Author: claimsbot

1. A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing a substrate;
forming a plurality of traces on the substrate, each trace having an interconnect site with edges parallel to the trace from a plan view for increasing escape routing density; and
forming a plurality of composite interconnects between the interconnect sites and a contact pad on the semiconductor die, each composite interconnect having a wedge shape with a tapered co-linear length along the trace longer than a width across the trace, each composite interconnect having a non-fusible portion connected to the contact pad on the semiconductor die and a fusible portion connected to the interconnect site on the substrate.
2. The method of claim 1, wherein the non-fusible portion of the composite interconnect includes gold, copper, nickel, lead solder, or lead-tin alloy.
3. The method of claim 1, wherein the fusible portion of the composite interconnect includes tin, lead-free alloy, tin-silver alloy, tin-silver-copper alloy, tin-silver-indium alloy, eutectic solder, or tin alloys with silver, copper, or lead.
4. The method of claim 1, wherein the tapered co-linear length of the composite interconnect reduces stress and damage to the semiconductor die.
5. The method of claim 1, further including depositing an underfill material between the semiconductor die and substrate.
6. The method of claim 1, further including forming a finish over the substrate.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing a substrate having a trace with an interconnect site; and
forming a composite interconnect between the interconnect site on the trace and a contact pad on the semiconductor die, the composite interconnect having a tapered co-linear length along the trace longer than a width across the trace, the composite interconnect having a non-fusible portion connected to the contact pad on the semiconductor die and a fusible portion connected to the interconnect site on the trace of the substrate.
8. The method of claim 7, wherein the non-fusible portion of the composite interconnect includes gold, copper, nickel, lead solder, or lead-tin alloy.
9. The method of claim 7, wherein the fusible portion of the composite interconnect includes tin, lead-free alloy, tin-silver alloy, tin-silver-copper alloy, tin-silver-indium alloy, eutectic solder, or tin alloys with silver, copper, or lead.
10. The method of claim 7, wherein the tapered co-linear length of the composite interconnect reduces stress and damage to the semiconductor die.
11. The method of claim 7, wherein a width of the interconnect site under the composite interconnect is no greater than a width of the trace away from the composite interconnect.
12. A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing a substrate having a trace with an interconnect site, wherein the interconnect site has a width less than 1.2 times a width of the trace; and
forming a composite interconnect between the interconnect site on the trace and a contact pad on the semiconductor die, the composite interconnect having a non-fusible portion connected to the contact pad on the semiconductor die and a fusible portion connected to the interconnect site on the trace of the substrate.
13. A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing a substrate having a trace;
forming a composite bump material over an interconnect site on the trace or a contact pad on the semiconductor die, the composite interconnect having a length along the trace longer than a width across the trace, the composite bump material having a fusible portion and a non-fusible portion; and
reflowing the composite bump material to form a composite interconnect between the interconnect site on the substrate and the contact pad on the semiconductor die.
14. The method of claim 13, wherein the non-fusible portion of the composite bump material includes gold, copper, nickel, lead solder, or lead-tin alloy.
15. The method of claim 13, wherein the fusible portion of the composite bump material includes tin, lead-free alloy, tin-silver alloy, tin-silver-copper alloy, tin-silver-indium alloy, eutectic solder, or tin alloys with silver, copper, or lead.
16. The method of claim 13, wherein the composite interconnect is tapered.
17. The method of claim 13, further including:
forming the fusible portion of the composite bump material adjacent to the interconnect site on the trace; and
forming the non-fusible portion of the composite bump material adjacent to the contact pad on the semiconductor die.
18. A semiconductor device, comprising:
a semiconductor die;
a substrate having a trace; and
a composite interconnect formed between an interconnect site on the trace and a contact pad on the semiconductor die, the composite interconnect having a length along the trace longer than a width across the trace, the composite interconnect having a non-fusible portion connected to the contact pad and fusible portion connected to the trace.
19. The semiconductor die of claim 18, wherein the non-fusible portion of the composite interconnect includes gold, copper, nickel, lead solder, or lead-tin alloy.
20. The semiconductor die of claim 18, wherein the fusible portion of the composite interconnect includes tin, lead-free alloy, tin-silver alloy, tin-silver-copper alloy, tin-silver-indium alloy, eutectic solder, or tin alloys with silver, copper, or lead.
21. The semiconductor die of claim 18, wherein the composite interconnect is tapered.
22. The semiconductor die of claim 18, wherein the fusible portion of the composite interconnect is adjacent to the interconnect site on the trace, and the non-fusible portion of the composite interconnect is adjacent to the contact pad on the semiconductor die.
23. The semiconductor die of claim 18, wherein the interconnect site has edges parallel to the trace.
24. A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing a substrate having a trace with an interconnect site; and
forming a composite interconnect between the interconnect site on the trace and a contact pad on the semiconductor die, the composite interconnect having a non-fusible portion connected to the contact pad on the semiconductor die and a fusible portion connected to the interconnect site on the trace of the substrate, the interconnect sites having parallel edges with a width less than a width of the composite interconnect and the composite interconnect having a tapered co-linear length along the trace longer than a width across the trace.
25. The method of claim 24, wherein the composite interconnect has a pitch as determined by minimum spacing between adjacent conductive traces that can be achieved on the substrate.
26. The method of claim 24, wherein the tapered co-linear length of the composite interconnect reduces stress and damage to the semiconductor die.
27. The method of claim 24, wherein the non-fusible portion of the composite interconnect includes gold, copper, nickel, lead solder, or lead-tin alloy.
28. The method of claim 24, wherein the fusible portion of the composite interconnect includes tin, lead-free alloy, tin-silver alloy, tin-silver-copper alloy, tin-silver-indium alloy, eutectic solder, or tin alloys with silver, copper, or lead.
29. The method of claim 24, wherein a width of the interconnect site under the composite interconnect is no greater than a width of the trace away from the composite interconnect.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A swaddling blanket, comprising:
a back panel, the back panel having a top edge, a bottom edge, a first side, and a second side; and
a first blanket arm, the first blanket arm having a top edge, a wide end, and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet, the top edge of the back panel extending fewer than three centimeters above the top edge of the first blanket arm.
2. A swaddling blanket as claimed in claim 1, additionally comprising a leg pouch, the leg pouch having a bottom edge, the leg pouch being disposed upon the back panel with the bottom edge of the leg pouch proximate to the bottom edge of the back panel.
3. A swaddling blanket as claimed in claim 1, additionally comprising an arm restraint, the arm restraint disposed upon the back panel.
4. A swaddling blanket as claimed in claim 1, additionally comprising a first arm restraint and a second arm restraint, the arm restraints disposed upon the back panel.
5. A swaddling blanket as claimed in claim 1, additionally comprising a second blanket arm, the second blanket arm having a wide end and a narrow end, the wide end of the second blanket arm being integrated with the second side of the back panel to form a continuous sheet.
6. A swaddling blanket as claimed in claim 5, wherein the second blanket arm is shorter than the first blanket arm.
7. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a leg pouch, the leg pouch having a top edge and a bottom edge, the leg pouch being disposed upon the back panel with the bottom edge of the leg pouch proximate to the bottom edge of the back panel;
a first arm restraint and a second arm restraint, the arm restraints disposed upon the back panel above the top edge of the leg pouch;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet, the first blanket arm being long enough to wrap entirely around an infant at least twice; and
a second blanket arm, the second blanket arm having a wide end and a narrow end, the wide end of the second blanket arm being integrated with the second side of the back panel to form a continuous sheet, the second blanket arm being long enough to span an infant’s torso and wide enough to overlap the top edge of the leg pouch.
8. A method for swaddling an infant, comprising the steps of:
laying the infant upon a swaddling blanket, with the infant facing upward;
inserting the infant’s legs in a leg pouch attached to the swaddling blanket;
restraining the infant’s arms close and parallel to the infant’s torso;
wrapping a second blanket arm across the infant; and
wrapping a first blanket arm around the infant in a direction opposite the direction in which the second blanket arm was wrapped.
9. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet, the first blanket arm being long enough to wrap entirely around an infant at least twice; and
a leg pouch, the leg pouch having a bottom edge, the leg pouch being disposed upon the back panel with the bottom edge of the leg pouch proximate to the bottom edge of the back panel.
10. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet, the first blanket arm being long enough to wrap entirely around an infant at least twice; and
an arm restraint, the arm restraint disposed upon the back panel.
11. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet, the first blanket arm being long enough to wrap entirely around an infant at least twice; and
a first arm restraint and a second arm restraint, the arm restraints disposed upon the back panel.
12. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet; and
an arm restraint, the arm restraint disposed upon the back panel.
13. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet; and
a first arm restraint and a second arm restraint, the arm restraints disposed upon the back panel.
14. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a leg pouch, the leg pouch having a top edge and a bottom edge, the leg pouch being disposed upon the back panel with the bottom edge of the leg pouch proximate to the bottom edge of the back panel, the leg pouch divided to accommodate a restraint member;
a first arm restraint and a second arm restraint, the arm restraints disposed upon the back panel above the top edge of the leg pouch;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet, the first blanket arm being long enough to wrap entirely around an infant at least twice; and
a second blanket arm, the second blanket arm having a wide end and a narrow end, the wide end of the second blanket arm being integrated with the second side of the back panel to form a continuous sheet, the second blanket arm being long enough to span an infant’s torso and wide enough to overlap the top edge of the leg pouch.
15. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a leg pouch, the leg pouch having a top edge and a bottom edge, the leg pouch being disposed upon the back panel with the bottom edge of the leg pouch proximate to the bottom edge of the back panel;
a first arm restraint and a second arm restraint, the arm restraints disposed upon the back panel above the top edge of the leg pouch, each arm restraint comprising a pouch;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet, the first blanket arm being long enough to wrap entirely around an infant at least twice; and
a second blanket arm, the second blanket arm having a wide end and a narrow end, the wide end of the second blanket arm being integrated with the second side of the back panel to form a continuous sheet, the second blanket arm being long enough to span an infant’s torso and wide enough to overlap the top edge of the leg pouch.
16. A swaddling blanket, comprising:
a back panel, the back panel having a bottom edge, a first side, and a second side;
a leg pouch, the leg pouch having a top edge and a bottom edge, the leg pouch being disposed upon the back panel with the bottom edge of the leg pouch proximate to the bottom edge of the back panel;
an arm restraint, the arm restraint disposed upon the back panel above the top edge of the leg pouch, the arm restraint comprising a pouch wide enough to contain the arms of an infant lying on the pouch with the arms of the infant disposed on either side of the infant’s torso;
a first blanket arm, the first blanket arm having a wide end and a narrow end, the wide end of the first blanket arm being integrated with the first side of the back panel to form a continuous sheet, the first blanket arm being long enough to wrap entirely around an infant at least twice; and
a second blanket arm, the second blanket arm having a wide end and a narrow end, the wide end of the second blanket arm being integrated with the second side of the back panel to form a continuous sheet, the second blanket arm being long enough to span an infant’s torso and wide enough to overlap the top edge of the leg pouch.

1-8. (canceled)
9. A composite substrate comprising:
a first material; and
a second material differing in melting point from the first material; wherein
in an end surface of the substrate, an interface between the first material and the second material is covered with a solidified melt of the first material or the second material.
10. The composite substrate of claim 9, wherein the first material is resin and the second material is glass, and an interface between the resin and the glass in the end surface of the substrate is covered with a solidified melt of the glass.
11. The composite substrate of claim 9, wherein the first material is resin and the second material is glass, and the end surface of the substrate is covered with a solidified melt of the glass.
12. The composite substrate of claim 9, wherein the first material is thermoplastic resin, and in the end surface of the substrate, an interface between the thermoplastic resin and the second material is covered with a solidified melt of the thermoplastic resin.
13. The composite substrate of claim 9, wherein the composite substrate has a layered structure of a first material layer including the first material and a second material layer including the second material, and in the end surface of the substrate, an interface between the first material layer and the second material layer is covered with a solidified melt of the first material or the second material.
14. The composite substrate of claim 9, further comprising a coat layer on at least one surface of the composite substrate.
15. A display device comprising the composite substrate of claim 9.
16. A method of manufacturing a composite substrate, comprising the steps of:
preparing a mother composite substrate including a first material and a second material differing in melting point from the first material; and
irradiating with a laser beam a predetermined area where the mother composite substrate is to be cut to heat the predetermined area to a temperature higher than or equal to a higher one of melting points of the first material and the second material for cutting the mother composite substrate in the predetermined area.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for updating a shadow master boot record in a storage device, the method comprising:
performing the following in a storage device having a memory with a first storage area having N sectors allocated to it for a shadow master boot record:
receiving updated sectors of the shadow master boot record from a host device;
writing the updated sectors in a second storage area of the memory;
determining a highest written sector (M) in the first storage area that is occupied by the shadow master boot record, wherein M<N;
copying the non-updated sectors of the shadow master boot record from the first storage area to the second storage area, wherein only the non-updated sectors up to the highest written sector (M) are copied; and
designating the second storage area as storing a current version of the shadow master boot record.
2. The method of claim 1, wherein the storage device receives non-consecutive updated sectors from the host device, and wherein the method further comprises copying the non-updated sectors in between writes of the non-consecutive updated sectors.
3. The method of claim 1, wherein the storage device determines the highest written sector (M) in the first storage area by determining which sectors in the first storage area are signed as unwritten.
4. The method of claim 1, wherein each sector is associated with an indicator indicating whether or not the sector was written to, and wherein a non-updated sector from the first storage area is copied to the second storage area only if the indicator associated with that sector indicates that the sector was written to.
5. The method of claim 1, wherein the method further comprises, in response to a command from the host device to revert the storage device to a default setting, setting the highest written sector (M) to 0 and signing all the sectors in the first storage area as unwritten.
6. The method of claim 1, wherein at least one updated sector received from the host device contains an update to some, but not all, of a sector in the first storage area, and wherein the method further comprises:
reading the sector from the first storage area;
modifying a part of the sector; and
writing the modified sector to the second storage area.
7. The method of claim 1, wherein at least one updated sector received from the host device contains an update to some, but not all, of a sector in the first storage area, and wherein the method further comprises:
copying the sector in its original form from the first storage area to the second storage area;
reading the sector from the second storage area;
modifying a part of the sector; and
writing the modified sector back to the second storage area.
8. The method of claim 1, wherein N is 128 MB.
9. The method of claim 1, wherein the first and second storage areas are in a private area of the memory.
10. The method of claim 1, wherein the storage device is embedded in the host device.
11. The method of claim 1, wherein the storage device is removably connectable to the host device.
12. The method of claim 1, wherein the storage device is a solid-state drive.
13. The method of claim 1, wherein the order of the non-updated sectors copied into the second storage area is the same as the order of the non-updated sectors in the first storage area.
14. A storage device comprising:
an interface configured to communicate with a host device;
a memory having a first storage area having N sectors allocated to it for a shadow master boot record and having a second storage area; and
a controller in communication with the interface and the memory, wherein the controller is configured to:
receive updated sectors of the shadow master boot record from the host device;
write the updated sectors in the second storage area;
determine a highest written sector (M) in the first storage area that is occupied by the shadow master boot record, wherein M<N;
copy the non-updated sectors of the shadow master boot record from the first storage area to the second storage area, wherein only the non-updated sectors up to the highest written sector (M) are copied; and
designate the second storage area as storing a current version of the shadow master boot record.
15. The storage device of claim 14, wherein the storage device receives non-consecutive updated sectors from the host device, and wherein the controller is further configured to copy the non-updated sectors in between writes of the non-consecutive updated sectors.
16. The storage device of claim 14, wherein the storage device determines the highest written sector (M) in the first storage area by determining which sectors in the first storage area are signed as unwritten.
17. The storage device of claim 14, wherein each sector is associated with an indicator indicating whether or not the sector was written to, and wherein a non-updated sector from the first storage area is copied to the second storage area only if the indicator associated with that sector indicates that the sector was written to.
18. The storage device of claim 14, wherein the controller is further configured to, in response to a command from the host device to revert the storage device to a default setting, set the highest written sector (M) to 0 and sign all the sectors in the first storage area as unwritten.
19. The storage device of claim 14, wherein at least one updated sector received from the host device contains an update to some, but not all, of a sector in the first storage area, and wherein the controller is further configured to:
read the sector from the first storage area;
modify a part of the sector; and
write the modified sector to the second storage area.
20. The storage device of claim 14, wherein at least one updated sector received from the host device contains an update to some, but not all, of a sector in the first storage area, and wherein the controller is further configured to:
copy the sector in its original form from the first storage area to the second storage area;
read the sector from the second storage area;
modify a part of the sector; and
write the modified sector back to the second storage area.
21. The storage device of claim 14, wherein N is 128 MB.
22. The storage device of claim 14, wherein the first and second storage areas are in a private area of the memory.
23. The storage device of claim 14, wherein the storage device is embedded in the host device.
24. The storage device of claim 14, wherein the storage device is removably connectable to the host device.
25. The storage device of claim 14, wherein the storage device is a solid-state drive.
26. The storage device of claim 14, wherein the order of the non-updated sectors copied into the second storage area is the same as the order of the non-updated sectors in the first storage area.