Author: claimsbot

1. A method comprising:
selecting a reference printing device;
receiving a targeted media;
printing a test pattern at a first applied energy value;
printing at least one other test pattern, wherein the at least one other test pattern is printed at another applied energy value different than the first applied energy value;
determining a first print quality for the test pattern at the first applied energy value;
determining a second print quality for the other test pattern at the other applied energy value;
printing a first test pattern at a first print speed;
printing at least one additional print pattern at a second print speed;
determining a print quality for the test pattern at the first print speed;
determining an additional print quality for the at least one additional print pattern at the second print speed; and
generating a profile for the targeted media.
2. A method comprising:
receiving one or more profiles, wherein each of the profiles is associated with a type of media;
receiving a media of a first type of media;
identifying the first type of media;
identifying a profile associated with the first type of media;
adjusting at least one printing parameter of a printing device based on the profile associated with the first type of media.
3. The method according to claim 2, wherein identifying the first type of media includes reading a barcode associated with the media.
4. The method of claim 2 further comprising:
determining an ambient temperature of the environment prior to adjusting the at least one printing parameter; and
adjusting a temperature printing parameter at least partially based on the ambient temperature.
5. The method of claim 4, wherein adjusting the temperature printing parameter comprises:
processing an equation that is a function of a temperature coefficient associated with the printing device.
6. A printing device comprising:
a memory element configured to store a profile for each of a plurality of types of media;
a printhead configured to print indicia on the plurality of types of media based on at least one printing parameter; and
a controller configured to:
identify a first type of media received by the printing device;
identify a profile stored in the memory element associated with the first type of media; and
adjust the at least one printing parameter based on the profile.
7. The printing device according to claim 6, wherein the controller applies an offset to the profile based on the printing device.
8. The printing device according to claim 6 further comprising an input element for receiving one or more profiles.
9. The printing device according to claim 6 further comprising a conveyance apparatus configured to convey media through the printing device, wherein the conveyance apparatus defines a print speed and, wherein the controller is further configured to adjust the print speed based on the profile.
10. The printing device according to claim 6, wherein the profile includes a strobe pattern.
11. The printing device according to claim 10, wherein the strobe pattern includes a series of first and second pulses separated by a brief interruption.
12. The printing device according to claim 6 further comprising a sensor configured to read indicia from the first type of media, wherein the controller is further configured to identify the first type of media in response to the sensor reading the indicia.
13. The printing device according to claim 6 further comprising a RFID reader configured to read information from a supply of the first type of media, wherein the controller is further configured to identify the first type of media in response to the RFID reader reading the information from the supply.
14. The printing device of claim 6 further comprising:
a temperature sensor that determines an ambient temperature of the environment local to the printing device.
15. The printing device of claim 6 further comprising:
a network component that is configured to communicate with a remote data server to download the profile to the memory element.
16. A supply of a first type of media comprising:
an identification means configured to be accessible to a printing device such that the printing device can identify the first type of media.
17. The supply according to claim 16, wherein the identification means is a barcode.
18. The supply according to claim 16, wherein the identification means is an RFID tag.
19. The supply according to claim 16, wherein the identification means contains a profile for the first type of media.
20. The supply according to claim 19, wherein the profile provides information to the printing device for adjusting one or more printing parameters of the printing device for obtaining a desired print quality.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A semiconductor device provided with a gate electrode formed on a semiconductor substrate via a gate insulating film, a first conductive type of body region formed so that the body region is adjacent to the gate electrode, a second conductive type of source region and a channel region respectively formed in the first conductive type of body region, a second conductive type of drain region formed in a position apart from the first conductive type of body region and a second conductive type of drift region formed so that the drift region surrounds the drain region, wherein:
a first conductive type of impurity layer ranging to the first conductive type of body region is formed under the gate electrode.
2. A semiconductor device according to claim 1, wherein:
the first conductive type of impurity layer is formed in the vicinity of an active region under the gate electrode.
3. A semiconductor device according to claim 2, wherein:
the first conductive type of impurity layer is extended from said first conductive type of body region to the direction of the drift region in a state of an impurity diffusion layer having a predetermined width of depth so as to surround the active region under the gate electrode.
4. A semiconductor device according to claim 3, wherein:
the first conductive type of impurity layer is extended from said first conductive type of body region for upper side to the direction of the drift region so as to approach for a surface direction of the substrate.
5. A semiconductor device according to claim 4, wherein:
the gate insulating film comprises a first insulating film and a second insulating film made of local oxidation film, having thicker than the first insulating film, said gate electrode is formed on the first insulating film and on the second insulating film so that an end of the first conductive type of impurity layer approach to a bottom of the second insulating film.
6. A semiconductor device according to claim 5, wherein:
the first conductive type of impurity layer is terminated beneath the gate electrode.
7. A semiconductor device according to claim 6, wherein:
the first conductive type of impurity layer is disposed in a depth so that a region surrounded by the first conductive type of body region and said second insulating film is depleted completely under the gate electrode.
8. A semiconductor device according to claim 6, wherein:
the first conductive type of impurity layer is disposed in a depth of 1 m from the first insulating film.
9. A method of manufacturing a semiconductor device, comprising:
a process for forming a second conductive type of well region by implanting and diffusing impurities of a second conductive type intoin a first conductive type of semiconductor substrate;
a process for forming a low density first conductive type of impurity layer and a low density second conductive type of impurity layer at an interval by respectively implanting and diffusing impurities of a first conductive type and impurities of a second conductive type intoin the second conductive type of well region;
a process for selectively oxidizing a region on the substrate to form a local oxide film;
a process for forming a middle density first conductive type of impurity layer ranging a low density first conductive type of impurity layer using resist films respectively having an opening on a local oxide film and on a gate electrode formation region as a mask after a gate insulating film is formed in a region except the local oxide film;
a process for forming a gate electrode so that the gate electrode ranges from the gate insulating film to the local oxide film; and
a process for implanting impurities of a second conductive type using resist films respectively having an opening on a source formation region formed in the low density first conductive type of impurity layer and on a drain formation region formed in the low density second conductive type of impurity layer as a mask to form a high density source region and a high density drain region.
10. A method of manufacturing a semiconductor device according to claim 9, wherein:
in the process for forming the second conductive type of well region, plural types of second conductive type of impurities different in a diffusion coefficient are implanted and diffused.
11. A method of manufacturing a semiconductor device according to claim 9, wherein:
in the process for forming the second conductive type of well region, as first impurities are implanted and diffused, second impurities are implanted and diffused.

1. A mass spectrometer equipped with a MALDI ion source structured to receive a sample plate and a mass analyzer adapted to perform mass analysis by ionizing spots of a sample adhered at different locations on a surface of a sample plate by irradiating the spots of the sample with laser light in turn to ionize the spots of the sample and introducing obtained sample ions into the mass analyzer to obtain mass spectra of the spots of the sample, means for observing the spots of the sample adhered at different locations on the surface of the sample plate, a data processing portion having associated memory with a stored program for processing data derived from the mass spectra and calibrating said data according to spot position on and topography of the sample plate, and reading means,
wherein a code or mark indicating identification information about the sample plate is formed on the surface of the sample plate such that the code or mark can be read by reading means, and
wherein the identification information about the sample plate read by the reading means is combined with the data derived from the mass spectra and stored in memory.
2. A mass spectrometer equipped with a MALDI ion source as set forth in claim 1, wherein observation means for observing the spots of the sample adhering at the different locations on the surface of the sample plate acts as said reading means.
3. A TOF mass spectrometer equipped with a MALDI ion source as set forth in any one of claims 1 and 2, wherein the data processing portion has a stored program such that the mass spectra obtained from the spots of the sample adhering at the different locations on the surface of the sample plate are calibrated in terms of mass by previously registering the identification information about the sample plate and information about topography of the surface of the sample plate while the identification information and the information about the topography are made to correspond to each other by reading the information about the topography of the surface of the sample plate from a storage device based on the identification information about the sample plate read by said reading means to find information about the heights of the locations at which the spots of the sample adhere, and calibrating the mass spectra in terms of mass based on the found information about the heights.
4. A TOF mass spectrometer equipped with a MALDI ion source as set forth in any one of claims 1 and 2, wherein codes or marks indicating information about the topography of the surface of the sample plate are formed on the surface of the sample plate such that the codes or marks can be read by said reading means, and wherein the data processing portion has a stored program such that information about the heights of the locations at which the spots of the sample adhere is found based on the information about the topography of the surface of the sample plate read by the reading means and mass spectra obtained from the spots of the sample adhering at the different locations of the surface of the sample plate are calibrated in terms of mass based on the found information about the heights.
5. A TOF mass spectrometer equipped with a MALDI ion source structured to receive a sample plate and a mass analyzer adapted to perform mass analysis by causing spots of a sample to adhere at different locations on a surface of a sample plate, irradiating the spots of the sample with laser light in turn to ionize the spots of the sample, introducing obtained sample ions into the mass analyzer to obtain mass spectra of the spots of the sample, and processing data derived from the mass spectra by means of a data-processing portion, said mass spectrometer further comprising:
codes or marks formed on the surface of the sample plate to indicate information about topography of the surface of the sample plate; and
reading means for reading the codes or marks,
wherein said data-processing portion has a stored program such that it calibrates the mass spectra obtained from the spots of the sample in terms of mass, based on the information about the topography of the surface of the sample plate read by the reading means.
6. A TOF mass spectrometer equipped with a MALDI ion source as set forth in claim 5, wherein said data-processing portion has a stored program such that it finds information about heights of said individual locations based on information about topography of the surface of the sample plate read by said reading means and performs mass calibration of the mass spectra based on corresponding sets of the found information about the heights.
7. A TOF mass spectrometer equipped with a MALDI ion source as set forth in any one of claims 5 and 6, wherein a code or mark indicating information for identification of the sample plate is formed on the surface of the sample plate such that the code or mark can be read by said reading means, and wherein the information about the identification of the sample plate read by the reading means is combined with the mass spectra and stored in memory.
8. A sample plate for use in a mass spectrometer equipped with a MALDI ion source, said sample plate comprising:
marks indicating positions at which spots of a sample are made to adhere; and
a code or mark indicating information for identification of the sample plate indicating information about the topography of the surface of the sample plate.
9. A sample plate for use in a mass spectrometer equipped with a MALDI ion source as set forth in claim 8, wherein said code indicating information for identification of the sample plate and said codes indicating information about the topography of the surface of the sample plate are made of a barcode or QR code.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A lock-up clutch mechanism for a torque converter, comprising:
a lock-up clutch including a substantially annular friction material having a friction surface; and
a front cover having an engagement surface, said friction surface and said engagement surface being axially opposed such that said friction surface frictionally engages with said engagement surface when said friction material is urged in an axial direction,
wherein said friction surface is curved convexly toward said engagement surface throughout substantially an entire circumference of the friction material, and
when said friction material is urged toward said engagement surface with a relatively small urging force during lock-up slip, an apex portion of the curved friction surface is contacted with said engagement surface with a sufficiently high surface pressure so that the surface pressure along a circumferential direction of the curved friction surface is substantially uniform.
2. A lock-up clutch mechanism according to claim 1, wherein said friction surface is curved such that a radially outer portion of said friction surface protrudes toward said engagement surface.
3. A lock-up clutch mechanism according to claim 1, wherein said friction surface is curved such that a substantially radially central portion of said friction surface protrudes toward said engagement surface.
4. A lock-up clutch mechanism according to claim 1, wherein said friction material has a varying thickness in a radial direction.
5. A lock-up clutch mechanism according to claim 1, wherein said friction material has a uniform thickness in a radial direction and is supported on a curved surface of the lock-up clutch.
6. A lock-up clutch mechanism according to claim 1, wherein the friction surface follows a continuous curved profile from an inner radial edge of the friction material to an outer radial edge of the friction material.
7. A method for manufacturing a lock-up clutch mechanism for a torque converter, comprising the steps of:
providing a lock-up clutch;
securing to the lock-up clutch a substantially annular friction material having a friction surface;
simultaneously with the securing, molding said friction material such that said friction surface is curved convexly throughout substantially an entire circumference of said friction material; and
providing a front cover having an engagement surface such that said friction surface and said engagement surface are axially opposed,
wherein said friction surface is curved convexly toward said engagement surface so as to frictionally engage with said engagement surface when said friction material is urged in an axial direction,
and when said friction material is urged toward said engagement surface with a relatively small urging force during lock-up slip, an apex portion of the curved friction surface is contacted with said engagement surface with a sufficiently high surface pressure so that the surface pressure along a circumferential direction of the curved friction surface is substantially uniform.
8. A method for manufacturing a lock-up clutch mechanism according to claim 7, wherein said friction surface of the molded friction material is curved such that a radially outer portion of said friction surface protrudes toward said engagement surface.
9. A method for manufacturing a lock-up clutch mechanism according to claim 7, wherein said friction surface of the molded friction material is curved such that a substantially radially central portion of said friction surface protrudes toward said engagement surface.
10. A method for manufacturing a lock-up clutch mechanism according to claim 7, wherein the friction surface of the molded friction material follows a continuous curved profile from an inner radial edge of the friction material to an outer radial edge of the friction material.
11. A method for manufacturing a lock-up clutch mechanism according to claim 7, wherein the molded friction material has a varying thickness in a radial direction.
12. A method for manufacturing a lock-up clutch mechanism according to claim 7, wherein the molded friction material has a uniform thickness in a radial direction and is secured on a curved surface of the lock-up clutch.
13. A method for manufacturing a lock-up clutch mechanism for a torque converter, comprising the steps of:
providing a lock-up clutch having a curved surface;
securing to the lock-up clutch at the curved surface a substantially annular friction material having a friction surface such that the friction surface is curved convexly throughout substantially an entire circumference of said friction material; and
providing a front cover having an engagement surface such that said friction surface and said engagement surface are axially opposed,
wherein said friction surface is curved convexly toward said engagement surface so as to frictionally engage with said engagement surface when said friction material is urged in an axial direction,
and when said friction material is urged toward said engagement surface with a relatively small urging force during lock-up slip, an apex portion of the curved friction surface is contacted with said engagement surface with a sufficiently high surface pressure so that the surface pressure along a circumferential direction of the curved friction surface is substantially uniform.
14. A method for manufacturing a lock-up clutch mechanism according to claim 13, wherein said friction surface is curved such that a radially outer portion of said friction surface protrudes toward said engagement surface.
15. A method for manufacturing a lock-up clutch mechanism according to claim 13, wherein said friction surface is curved such that a substantially radially central portion of said friction surface protrudes toward said engagement surface.
16. A method for manufacturing a lock-up clutch mechanism according to claim 13, wherein the friction surface follows a continuous curved profile from an inner radial edge of the friction material to an outer radial edge of the friction material.
17. A method for manufacturing a lock-up clutch mechanism according to claim 13, wherein said friction material has a varying thickness in a radial direction.
18. A method for manufacturing a lock-up clutch mechanism according to claim 13, wherein said friction material has a uniform thickness in a radial direction.