Author: claimsbot

1. An imaging device comprising:
an analog-signal output unit including a pixel configured to output a photoelectric conversion signal based on incident light; and
an analog-to-digital converter including a comparator,
wherein the comparator executes a first comparison, a second comparison, and a third comparison,
wherein the first comparison is a comparison between a noise signal output from the analog-signal output unit and a first reference signal having a potential that is changed by a first changing quantity per unit time,
wherein the second comparison is a comparison between the noise signal and a second reference signal having a potential that is changed by a second changing quantity per unit time, the second changing quantity being larger than the first changing quantity,
wherein the third comparison is a comparison between one of the first reference signal and the second reference signal, and a signal output from the analog-signal output unit based on the photoelectric conversion signal, and
wherein the analog-to-digital converter generates a digital signal based on a result of the first comparison, a digital signal based on a result of the second comparison, and a digital signal based on a result of the third comparison.
2. The imaging device according to claim 1,
wherein the pixel includes
a photoelectric converter configured to generate a charge based on the incident light, and
a transistor having an input node to which the charge is input, and configured to output the photoelectric conversion signal based on the charge, and

wherein the noise signal is a signal that is output from the transistor based on a reset potential of the input node.
3. The imaging device according to claim 1,
wherein the analog-signal output unit has an input node to which the photoelectric conversion signal is input, and further includes an amplifier configured to amplify a signal input to the input node and output the amplified signal to the comparator, and
wherein the noise signal is a signal that is output from the amplifier based on a reset potential of the input node of the amplifier.
4. An imaging device comprising:
a pixel configured to output a photoelectric conversion signal based on incident light; and
an analog-to-digital converter including a comparator configured to compare a reference signal with a signal that is input to an input node of the comparator,
wherein the comparator executes a first comparison, a second comparison, and a third comparison,
wherein the first comparison is a comparison between a reset potential of the input node of the comparator and a first reference signal having a potential that is changed by a first changing quantity per unit time,
wherein the second comparison is a comparison between the reset potential of the input node of the comparator and a second reference signal having a potential that is changed by a second changing quantity per unit time, the second changing quantity being larger than the first changing quantity,
wherein the third comparison is a comparison between one of the first reference signal and the second reference signal, and a potential of the input node of the comparator based on the photoelectric conversion signal, and
wherein the analog-to-digital converter generates a digital signal based on a result of the first comparison, a digital signal based on a result of the second comparison, and a digital signal based on a result of the third comparison.
5. The imaging device according to claim 1,
wherein the digital signal generated by the analog-to-digital converter based on the result of the first comparison is a first digital signal,
wherein the digital signal generated by the analog-to-digital converter based on the result of the second comparison is a second digital signal,
wherein the analog-to-digital converter further includes a selection circuit,
wherein the analog-to-digital converter generates the first digital signal and the second digital signal, and then the comparator compares a potential of a signal based on the photoelectric conversion signal with a predetermined potential,
wherein, when the potential of the signal based on the photoelectric conversion signal is smaller than the predetermined potential, the selection circuit supplies the first reference signal to the comparator for the third comparison, and
wherein, when the potential of the signal based on the photoelectric conversion signal is larger than the predetermined potential, the selection circuit supplies the second reference signal to the comparator for the third comparison.
6. The imaging device according to claim 5,
wherein the digital signal generated by the analog-to-digital converter based on the result of the third comparison is a third digital signal,
wherein the analog-to-digital converter further includes a first memory and a second memory, and
wherein, after the first memory holds the first digital signal and the second memory holds the second digital signal, the selection circuit causes the second memory to hold the third digital signal while the selection circuit causes the first memory to hold the first digital signal when the potential of the signal based on the photoelectric conversion signal is smaller than the predetermined potential, and the selection circuit causes the first memory to hold the third digital signal while the selection circuit causes the second memory to hold the second digital signal when the potential of the signal based on the photoelectric conversion signal is larger than the predetermined potential.
7. The imaging device according to claim 5, further comprising:
a reference-signal supply unit,
wherein, during the first comparison, the reference-signal supply unit does not supply the second reference signal, but supplies the first reference signal to the comparator through the selection circuit,
wherein, during the second comparison, the reference-signal supply unit does not supply the first reference signal, but supplies the second reference signal to the comparator through the selection circuit, and
wherein, during the third comparison, a period in which the reference-signal supply unit supplies the first reference signal to the selection circuit overlaps a period in which the reference-signal supply unit supplies the second reference signal to the selection circuit.
8. The imaging device according to claim 1, further comprising:
a correction unit,
wherein the analog-to-digital converter generates a fourth digital signal based on a result of comparison between a first analog signal and the first reference signal by the comparator,
wherein the analog-to-digital converter generates a fifth digital signal based on a result of comparison between the first analog signal and the second reference signal by the comparator,
wherein the analog-to-digital converter generates a sixth digital signal based on a result of comparison between a second analog signal and the first reference signal by the comparator, the second analog signal having a signal value different from a signal value of the first analog signal,
wherein the analog-to-digital converter generates a seventh digital signal based on a result of comparison between the second analog signal and the second reference signal by the comparator, and
wherein the correction unit corrects a third digital signal, which is the digital signal generated by the analog-to-digital converter based on the result of the third comparison, the correction being based on a difference between a signal value of the fourth digital signal and a signal value of the sixth digital signal and a difference between a signal value of the fifth digital signal and a signal value of the seventh digital signal.
9. The imaging device according to claim 8, further comprising:
a test-signal supply unit,
wherein the test-signal supply unit outputs the first analog signal and the second analog signal to the comparator.
10. The imaging device according to claim 8,
wherein the correction unit corrects the third digital signal by multiplying the third digital signal by a correction value \u03b2, which is obtained by an expression as follows,
\u03b2=(DS1\u2212DN1)(G\xd7(DS2\u2212DN2)),
where DN1 is the signal value of the fourth digital signal, DN2 is the signal value of the fifth digital signal, DS1 is the signal value of the sixth digital signal, DS2 is the signal value of the seventh digital signal, and G is a ratio of the second changing quantity to the first changing quantity.
11. The imaging device according to claim 8,
wherein the imaging device comprises a plurality of the pixels and a plurality of the analog-to-digital converters,
wherein the plurality of pixels are the pixels in a plurality of columns,
wherein the plurality of analog-to-digital converters are provided in correspondence with the respective columns having the pixels arranged therein, and each of the plurality of analog-to-digital converters generates the fourth digital signal, the fifth digital signal, the sixth digital signal, and the seventh digital signal, and
wherein the correction unit corrects the third digital signal generated by each of the plurality of analog-to-digital converters based on an average value of differences between signal values of the fourth digital signals and signal values of the sixth digital signals of the plurality of analog-to-digital converters and an average value of differences between signal values of the fifth digital signals and signal values of the seventh digital signals of the plurality of analog-to-digital converters.
12. An imaging system comprising:
the imaging device according to claim 1; and
a signal processor configured to process a signal output from the imaging device,
wherein, when the analog-to-digital converter executes the third comparison by using the first reference signal, the signal output unit generates a signal of a difference between the digital signal generated by the third comparison and the digital signal generated by the first comparison, and
wherein, when the analog-to-digital converter executes the third comparison by using the second reference signal, the signal output unit generates a signal of a difference between the digital signal generated by the third comparison and the digital signal generated by the second comparison.
13. An imaging system comprising:
the imaging device according to claim 1; and
a signal processor configured to process a signal output from the imaging device.
14. A driving method of an imaging device, the imaging device including an analog-signal output unit including a pixel configured to output a photoelectric conversion signal based on incident light, and an analog-to-digital converter including a comparator, the method comprising:
a first step of causing the comparator to compare a noise signal output from the analog-signal output unit with a first reference signal having a potential that is changed by a first changing quantity per unit time;
a second step of causing the comparator to compare the noise signal with a second reference signal having a potential that is changed by a second changing quantity per unit time, the second changing quantity being larger than the first changing quantity; and
a third step of causing the comparator to compare one of the first reference signal and the second reference signal with a signal based on the photoelectric conversion signal.
15. The driving method of the imaging device according to claim 14,
wherein the analog-to-digital converter further includes a first memory and a second memory,
wherein during the first step, the analog-to-digital converter is caused to generate a first digital signal based on a result of the comparison by the comparator, and the first memory is caused to hold the first digital signal,
wherein during the second step, the analog-to-digital converter is caused to generate a second digital signal based on a result of the comparison by the comparator, and the second memory is caused to hold the second digital signal,
wherein during the third step, the analog-to-digital converter is caused to generate a third digital signal based on a result of the comparison by the comparator,
wherein, when a potential of the signal based on the photoelectric conversion signal is smaller than a predetermined potential, the second memory is caused to hold the third digital signal while the first memory is caused to hold the first digital signal, and

wherein, when the potential of the signal based on the photoelectric conversion signal is larger than the predetermined potential, the first memory is caused to hold the third digital signal while the second memory is caused to hold the second digital signal.
16. The driving method of the imaging device according to claim 15,
wherein the imaging device further includes a selection circuit,
wherein, during the first step, the selection circuit does not supply the second reference signal to the comparator, but supplies the first reference signal to the comparator,
wherein, during the second step, the selection circuit does not supply the first reference signal to the comparator, but supplies the second reference signal to the comparator, and
wherein, during the third step, the first reference signal and the second reference signal are supplied to the selection circuit in parallel, the selection circuit selects the first reference signal from among the first and second reference signals and supplies the first reference signal to the comparator when the potential of the signal based on the photoelectric conversion signal is smaller than the predetermined potential, and the selection circuit selects the second reference signal from among the first and second reference signals and supplies the second reference signal to the comparator when the potential of the signal based on the photoelectric conversion signal is larger than the predetermined potential.
17. The driving method of the imaging device according to claim 14,
wherein the analog-to-digital converter is caused to generate a fourth digital signal based on a result of comparison between a first analog signal and the first reference signal by the comparator,
wherein the analog-to-digital converter is caused to generate a fifth digital signal based on a result of comparison between the first analog signal and the second reference signal by the comparator,
wherein the analog-to-digital converter is caused to generate a sixth digital signal based on a result of comparison between a second analog signal and the first reference signal by the comparator, the second analog signal having a signal value different from a signal value of the first analog signal,
wherein the analog-to-digital converter is caused to generate a seventh digital signal based on a result of comparison between the second analog signal and the second reference signal by the comparator, and
wherein, in the comparison between the one of the first reference signal and the second reference signal, and the signal based on the photoelectric conversion signal by the comparator, based on a result of the comparison by the comparator, a digital signal generated by the analog-to-digital converter is corrected based on a difference between a signal value of the fourth digital signal and a signal value of the sixth digital signal, and a difference between a signal value of the fifth digital signal and a signal value of the seventh digital signal.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A medical device for supporting a structure comprising:
a screw assembly, the screw assembly including
a base,
a support configured for receiving one or more anchor assemblies, the support including a top portion and a bottom portion, and
an interconnection means for coupling the base to the support, the interconnection means allowing the support to be positionable in a first position that is substantially parallel to a long axis of the base and secondarily positionable substantially perpendicular to the long axis of the base,
the base and the one or more anchor assemblies configured for attachment to a structure in a patient.
2. The medical device of claim 1, wherein the structure supported is bone selected from the group consisting of a vertebra, femur, tibia, fibula, humerus, radius, ulna, calcaneous, and a pelvis.
3. The medical device of claim 1, wherein the screw assembly has an overall length sized for subcutaneous support of the posterior of a spine.
4. The medical device of claim 1, wherein the base is comprised of
a base head having a shape and a locking means, and
an anchor.
5. The medical device of claim 4, wherein the base head shape is an open saddle-type head.
6. The medical device of claim 4, wherein the locking means is comprised of a setscrew,
wherein the setscrew is configured to link the support and the base, and
wherein tightening the setscrew effects locking of the support in a position relative to a long axis of the base.
7. The medical device of claim 4, wherein the anchor is selected from the group consisting of a screw, staple, nail, hook and a pin.
8. The medical device of claim 4, wherein the anchor is a screw configured for bone anchoring.
9. The medical device of claim 4, wherein the anchor is a screw configured for insertion into the pedicle of a vertebra.
10. The medical device of claim 1, wherein the support has a shape selected from the group consisting of a board, plate, elongated cross-section, oval, square, I-beam and a rod.
11. The medical device of claim 1, wherein the support is comprised of
a connector end,
one or more apertures, and
a receiver.
12. The medical device of claim 11, wherein the connector end is configured for interconnection of the support and the base of the screw assembly.
13. The medical device of claim 11, wherein the connector end is configured for hinge-type interconnection of the support and the base of the screw assembly.
14. The medical device of claim 11, wherein the one or more apertures of the support include a first connector end proximal aperture having a dimensional configuration to support a range of movement of the base in relation to the support, and, one or more second connector end distal apertures providing access to the base and the means for locking the anchor assembly to the support, when assembled with the support.
15. The medical device of claim 1, wherein the support is comprised of
a support member having a top portion and a bottom portion,
a head assembly, and
an interconnection means.
16. The medical device of claim 15, wherein the support member is comprised of a receiver, and
one or more apertures.
17. The medical device of claim 16, wherein the one or more apertures include
a first aperture wherein an anchor assembly is passable therethrough and lockably engagable with the support member, and
a second aperture wherein access is provided from the top portion of the support member to access the head assembly.
18. The medical device of claim 15, wherein the head assembly is comprised of
a connector end,
an aperture having a dimensional configuration supporting a range of movement of the base in relation to the support, and
a connector end proximal aperture having a dimensional configuration to support a range of movement of the base in relation to the support,
a locking means for securing the head assembly to the support member, wherein the head assembly is configured for interconnection with the support member.
19. A method of supporting a bony structure, the method comprising the steps of:
1) delivering to bone a screw assembly comprising a support having a receiver, a base, an interconnection means, and a locking means;
2) deploying the support substantially perpendicular to the long axis of the base;
3) passing through the support and implanting one or more anchor assemblies having a base and a locking means into bone;
4) locking the bases within one or more of the anchor assemblies;
5) locking one or more of the anchor assemblies within the support receiver; and
6) engaging the locking means of the screw assembly to secure the position of the support in relation to the base.
20. A method of supporting a bony structure, the method comprising the steps of:
1) delivering to bone a screw assembly comprising: a support comprising a support member having a receiver, a head assembly having a connector end an interconnection means and a locking means for securing the head assembly to the support member; a base; an interconnection means, and a locking means for securing the support in a position in relation to the base;
2) deploying the support substantially perpendicular to the long axis of the base;
3) passing through the support and implanting one or more anchor assemblies having a base and a locking means into bone;
4) locking the bases within one or more of the anchor assemblies;
5) locking one or more of the anchor assemblies within the support receiver;
6) locking the head assembly within the support member; and engaging the locking means of the screw assembly to secure the position of the support in relation to the base.

1. A nail dryer includes a housing for contacting a user’s fingers and an air stream generation unit received in the shell for generation of air stream in order to dry nail polish on the user’s nails.
2. The nail dryer according to claim 1 wherein the housing defines at least one vent through which air leaves the housing and a plurality of apertures through which air enters the housing.
3. The nail dryer according to claim 2 wherein the housing includes two shells each defining a plurality of apertures.
4. The nail dryer according to claim 2 wherein the housing includes two shells each defining at least one cutout, wherein the at least one cutout defined in one of the shells matches the at least one cutout defined in the remaining one of the shells so as to make the at least one vent.
5. The nail dryer according to claim 3 wherein one of the shells includes a plurality of hooks formed thereon and the remaining one of the shells defines a corresponding number of recesses for receiving the hooks.
6. The nail dryer according to claim 2 wherein the air stream generation unit includes a motor and a propeller connected with the motor.
7. The nail dryer according to claim 6 wherein the air stream generation unit includes a power supply for powering the motor.
8. The nail dryer according to claim 7 wherein the power supply is a DC power supply received in the housing.
9. The nail dryer according to claim 8 wherein the air stream generation unit includes a circuit for connecting the motor with the DC power supply.
10. The nail dryer according to claim 9 wherein the air stream generation unit includes a switch mounted on the housing.
11. The nail dryer according to claim 6 wherein the housing includes a seat on which the motor is mounted.
12. The nail dryer according to claim 3 wherein the air stream generation unit includes a motor and a propeller connected with the motor.
13. The nail dryer according to claim 12 wherein the seat includes a plurality of plates projecting from one of the shells.
14. The nail dryer according to claim 13 wherein each of the plates of the seat includes an edge complementary to the motor.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method for forming a damascene interconnection comprising:
forming an insulating layer on a semiconductor substrate;
patterning and etching the insulating layer to form an opening exposing a predetermined region of the semiconductor substrate; and
forming a seed layer covering only a sidewall of the opening and a top surface of the insulating layer,
wherein the seed layer is formed by depositing the seed layer on an entire surface of a resulting structure where the opening is formed, and resputtering the seed layer resident on a bottom of the opening.
2. The method of claim 1, wherein the seed layer is formed using an ionized physical vapor deposition (PVD) apparatus that has a target corresponding to a cathode to which a power for making plasma is applied, and a chuck, positioned opposite to the target, corresponding to an anode to which a radio frequency (RF) bias for accelerating ions is applied.
3. The method of claim 1, wherein the seed layer is made of one selecting from a group consisting of copper, aluminum, and a combination thereof.
4. The method of claim 1, wherein after forming the seed layer, the method further comprising steps of:
forming a copper layer on the seed layer to fill the opening; and
planarly etching the copper layer and the seed layer down to a top surface of the insulating layer.
5. The method of claim 4, wherein the copper layer is formed using an electroplating technique.
6. The method of claim 1, wherein before forming the seed layer, the method further comprising a step of forming a barrier layer on the entire surface of the resulting structure where the opening is formed.
7. The method of claim 6, wherein the barrier layer on the bottom of the opening is selectively removed when the seed layer is formed.
8. The method of claim 6, wherein the barrier layer is made of one selected from a group consisting of Ti, TiN, W, WN, Ta, and TaN.
9. The method of claim 1, wherein the opening comprises a via hole exposing a predetermined region of the substrate, and a groove.
10. A method for forming a damascene interconnection comprising:
forming an insulating layer on a semiconductor substrate;
patterning and etching the insulating layer to form an opening exposing a predetermined region of the semiconductor substrate; and
forming an initial seed layer on an entire surface of a resulting structure where the opening is formed, using an ionized PVD process;
resputtering, in a first step, the initial seed layer on a bottom of the opening to be redeposited on a sidewall of the opening such that the initial seed layer remaining on the bottom of the opening is relatively thinner than that on the sidewall thereof, and
forming, in a second step, an additional seed layer on the entire surface of the resulting structure where the opening is formed.
11. The method of claim 10, wherein the ionized PVD process is performed using an ionized physical vapor deposition (PVD) apparatus that has a target corresponding to a cathode to which a power for making plasma is applied, and a chuck, positioned opposite to the target, corresponding to an anode to which a radio frequency (RF) bias for accelerating ions is applied.
12. The method of claim 11, wherein the power in the second step is higher relative to that in the first step, and the RF bias in the second step is equal to or lower relative to that in the first step.
13. The method of claim 12, wherein the step of resputtering the initial seed layer on the bottom of the opening is performed until the layer underlying the initial seed layer is exposed.
14. The method of claim 10, wherein after forming the additional seed layer, the method further comprising the steps of:
forming a copper layer on the additional seed layer to fill the opening; and
planarly etching the copper layer and the additional seed layer down to a top surface of the insulating layer.
15. A damascene interconnection structure comprising:
a semiconductor substrate;
an opening penetrating the insulating layer to expose a predetermined region of the semiconductor substrate; and
a seed layer formed on a sidewall and a bottom of the opening, and the seed layer on the sidewall of the opening is relatively thicker than that on the bottom thereof.
16. The damascene interconnection structure of claim 15, further comprising a copper layer filling the opening in which the seed layer is formed.
17. The damascene interconnection structure of claim 15, further comprising a barrier layer formed between the sidewall of the opening and the seed layer.
18. The damascene interconnection structure of claim 17, wherein the barrier layer on a bottom of the opening is selectively removed.
19. The damascene interconnection structure of claim 15, wherein the opening is composed of a via hole exposing a predetermined region of the semiconductor substrate, and a groove.