Author: claimsbot

1. A method of handling a load at a high desired load handling position using a mobile loading machine of the kind having a loading arm connected at one end to a body of the machine for movement at least about a generally horizontal axis between a lower travelling position, and a higher load handling position, and the arm having at its outermost end a loading implement for carrying the load, the method including the steps of manoeuvring the machine with the arm in the lower travelling position generally below the load handling position, and then one of:
a) directing a signal from the machine upwardly towards the load handling position in a plane in which a reference point of the loading implement is movable as the arm is raised about the generally horizontal axis, or
b) directing a signal downwardly from at or adjacent the load handling position in a plane in which a reference point of the loading implement would be moveable if the arm is raised about the generally horizontal axis with the machine in a correct lateral position,
to ascertain whether the machine is correctly laterally positioned so that if the arm is lifted, the loading implement is positionable at the load handling position, manoeuvring the machine as necessary until the machine is correctly laterally positioned and then raising the loading arm to raise the loading implement towards the load handling position.
2. A method according to claim 1 wherein the signal is directed from the machine upwardly towards the load handling position, and the signal is light which is directed as a fan of light in the plane of movement of the reference point.
3. A method according to claim 1 wherein the light is high intensity light such as collimated laser light.
4. A method according to claim 1 wherein the reference point of the loading implement is a laterally central position of the loading implement, which lies generally along an elongate axis of the loading arm.
5. A method according to claim 2 wherein the light is directed upwardly towards the load handling position from an illuminating device carried on one of the loading arm and the body of the machine to direct the light in the plane.
6. A method according to claim 1 wherein the signal is directed from at or adjacent the load handling position downwardly towards the machine, and the signal is receivable by a receiver of the machine at least when the machine is correctly laterally positioned.
7. A method according to any one of the preceding claims wherein where the arm includes a plurality of relatively telescopic sections, the method including extending the arm to move the loading implement axially of the arm towards the load handling position.
8. A method of handling a load at a high desired load handling position using a mobile loading machine of the kind having a loading arm connected at one end to a body of the machine for movement at least about a generally horizontal axis between a lower travelling position, and a higher load handling position, and the arm having at its outermost end a loading implement for carrying the load, the method including the steps of directing a signal from at or adjacent the load handling position downwardly towards the machine and manoeuvring the machine with the aim in the lower travelling position generally below the load handling position, until the signal is received by a receiver of the machine to indicate that the machine is in a correct lateral position so that if the arm is raised, the loading implement is positionable at the load handling position, and then raising the loading arm to raise the loading implement towards the load handling position.
9. A method according to claim 8 wherein one of a signalling device and a target is located at or adjacent the load handling position, from which the signal passes to the receiver.
10. A method according to claim 8 wherein the receiver is located adjacent the machine operator so that the machine operator may use the receiver directly visually.
11. A method according to claim 8 wherein the receiver is provided by a camera which provides a signal to a screen viewer which is viewable by the machine operator.
12. A mobile loading machine of the kind having a loading arm connected at one end to a body of the machine for movement at least about a generally horizontal axis between a lower travelling position, and a higher load handling position, and the arm having at its outermost end a loading implement for carrying the load, the machine being manoeuvrable with the arm in the lower travelling position to below a high load handling position, the machine further including an device for directing a signal upwardly towards the load handling position in a plane in which a reference point of the loading implement is movable as the arm is raised about the generally horizontal axis.
13. A machine according to claim 12 wherein the signalling device produces a fan or beam of light.
14. A mobile loading machine of the kind having a loading arm connected at one end to a body of the machine for movement at least about a generally horizontal axis between a lower travelling position, and a higher load handling position, and the arm having at its outermost end a loading implement for carrying the load, the machine including a receiver, the machine being manoeuvrable with the arm in the lower travelling position to generally below the load handling position, as necessary until a signal from at or adjacent the load handling position is received by the receiver to indicate that the machine is in a correct lateral position.
15. A machine according to claim 14 wherein the signal is light and the receiver is a viewer which is located adjacent the machine operator so that the machine operator may use the viewer directly visually.
16. A machine according to claim 15 wherein the receiver is provided by a camera which provides a signal to a screen viewer which is viewable by the machine operator.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A chip package, comprising:
a substrate having an upper surface and a lower surface;
a plurality of conducting pads located under the lower surface of the substrate;
a dielectric layer located between the conducting pads;
a trench extending from the upper surface towards the lower surface of the substrate;
a hole extending from a bottom of the trench towards the lower surface of the substrate, wherein an upper sidewall of the hole inclines to the lower surface of the substrate, and a lower sidewall or a bottom of the hole exposes a portion of the conducting pads; and
a conducting layer located in the hole and electrically connected to at least one of the conducting pads,
wherein an upper conducting pad of the conducting pads has at least an opening or a trench, wherein the opening or the trench exposes a lower conducting pad of the conducting pads.
2. The chip package as claimed in claim 1, wherein a thickness of at least one of the conducting pads near the hole increases along a direction away from the hole.
3. The chip package as claimed in claim 1, wherein the bottom of the hole exposes an upper surface of at least one of the conducting pads.
4. The chip package as claimed in claim 1, wherein the lower sidewall of the hole exposes a side of at least one of the conducting pads.
5. The chip package as claimed in claim 1, further comprising a spacer layer disposed under the conducting pads, wherein the hole further extends into the spacer layer.
6. The chip package as claimed in claim 1, further comprising an optoelectronic device formed in the substrate.
7. The chip package as claimed in claim 1, further comprising a second substrate disposed below the lower surface of the substrate and below the conducting pads.
8. The chip package as claimed in claim 7, further comprising an optoelectronic device formed in the second substrate.
9. The chip package as claimed in claim 7, wherein the hole further extends into the second substrate.
10. The chip package as claimed in claim 9, further comprising an insulating layer located between the conducting layer and the second substrate.
11. The chip package as claimed in claim 7, further comprising a spacer layer disposed below the second substrate, wherein the hole further extends into the spacer layer.
12. The chip package as claimed in claim 11, further comprising an insulating layer located between the conducting layer and the second substrate and located between the conducting layer and the spacer layer.
13. The chip package as claimed in claim 1, further comprising a solder mask layer located on the conducting layer and filling the hole substantially and completely.
14. A chip package, comprising:
a substrate having an upper surface and a lower surface;
a plurality of conducting pads located under the lower surface of the substrate;
a dielectric layer located between the conducting pads;
a trench extending from the upper surface towards the lower surface of the substrate;
a hole extending from a bottom of the trench towards the lower surface of the substrate, wherein an upper sidewall of the hole inclines to the lower surface of the substrate, and a lower sidewall or a bottom of the hole exposes a portion of the conducting pads;
a conducting layer located in the hole and electrically connected to at least one of the conducting pads; and
a spacer layer disposed under the conducting pads, wherein the hole further extends into the spacer layer.
15. The chip package as claimed in claim 14, wherein a thickness of at least one of the conducting pads near the hole increases along a direction away from the hole.
16. The chip package as claimed in claim 14, wherein the bottom of the hole exposes an upper surface of at least one of the conducting pads.
17. The chip package as claimed in claim 14, wherein the lower sidewall of the hole exposes a side of at least one of the conducting pads.
18. The chip package as claimed in claim 14, further comprising an optoelectronic device formed in the substrate.
19. The chip package as claimed in claim 14, further comprising a second substrate disposed below the lower surface of the substrate and below the conducting pads.
20. The chip package as claimed in claim 19, further comprising an optoelectronic device formed in the second substrate.
21. The chip package as claimed in claim 19, wherein the hole further extends into the second substrate.
22. The chip package as claimed in claim 21, further comprising an insulating layer located between the conducting layer and the second substrate.
23. The chip package as claimed in claim 19, further comprising a spacer layer disposed below the second substrate, wherein the hole further extends into the spacer layer.
24. The chip package as claimed in claim 23, further comprising an insulating layer located between the conducting layer and the second substrate and located between the conducting layer and the spacer layer.
25. The chip package as claimed in claim 14, further comprising a solder mask layer located on the conducting layer and filling the hole substantially and completely.

1. An organic light-emitting display apparatus, comprising:
a substrate;
a first passivation layer formed on the substrate;
at least one of color filters formed on the first passivation layer;
an overcoat layer that covers the color filter;
a second passivation layer that is formed on the first passivation layer and surrounds the overcoat layer;
a first electrode formed on the second passivation layer;
a second electrode facing the first electrode; and
an organic layer disposed between the first electrode and the second electrode.
2. The organic light-emitting display apparatus of claim 1, wherein the color filter is one of red, green, and blue color filters.
3. The organic light-emitting display apparatus of claim 1, further comprising a polarizing film on a surface of the substrate.
4. The organic light-emitting display apparatus of claim 1, further comprising a black matrix in which optical transmission regions and optical blocking regions are divided on the second passivation layer.
5. The organic light-emitting display apparatus of claim 1, further comprising a black matrix in which optical transmission regions and optical blocking regions are divided between the substrate and the first passivation layer.
6. The organic light-emitting display apparatus of claim 1, further comprising a pixel defining layer in which a pixel region and a non-pixel region are divided on the second passivation layer.
7. The organic light-emitting display apparatus of claim 1, wherein the color filter has a thickness in a range from about 1 \u03bcm to about 5 \u03bcm.
8. The organic light-emitting display apparatus of claim 1, wherein the overcoat layer has a thickness in a range from about 1 \u03bcm to about 10 \u03bcm.
9. The organic light-emitting display apparatus of claim 1, wherein the first and second passivation layers comprise a SiOx group layer or a SiNx group layer.
10. The organic light-emitting display apparatus of claim 1, wherein the second passivation layer has a thickness in a range from about 500 \u212b to about 10,000 \u212b.
11. A method of manufacturing an organic light-emitting display apparatus, the method comprising steps of:
providing a substrate;
forming a first passivation layer on the substrate;
forming at least one color filter on the first passivation layer;
forming an overcoat layer that covers the color filter;
forming a second passivation layer on the first passivation layer to surround the overcoat layer;
forming a first electrode on the second passivation layer;
forming an organic layer on the first electrode; and
forming a second electrode on the organic layer.
12. The method of claim 11, wherein
the forming of the first passivation layer on the substrate comprises forming the first passivation layer by using a SiOx group layer or a SiNx group layer, and
the forming of the second passivation layer on the first passivation layer comprises forming the first passivation layer by using a SiOx group layer or a SiNx group layer.
13. The method of claim 11, wherein the forming of the second passivation layer comprises forming the second passivation layer to have a thickness in a range from about 500 \u212b to about 10,000 \u212b.
14. The method of claim 11, wherein the forming of at least one color filter on the first passivation layer comprises forming the color filter to have a thickness in a range from about 1 \u03bcm to about 5 \u03bcm.
15. The method of claim 11, wherein the forming of the overcoat layer comprises forming the overcoat layer to have a thickness in a range from about 1 \u03bcm to about 10 \u03bcm.
16. The method of claim 11, further comprising forming a pixel defining layer in which a pixel region and a non-pixel region are divided on the second passivation layer between the forming of the first electrode and the forming of the organic layer.
17. The method of claim 11, after the forming of the second electrode on the organic layer, further comprising additionally forming a polarizing film on a surface of the substrate.
18. The method of claim 11, further comprising forming a black matrix in which optical transmission regins and optical blocking regions are divided on the second passivation layer between the forming of the second passivation layer and the forming of the first electrode on the second passivation layer.
19. The method of claim 11, further comprising forming a black matrix in which optical transmission regins and optical blocking regions are divided on the substrate between the forming of the substrate and the forming of the first passivation layer on the substrate.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A filled skutterudite comprising a chemical composition of GyM4X12, where G comprises mischmetal as a source of guest atoms; wherein mischmetal comprises at least two rare earth elements and one or more non-rare earth impurities, y is a filling fraction of said guest atoms, M represents transition metal atoms, and X represents atoms from groups IVA-VIA of the periodic table.
2. The filled skutterudite of claim 1 wherein said chemical composition is MmyCo4Sb12 (0<y\u22661), where Mm is mischmetal.
3. The filled skutterudite of claim 1 wherein M is a transition metal selected from the group consisting of Mn, Tc, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag and Au.
4. The filled skutterudite of claim 3 wherein M is Co, Rh or Ir.
5. The filled skutterudite of claim 4 wherein M is Co.
6. The filled skutterudite of claim 1 wherein X is an atom selected from the group consisting of C, Si, Ge, Sn, Pb, N, P, As, Sb, Bi, O, S, Se, Te and Po.
7. The filled skutterudite of claim 6 wherein X is P, As or Sb.
8. The filled skutterudite of claim 7 wherein X is Sb.
9. A filled skutterudite comprising a chemical composition of GyM4X12, where G represents mischmetal alone or in combination with at least one rare earth element, as a source of guest atoms; wherein mischmetal comprises at least two rare earth elements and one or more non-rare earth impurities, y is a filling fraction of said guest atoms, M represents transition metal atoms, and X represents atoms from groups IVA-VIA of the periodic table.
10. The filled skutterudite of claim 9 wherein said rare earth element is a rare earth element selected from the group consisting of Ce, Pr, Nd, Sm, Eu, Gd, Dy, Ho, Er, Tm, Yb, Lu, and combinations of these atoms.
11. The filled skutterudite of claim 9 wherein M is a transition metal selected from the group consisting of Mn, Tc, Re, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Cu, Ag and Au.
12. The filled skutterudite of claim 11 wherein M is Co, Rh or Ir.
13. The filled skutterudite of claim 12 wherein M is Co.
14. The filled skutterudite of claim 9 wherein X is an atom selected from the group consisting of C, Si, Ge, Sn, Pb, N, P, As, Sb, Bi, O, S, Se, Te and Po.
15. The filled skutterudite of claim 14 wherein X is P, As or Sb.
16. The filled skutterudite of claim 15 wherein X is Sb.