1. A module structure of vehicle cockpit components, comprising:
a function module assembly formed by modularizing an air conditioning unit and a peripheral member of the air conditioning unit, the air conditioning unit being for adjusting an air temperature and for blowing the adjusted air into a passenger compartment of the vehicle;
a structure module assembly formed by modularizing a steering support member for supporting a steering shaft disposed at a driver seat side of the vehicle, and an air bag unit for protecting a passenger in a vehicle collision disposed at a passenger seat side of the vehicle spaced from the driver seat side; and
a design module assembly formed by modularizing a dashboard and at least one of a display unit and a meter unit in the vehicle; wherein
the dashboard of the design module assembly includes a center-face blowing port and a side-face blowing port.
2. The module structure according to claim 1, wherein the steering support member is supported by a vehicle A-pillar.
3. The module structure according to claim 1, wherein:
the dashboard is an upper dashboard of the vehicle;
the structure module assembly is modularized with a lower dashboard part of the vehicle;
the upper dashboard part and the lower dashboard part are connected to form a design surface in the passenger compartment when the design module assembly and the structure module assembly are assembled to the vehicle;
the upper dashboard part defines an upper portion of the design surface; and
the lower dashboard part defines a lower portion of the design surface.
4. The module structure according to claim 3, wherein the lower dashboard part is disposed to be used as the steering support member.
5. The module structure according to claim 1, wherein the design module assembly is modularized with an air-conditioning duct, through which conditioned air from the air conditioning case flows into the passenger compartment.
6. The module structure according to claim 1, wherein the air bag unit is at least one of an upper air-bag unit for protecting the upper body of a passenger on a front seat and a knee air-bag unit for protecting the knee portion of the passenger.
7. The module structure according to claim 1, wherein at least any one of the steering shaft and a glove box is modularized with the structure module.
8. The module structure according to claim 1, wherein the peripheral member is at least one of a container case for containing an electronic control unit, a junction box, a wire harness and an air-conditioning duct.
9. The module structure according to claim 1, wherein:
the air conditioning unit includes a resinous air conditioning case for defining an air passage therein;
the peripheral member is at least one of a container case for containing an electronic control unit and a junction box; and
at least one of the container case and the junction box is integrated to the resinous air conditioning case by resin molding.
10. The module structure according to claim 1, wherein the steering support member has a support portion for supporting the steering shaft, and the support portion is disposed below the steering shaft.
11. The module structure according to claim 1, wherein:
the steering support member has an insertion hole into which the steering shaft is inserted; and
the steering shaft is inserted into the insertion hole to be supported by the steering support member.
12. The module structure according to claim 1, wherein the steering support member has a center portion substantially at a center area in a vehicle width direction, and the center portion of the steering support member is located below an upper end of an audio system disposed substantially at a center in the dashboard in the vehicle width direction.
13. The module structure according to claim 1, wherein the steering support member includes a pipe member extending in a vehicle width direction.
14. The module structure according to claim 1, wherein the steering support member is a plate member extending in a vehicle width direction and having an opening opened in a direction perpendicular to the vehicle width direction.
15. The module structure according to claim 14, wherein the steering support member has reinforcement ribs that are provided in the opening to extend in a direction perpendicular to the vehicle width direction.
16. The module structure according to claim 1, wherein the steering support member is made of at least one of an aluminum alloy and a magnesium alloy.
17. The module structure according to claim 16, wherein the steering support member is formed by die-casting.
18. The module structure according to claim 1, wherein the steering support member includes a metal portion for supporting the steering shaft, and a resin portion that is the other part of the metal portion in the steering support member.
19. The module structure according to claim 1, wherein the steering support member supports at least one of a side bracket for fixing the steering support member to a vehicle body, a brace for supporting the steering support member from below of the steering support member, a brake pedal, an accelerator pedal and a clutch pedal.
20. The module structure according to claim 1, wherein the steering support member has a fastening member which is fasted to the steering shaft from a lower side of the steering shaft.
21. The module structure according to claim 1, wherein the structure module assembly includes a steering column cover which covers a part of the steering shaft.
22. The module structure according to claim 1, wherein:
the design module assembly includes both of the display unit and the meter unit; and
the display unit is disposed at a vehicle front side of the meter unit.
23. The module structure according to claim 13, wherein:
the steering shaft is disposed to contact the pipe member; and
the steering support member further has a fastening member through which the pipe member is fastened to the steering shaft.
24. The structural module according to claim 1, wherein the structure module assembly extends across both the driver seat side and the passenger seat side of the vehicle.
25. The structural module according to claim 24, wherein the design module assembly extends across both the driver seat side and the passenger seat side of the vehicle.
26. The structural module according to claim 1, wherein the dashboard defines a finished surface directly exposed to the passenger compartment of the vehicle.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. An integrated circuit, comprising:
a first semiconductor die; and
a leadframe for mounting the first semiconductor die, including
a first laminate having a bottom surface formed with a lead of the integrated circuit, and
a second laminate having a bottom surface attached to a top surface of the first laminate for electrically coupling the lead to the first semiconductor die.
2. The integrated circuit of claim 1, further comprising a molding compound for encapsulating the first semiconductor die.
3. The integrated circuit of claim 2, wherein the second laminate forms a mold lock for the molding compound.
4. The integrated circuit of claim 3, wherein the second laminate extends outwardly from the lead to form a shelf and the molding compound covers the shelf.
5. The integrated circuit of claim 1, wherein a bottom surface of the first semiconductor die is mounted on the top surface of the first laminate, and the second laminate has a thickness greater than a thickness of the first semiconductor die.
6. The integrated circuit of claim 5, wherein the leadframe further includes a third laminate having a bottom surface attached to the top surface of the second laminate and patterned with a bonding strip for attaching to a bonding pad of the first semiconductor die.
7. The integrated circuit of claim 5, wherein the leadframe further includes a third laminate that extends over the first semiconductor die to form an electromagnetic shield.
8. The integrated circuit of claim 1, further comprising a bonding wire for coupling a pad of the first semiconductor die through the second laminate to the lead.
9. The integrated circuit of claim 1, further comprising an electrical component having a first electrode attached to the first laminate and a second electrode attached to the second laminate.
10. The integrated circuit of claim 1, further comprising a second semiconductor die mounted to the leadframe.
11. The integrated circuit of claim 10, wherein a first interconnect line of the first laminate is electrically coupled through the second laminate to a bonding pad of the first semiconductor die.
12. The integrated circuit of claim 11, wherein the second laminate is formed with a second interconnect line that is electrically coupled to a bonding pad of the second semiconductor die and crosses under the first interconnect line.
13. The integrated circuit of claim 1, wherein the first and second laminates are formed with a conductive material.
14. The integrated circuit of claim 13, wherein the first and second laminates are each formed to a thickness greater than fifty micrometers.
15. A semiconductor package, comprising a leadframe for mounting a semiconductor die, the leadframe including
a first conductive laminate having a bottom surface patterned for making external electrical connections; and
a second conductive laminate attached to a top surface of the first laminate and providing a signal path from the semiconductor die to the first conductive laminate.
16. The semiconductor package of claim 15, further comprising a molding compound for encapsulating the semiconductor die.
17. The semiconductor package of claim 16, wherein the second conductive laminate extends beyond an edge of the first conductive laminate to form a mold lock that secures the molding compound.
18. A semiconductor device, comprising:
a semiconductor die; and
a leadframe formed as stacked conductive laminates for mounting the semiconductor die, one of the stacked conductive laminates patterned to form an external lead of the semiconductor device and another of the stacked conductive laminates patterned for electrically coupling a bonding pad of the semiconductor die to the external lead.