Author: claimsbot

1. A method of forming an etch mask above a semiconductor device, the method comprising:
forming an opening in a mask layer formed above at least one further mask layer and a material layer to be patterned, said opening extending through said mask layer and exposing a surface of a first layer formed below said mask layer;
performing a selective deposition process by initiating selective growth of material on an exposed sidewall surface of said mask layer so as to reduce a width of said opening from a first width to a second width while maintaining exposure of at least a portion of said previously exposed surface of said first layer, wherein during said selective deposition process said material is formed only on said exposed sidewall surface of said mask layer and not on an upper surface of said mask layer; and
patterning said at least one further mask layer by using said opening having said reduced width.
2. The method of claim 1, wherein forming said opening comprises forming a resist mask above said mask layer and using said resist mask as an etch mask when etching through said mask layer.
3. The method of claim 2, wherein said resist mask is formed on said mask layer.
4. The method of claim 2, wherein not forming said material on said upper surface of said mask layer comprises maintaining said resist mask above said mask layer.
5. The method of claim 1, wherein patterning said at least one further mask layer comprises forming a tapered opening in at least one of said at least one further mask layer.
6. The method of claim 1, further comprising forming a resist mask and at least one further mask layer above said mask layer and patterning said at least one further mask layer by using said resist mask.
7. The method of claim 1, wherein performing a selective deposition process comprises establishing a gaseous atmosphere.
8. The method of claim 1, wherein performing a selective deposition process comprises performing a wet chemical deposition process.
9. The method of claim 1, further comprising forming an initialization layer at least on said exposed surface after forming said mask layer and using said initialization layer for initiating said selective growth.
10. The method of claim 1, wherein said reduced width is adjusted to 100 nm or less.
11. The method of claim 1, wherein not forming said material on said upper surface of said mask layer comprises performing a surface treatment on said exposed sidewall surface of said mask layer prior to initiating said selective growth of said material on said exposed sidewall surface.
12. A method, comprising:
providing a material layer above a substrate of a semiconductor device;
forming a mask layer stack above said material layer, said mask layer stack comprising a first mask layer and a second mask layer formed above said first mask layer;
forming a first mask opening in said first mask layer by using a second mask opening formed in said second mask layer;
reducing a width of said first mask opening by performing a selective deposition process and using an exposed sidewall surface of said first mask layer to initiate said selective deposition process, wherein during said selective deposition process said material is formed only on said exposed sidewall surface of said first mask layer and not on an upper surface of said first mask layer; and
patterning said material layer by using said first mask opening having said reduced width as an etch mask.
13. The method of claim 12, wherein patterning said material layer comprises etching into said material layer in the presence of said first mask layer.
14. The method of claim 12, wherein said second mask layer is provided as a radiation sensitive material and is formed on said first mask layer.
15. The method of claim 12, further comprising forming at least one further mask layer between said first mask layer and said second mask layer.
16. The method of claim 12, wherein patterning said material layer comprises forming one of a contact opening and a via opening in said material layer.
17. The method of claim 12, wherein providing said material layer comprises providing a semiconductor layer above said substrate.
18. The method of claim 12, wherein said selective deposition process is performed in the presence of said second mask layer.
19. The method of claim 12, wherein not forming said material on said upper surface of said first mask layer comprises maintaining said second mask layer above said first mask layer.
20. The method of claim 12, wherein not forming said material on said upper surface of said first mask layer comprises performing a surface treatment on said exposed sidewall surface of said first mask layer prior to performing said selective deposition process.
21. A method, comprising:
forming a mask layer above a material layer to be patterned, said material layer being formed above a substrate of a semiconductor device;
forming a resist mask above said mask layer, said resist mask comprising a resist opening;
forming a mask opening in said mask layer through said resist opening, said mask opening exposing a sidewall surface of said mask layer;
growing a material selectively on said exposed sidewall surface in said mask opening to reduce a width of said mask opening while maintaining said resist mask above said mask layer; and
patterning said material layer on the basis of said mask opening having said reduced width.
22. A method, comprising:
forming a mask layer above a material layer to be patterned, said material layer being formed above a substrate of a semiconductor device;
forming a resist mask above said mask layer, said resist mask comprising a resist opening;
forming a mask opening in said mask layer through said resist opening, said mask opening exposing a sidewall surface of said mask layer;
growing a material selectively on said exposed sidewall surface in said mask opening to reduce a width of said mask opening without forming said material on an upper surface of said mask layer; and
patterning said material layer on the basis of said mask opening having said reduced width, wherein patterning said material layer on the basis of said mask opening having said reduced width comprises patterning at least one further mask layer by using said first mask layer and etching into said material layer by using at least said at least one further mask layer as an etch mask.
23. The method of claim 22, wherein not forming said material on said upper surface of said mask layer comprises performing a surface treatment on said exposed sidewall surface of said mask layer prior to growing said material selectively on said exposed sidewall surface.
24. A method, comprising:
forming a mask layer above a material layer to be patterned, said material layer being formed above a substrate of a semiconductor device;
forming a resist mask above said mask layer, said resist mask comprising a resist opening;
forming a mask opening in said mask layer through said resist opening, said mask opening exposing a sidewall surface of said mask layer;
growing a material selectively on said exposed sidewall surface in said mask opening to reduce a width of said mask opening while preventing said material from being formed on an upper surface of said mask layer; and
patterning said material layer on the basis of said mask opening having said reduced width, wherein patterning said material layer comprises forming an opening in said material layer so as to extend to one of a contact region of a semiconductor-based circuit feature and a metal region of a metallization system of said semiconductor device.
25. The method of claim 24, wherein preventing said material from being formed on said upper surface of said mask layer comprises maintaining said resist mask above said mask layer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A pad assembly for mounting a current generator for applying a therapeutic electrical current to an area of human skin, comprising:
a pad comprising a thin, flexible plastic film having electrical paths printed on an underside thereof with electrically conductive ink, each of which paths include a terminal and a contact for connection to a current generator, the pad further having a pair of layers of an electrically conductive adhesive disposed over the terminals at spaced positions for conducting electrical current to human skin underlying the terminals; and
a fixture secured to the pad configured for mounting a current generator on the fixture a manner effective to conduct current from the current generator to the terminals of the pad.
2. The pad assembly of claim 1, wherein the thin, flexible plastic film is made of a material selected from the group consisting of vinyl, rubber, nylon, polyester, polypropylene and polyethylene.
3. The pad assembly of claim 2, wherein the thin, flexible plastic film is made of vinyl.
4. The pad assembly of claim 3, wherein the thin, flexible plastic film has a thickness in the range of about 0.001 to 0.125 inch.
5. The pad assembly of claim 1, wherein the thin, flexible plastic film has a pair of wings extending from a midportion having a central opening therethrough, and the fixture is configured for mounting over the central opening.
6. The pad assembly of claim 1, wherein the electrically conductive adhesive is a hydrogel.
7. The pad assembly of claim 1, wherein the thin, flexible plastic film is transparent and has a layer of underprinting thereon readable through the transparent film.
8. A pad assembly for mounting a current generator for applying a therapeutic electrical current to an area of human skin, comprising:
a pad comprising a thin, flexible, stretchable plastic film that conforms to human skin having a pair of wings extending from a midportion having a central opening therethrough;
a pair of first electrical paths disposed on an underside of the pad, each of which paths include a inner contact proximate the central opening for connection to a current generator, a terminal on one of the wings, and a connecting portion extending from the inner contact to the terminal;
a pair of layers of electrically conductive adhesive covering the terminals for conducting electrical current to an area of human skin underlying the terminals, and for replaceably securing the pad assembly to human skin; and
a fixture mounted on the pad over the central opening, the fixture including portions disposed on opposite sides of the central opening, means for securing a current generator to the fixture, and means for conducting current from the current generator to the inner contacts of the first paths.
9. The pad assembly of claim 8, wherein the thin, flexible plastic film is made of a material selected from the group consisting of vinyl, rubber, nylon, polyester, polypropylene and polyethylene, and has a thickness in the range of about 0.001 to 0.125 inch, the first electrical paths are printed on an underside of the thin, flexible plastic film with an electrically conductive ink, and the electrically conductive adhesive is a hydrogel.
10. The pad assembly of claim 8, further comprising a layer of dielectric material covering the connecting portion of each path.
11. The pad assembly of claim 8, wherein the means for conducting current from the current generator to the inner contacts of the first paths comprises a reversing sheet of plastic film having a second pair of electrical paths formed on one side thereof, wherein each second path is configured for face to face contact with the inner contact of one of the first paths and with a contact of the current generator extending into the central opening of the pad.
12. The pad assembly of claim 1 1, wherein the fixture further comprises a base having a set of pins extending from an inner face thereof and a mount having openings on an inner face thereof for receiving the pins of the base, whereby the pins extend through aligned holes in the pad and in the sheet of plastic film having the second pair of electrical paths thereon, whereby the fixture clamps the reversing sheet to the pad from opposite sides of the pad.
13. The pad assembly of claim 12, wherein the mount has a series of L-shaped projections on an outer face thereof configured for mechanical engagement with the current generator for removably securing the current generator to the mount.

1. A printing system comprising:
a media feed assembly for feeding different sizes of media along a media path, the media path having a width corresponding to a maximum width of media that can be printed by the printing system;
a printhead assembly positioned on a first side of the media path and spanning the width of the media path;
an aerosol collection duct with an opening on the first side of the media path; and,
a spittoon system positioned on a second side of the media path opposing the first side; wherein,
the printhead assembly is configured to eject non-printing ink drops from any section not required to print media that is less than the maximum width, and the spittoon system is configured to collect the non-printing ink drops.
2. The printing system according to claim 1 wherein the media feed assembly feeds media along the media path in a media feed direction and the printhead assembly has a plurality of printheads arranged into a group of leading printheads and a group of trailing printheads, the leading printheads being upstream of the trailing printheads with respect to the media feed direction.
3. The printing system according to claim 2 wherein the opening of the aerosol collection duct is downstream of the trailing printheads.
4. The printing system according to claim 3 wherein the spittoon system is at least one service module operating in a spittoon mode.
5. The printing system according to claim 4 further comprising a plurality of the service modules, one of the service modules being provided for each of the printheads respectively wherein during use, any of the printheads not fully required to print media that is less than the maximum width, have the corresponding service module operating in the spittoon mode.
6. The printing system according to claim 5 wherein the service modules are configured to operate in a platen mode when all the corresponding printhead is printing the media.
7. The printing system according to claim 5 wherein the service modules are independently operable.
8. The printing system according to claim 7 wherein the printhead assembly has a plurality of printheads positioned to span the media path, each of the service modules configured to service one of the printheads respectively.
9. The printing system according to claim 8 further comprising a platen having an apertured platen face, wherein the service modules are positioned for accessing the printheads through the apertured platen face.
10. The printing system according to claim 9 wherein the apertured platen face has an aperture for each one of the plurality of service modules respectively.
11. The printing system according to claim 10 wherein one of the modes is a capping mode for use when the printhead corresponding to the service module is inactive.
12. The printing system according to claim 10 wherein one of the modes is a priming mode for use when the printhead corresponding to the service module is a newly installed replacement printhead.
13. The printing system according to claim 12 wherein the service modules that do not correspond to the newly installed replacement printhead are configured to operate in the capping mode while the newly installed replacement printhead is primed.
14. The printing system according to claim 1 further comprising:
a drive roller configured to engage and push media into a print zone; and,
a movable media engagement assembly configured to engage one side of the media and pull the media while the drive roller remains engaged with the media.
15. The printing system according to claim 14 wherein the movable media engagement assembly has an apertured surface that has a media engagement side and low pressure region at a side opposite the media engagement side.
16. The printing system according to claim 15 wherein the movable media engagement assembly has a vacuum belt configured to receive the media from the print zone.
17. The printing system according to claim 16 wherein the drive roller is configured to control a media translation speed until the media disengages from the drive roller.
18. The printing system according to claim 17 wherein the vacuum belt is configured to control the media transport speed subsequent to disengagement of the media from the drive roller.
19. The printing system according to claim 9 further comprising a media encoder positioned in the platen and configured to produce timing signals for operating the printhead assembly.
20. The printing system according to claim 16 further comprising a scanner adjacent the vacuum belt to capture information from the media for feedback control of the pagewidth printhead assembly.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A restraining net launching device comprising:
a planar restraining net which is tightly packed into a cylindrical shape having an outside portion, said restraining net when planar including a perimeter which is heavier than a remainder of said net;
a launcher in which said packed net is loaded and from which said packed net is launched along a longitudinal axis of said launcher, said launcher including rifling which engages the outside portion of said packed net during launching; and
a source of propelling gas for propelling said tightly packed restraining net out of said launcher during launching such that the rifling of said launcher engaging the outside portion causes said tightly packed restraining net to rotate about the longitudinal axis and unfurl after exiting said launcher with the heavier perimeter radially outermost.
2. A restraining net launching device as claimed in claim 1:
wherein said launcher includes
a) an elongate launch cup in which said packed net is located, said launch cup including a rear wall, an open front, an elongate barrel wall extending between said rear wall and said open front, and rifling along an interior surface of said barrel wall, and
b) a hollow extension projecting from the rear wall of said launch cup; and
wherein said source of propelling gas is a muzzle to which said extension of said launch cup is attached for transferring propelling gas formed in said muzzle into an area adjacent the rear wall of said launch cup.
3. A restraining net launching device as claimed in claim 2, wherein said launcher further includes a gas seal member in said launch cup located between said packed net and said rear wall of said launch cup.
4. A restraining net launching device as claimed in claim 1:
wherein said launcher includes
a) a gun barrel having a rifled bore and a rear breech, and
b) a cartridge case in which said packed net is located and which is received in said breech said cartridge case, said cartridge case including a rear wall and an open front; and
wherein said source of propelling gas is a charge provided in said cartridge case between said packed net and said rear wall.
5. A restraining net launching device as claimed in claim 4, wherein said launcher further includes a gas seal member located between said packed net and said charge.
6. A restraining net launching device as claimed in claim 4, wherein said cartridge case further includes a protective cap which covers the open front thereof.
7. A restraining net launching device as claimed in claim 1:
wherein said launcher includes
a) a gun barrel having a smooth bore and a rear breech, and
b) a cartridge case in which said packed net is located and which is received in said breech, said cartridge case including a rear wall, an open front, and rifling along an interior wall of said cartridge case between said rear wall and said open front; and
wherein said source of propelling gas is a charge provided in said cartridge case between said packed net and said rear wall.
8. A restraining net launching device as claimed in claim 7, wherein said launcher further includes a gas seal member located between said packed net and said charge.
9. A restraining net launching device as claimed in claim 7, wherein said cartridge case further includes a protective cap which covers the open front thereof.