1. Apparatus for tensioning the belt drive of a pump jack where the pump jack includes a motor having an output pulley, a transmission including an input drive pulley and a belt interconnecting the output pulley and the input drive pulley, the apparatus comprising:
a base frame for mounting on a support portion of the pump jack adjacent the motor;
an upstanding support carried on the base frame and standing upwardly therefrom to a position adjacent the belt;
an idler roller for engaging the belt with a cylindrical roller surface carried on bearings for rotating about an axis of the cylindrical surface so as to roll on the belt;
a pivotally mounted arm extending from the upstanding support to the roller for supporting the roller axis transverse to the belt;
the arm being mounted on the support for pivotal movement about an arm axis parallel to the roller axis so as to move the roller closer to and further from the belt;
and a spring for applying a force to the arm to press the roller against the belt.
2. The apparatus according to claim 1 wherein the base frame, the upstanding support and the pivotally mounted arm are all arranged one side of the idler roller so as to present the idler roller to the belt from one side of the belt.
3. The apparatus according to claim 2 wherein the spring extends from the mounting arm to a position on the base frame or upstanding support so as to be free from interference with the idler roller and the belt.
4. The apparatus according to claim 1 wherein the roller has two end flanges for confining and guiding the belt.
5. The apparatus according to claim 1 wherein the base frame comprises a plate with slots for bolts by which the position of the plate can be adjusted relative to a support surface for adjustment relative to the belt.
6. The apparatus according to claim 1 wherein the slots extend at right angles to the belt for adjustment of the plate toward and away from the belt.
7. The apparatus according to claim 6 wherein the base frame includes a pair of rails arranged parallel to the belt for adjustment of the plate longitudinally of the rails.
8. The apparatus according to claim 1 wherein the base frame is adjustable longitudinally and transversely to the belt.
9. The apparatus according to claim 1 wherein the upstanding support comprises a plurality of legs connected to the base frame and upstanding therefrom.
10. The apparatus according to claim 9 wherein the upstanding support comprises a platform connected to a top of the legs.
11. The apparatus according to claim 10 wherein the platform carries a pair of bearings for supporting a pivot shaft defining the arm axis.
12. The apparatus according to claim 10 wherein the platform is mounted for adjustment of the position of the bearings relative to the legs for movement of the shaft toward and away from the belt.
13. The apparatus according to claim 10 wherein the platform is mounted for adjustment by tilting of the platform about a transverse axis for alignment of the idler roller with the path of the belt.
14. The apparatus according to claim 10 wherein the platform is mounted for adjustment by tilting of the platform by adjustment of a length of one or more of the legs.
15. The apparatus according to claim 1 wherein the pivotally mounted arm comprises a roller support plate at one end of the idler roller at right angles to the roller axis.
16. The apparatus according to claim 15 wherein the roller support plate is held at right angles to the pivot axis by a brace connected at a position spaced along the pivot axis and extending toward the roller support plate at a position adjacent the idler roller.
17. The apparatus according to claim 15 wherein the spring is connected at one end to a depending connecting leg connected to the roller support plate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A collar positionable around a contact pad of a semiconductor device, the collar including an aperture to which at least a portion of the contact pad is exposed, the collar comprising a plurality of mutually adhered regions.
2. The collar of claim 1, being configured to prevent material of a conductive structure securable to the contact pad from contacting a region of a surface of the semiconductor device that surrounds the contact pad.
3. The collar of claim 2, including an inner surface defining the aperture and which is configured to be at least partially contacted by at least a portion of the conductive structure within the aperture.
4. The collar of claim 3, wherein the inner surface is configured to define a shape of at least a portion of the conductive structure.
5. The collar of claim 4, wherein the inner surface is configured to define the conductive structure to have a pillar shape.
6. The collar of claim 4, wherein the inner surface is configured to define at least a base portion of the conductive structure and to impart the conductive structure with a mushroom-like shape.
7. The collar of claim 4, wherein the inner surface is configured to define the conductive structure to have a substantially non-ball-shaped configuration.
8. The collar of claim 1, wherein at least some of the plurality of mutually adhered regions comprise photopolymer.
9. The collar of claim 1, wherein the plurality of mutually adhered regions comprises a plurality of layers.
10. The collar of claim 9, wherein the layers are at least partially superimposed and contiguous.
11. A support structure for a discrete conductive structure, comprising:
a plurality of mutually adhered regions comprising dielectric material; and
a receptacle extending through the plurality of mutually adhered regions and configured to receive at least a portion of the discrete conductive structure.
12. The support structure of claim 11, wherein the plurality of mutually adhered regions is configured to prevent material of the discrete conductive structure from extending laterally beyond a periphery of the receptacle.
13. The support structure of claim 11, wherein each of the plurality of mutually adhered regions comprises photopolymer.
14. The support structure of claim 11, wherein the receptacle is configured to contact at least a portion of an external surface of the discrete conductive structure.
15. The support structure of claim 14, wherein the external surface is configured to define a shape of at least a portion of the discrete conductive structure.
16. The support structure of claim 11, wherein the receptacle is configured to receive substantially all of the discrete conductive structure.
17. The support structure of claim 11, wherein the plurality of mutually adhered regions comprises a plurality of layers.
18. The support structure of claim 17, wherein the layers are at least partially superimposed and contiguous.
19. The support structure of claim 18, wherein the receptacle extends through each layer of the plurality of layers.
20. A form for at least a portion of a discrete conductive structure, comprising:
a body including a plurality of mutually adhered dielectric material regions; and
a receptacle laterally confined by the body, the receptacle having a shape into which at least the portion of the discrete conductive structure is to be formed.
21. The form of claim 20, wherein each of the plurality of mutually adhered dielectric material regions comprises photopolymer.
22. The form of claim 20, wherein the receptacle opens to an end of the body to facilitate communication between the discrete conductive structure and a portion of a contact around which the body is positioned.
23. The form of claim 22, wherein the body prevents material of the portion of the discrete conductive structure from extending laterally beyond an outer periphery of the body.
24. The form of claim 22, wherein the body and the receptacle are configured to facilitate alignment of the discrete conductive structure with the contact.
25. The form of claim 20, wherein the receptacle is configured to form a shape of a substantial length of the discrete conductive structure.
26. The form of claim 20, wherein the plurality of mutually adhered dielectric material regions comprises a plurality of layers.
27. The form of claim 26, wherein the layers are at least partially superimposed and contiguous.
28. The form of claim 27, wherein the receptacle extends through each layer of the plurality of layers.