of the rocker each include substantially elongated surfaces configured to facilitate translational movement of the rocker relative to the main body.
7. The uniplanar bone screw of claim 4,
wherein the bottom surface of the slot is one of:
(i) substantially flat in a first direction and in a second direction,
(ii) substantially curved in the first direction and in the second direction,
(ii) substantially flat in the first direction and substantially curved in the second direction, and
(iv) substantially curved in the first direction and substantially flat in the second direction, and
wherein the second direction is substantially perpendicular to the first direction.
8. The uniplanar bone screw of claim 4, wherein the bottom surface of the slot includes a pointed portion.
9. The uniplanar bone screw of claim 1, wherein the rocker includes a taper that contacts the rod.
10. The uniplanar bone screw of claim 1, wherein the rocker includes an upper portion and wherein the upper portion includes a surface that is configured to interface with and at least partially support the rod.
11. The uniplanar bone screw of claim 1,
wherein the rocker includes a substantially elliptic portion, a first wing extending from a first end of the substantially elliptic portion and a second wing extending from a second end of the substantially elliptic portion, and
wherein the substantially elliptic portion, the first wing and the second wing are configured to confine the rocker within the main body.
12. The uniplanar bone screw of claim 1, wherein the rocker comprises one of a sliding rod support and a swing.
13. The uniplanar bone screw of claim 12, wherein the shape of the sliding rod support is one of substantially convex and substantially concave.
14. The uniplanar bone screw of claim 12, wherein the swing includes holes for receiving guide features that are configured to couple the swing to the main body.
15. The uniplanar bone screw of claim 12, wherein the swing includes one or more suspension lines that suspend the swing from the main body.
16. The uniplanar bone screw of claim 12, wherein the center of the sliding rod support serves as an axis of rotation about which the sliding rod support rotates.
17. The uniplanar bone screw of claim 12, wherein one of a swing hole of the swing and a projection serve as an axis of rotation about which the swing rotates.
18. The uniplanar bone screw of claim 12, wherein when the rod-securing element is secured, the swing at least one of contacts a bottom surface of a slot of the main body such that a load is distributed and translates.
19. The uniplanar bone screw of claim 1, wherein the se lead includes a bottom portion and a top portion that is detachably coupled to the bottom portion.
20. The uniplanar bone screw of claim 1, wherein the rocker is configured to at least one of translate and rotate within the slot.
21. The uniplanar bone screw of claim 1, wherein an angle of rotation of the rod is determined by the distance of the center of the rocker from the fulcrum of the rod-securing element.
22. The uniplanar bone screw of claim 1, wherein the fulcrum comprises a cone-shape and a pointed portion of the cone directly abuts the rod.