1. An iron-type golf club head comprising:
a body composed of a damascene patterned metal wherein the damascene patterned metal comprises a first metal and a second metal, the first metal having properties different than the second metal, and the damascene patterned metal comprising a plurality of alternating vertical layers of the first metal and the second metal, each of the plurality of alternating vertical layers extending from a sole of the iron-type golf club head to a top of the iron-type golf club head.
2. The iron-type golf club head according to claim 1 wherein the damascene patterned metal is composed of stainless steel 304L and stainless steel 316L.
3. The iron-type golf club head according to claim 1 wherein the damascene patterned metal is composed of an alpha titanium and a metastable beta titanium.
4. The iron-type golf club head according to claim 1 wherein the damascene patterned metal is composed of copper and nickel.
5. The iron-type golf club head according to claim 1 further comprising a front face with a plurality of scorelines.
6. An iron-type golf club head comprising:
a body composed of a damascene patterned metal wherein the damascene patterned metal comprises a stainless steel 304L and a stainless steel 316L, the damascene patterned metal comprising a plurality of alternating vertical layers of the stainless steel 304L and the stainless steel 316L, each of the plurality of alternating vertical layers extending from a sole of the iron-type golf club head to a top of the iron-type golf club head.
7. The iron-type golf club head according to claim 6 further comprising a front face with a plurality of scorelines.
8. An iron-type golf club head comprising:
a body composed of a damascene patterned metal wherein the damascene patterned metal comprises a pure titanium and a beta-C-titanium, the damascene patterned metal comprising a plurality of alternating vertical layers of the pure titanium and the beta-C-titanium, each of the plurality of alternating vertical layers extending from a sole of the iron-type golf club head to a top of the iron-type golf club head.
9. The iron-type golf club head according to claim 8 further comprising a front face with a plurality of scorelines.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for interconnecting bond pads between integrated components, the method comprising:
forming interconnect wires on a thermally decomposable adhesive on a printhead substrate;
positioning the printhead so that at least an interconnect wire of the interconnect wires is located over a desired location of bond pads;
releasing the at least an interconnect wire, the at least an interconnect wire falling on the corresponding bond pads.
2. A method as in claim 1 further comprising
forming a beveled slope of one of the integrated components.
3. A method as in claim 1 further comprising
pushing the at least an interconnect wire onto the bond pads.
4. A method as in claim 1 further comprising
laser welding the at least an interconnect wire to the bond pads.
5. A method as in claim 1 further comprising
applying a conductive adhesive on the bond pads before releasing the at least an interconnect wire.
6. A method as in claim 1 wherein the integrated components are positioned in an at least partially stacked configuration.
7. A method as in claim 1 wherein the integrated components are positioned in an at least partially coplanar configuration.
8. A method as in claim 1 wherein the printhead simultaneously releases multiple interconnect wires over corresponding bond pads.
9. A method for forming interconnect wires on a printhead, the method comprising:
placing interconnect wires on a thermally decomposable adhesive on a printhead substrate;
laser cutting the interconnect wires to correct lengths.
10. A method as in claim 9 wherein the interconnect wires are separated by a same distance as the separation of adjacent bond pads.
11. A method as in claim 9 wherein multiple interconnect wires are cut to a same length for simultaneously printing on multiple bond pads.
12. A method as in claim 9 further comprising
coating a layer of thermally decomposable adhesive on the printhead substrate.
13. A method as in claim 9 wherein the thermally decomposable adhesive is releasable by at least one of heat and light.
14. A method for forming interconnect wires on a printhead, the method comprising:
depositing a conductive layer on a thermally decomposable adhesive on a printhead substrate;
patterning the conductive layer to form interconnect wires with correct lengths.
15. A method as in claim 14 wherein patterning the conductive layer comprises a photolithography process.
16. A method as in claim 14 wherein the interconnect wires are separated by a same distance as the separation of adjacent bond pads.
17. A method as in claim 14 wherein multiple interconnect wires are patterned to a same length for simultaneously printing on multiple bond pads.
18. A method as in claim 14 further comprising
coating a layer of thermally decomposable adhesive on the printhead substrate.
19. A method as in claim 14 wherein the thermally decomposable adhesive is releasable by at least one of heat and light.
20. A method for forming interconnect wires on a printhead, the method comprising:
extruding an interconnect wire on a thermally decomposable adhesive on a printhead substrate;
laser cutting a correct length of the interconnect wire, the interconnect wire falling on the thermal decomposable adhesive.
21. A method as in claim 20 wherein extruding the interconnect wire comprises a mechanical feeder.
22. A method as in claim 20 wherein extruding the interconnect wire comprises a wirebonder wire feeder mechanism.
23. A method as in claim 20 wherein the interconnect wires are separated by a same distance as the separation of adjacent bond pads.
24. A method as in claim 20 wherein multiple interconnect wires are cut to a same length for simultaneously printing on multiple bond pads.
25. A method as in claim 20 further comprising
coating a layer of thermally decomposable adhesive on the printhead substrate.
26. A method as in claim 20 wherein the thermally decomposable adhesive is releasable by at least one of heat and light.
27. A printhead for printing interconnect wires, comprising
a thermally decomposable adhesive on a printhead substrate;
a plurality of interconnect wires patterned to the correct lengths disposed on the thermally decomposable adhesive; and
a release mechanism for releasing the thermally decomposable adhesive.
28. A printhead as in claim 27 wherein the interconnect wires are separated by a same distance as the separation of adjacent bond pads.
29. A printhead as in claim 27 wherein multiple interconnect wires are cut to a same length for simultaneously printing on multiple bond pads.
30. A printhead as in claim 27 wherein the release mechanism comprises at least one of heat and light.
31. A printhead as in claim 27 wherein the interconnect wires are placed on the thermal decomposable adhesive and laser cut to the correct lengths.
32. A printhead as in claim 27 wherein the interconnect wires are patterned to the correct lengths from a deposited conductive layer on the thermal decomposable adhesive.