1. An integrated device for diagnostic analyses used to verify the presence of bacteria in at least a biological sample mixed with a eugonic culture broth, in order to identify at least the type of bacteria, and to test a series of antibiotics, selected from a group of antibiotics characteristic at least for said type of bacteria identified, identifying those effective to determine the antibiotic therapy, the device comprising inside an integrated structure, first optical examination means, having a laser emitter, able to verify the presence of bacteria, by observing the related growth curve, to define corresponding positive biological samples, and to identify at least the type, by observing the development of the bacterial growth over time of bacteria present in said positive biological samples, in order to define said group of antibiotics, and second examination means able to verify the sensitive or resistant response of each positive biological sample to a series of antibiotics of said group of antibiotics defined by said first examination means.
2. An integrated device as in claim 1, wherein a desired quantity of each positive biological sample is directly mixed with at least an antibiotic of said series of antibiotics, in order to verify the sensitivity or resistance of the bacterium to said antibiotic with respect to a desired quantity of said positive or reference sample, which is not mixed with any antibiotic.
3. An integrated device as in claim 1, comprising first and second containing means arranged inside said integrated structure, wherein said second containing means define a first and a second zone of analysis, said first examination means being associated at least with said first zone of analysis and said second examination means being associated with said second zone of analysis.
4. An integrated device as in claim 3, wherein said first containing means are able to contain a plurality of test tubes inside each of which a pure biological sample is present, cooling means being associated with said containing means in order to ensure the correct preservation of said pure biological samples.
5. An integrated device as in claim 3, wherein said second containing means comprise a heating unit able to heat said biological samples in order to promote the bacterial growth.
6. An integrated device as in claim 3, comprising selection means able to pick up a desired quantity of a pure biological sample contained in a test tube in order to dispense said desired quantity into a specific container containing eugonic broth and arranged in said first zone of analysis, associated with said first examination means.
7. An integrated device as in claim 6, wherein said selection means are able to pick up a desired quantity of a determinate positive biological sample contained in a container, arranged in said first zone of analysis, so as to divide said desired quantity into a plurality of first and second containers arranged in said second zone of analysis.
8. An integrated device as in claim 7, wherein said selection means cooperate with means to standardize the bacterial concentration present in the suspension taken.
9. An integrated device as in claim 8, wherein said standardization means comprise a photometer able to detect the turbidity of the suspension and to classify the concentration thereof according to the McFarland scale.
10. An integrated device as in claim 7, wherein an antibiotic of said group of antibiotics characteristic for at least said type of bacteria identified by said first examination means is introduced inside each of said second containers, wherein said determinate positive or reference biological sample is present substantially exclusively inside each of said first containers.
11. An integrated device as in claim 10, wherein said second examination means are able to compare the development of the bacterial charge of the biological samples contained in every container of said second plurality of containers with the development of the bacterial charge of the corresponding determinate positive biological sample contained in said first containers.
12. An integrated device as in claim 1, wherein each of said first and second examination means comprises said emitter means to emit electromagnetic radiations, and detection means to detect said electromagnetic radiations which pass through said container.
13. An integrated device as in claim 12, wherein the detection means of said first examination means include at least two fixed sensor elements, wherein the detection means of said second examination means include at least a movable sensor element.
14. An integrated device as in claim 12, wherein the detection means of the first and second examination means include at least a movable sensor element.
15. An integrated device as in claim 13, wherein said fixed sensor elements are arranged respectively at about 90\xb0 and 150\xb0 with respect to said emitter means and along a circumference at center of which said container is arranged.
16. An integrated device as in claim 1, further comprising, in said integrated structure, third examination means able to examine the positive biological samples in order to evaluate the correctness of the examination performed by the first examination means or the second examination means.
17. An integrated device as in claim 16, wherein said third examination means comprise devices able to analyze the spectral content of a gas produced by every positive biological sample.
18. An integrated device as in claim 6, wherein said selection means comprise mechanisms to move at least a pick-up and dispensing needle.
19. An integrated device as in claim 18, further comprising, in said integrated structure, a washing and sterilizing device, to wash and sterilize said pick-up and dispensing needle.
20. An integrated device as in claim 6, comprising reading means able to identify each of said containers, in order to correlate each of said containers to the biological sample contained therein and to the patient from whom said biological sample was taken.
21. An integrated device as in claim 6, further comprising a control unit able to at least memorize the displacements, the samples and the dispensing performed by means of said selection means.
22. An integrated device as in claim 1, comprising, in said first analysis zone, a plate defining a plurality of recesses each of which is able to be filled with the bacterial suspension and a relative antibiotic in order to select the most suitable antibiotic for the specific bacterium.
23. An integrated device as in claim 22, comprising means to detect the turbidity able to detect the kinetics of growth or inhibition in each of said recesses containing the bacterial suspension and a relative antibiotic.
24. An integrated device as in claim 22, wherein a chemical reagent is added to the bacterial suspension in at least some of said recesses, the device comprising means to detect the combination of colors produced by said chemical reagents in order to discriminate the bacterial species according to the resulting combination of colors.
25. A method for diagnostic analyses used to verify the presence of bacteria in at least a biological sample mixed with a eugonic culture broth, in order to identify at least the type of bacteria, and to test a series of antibiotics, selected from a group of antibiotics characteristic at least for said type of bacteria identified, identifying those effective to determine the antibiotic therapy, the method comprising the following steps:
a first examination step during which the content of a plurality of biological samples is examined by means of an optical examination device comprising at least a laser emitter, to verify the presence of bacteria to define a plurality of positive biological samples, and to identify at least the type of bacteria to define said group of antibiotics;
a second examination step, during which, if the result of the first examination step is affirmative, the sensitive or resistant response is verified of each positive biological sample to a series of antibiotics of said group of antibiotics defined in said first examination step.
26. A method as in claim 25, wherein during said second examination step each positive biological sample is mixed with at least an antibiotic of said series of antibiotics, in order to verify the sensitivity or resistance of the bacterium to said antibiotic with respect to a positive reference sample, to which no antibiotic has been added.
27. A method as in claim 25, further comprising a first selection step performed before said first examination step, during which a desired quantity of a pure biological sample is taken, contained in a respective test tube arranged in first containing means, and is dispensed in a container, arranged in second containing means, and containing said eugonic broth so as to promote the bacterial growth.
28. A method as in claim 25, further comprising a second selection step, performed after said first examination step and before said second examination step, during which a desired quantity of a specific positive biological sample is taken, enriched by the presence of grown bacteria, in order to divide it said desired quantity into a plurality of second containers inside each of which an antibiotic of said group of antibiotics is provided characteristic at least for said types of bacteria.
29. A method as in claim 25, further comprising a verification step after said first examination step, to verify the correct identification of the type of bacteria as resulting from said first examination step, which provides to mix a reagent substance with one or more of said biological samples, and to analyze the reaction times of each of said biological samples with said reagent substance.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. Power semiconductor module, comprising
at least one semiconductor chip which has a first main electrode side and a second main electrode side opposite the first main electrode side, the first main electrode side making thermal and electrical contact with the first base plate, and the second main electrode side making thermal and electrical contact with a second base plate,
a first cooling device with a first main electrode connecting element and a heat sink, the first main electrode connecting element making thermal and electrical contact with the side of the first base plate facing away from the first main electrode side, and the heat sink making thermal contact with the side of the first main electrode connecting element facing away from the first main electrode side, and
a second cooling device which makes thermal contact with the side of the second base plate facing away from the second main electrode.side, wherein the power semiconductor module has a housing in which at least one semiconductor chip and the first and second cooling device are located and wherein the heat sink of the first cooling device is supported against the housing.
2. Power semiconductor module as claimed in claim 1, wherein the first main electrode connecting element is electrically insulated relative to the housing.
3. Power semiconductor module as claimed in claim 1, wherein the heat sink of the first cooling device is electrically insulated relative to the housing.
4. Power semiconductor module as claimed in claim 2, wherein the heat sink of the first cooling device makes electrical contact with the first main electrode connecting element.
5. Power semiconductor module as claimed in claim 1, wherein the heat sink of the first cooling device is electrically insulated relative to the first main electrode connecting element.
6. Power semiconductor module as claimed in claim 1, wherein the heat sink of the first cooling device has cooling ribs.
7. Power semiconductor module as claimed in claim 1, wherein the second cooling device comprises a heat sink which makes thermal contact with the side of the second main electrode connecting element which faces away from the second main electrode side.
8. Power semiconductor module as claimed in claim 7, wherein the heat sink of the second cooling device is supported against the housing.
9. Power semiconductor module as claimed in claim 7, wherein the second main electrode connecting element is electrically insulated relative to the housing.
10. Power semiconductor module as claimed in claim 7, wherein the heat sink of the second cooling device is electrically insulated relative to the housing.
11. Power semiconductor module as claimed in claim 9, wherein the heat sink of the second cooling device makes electrical contact with the second main electrode connecting element.
12. Power semiconductor module as claimed in claim 7, wherein the heat sink of the second cooling device is electrically insulated relative to the second main electrode connecting element.
13. Power semiconductor module as claimed in claim 7, wherein the heat sink has cooling ribs.
14. Power semiconductor module as claimed in claim 1, wherein the power semiconductor module has at least two semiconductor chips and at least two first and two second base plates, at least one semiconductor chip at a time on its main electrode sides making thermal and electrical contact with a first and second base plate, and the respective first main electrode connecting elements making electrical contact with one another or the respective first main electrode connecting elements being made as a common first main electrode connecting element.
15. Power semiconductor module as claimed in claim 14, wherein in the case of a common first main electrode connecting element the common first main electrode connecting element is made as a main electrode terminal board which has tapers between the areas in which at least two semiconductor chips have made contact.
16. Power semiconductor module as claimed in claim 1, wherein the power semiconductor module has at least two semiconductor chips and at least two first and two second base plates, at least one semiconductor chip at a time on its main electrode sides making thermal and electrical contact with a first and second base plate, and the respective second main electrode connecting elements making electrical contact with one another or the respective second main electrode connecting elements being made as a common second main electrode connecting element.
17. Power semiconductor module as claimed in claim 16, wherein in the case of a common second main electrode connecting element the common second main electrode connecting element is made as a main electrode terminal board which has tapers between the areas in which at least two semiconductor chips have made contact.
18. Power semiconductor module as claimed in claim 14, wherein at least one semiconductor chip located between the first and second base plate is connected in parallel to at least one second semiconductor chip which is located between another first and second base plate.
19. Power semiconductor module as claimed in claim 14, wherein at least one semiconductor chip located between the first and second base plate is connected antiparallel to at least one second semiconductor chip located between another first and second base plate.
20. Power semiconductor module as claimed in claim 14, wherein at least one semiconductor chip located between the first and second base plate is series-connected to at least one second semiconductor chip located between another first and second base plate.
21. Power semiconductor module as claimed in claim 1, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, and wherein between the first cooling device and the first housing part there is a flexible element which can be pressed together.
22. Power semiconductor module as claimed in claim 1, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, and wherein between the second cooling device and the second housing part there is a flexible element which can be pressed together.
23. Power semiconductor module as claimed in claim 21, wherein the flexible element which can be pressed together is a spring element, especially an elastomer, polymer, plastic metal or gas compression spring element.
24. Power semiconductor module as claimed in claim 1, wherein the housing is made in one part.
25. Power semiconductor module as claimed in claim 1, wherein the housing is made elastic.
26. Power semiconductor module as claimed in claim 1, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, and wherein the first andor second housing part is made elastic.
27. Power semiconductor module as claimed in claim 1, wherein at least one semiconductor chip has a control terminal which leads away parallel with respect to the first or the second main electrode side of the pertinent semiconductor chip.
28. Power semiconductor module as claimed in claim 27, wherein the power semiconductor module comprises a circuit board, the circuit board is located in the plane of at least one semiconductor chip and the control terminal makes electrical contact with the circuit board.
29. Power semiconductor module as claimed in claim 8, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, and wherein the cooling ribs are made elastic.
30. Power semiconductor module as claimed in claim 13, wherein the housing comprises a first housing part and a second housing part, at least one semiconductor chip being surrounded with its first and its second main electrode side at least partially by one housing part at a time, mid wherein the cooling ribs are made elastic.
31. Power semiconductor module as claimed in claim 1, wherein the heat sink of the first cooling device and the first main electrode connection element are made in one piece.
32. Power semiconductor module as claimed in claim 7, wherein the heat sink of the second cooling device mid the second main electrode connection element are made in one piece.