1. A golf ball comprising a ball surface having a plurality of non-circular dimples thereon, wherein mutually neighboring dimples have contour lines therebetween which are arranged so as to be substantially parallel and are separated by an interval of 0.05 to 1.0 mm, land areas defined by the substantially parallel contour lines have an outer surface which forms the outermost peripheral face of the ball, and the non-circular dimples have a non-circular shape with inside angles that are curved, wherein a plurality of circular dimples is present on the ball surface.
2. The golf ball of claim 1, which has a dimple surface coverage, based on the surface area of the ball, of at least 75%.
3. The golf ball of claim 1, wherein a number of the plurality of circular dimples is adjusted to a ratio of at least 2% but not more than 50% of a total number of dimples.
4. The golf ball of claim 1, wherein at least four but not more than seven non-circular dimples are present around each of the plurality of circular dimples.
5. The golf ball of claim 1, wherein a volume of the plurality of non-circular dimples as a proportion of a total volume of the ball, expressed as the ratio of a cumulative volume of the plurality of non-circular dimples enclosed between an imaginary sphere were the ball to have no dimples on its surface and the dimple recesses to a volume of the imaginary sphere were the ball to have no dimples on its surface is set in a range of at least 1.1% but not more than 1.7%.
6. A golf ball comprising a ball surface having a plurality of non-circular dimples thereon, wherein mutually neighboring dimples have contour lines therebetween which are arranged so as to be substantially parallel and are separated by an interval of 0.05 to 1.0 mm, land areas defined by the substantially parallel contour lines have an outer surface which forms the outermost peripheral face of the ball, and the non-circular dimples have a non-circular shape with inside angles that are curved, wherein the non-circular dimples having a non-circular shape with curved inside angles have, in the smallest curved portions thereof, a radius of curvature in a range of 0.1 to 3.0 mm.
7. The golf ball of claim 6, wherein a plurality of circular dimples is present on the ball surface.
8. The golf ball of claim 6, which has a dimple surface coverage, based on the surface area of the ball, of at least 75%.
9. The golf ball of claim 6, wherein the dimples on the ball surface have a cumulative volume, obtained by summing the volumes of the individual dimples below a flat plane circumscribed by the edge of each dimple, of from 400 to 750 mm3.
10. The golf ball of claim 6, wherein a volume of the plurality of non-circular dimples as a proportion of a total volume of the ball, expressed as the ratio of a cumulative volume of the plurality of non-circular dimples enclosed between an imaginary sphere were the ball to have no dimples on its surface and the dimple recesses to a volume of the imaginary sphere were the ball to have no dimples on its surface is set in a range of at least 1.1% but not more than 1.7%.
11. A golf ball comprising a ball surface having a plurality of non-circular dimples thereon, wherein mutually neighboring dimples have contour lines therebetween which are arranged so as to be substantially parallel and are separated by an interval of 0.05 to 1.0 mm, land areas defined by the substantially parallel contour lines have an outer surface which forms the outermost peripheral face of the ball, and the non-circular dimples have a non-circular shape with inside angles that are curved, wherein the dimples on the ball surface have a cumulative volume, obtained by summing the volumes of the individual dimples below a flat plane circumscribed by the edge of each dimple, of from 400 to 750 mm3.
12. The golf ball of claim 11, wherein a plurality of circular dimples is present on the ball surface.
13. The golf ball of claim 11, wherein the non-circular dimples having a non-circular shape with curved inside angles have, in the smallest curved portions thereof, a radius of curvature in a range of 0.1 to 3.0 mm.
14. The golf ball of claim 11, which has a dimple surface coverage, based on the surface area of the ball, of at least 75%.
15. The golf ball of claim 11, wherein a volume of the plurality of non-circular dimples as a proportion of a total volume of the ball, expressed as a ratio of a cumulative volume of the plurality of non-circular dimples enclosed between an imaginary sphere were the ball to have no dimples on its surface and the dimple recesses to a volume of the imaginary sphere were the ball to have no dimples on its surface is set in a range of at least 1.1% but not more than 1.7%.
16. A golf ball comprising a ball surface having a plurality of non-circular dimples thereon, wherein mutually neighboring dimples have contour lines therebetween which are arranged so as to be substantially parallel and are separated by an interval of 0.05 to 1.0 mm, land areas defined by the substantially parallel contour lines have an outer surface which forms the outermost peripheral face of the ball, and the non-circular dimples have a non-circular shape with inside angles that are curved,
wherein a plurality of circular dimples is present on the ball surface,
wherein the non-circular dimples having a non-circular shape with curved inside angles have, in the smallest curved portions thereof, a radius of curvature in a range of 0.1 to 3.0 mm; and
wherein the dimples on the ball surface have a cumulative volume, obtained by summing the volumes of the individual dimples below a flat plane circumscribed by the edge of each dimple, of from 400 to 750 mm3.
17. The golf ball of claim 16, which has a dimple surface coverage, based on the surface area of the ball, of at least 75%.
18. The golf ball of claim 16, wherein a number of the plurality of circular dimples is adjusted to a ratio of at least 2% but not more than 50% of a total number of dimples.
19. The golf ball of claim 16, wherein at least four but not more than seven non-circular dimples are present around each of the plurality of circular dimples.
20. The golf ball of claim 16, wherein a volume of the plurality of non-circular dimples as a proportion of a total volume of the ball, expressed as the ratio of a cumulative volume of the plurality of non-circular dimples enclosed between an imaginary sphere were the ball to have no dimples on its surface and the dimple recesses to a volume of the imaginary sphere were the ball to have no dimples on its surface is set in a range of at least 1.1% but not more than 1.7%.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A sputter deposition system for depositing at least one layer on a substrate, comprising:
a) a deposition chamber having an azimuthal axis;
b) a rotatable member associated with the deposition chamber and including a plurality of magnetrons provided thereon, each of the plurality of magnetrons including a corresponding one of a plurality of sputtering targets, the rotatable member configured to position each of the magnetrons to direct sputtered material from the corresponding one of the sputtering targets to a deposition zone defined in the deposition chamber;
c) a transport mechanism in the deposition chamber, the transport mechanism having an arm rotatable about the azimuthal axis; and
d) a substrate holder attached to the arm of the transport mechanism at a first radius from the azimuthal axis, the substrate holder supporting the substrate as the arm rotates the substrate holder to intersect the deposition zone for depositing sputtered material on the substrate.
2. The deposition system of claim 1 wherein the substrate holder is configured to rotate about a central rotation axis for rotating the substrate as the arm moves the substrate through the deposition zone.
3. The deposition system of claim 1 further comprising:
a processor in communication with the transport mechanism, wherein the processor instructs the transport mechanism to rotate the arm about the azimuthal axis through the deposition zone at first and second angular velocities to provide a substantially uniform thickness of the sputtered material on the substrate.
4. The deposition system of claim 1 further comprising:
a second transport mechanism having an arm that rotates about the azimuthal axis to transport a second substrate through the deposition zone; and
a second substrate holder attached to the arm of the second transport mechanism at a second radius from the azimuthal axis for supporting the second substrate.
5. The deposition system of claim 1 wherein at least one of the sputtering targets comprises at least two materials.
6. The deposition system of claim 1 wherein the rotatable member includes a second rotatable member, each member of the second rotatable member including a plurality of magnetrons provided thereon, each of the plurality of magnetrons of the second rotatable member including a corresponding one of a plurality of sputtering targets, the second rotatable member configured to position each of the magnetrons to direct sputtered material from the corresponding one of the sputtering targets to a second deposition zone defined in the deposition chamber.
7. The deposition system of claim 1 wherein the plurality of magnetrons includes six magnetrons.
8. The deposition system of claim 1 further comprising:
a processor in communication with the rotatable member, wherein the processor instructs the rotatable member to rotate the sputtering target of each of the plurality of magnetrons to align with the deposition zone for depositing sputtered material on the substrate.
9. The deposition system of claim 1 further comprising:
a processor in communication with the transport mechanism, wherein the processor instructs the transport mechanism to transport the substrate through the deposition zone.
10. The deposition system of claim 1 further comprising:
a chimney situated within the deposition chamber and being in association with the rotatable member for confining and directing sputtered material from the corresponding one of the sputtering targets to the deposition zone defined in the deposition chamber.
11. A sputter deposition system for depositing at least one layer on a substrate, comprising:
a) a deposition chamber having an azimuthal axis;
b) a rotatable member associated with the deposition chamber and including a plurality of magnetrons provided thereon, each of the plurality of magnetrons including a corresponding one of a plurality of sputtering targets, the rotatable member configured to position each of the magnetrons to direct sputtered material from the corresponding one of the sputtering targets to a deposition zone defined in the deposition chamber;
c) a transport mechanism in the deposition chamber, the transport mechanism having an arm rotatable about the azimuthal axis;
d) a substrate holder attached to the arm of the transport mechanism at a first radius from the azimuthal axis, the substrate holder supporting the substrate as the arm rotates the substrate holder to intersect the deposition zone for depositing sputtered material on the substrate, the substrate holder further configured to rotate about a central rotation axis for rotating the substrate as the arm moves the substrate through the deposition zone; and
e) a processor in communication with the transport mechanism, wherein the processor instructs the transport mechanism to rotate the arm about the azimuthal axis through the deposition zone at first and second angular velocities to provide a substantially uniform thickness of the sputtered material on the substrate.
12. The deposition system of claim 11 further comprising:
a second transport mechanism having an arm that rotates about the azimuthal axis to transport a second substrate through the deposition zone; and
a second substrate holder attached to the arm of the second transport mechanism at a second radius from the azimuthal axis for supporting the second substrate.
13. The deposition system of claim 11 wherein at least one of the sputtering targets comprises at least two materials.
14. The deposition system of claim 11 wherein the rotatable member includes a second rotatable member, each member of the second rotatable member including a plurality of magnetrons provided thereon, each of the plurality of magnetrons of the second rotatable member including a corresponding one of a plurality of sputtering targets, the second rotatable member configured to position each of the magnetrons to direct sputtered material from the corresponding one of the sputtering targets to a second deposition zone defined in the deposition chamber.
15. The deposition system of claim 11 wherein the plurality of magnetrons includes six magnetrons.
16. The deposition system of claim 11 further comprising:
a chimney situated within the deposition chamber and being in association with the rotatable member for confining and directing sputtered material from the corresponding one of the sputtering targets to the deposition zone defined in the deposition chamber.
17. A method of sputter depositing at least one layer onto a substrate, the method comprising:
a) rotating a rotatable member supporting a plurality of magnetrons to select a sputtering target of a first magnetron;
b) directing material from the sputtering target of the first magnetron to a deposition zone defined in a deposition chamber; and
c) rotating a substrate about an azimuthal axis through the deposition zone.
18. The method of claim 17 further comprising:
rotating the substrate about a central rotation axis perpendicular to the substrate surface as the substrate is transported through the deposition zone.
19. The method of claim 17 further comprising:
rotating the substrate about the azimuthal axis through the deposition zone at first and second angular velocities to provide a substantially uniform thickness of the material on the substrate.
20. The method of claim 17 further comprising:
rotating a second substrate about the azimuthal axis through the deposition zone.
21. The method of claim 17 further comprising:
rotating the rotatable member supporting the plurality of magnetrons to select a sputtering target of a second magnetron,
directing material from the sputtering target of the second magnetron to the deposition zone defined in the deposition chamber, and
rotating the substrate about the azimuthal axis through the deposition zone.
22. The method of claim 17 further comprising:
rotating a second rotatable member supporting a plurality of magnetrons to select a sputtering target of a first magnetron,
directing a first material from the sputtering target of the first magnetron of the second rotatable member to a second deposition zone defined in the deposition chamber; and
rotating the substrate about the azimuthal axis through the second deposition zone.