Author: claimsbot

We claim:

1. A connection assembly, comprising:
a shaft having a first end, said first end defining a cross section having a polygon shape and further defining an outward projection; and
a flange defining a recess having a shape complimentary to said polygon shape of said first end of said shaft, a ridge, and an inward projection opposite said ridge, said ridge and said inward projection cooperatively defining a groove;
wherein said recess rotationally retains said first end of said shaft and said ridge and said inward projection cooperatively axially retain said outward projection in said groove.
2. A connection assembly according to claim 1, wherein said polygon shape of said first end is a member selected from the group consisting of a triangle, a square, a pentagon, a hexagon, a heptagon, and an octagon.
3. A connection assembly according to claim 1, wherein said polygon shape defines convex sides.
4. A connection assembly according to claim 1, wherein said polygon shape defines concave sides.
5. A connection assembly according to claim 1, wherein said outward projection extends continuously around the perimeter of said polygon shape of said first end of said shaft.
6. A connection assembly according to claim 1, wherein said shape of said recess is a member selected from the group consisting of a triangle, a square, a pentagon, a hexagon, a heptagon and an octagon.
7. A connection assembly according to claim 1, wherein said recess defines convex sides.
8. A connection assembly according to claim 1, wherein said recess defines concave sides.
9. A connection assembly according to claim 1, wherein said ridge extends continuously around the perimeter of said recess.
10. A connection assembly according to claim 1, wherein said inward projection extends continuously around the perimeter of said recess.
11. A connection assembly according to claim 1, wherein said groove extends continuously around the perimeter of said recess.
12. A connection assembly according to claim 1, wherein said outward projection defines a first angular surface.
13. A connection assembly according to claim 12, wherein said inward projection defines a second angular surface complimentary to said first angular surface, such that said inward projection, said groove, and said ridge are in continuous contact with said outward projection.
14. A connection assembly, comprising:
a shaft having a first end, said first end defining a cross section having a polygon shape and further defining a circumferential outward projection;
a flange defining a recess having a shape complimentary to said polygon shape of said first end, a circumferential ridge, a circumferential inward projection opposite said ridge, said ridge and said inward projection cooperatively defining a circumferential groove;
wherein said recess rotationally retains said first end of said shaft, and said circumferential ridge and said circumferential inward projection cooperatively axially retain said outward projection in said circumferential groove.
15. The connection assembly of claim 14, wherein said polygon shape of said first end is a member selected from the group consisting of a triangle, a square, a pentagon, a hexagon, a heptagon, and an octagon.
16. A connection assembly according to claim 14, wherein said polygon shape defines convex or concave sides.
17. A connection assembly according to claim 14, wherein said polygon shape defines concave sides.
18. The connection assembly of claim 14, wherein said shape of said recess is a member selected from the group consisting of a triangle, a square, a pentagon, a hexagon, a heptagon, and an octagon.
19. A connection assembly according to claim 14, wherein said recess defines convex sides.
20. A connection assembly according to claim 14, wherein said recess defines concave sides.
21. A connection assembly according to claim 14, wherein said outward projection defines a first angular surface.
22. A connection assembly according to claim 21, wherein said inward projection defines a second angular surface complimentary to said first angular surface, such that said inward projection, and said ridge are in continuous contact with said outward projection.
23. A method of connecting a shaft and a flange, comprising:
providing a shaft having a terminus that defines a polygon shape and an outward projection;
providing a flange having a recess adapted to receive the polygon shape, a ridge, and an upwardly extending projection;
inserting the terminus into the recess such that the outward projection is in continuous contact with the ridge; and
clamping the upwardly extending projection over the outward projection so as to form an inward projection to axially retain the flange and shaft.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. (canceled)
2. (canceled)
3. A defect inspecting method, comprising the steps of:
detecting a plurality of defects of a semiconductor device on a substrate, and selecting desired defects from among said defects, and selecting, from among said defects, indicator defects that are easily detectable from among said plurality of defects in accordance with attribute of the defects detected by an observing apparatus; and
observing said indicator defects by said observing apparatus in accordance with said attribute of said indicator defects, and detecting said desired defects in accordance with coordinates of said indicator defects.
4. The defect inspecting method as claimed in claim 3, wherein said attribute is one of at least dimension, type, scattered light amount, local variation in luminance, and profile configuration of said plurality of defects.
5. A defect inspecting system comprising:
a defect selecting unit for selecting desired defects from among a plurality of defects of a semiconductor device on a substrate detected by a defect inspecting apparatus, and selecting, from among said defects, indicator defects that are easily detectable from among said plurality of defects in accordance with attribute of the defects detected by an observing apparatus, said defect inspecting apparatus detecting said defects of a sample, said observing apparatus observing said defects;
a memory unit for storing a correlated relationship between defects’ position-coordinates defined by said defect inspecting apparatus and said defects’ position-coordinates defined by said observing apparatus;
a coordinate-correspondence determining unit for coordinate-transforming position-coordinates of said indicator defects with the use of said correlated relationship so as to calculate transformed position-coordinates of said indicator defects, said indicator defects being detected by said observing apparatus in accordance with said attribute; and
communications means for connecting communications among said defect selecting unit, said memory unit, and said coordinate-correspondence determining unit.
6. The defect inspecting system as claimed in claim 5, wherein said attribute is one of at least dimension, type, scattered light amount, local variation in luminance, and profile configuration of said plurality of defects.

1. A chip-type electronic component comprising:
a ceramic element body;
a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each other;
a first external connection conductor which is arranged on an external surface of the ceramic element body and to which the plurality of first internal electrodes are connected;
a second external connection conductor which is arranged on the external surface of the ceramic element body and to which the plurality of second internal electrodes are connected;
first and second terminal electrodes arranged on the external surface of the ceramic element body;
a first internal connection conductor arranged in the ceramic element body and connecting the first external connection conductor and the first terminal electrode; and
a second internal connection conductor arranged in the ceramic element body and connecting the second external connection conductor and the second terminal electrode,
wherein the number of the first internal connection conductor is set to be smaller than the number of the first internal electrodes, and
wherein the number of the second internal connection conductor is set to be smaller than the number of the second internal electrodes.
2. The chip-type electronic component according to claim 1,
wherein the ceramic element body has first and second principal faces opposed to each other as the external surface, and
wherein the first and second external connection conductors are arranged on the first principal face and the first and second terminal electrodes are arranged on the second principal face.
3. The chip-type electronic component according to claim 1,
wherein the ceramic element body is comprised of a plurality of ceramic layers laminated together, and
wherein the first and second principal faces are parallel to a laminate direction of the plurality of ceramic layers.
4. The chip-type electronic component according to claim 1,
wherein the ceramic element body is comprised of a plurality of ceramic layers laminated together,
wherein a length of the first external connection conductor in a laminate direction of the plurality of ceramic layers is set to be larger than a length of the first terminal electrode in the laminate direction of the plurality of ceramic layers, and
wherein a length of the second external connection conductor in the laminate direction of the plurality of ceramic layers is set to be larger than a length of the second terminal electrode in the laminate direction of the plurality of ceramic layers.
5. The chip-type electronic component according to claim 1, further comprising:
a plurality of third and fourth internal electrodes arranged alternately in the ceramic element body so as to be opposed at least in part to each other;
a third external connection conductor which is arranged on the external surface of the ceramic element body and to which the plurality of third internal electrodes are connected;
a fourth external connection conductor which is arranged on the external surface of the ceramic element body and to which the plurality of fourth internal electrodes are connected;
third and fourth terminal electrodes arranged on the external surface of the ceramic element body;
a third internal connection conductor arranged in the ceramic element body and connecting the third external connection conductor and the third terminal electrode; and
a fourth internal connection conductor arranged in the ceramic element body and connecting the fourth external connection conductor and the fourth terminal electrode,
wherein the second external connection conductor and the fourth external connection conductor are integrally formed.
6. The chip-type electronic component according to claim 5,
wherein the ceramic element body is comprised of a plurality of ceramic layers laminated together,
wherein a length of the third external connection conductor in a laminate direction of the plurality of ceramic layers is set to be larger than a length of the third terminal electrode in the laminate direction of the plurality of ceramic layers, and
wherein a length of the fourth external connection conductor in the laminate direction of the plurality of ceramic layers is set to be larger than a length of the fourth terminal electrode in the laminate direction of the plurality of ceramic layers.
7. The chip-type electronic component according to claim 1,
wherein the first and second principal faces are parallel to a direction in which the first internal electrodes and the second internal electrodes are opposed.
8. The chip-type electronic component according to claim 1,
wherein a length of the first external connection conductor in a direction in which the first internal electrodes and the second internal electrodes are opposed is set to be larger than a length of the first terminal electrode in the direction in which the first internal electrodes and the second internal electrodes are opposed, and
wherein a length of the second external connection conductor in the direction in which the first internal electrodes and the second internal electrodes are opposed is set to be larger than a length of the second terminal electrode in the direction in which the first internal electrodes and the second internal electrodes are opposed.
9. The chip-type electronic component according to claim 5,
wherein a length of the third external connection conductor in a direction in which the third internal electrodes and the fourth internal electrodes are opposed is set to be larger than a length of the third terminal electrode in the direction in which the third internal electrodes and the fourth internal electrodes are opposed, and
wherein a length of the fourth external connection conductor in the direction in which the third internal electrodes and the fourth internal electrodes are opposed is set to be larger than a length of the fourth terminal electrode in the direction in which the third internal electrodes and the fourth internal electrodes are opposed.
10. A chip-type electronic component comprising:
a ceramic element body comprised of a plurality of ceramic layers laminated together;
a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each other;
a first external connection conductor which is arranged on an external surface of the ceramic element body and to which the plurality of first internal electrodes are connected;
a second external connection conductor which is arranged on the external surface of the ceramic element body and to which the plurality of second internal electrodes are connected;
first and second terminal electrodes arranged on the external surface of the ceramic element body;
a first internal connection conductor arranged in the ceramic element body and connecting the first external connection conductor and the first terminal electrode; and
a second internal connection conductor arranged in the ceramic element body and connecting the second external connection conductor and the second terminal electrode,
wherein the number of the first internal connection conductor is set to be smaller than the number of the first internal electrodes, and
wherein the number of the second internal connection conductor is set to be smaller than the number of the second internal electrodes.
11. The chip-type electronic component according to claim 10,
wherein the ceramic element body has first and second principal faces opposed to each other as the external surface, and
wherein the first and second external connection conductors are arranged on the first principal face and the first and second terminal electrodes are arranged on the second principal face.
12. The chip-type electronic component according to claim 11,
wherein the first and second principal faces are parallel to a laminate direction of the plurality of ceramic layers.
13. The chip-type electronic component according to claim 10,
wherein a length of the first external connection conductor in a laminate direction of the plurality of ceramic layers is set to be larger than a length of the first terminal electrode in the laminate direction of the plurality of ceramic layers, and
wherein a length of the second external connection conductor in the laminate direction of the plurality of ceramic layers is set to be larger than a length of the second terminal electrode in the laminate direction of the plurality of ceramic layers.
14. The chip-type electronic component according to claim 10, further comprising:
a plurality of third and fourth internal electrodes arranged alternately in the ceramic element body so as to be opposed at least in part to each other;
a third external connection conductor which is arranged on the external surface of the ceramic element body and to which the plurality of third internal electrodes are connected;
a fourth external connection conductor which is arranged on the external surface of the ceramic element body and to which the plurality of fourth internal electrodes are connected;
third and fourth terminal electrodes arranged on the external surface of the ceramic element body;
a third internal connection conductor arranged in the ceramic element body and connecting the third external connection conductor and the third terminal electrode; and
a fourth internal connection conductor arranged in the ceramic element body and connecting the fourth external connection conductor and the fourth terminal electrode,
wherein the second external connection conductor and the fourth external connection conductor are integrally formed.
15. The chip-type electronic component according to claim 14,
wherein a length of the third external connection conductor in a laminate direction of the plurality of ceramic layers is set to be larger than a length of the third terminal electrode in the laminate direction of the plurality of ceramic layers, and
wherein a length of the fourth external connection conductor in the laminate direction of the plurality of ceramic layers is set to be larger than a length of the fourth terminal electrode in the laminate direction of the plurality of ceramic layers.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A multilayer optical film comprising:
at least a first layer and a second layer, wherein the first layer comprises a wave plate having a refractive index profile of nx>ny\u2267nz; and, the second layer comprises a fluoropolymer comprising a moiety of
wherein R1, R2, and R3 are each independently hydrogen atoms, alkyl groups, substituted alkyl groups, or halogens, wherein at least one of the R1, R2, and R3 is a fluorine atom, wherein R is each independently a substituent on the styrenic ring, n is an integer from 0 to 5 representing the number of the substituents on the styrenic ring, and wherein nx and ny represent in-plane refractive indices and nz represents a thickness-direction refractive index of the wave plate;
wherein the multilayer optical film has a positive in-plane retardation (Re) and an out-of-plane retardation (Rth) that satisfies the equation of |Rth|<Re2 throughout a wavelength range of 400 nm to 800 nm.
2. The multilayer optical film of claim 1, wherein the substituent R on the styrenic ring is selected from the group comprising alkyl, substituted alkyl, halogen, hydroxyl, carboxyl, nitro, alkoxy, amino, sulfonate, phosphate, acyl, acyloxy, phenyl, alkoxycarbonyl, and cyano.
3. The multilayer optical film of claim 1, wherein the wave plate is an A-plate having a refractive index profile of nx\u2267ny=nz.
4. The multilayer optical film of claim 1, wherein the wave plate is a quarter wave plate having in-plane retardation (Re) of about 120-160 nm at wavelength (\u03bb) 560 nm.
5. The multilayer optical film of claim 1, wherein the wave plate is a broadband quarter wave plate, having in-plane retardation equal to about \u03bb4 at each wavelength ranging from 400 to 800 nm.
6. The multilayer optical film of claim 1, wherein the wave plate is a biaxial wave plate having a refractive index profile of nx>ny>nz.
7. The multilayer optical film of claim 1, wherein the wave plate is a polymer film selected from the group comprising polycarbonate, cyclic olefin polymer, polyester, cellulose ester, polyacrylate, polyolefin, polysulfone, and polyurethane.
8. The multilayer optical film of claim 1, wherein the fluoropolymer is poly(\u03b1,\u03b2,\u03b2-trifluorostyrene).
9. The multilayer optical film of claim 1, wherein the second layer comprising the fluoropolymer is made by extrusion of a polymer melt.
10. The multilayer optical film of claim 1, wherein the second layer comprising the fluoropolymer is made by solution cast of a polymer solution.
11. The multilayer optical film of claim 1, wherein the second layer comprising the fluoropolymer is uniaxially or biaxially stretched, which satisfies the relation of |nx\u2212ny|>0.001, wherein nx and ny are the in-plane refractive indices of the film.
12. The multilayer optical film of claim 1, wherein the second layer comprising the fluoropolymer is laminated on the wave plate.
13. The multilayer optical film of claim 1, wherein the second layer comprising the fluoropolymer is a coating film cast on the wave plate.
14. The multilayer optical film of claim 1, wherein the second layer comprising the fluoropolymer has a thickness of from 3 to 150 \u03bcm.
15. The multilayer optical film of claim 13, wherein the second layer comprising the fluoropolymer has a thickness of from 3 to 20 \u03bcm.
16. The multilayer optical film of claim 1, whose out-of-plane retardation (Rth) satisfies the equation of |Rth|<100 nm.
17. The multilayer optical film of claim 1, whose out-of-plane retardation (Rth) satisfies the equation of 30 nm |Rth|<100 nm.
18. The multilayer optical film of claim 11, whose out-of-plane retardation (Rth) satisfies the equation of 30 nm |Rth|<100 nm.
19. The multilayer optical film of claim 1, whose out-of-plane retardation (Rth) satisfies the equation of |Rth|<30 nm.
20. The multilayer optical film of claim 11, whose out-of-plane retardation (Rth) satisfies the equation of |Rth|<30 nm.
21. The multilayer optical film of claim 1, whose out-of-plane retardation (Re) of about 120-160 nm at the wavelength (\u03bb) 560 nm.
22. The multilayer optical film of claim 1, whose out-of-plane retardation (Re) of about 120-160 nm at the wavelength (\u03bb) 560 nm and an out-of-plane retardation (Rth) that satisfies the equation of |Rth|<30 nm.
23. The multilayer optical film of claim 1, whose out-of-plane retardation (Re) equal to about \u03bb4 at each wavelength ranging from 400 nm to 800 nm.
24. The multilayer optical film of claim 1, whose out-of-plane retardation (Re) equal to about \u03ba4 at each wavelength ranging from 400 nm to 800 nm and an out-of-plane retardation (Rth) that satisfies the equation of |Rth|<30 nm.
25. A circular polarizer comprising the multilayer optical film of claim 1.
26. A liquid crystal display comprising the multilayer optical film of claim 1.
27. A OLED display comprising the multilayer optical film of claim 1.