1. A cooling system comprising:
one or more nodes, each node having at least one temperature sensor to monitor a temperature of internal node components;
an air-to-liquid heat exchanger configured to accept a liquid coolant input and to provide cooled air to the one or more nodes;
a temperature sensor to monitor a temperature of the air provided by the air-to-liquid heat exchanger;
a liquid cooling system configured to provide liquid coolant to components of the one or more nodes;
a valve configured to control coolant flow to the air-to-liquid heat exchanger and the liquid cooling system based on the temperature of internal node components and the temperature of the air provided by the air-to-liquid heat exchanger; and
a pump configured to provide liquid coolant to the liquid cooling system and the air-to-liquid heat exchanger, having a pump strength that is based on the temperature of internal node components and the temperature of the air provided by the air-to-liquid heat exchanger.
2. The cooling system of claim 1, further comprising control logic configured to compare a maximum internal node component temperature to a first and second component threshold and to compare the air temperature to a first and second air threshold.
3. The cooling system of claim 2, wherein the control logic is further configured to control the valve and the pump according to said comparisons.
4. The cooling system of claim 1, further comprising a flow rate valve configured to limit a coolant flow to the air-to-liquid heat exchanger based on the temperature of internal node components and the temperature of the air provided by the air-to-liquid heat exchanger.
5. The cooling system of claim 1, further comprising a flow rate valve configured to limit a coolant flow to the liquid cooling system based on the temperature of internal node components and the temperature of the air provided by the air-to-liquid heat exchanger.
6. The cooling system of claim 1, wherein the valve is a three-way valve that connects the air-to-liquid heat exchanger and the liquid cooling system to the pump in parallel.
7. The cooling system of claim 1, wherein the air-to-liquid heat exchanger and the liquid cooling system are connected serially and the valve is a two-way bypass valve.
8. The cooling system of claim 7, wherein the two-way bypass valve provides a bypass for the air-to-liquid heat exchanger, such that opening the two-way bypass valve allows coolant to flow directly to the liquid cooling system.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus comprising:
a printed circuit board;
a first antenna element etched onto the printed circuit board, the first antenna element working within a first frequency band;
a second antenna element etched onto the printed circuit board, the second antenna element working with a second frequency band;
a first RF choke etched onto the printed circuit board near a first end of the printed circuit board, the first RF choke working within the first frequency band; and
a second RF choke etched onto the printed circuit board near the first end of the printed circuit board, the second RF choke working within the second frequency band.
2. The apparatus as in claim 1 further comprising an upper domed body housing the printed circuit board, the first antenna element, the second antenna element, the first RF choke, and the second RF choke.
3. The apparatus as in claim 1 wherein the first frequency band includes a relatively higher frequency band.
4. The apparatus as in claim 3 wherein the first frequency band includes a 5.8 GHz frequency band.
5. The apparatus as in claim 1 wherein the second frequency band includes a relatively lower frequency band.
6. The apparatus as in claim 5 wherein the second frequency band includes a 2.4 GHz frequency band.
7. The apparatus as in claim 1 further comprising a third RF choke embedded in a connector body below the first and second antenna elements.
8. The apparatus as in claim 1 wherein the first antenna element includes a radiator.
9. The apparatus as in claim 8 wherein the first antenna element includes a loop-shaped radiator.
10. The apparatus as in claim 9 wherein a length of the first antenna element is approximately \xbc wavelength.
11. The apparatus as in claim 9 wherein the loop-shaped radiator is symmetrical.
12. The apparatus as in claim 1 wherein the second antenna element includes a radiator.
13. The apparatus as in claim 12 wherein the second antenna element includes a folded radiator.
14. The apparatus as in claim 13 wherein a length of the second antenna element is approximately \xbc wavelength.
15. The apparatus as in claim 13 wherein the second antenna element is integrated into the first antenna element.
16. The apparatus as in claim 13 wherein the folded radiator is bent into two equal parts.
17. The apparatus as in claim 1 wherein the second antenna element acts as an open circuit to the first antenna element.
18. The apparatus as in claim 1 further comprising a connector body for mounting on a plurality of different WiFi access point metal platforms.
19. The apparatus as in claim 18 wherein the connector body includes a connector pin for connecting with the printed circuit board.
20. The apparatus as in claim 1 wherein each of the first and second RF chokes includes a high impedance section.