1. An electronic assembly comprising:
a printed circuit board having a surface with a plurality of conductive pads disposed thereon and a plurality of conductive traces within the printed circuit board;
an electrical connector comprising a housing and a plurality of conductive elements within the housing, each of the plurality of conductive elements comprising a surface mount contact tail extending from the housing, the housing being disposed adjacent to an area of the surface, the area comprising at least a portion of the plurality of conductive pads and the surface mount contact tail of each of the plurality of conductive elements being electrically connected to a pad of a first portion of the plurality of conductive pads;
a plurality of electronic components, each electronic component having a first end and a second end, the first end of each of the plurality of electronic components being electrically connected to a pad of the first portion of the plurality of conductive pads and the second end of each of the plurality of electronic components being electrically connected to a pad of a second portion of the plurality of conductive pads; and
a plurality of vias, each of the plurality of vias passing through a conductive pad of the second portion of the plurality of conductive pads and a conductive trace of the plurality of conductive traces.
2. The electronic assembly of claim 1, wherein the first portion of the plurality of conductive pads are free of vias.
3. The electronic assembly of claim 1, wherein the plurality of electronic components are disposed adjacent the housing.
4. The electronic assembly of claim 1, wherein the housing comprises a plurality of recesses and each of the plurality of electronic components is partially disposed within a recess of the plurality of recesses.
5. The electronic assembly of claim 1, wherein each of plurality of electronic components comprises a surface mount component.
6. The electronic assembly of claim 5, wherein each of plurality of electronic components comprises a capacitor.
7. The electronic assembly of claim 5, wherein each of plurality of electronic components comprises a resistor.
8. The electronic assembly of claim 1, wherein:
the electrical connector comprises a plurality of wafer assemblies, each wafer subassembly comprising a portion of the housing and a portion of the plurality of conductive elements; and each of the plurality of electronic components is disposed between two adjacent wafer assemblies of the plurality of wafer assemblies.
9. An electrical connector comprising:
a housing having a surface;
a plurality of conductive elements each having an intermediate portion disposed within the housing and a contact tail extending from the housing adjacent the surface; and
a plurality of electronic components separately formed from one another and attached to the surface of the housing, each of the plurality of electronic components comprising a conductive surface, and each of the plurality of components being disposed with the conductive surface adjacent a contact tail of a conductive element of the plurality of conductive elements.
10. The electrical connector of claim 9, wherein the conductive surface of each of the plurality of electronic components comprises a solder-wettable surface.
11. The electrical connector of claim 10, wherein:
each of the plurality of electronic components comprises a first end and a second end;
the conductive surface of each of the plurality of electronic components is a first conductive surface positioned at the first end of the electronic component; and
each of the plurality of electronic components comprises a second conductive surface positioned at the second end of the electronic component.
12. The electrical connector of claim 11, wherein each of the plurality of electronic components is a surface mount capacitor.
13. The electrical connector of claim 12 in combination with a printed circuit board, wherein:
the printed circuit board comprises a surface and a first plurality of conductive pads and a second plurality of pads disposed on the surface, each of the second plurality of pads being positioned adjacent a pad of the first plurality of pads;
a contact tail of a conductive element of the plurality of conductive elements is soldered to a pad of the first plurality of pads; and
a first conductive surface of an electronic component of the plurality of electronic components is soldered to a pad of the first plurality of pads and a second conductive surface of the electronic component is soldered to a pad of the second plurality of pads.
14. The electrical connector in the combination of claim 13, wherein:
the printed circuit board comprises a plurality of conductive structures within the printed circuit board and a plurality of vias providing an electrical connection from the surface to a structure of the plurality of conductive structures;
each pad of the second plurality of pads has a via of the plurality of vias passing therethrough; and
each pad of the first plurality of pads has no via passing therethrough.
15. The electrical connector in the combination of claim 14, wherein:
the plurality of conductive structures comprise signal traces and ground layers; and
each of the plurality of vias provides a connection to a signal trace.
16. The electrical connector of claim 12, wherein each of the surface mount capacitors is an 0201 surface mount capacitor.
17. The electrical connector of claim 9, wherein each of the plurality of electronic components is attached to the housing with an adhesive.
18. The electrical connector of claim 9, wherein the housing comprises a plurality of recesses and each of the plurality of electronic components is at least partially disposed within a recess of the plurality of recesses.
19. The electrical connector of claim 18, wherein:
the electrical connector comprises a plurality of subassemblies, each subassembly comprising a housing portion and at least one column of conductive elements, the housing portion comprising a subset of the plurality of recesses, each recess of the subset being disposed adjacent a contact tail of a conductive element of the column; and
the first end of an electronic component of the plurality of electronic components is disposed within a recess of the subset.
20. The electrical connector of claim 9, wherein:
the plurality of conductive elements comprises a plurality of differential pairs; and
the plurality of conductive elements is each disposed with the conductive surface adjacent a contact tail of a conductive element of a differential pair of the plurality of differential pairs.
21. The electrical connector of claim 9, wherein:
the housing comprises a plurality of members, each of the plurality of members being adapted and configured to clip an electronic component of the plurality of electronic components to the housing in a position in which the conductive surface of the electronic component is adjacent a contact tail of a conductive element of the plurality of conductive elements.
22. The electrical connector of claim 9, wherein the plurality of electronic components are electrically isolated from the plurality of conductive elements.
23. A printed circuit board comprising a component footprint, the component footprint comprising:
a plurality of columns, each column comprising:
a plurality of first pairs of conductive pads disposed on a surface of the printed circuit board, each first pair comprising two adjacent pads and a via disposed in each pad;
a plurality of second pairs of conductive pads disposed on the surface of the printed circuit board, each second pair comprising two pads, wherein each of the second pairs of conductive pads comprises two adjacent pads without a via disposed in either pad; and
a plurality of conductive strips disposed on the surface of the printed circuit board, each conductive strip being disposed between two adjacent first pairs of conductive pads and between two adjacent second pairs of conductive pads.
24. The printed circuit board of claim 23, wherein each of the two adjacent pads of each second pair of conductive pads is adapted to electrically receive a conductive region of a capacitor.
25. The printed circuit board of claim 23, wherein one of the two adjacent pads of each second pair of conductive pads is adapted to electrically receive both a conductive region of a capacitor and a contact tail of an electrical connector.
26. The printed circuit board of claim 23, in combination with an electrical connector and a plurality of capacitors, wherein:
a capacitor of the plurality of capacitors is connected to a pad of the first plurality of pairs of pads and a pad of the second plurality of pairs of pads; and
a contact tail of the electrical connector is connected to each pad of the second plurality of pairs of pads.
27. An electrical connector comprising:
a housing having a surface;
a plurality of conductive elements each having an intermediate portion disposed within the housing and a contact tail extending from the housing adjacent the surface;
a plurality of electronic components attached to the surface of the housing, wherein each of the plurality of electronic components is electrically isolated from the plurality of conductive elements, and each of the plurality of components is disposed with the conductive surface adjacent a contact tail of a conductive element of the plurality of conductive elements.
28. The electrical connector of claim 27, wherein the plurality of electronic components comprise a plurality of surface mount components separately formed from one another.
29. The electrical connector of claim 27, wherein the plurality of electronic components are attached to the surface of the housing by a retention mechanism.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A lithographic apparatus comprising:
an illumination system configured to condition a beam of extreme ultra-violet radiation;
a support configured to hold a reflective patterning device, the reflective patterning device configured to impart a pattern to the beam of extreme ultra-violet radiation;
a substrate table configured to hold a substrate;
a projection system configured to project the patterned beam of extreme ultra-violet radiation onto a target portion of the substrate; and
a masking device configured to control illumination of the reflective patterning device by the beam of extreme ultra-violet radiation, the masking device comprising a masking blade including a masking edge configured to delimit a boundary of an illumination region on the reflective patterning device, and a masking surface having a plurality of facet surfaces, wherein each of the facet surfaces is inclined in a first direction at an angle greater than a maximum angle subtended by radiation that can be captured by the projection system to reflect a portion of the beam of extreme ultra-violet radiation incident on the masking blade such that the reflected extreme ultra-violet radiation is not captured by the projection system.
2. The apparatus of claim 1, wherein the masking surface comprises a plurality of facet portions, each facet portion comprising a first facet surface and a second facet surface of the plurality of facet surfaces arranged to converge at a point that protrudes in a direction away from the masking surface, wherein the first facet surface is inclined in the first direction at the angle greater than the maximum angle subtended by radiation that can be captured by the projection system.
3. The apparatus of claim 2, wherein the second facet surface is inclined in a second direction at an angle greater than the maximum angle subtended by radiation that can be captured by the projection system.
4. The apparatus of claim 2, wherein the facet portions comprise three or more facet surfaces.
5. The apparatus of claim 4, wherein the three or more facet surfaces are each configured to reflect the radiation towards a different beam dump.
6. The apparatus of claim 1, wherein the masking edge is inclined at an inclination angle greater than a certain angle, the inclination angle being such that at least a portion of radiation reflected from the masking edge falls outside the angular capture range of the projection system.
7. The apparatus of claim 6, wherein the certain angle is the maximum angle subtended by radiation that can be captured by the projection system.
8. The apparatus of claim 6, wherein when the certain angle is the sum of the maximum angle subtended by radiation that can be captured by the projection system and a centroid angle of incidence for radiation incident on the masking edge.
9. The apparatus of claim 1, wherein the masking blade comprises a metallic material.
10. The apparatus of claim 9, wherein the metallic material is titanium.
11. The apparatus of claim 1, wherein the masking blade is configured to reflect the radiation towards the illumination system.
12. The apparatus of claim 1, wherein the masking blade is configured to reflect the radiation towards a beam dump.
13. A method of controlling reflection of extreme ultra-violet radiation in a lithographic apparatus, the method comprising:
projecting a beam of extreme ultra-violet radiation toward a reflective patterning device of the lithographic apparatus; and
using a masking blade including a masking edge configured to delimit a boundary of an illumination region on the reflective patterning device and disposed before the reflective patterning device in the optical path of the beam of extreme ultra-violet radiation to reflect at least a portion of the extreme ultra-violet radiation at an angle which is equal to or greater than a certain angle, such that at least a portion of the reflected extreme ultra-violet radiation is not captured by a projection system of the lithographic apparatus, wherein the masking blade further includes a masking surface having a plurality of facet surfaces, each of the facet surfaces is inclined in a first direction at an angle greater than a maximum angle subtended by radiation that can be captured by the projection system to reflect a portion of the beam of extreme ultra-violet radiation incident on the masking blade such that the reflected extreme ultra-violet radiation is not captured by the projection system.
14. A masking device for a reflective patterning device in a lithographic apparatus, the masking device comprising a masking blade including a masking edge configured to delimit a boundary of an illumination region on the reflective patterning device and a masking surface having a plurality of facet surfaces, wherein each of the facet surfaces is inclined in a first direction at an angle greater than a maximum angle subtended by radiation that can be captured by a projection system of the lithographic apparatus to reflect extreme ultra-violet radiation such that at least a portion of the reflected extreme ultra-violet radiation falls outside an angular capture range of captured by the projection system of the lithographic apparatus.