Author: claimsbot

1. A method for providing a scalable user interface comprising the steps of:
receiving a task to be completed, including the building of a user interface to be presented on a client side device, into a user interface loader;
determining server capabilities required to accomplish the task utilizing the user interface loader;
determining the client side device capabilities required to accomplish the task utilizing the user interface loader;
providing reusable user interface components available for use in multiple profiles to the user interface loader, wherein the reusable interface components comprise a widget object component, a layout component, a visual style component, a data binding component, an interaction component and a navigation component, and wherein said multiple profiles comprise one or more user interface scalability strategies that are executed at runtime of building the user interface;
defining a user interface description utilizing the reusable interface components;
assigning responsibility for accomplishing portions of the task responsive to determining the server capabilities and the client side device capabilities utilizing said user interface loader by assigning components of the user interface to be built at the server or at the client side device responsive to profiles based upon the server capabilities and the client side device capabilities;
building the user interface from the user interface description; and
presenting the user interface on client side device to complete the task.
2. A computer system having a scalable user interface system, comprising:
a plurality of client side devices at least some of which have different capabilities;
a plurality of servers at least some of which have different capabilities and including a user interface generator responsive to a user interface description to apportion building a user interface based upon one or more profiles comprising user interface scalability strategies that are executed at runtime of building the user interface;
user interface components stored in memory and available for use to build the user interface description, wherein the interface components comprise a widget object component, a layout component, a visual style component, a data binding component, an interaction component and a navigation component; and
assigning said user interface components to be built at the server or at the client side device responsive to said profiles based upon the server capabilities and the client side device capabilities.
3. A method for providing a scalable user interface system, comprising the steps of:
providing general reusable user interface components and application specific user interface components to a user interface loader;
providing profiles for user interfaces based upon server capabilities and client side device capabilities to the user interface loader, wherein the profiles comprise one or more user interface scalability strategies;
providing reusable user interface components available for use in multiple profiles to the user interface loader, wherein the reusable interface components comprise a widget object component, a layout component, a visual style component, a data binding component, an interaction component and a navigation component; and
executing user interface scalability strategies at runtime to build a user interface description using the general user interface components and the reusable user interface components at a server and application specific user interface components available at a client side device.
4. A method for providing a scalable user interface system, comprising the steps of:
receiving a user interface description defining a user interface to be built;
apportioning building the user interface description between a server and a client side device responsive to one or more profiles based upon the server capabilities and the client side device capabilities, wherein said profiles comprise one or more user interface scalability strategies that are executed at runtime of building the user interface;
using user interface components stored on the server to build a first portion of the user interface description at the server for transmission to the client side device, wherein the user interface components comprise a widget object component, a layout component, a visual style component, a data binding component, an interaction component and a navigation component;
building a second portion of the user interface description at the client side device and combining the second portion with the first portion received from the server; and
displaying the user interface on the client side device.
5. The method of claim 4, which includes the step of discarding user interface components not capable of being displayed on the client side device.
6. A computer system having a scalable user interface system, comprising:
one or more client side devices with user interface presentation andor interaction capabilities; and
one or more servers with user interface support andor interaction handling capabilities and including a user interface generator responsive to a user interface description to apportion building the user interface description at the server or at the client side device based upon one or more profiles based upon the server capabilities and the client side device capabilities, said profiles comprising user interface scalability strategies executed at runtime of building the user interface, wherein the user interface description is generated from reusable user interface components comprising a widget object component, a layout component, a visual style component, a data binding component, an interaction component and a navigation component.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A process for manufacturing components in a semiconductor material wafer, comprising:
providing a multi-layer wafer comprising a first semiconductor material layer, a second semiconductor material layer, and a dielectric material layer arranged between said first and second semiconductor material layers; and
removing said first semiconductor material layer,
the removal step including the steps of:
mechanically thinning said first semiconductor material layer, forming a residual semiconductor layer; and
chemically removing said residual semiconductor layer.
2. The process according to claim 1, wherein said step of chemically removing comprises the step of using said dielectric material layer as a stop layer.
3. The process according to claim 1, wherein said step of mechanically thinning comprises the step of milling said first semiconductor material layer.
4. The process according to claim 1, wherein said step of mechanically thinning comprises thinning said first semiconductor material layer to a preset thickness.
5. The process according to claim 4, wherein said preset thickness is of approximately 50 m.
6. The process according to claim 1, wherein said step of providing said multi-layer wafer comprises the steps of:
depositing said dielectric material layer on top of said first semiconductor material layer and
growing said second semiconductor material layer on top of said dielectric material layer.
7. The process according to claim 1, wherein said step of providing said multi-layer wafer comprises using a SOI-type wafer.
8. The process according to claim 1, further comprising forming suspended structures inside said second semiconductor material layer.
9. The process according to claim 1, further comprising, before said step of removing said first semiconductor material layer, the steps of:
providing a first wafer of semiconductor material; and
fixing said multi-layer wafer to said first wafer, with said second semiconductor material layer facing said first wafer.
10. The process according to claim 9, wherein, before fixing said multi-layer wafer, the step is carried out of forming suspended structures inside said second semiconductor material layer.
11. The process according to claim 10, wherein said step of forming suspended structures comprises the steps of:
forming a sacrificial layer partially coating a first portion of said second semiconductor material layer;
growing a second portion of said second semiconductor material layer;
forming a first trench separating a stator region from a rotor region, and a second trench externally delimiting said rotor region; and
removing said sacrificial layer.
12. The process according to claim 9 wherein, after said step of removing said first semiconductor material layer, the step is carried out of forming a translating platform in said multi-layer wafer.
13. The process according to claim 12, wherein said step of forming a translating platform comprises the steps of:
defining said dielectric material layer to form a mask; and
etching said second semiconductor material layer using said mask to form a through trench delimiting said translating platform.
14. The process according to claim 1, further including removing said dielectric material layer after said step of chemically removing said residual semiconductor layer.
15. A method, comprising:
forming a dielectric layer on a semiconductor substrate;
forming an epitaxial layer on the dielectric layer;
mechanically removing a portion of the semiconductor substrate, leaving a remainder of the semiconductor substrate and the dielectric and epitaxial layers; and
chemically removing the remainder of the semiconductor substrate, leaving the dielectric and epitaxial layers.
16. The method of claim 15, further including forming a polycrystalline-silicon germ layer on the dielectric layer prior to forming the epitaxial layer.
17. The method of claim 15, further including removing the dielectric layer.
18. The method of claim 15, further including bonding a support layer to the epitaxial layer.
19. The method of claim 15, further including forming a micromechanical structure in the epitaxial layer prior to the thinning step.
20. The method of claim 19 wherein the step of forming a micromechanical structure comprises:
forming trenches in the epitaxial layer delineating the micromechanical structure;
forming and defining a layer of sacrificial material on the epitaxial layer such that it fills the trenches and defines, on the surface of the epitaxial layer, portions of the micromechanical structure;
forming an additional epitaxial layer on the epitaxial layer;
forming trenches in the additional epitaxial layer further delineating the micromechanical structure;
bonding portions of the additional epitaxial layer to a support layer; and
removing the sacrificial material.
21. A method, comprising:
forming a dielectric layer on a semiconductor substrate;
forming an epitaxial layer on the dielectric layer;
forming a micromechanical structure in the epitaxial layer;
mechanically removing a portion of the semiconductor substrate, leaving a remainder of the semiconductor substrate;
bonding a support layer to the micromechanical structure; and
chemically removing the remainder of the semiconductor substrate.

1. An optical apparatus having an optical axis, the optical apparatus comprising:
an optical element forming an asymmetrical shape with respect to the optical axis;
an optical element holding member that holds the optical element; and
at least three support members that support the optical element holding member,
wherein at least either one of the optical element holding member and the optical element is configured so that total weight of the optical element holding member and the optical element is applied substantially equally to the at least three support members.
2. The optical apparatus according to claim 1, wherein the at least three support members respectively support the optical element holding member at least three support positions, and center of mass of the optical element holding member and the optical element is located within a predetermined distance from the incenter of a triangle formed by three of the at least three support positions.
3. The optical apparatus according to claim 1, wherein the at least three support members respectively support the optical element holding member at least three support positions, and center of mass of the optical element holding member and the optical element coincides with the incenter of a triangle formed by three of the at least three support positions.
4. The optical apparatus according to claim 1, wherein the at least three support members respectively support the optical element holding member at least three support positions, and at least either one of the optical element holding member and the optical element is configured such that a reference plane containing the three support positions, center of mass of an optical unit including the optical element holding member and the optical element with respect to the reference plane, and an intersection point between a perpendicular of the reference plane extending through the center of mass and the reference plane have a predetermined positional relationship relative to a triangle formed by the three support positions.
5. The optical apparatus according to claim 4, wherein the intersection point coincides with the incenter of the triangle.
6. The optical apparatus according to claim 4, wherein the intersection point is located within a predetermined distance from the incenter of the triangle.
7. The optical apparatus according to claim 4, wherein the intersection point is located inside the triangle.
8. The optical apparatus according to claim 1, wherein the at least three support members respectively support the optical element holding member at least three support positions, and at least either one of the optical element holding member and the optical element is configured such that center of mass of the optical element holding member and the optical element located on a reference plane containing a triangle formed by three of the at least three support positions.
9. The optical apparatus according to claim 1, wherein the at least three support members respectively support the optical element holding member at least three support positions, and at least either one of the optical element holding member and the optical element is configured such that at least one of inertia principal axes of an optical unit including the optical element holding member and the optical element is parallel to a reference plane containing the at least support positions.
10. The optical apparatus according to claim 1, wherein the at least three support members respectively support the optical element holding member at least three support positions, and at least either one of the optical element holding member and the optical element is configured such that at least one of inertia principal axes of an optical unit including the optical element holding member and the optical element located on a reference plane containing the at least three support positions.
11. The optical apparatus according to claim 1, wherein the at least three support members respectively support the optical element holding member at least three support positions, and at least either one of the optical element holding member and the optical element is configured such that at least one of inertia principal axes of an optical unit including the optical element holding member and the optical element intersects with a triangle defined by three of the at least three support positions.
12. The optical apparatus according to claim 11, wherein the inertia principal axes all intersect with the triangle.
13. The optical apparatus according to claim 1, wherein at least either one of the optical element holding member and the optical element includes a balance weight.
14. The optical apparatus according to claim 13, wherein the balance weight is integrally formed with at least either one of the optical element holding member and the optical element.
15. An optical apparatus having an optical axis, the optical apparatus comprising:
an optical element forming an asymmetrical shape with respect to the optical axis;
an optical element holding member that holds the optical element;
at least three support members that support the optical element holding member; and
a balance weight provided to at least one of the optical element holding member and the optical element.
16. The optical apparatus according to claim 15, wherein the balance weight adjusts weight balance of at least one of the optical element holding member and the optical element such that the weight of the optical element holding member and the optical element is distributed and applied substantially equally to the at least three support members.
17. The optical apparatus according to claim 15, wherein at least either one of the optical element holding member and the optical element is configured such that weight of the optical element held by the optical element holding member is applied substantially equally to the at least three support members.
18. The optical apparatus according to claim 16, wherein the balance weight is a projecting portion integrally formed with at least one of the optical element holding member and the optical element.
19. The optical apparatus according to claim 16, wherein the balance weight is a cutaway portion formed in at least part of the optical element holding member and the optical element.
20. An optical apparatus having an optical axis, the optical apparatus comprising:
an optical element forming an asymmetrical shape with respect to the optical axis;
an optical element holding member that holds the optical element; and
at least three support members that support the optical element holding member,
wherein the at least three support members are arranged at irregular intervals such that weight of the optical element holding member and the optical element is distributed substantially equally to the at least three support members.
21. A barrel comprising:
an optical apparatus according to claim 1.
22. An exposure apparatus for exposing an image of a pattern formed on a mask onto a substrate through a projection optical system, the exposure apparatus comprising a barrel according to claim 21.
23. A device manufacturing method including a lithography operation, the method comprising:
performing exposure in the lithography operation by using an exposure apparatus according to claim 22.
24. A barrel comprising:
an optical apparatus according to claim 15.
25. An exposure apparatus for exposing an image of a pattern formed on a mask onto a substrate through a projection optical system, the exposure apparatus comprising a barrel according to claim 24.
26. A device manufacturing method including a lithography operation, the method comprising:
performing exposure in the lithography operation by using an exposure apparatus according to claim 23.
27. A barrel comprising:
an optical apparatus according to claim 20.
28. An exposure apparatus for exposing an image of a pattern formed on a mask onto a substrate through a projection optical system, the exposure apparatus comprising a barrel according to claim 27.
29. A device manufacturing method including a lithography operation, the method comprising:
performing exposure in the lithography operation by using an exposure apparatus according to claim 28.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A process for making a substrate bearing a coating of a crosslinked polymer composition on at least one surface thereof, comprising the steps of:
(a) coating onto said substrate a crosslinkable oligomer composition comprising:
(1) a first component oligomer comprising a plurality of polymerized monomer units having pendent, free-radically polymerizable functional groups, and a plurality of polymerized monomer units having pendent, hydrophilic poly(alkylene oxide) groups; and
(2) a second component oligomer comprising a plurality of polymerized monomer units having pendent, photoinitiator groups; and

(b) photochemically crosslinking said first component oligomer and second component oligomer, in the presence of a photoinitiator, by forming covalent bonds between said pendent, free-radically polymerizable functional groups of said first component oligomer said second component oligomer.
2. The process of claim 1 wherein said oligomer composition has been partially converted to a coatable viscosity of from 750 to 7,500 cPs at 22\xb0 C. prior to step a.
3. The process of claim 1 wherein said oligomer composition comprises
(a) per 100 parts by weight of said first component, an amount of said second component sufficient to provide more than two crosslinks per first component oligomer chain;
(b) less than 2 parts by weight residuals content.
4. The process of claim 1 wherein the molecular weight (Mn) of said first oligomer is less than the entanglement molecular weight.
5. The process of claim 1 wherein the average degree of polymerization of the first and second component oligomers is \u2266300.
6. The process of claim 1, wherein said pendent polyalkylene oxide groups of said first component oligomer is of the formula:
\u2014(CH(R1)\u2014CH2\u2014O)m\u2014R2
wherein R1 is a H or a C1 to C4 alkyl group, R2 is H, a C1 to C4 alkyl group, aryl, or combinations thereof, and m is from 2 to 100.
7. The process of claim 1, wherein said pendent poly(alkylene oxide) group is a poly(ethylene oxide) (co)polymer.
8. The process of claim 1, wherein said pendent poly(alkylene oxide) group is a poly(ethylene oxide-co-propylene oxide) copolymer.
9. The process of claim 1, wherein said second component oligomer further comprises a plurality of polymerized monomer units having pendent, hydrophilic poly(alkylene oxide) groups.
10. The process of claim 1 wherein said first oligomer having pendent unsaturated polymerizable groups is prepared by the reaction of an oligomer having a plurality of pendent reactive functional groups with an unsaturated compounds having co-reactive functional groups.
11. The process of claim 10 wherein said pendent reactive functional groups are selected from hydroxyl, amino, oxazolinyl, oxazolonyl, acetyl acetonyl, carboxyl, isocyanato, epoxy, aziridinyl, acyloyl halide, and cyclic anhydride groups.
12. The process of claim 1 wherein the second component oligomer is prepared by the reaction of an oligomer having a plurality of pendent reactive functional groups with co-reactive compounds having a photoinitator group.
13. The process of claim 1 which comprises an amount of said second component oligomer is sufficient to provide more than two crosslinks per first component oligomer chain.
14. The process of claim 1 wherein said crosslinkable oligomer composition comprises:
(a) from 0.01 to 99.9 parts by weight of said first component oligomer, and
(b) from 99.9 to 0.1 parts by weight of said second component oligomer,
wherein the composition, when crosslinked, can absorb at least 50 wt. % water.
15. The process of claim 1 wherein said first component oligomer comprises
(a) from 20 to 99 parts by weight of polymerized monomer units derived from an ethylenically-unsaturated monomer having a pendent poly(alkylene oxide) group;
(b) from 0.1 to 35 parts by weight of polymerized monomer units derived from of an ethylenically-unsaturated monomer having a pendent polymerizable functional group;
(c) from 0 to 50 parts by weight of polymerized monomer units derived from a polar monomer;
(d) from 0 to 20 parts by weight of polymerized monomer units derived from a hydrophobic monomer;
(e) from 0 to 10 parts by weight of at least one other monomer.
16. The process of claim 15 wherein said polar monomer c), when present, is selected from the group consisting of substituted (meth)acrylamides, N-vinyl pyrrolidone, N-vinyl caprolactam, acrylonitrile, N-vinyl acetamide, tetrahydrofurfuryl acrylate, acrylamides, and mixtures thereof.
17. The process of claim 1 wherein the second oligomer component comprises:
(a) from 20 to 99 parts by weight of polymerized monomer units having pendent, hydrophilic poly(alkylene oxide) groups,
(b) from 0.1 to 25 parts by weight of polymerized monomer units derived from of an ethylenically-unsaturated monomer having a pendent photoinitiator group;
(c) from 0 to 25 parts by weight of polymerized monomer units derived from of an ethylenically-unsaturated monomer having a pendent polymerizable group;
(d) from 0 to 20 parts by weight of hydrophobic monomers;
(e) from 0 to 50 parts by weight of polymerized monomer units derived from a polar monomer; and
(f) from 0 to 40 parts by weight, preferably less than 25 parts by weight, of at least one other monomer.