Author: claimsbot

1. A method of removing photoresist and post etch residue from a semiconductor substrate having a layer of low-k dielectric material comprising:
introducing a semiconductor substrate having a layer of low-k dielectric material having photoresist and post etch residue thereon into a downstream reaction chamber;
generating plasma comprising reactive species in an upstream applicator, wherein the reactive species comprise atomic hydrogen and atomic oxygen, wherein atomic oxygen passivates applicator surfaces exposed to the plasma, wherein the plasma is generated from a gas mixture comprising 0.05-0.1% by volume oxygen, 1-10% by volume hydrogen, and balance inert carrier gas and
introducing the reactive species into the downstream reaction chamber, wherein atomic hydrogen removes photoresist and post etch residue from the low-k dielectric material.
2. The method of claim 1, wherein the oxygen is supplied as O2.
3. The method of claim 1, wherein the gas mixture has a total flow rate of up to about 6000-7000 standard cubic centimeters per minute.
4. The method of claim 1, wherein the semiconductor substrate is a semiconductor wafer supported on a substrate support heated to a temperature of at least 250\xb0 C.
5. The method of claim 1, wherein the reactive species are introduced into the downstream reaction chamber through a quartz baffle and further wherein atomic oxygen passivates baffle surfaces exposed to the plasma.
6. The method of claim 1, wherein the reactive species are exposed to a quartz chamber liner before being introduced into the downstream reaction chamber and further wherein atomic oxygen passivates chamber liner surfaces exposed to the plasma.
7. The method of claim 1, wherein the upstream applicator is comprised of quartz.
8. The method of claim 1, wherein the volume ratio of hydrogen to oxygen is greater than 10:1.
9. The method of claim 1, wherein the volume ratio of hydrogen to oxygen is greater than 20:1.
10. The method of claim 1, wherein the volume ratio of hydrogen to oxygen is greater than 40:1.
11. The method of claim 1, wherein the inert carrier gas is selected from the group consisting of helium, argon, and mixtures thereof.
12. The method of claim 11, wherein the inert carrier gas is helium and further wherein hydrogen and helium are supplied as H2He.
13. The method of claim 1, further comprising seasoning the reaction chamber with an oxygen-containing gas, which is energized into a plasma state for a time sufficient to remove polymer byproducts deposited on chamber surfaces, prior to introducing the semiconductor substrate into the downstream reaction chamber.
14. A method of sequentially processing semiconductor wafers comprising:
a) removing photoresist and post etch residue from a semiconductor substrate according to the method of claim 13;
b) removing the semiconductor wafer from the downstream reaction chamber; and
c) repeating steps a) and b).

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. What I claim for my invention is a process for incorporating a unique ingredient, goya (momordica charantia), in generic paraffin and cosmetic clay for facial masks and body application.
2. I further claim that while goya is widely used in Asian cooking and folk medicine, my invention marks the first use of goya as a key ingredient for cosmetic facial masks and cosmetic skin care.
3. I further claim that following goya facial mask or body application, clients perceive softer, smoother, refreshed skin and express pleasure with the elegant or exotic nature of the invention.

1. A method for producing local analgesia in a subject having a site of local discomfort, the method comprising topically administering an effective amount of an aliphatic polyamine to the site.
2. A method for producing relief in a subject having a site subject of nociceptive stimulation, the method comprising topically administering an effective amount of an aliphatic polyamine to the site.
3. The method of claim 1 or 2, wherein the polyamine is an alkylamine, preferably in which all of the amines a primary alkyl amines.
4. The method of claim 1, 2 or 3, wherein the polyamine has up to fifteen carbon atoms.
5. The method of any of claims 1 to 4, wherein the polyamine has up to four amino groups.
6. The method of any of claims 1 to 4, wherein the polyamine has up to three amino groups.
7. The method of any of claims 1 to 6, wherein the polyamine is saturated.
8. The method of any of claims 1 to 7, wherein the polyamine is non-cyclic.
9. The method of any of claims 1 to 8, wherein the polyamine has up to ten carbon atoms.
10. The method of claim 9, wherein the polyamine is spermine.
11. The method of claim 9, wherein the polyamine has at least four carbon atoms.
12. The method of claim 11, wherein the polyamine has up to seven carbon atoms.
13. The method of claim 12, wherein the polyamine is putrescine.
14. The method of claim 12, wherein the polyamine is spermidine.
15. The method of claim 12, wherein the polyamine is cadaverine.
16. The method of any preceding claim wherein the polyamine is administered as part of a composition and wherein the polyamine may be present, at least in part, as a pharmaceutically acceptable salt.
17. The method of claim 16, wherein the polyamine makes up between 0.1 and 10 weight percent of the composition administered to the site, or between 0.2 and 9 percent, or between 0.3 and 8 percent, or between 0.4 and 7 percent, or between 0.5 and 6 percent, or between 0.6 and 5 percent, or between 0.7 and 5 percent, or between 0.8 and 5 percent, or between 1 and 4 percent or between 1 and 3 percent, or between 1 and 2 percent.
18. The method of any preceding claim, wherein the site is located on the epidermis of a human.
19. The method of any of claims 16 to 18, wherein the composition further comprises a chaotropic agent.
20. The method of claim 19, wherein the chaotropic agent is urea, or is oleic acid, or is a combination of urea and oleic acid.
21. The method of claim 20, wherein the urea makes up about, or at least 5 percent, or about or at least 10 percent, or about at least 15 percent, or about or at least 20 percent, or about or at least 25 percent, or about or at least 30 percent, or about or at least 35 percent, or about or at least 40 percent, by weight, of the composition.
22. The method of any of claims 16 to 21, wherein the composition includes a pharmaceutically acceptable vehicle compatible with mammalian skin, and particularly, human skin.
23. The method of any of claims 16 to 22, wherein composition is a cream, or a is a spray, or is an ointment or is a gel, or is a lotion.
24. The method of any of claims 16 to 23, wherein the composition further comprises beta 1,3-D glucan.
25. The method of any of claims 16 to 24, wherein the composition further comprises lidocaine.
26. The method of any preceding claim, wherein the discomfort is the result of a sports injury, a physical assault, arthritis, rheumatism, headache, shingles, surgical pain, or a combination of any of the foregoing.
27. The method of any of claims 1 to 25, wherein the pain being experienced by the mammal is the result of a non-pathological condition.
28. The method of any of claims 1 to 25, wherein the subject is suffering from fibromyalgia.
29. The method of any of claims 1 to 22, wherein administering the polyamine includes mounting a patch having the polyamine incorporated thereinto at the site such that the polyamine is transferred from the patch to the site.
30. The method of claim 29, wherein release of the polyamine from the patch is controlled to produce the analgesia over a period of time, wherein the period of time can be up to about one week, or wherein the period of time is between about one hour and one week, or between one hour and six days, or between six hours and five days, or between six hours and four days, or between twenty-four hours and three days, or between one day and two days.
31. The method of any preceding claim, wherein the site is free of extracellular wound scar skin tissue.
32. The method of any of claims 1 to 30, wherein the site is free of a wound undergoing healing of the skin.
33. A topical analgesic drug composition comprising an analgesia-inducing amount of at least one aliphatic polyamine and urea, wherein the urea is present in the amount of at least about 5, or about 10, or about 15 percent urea, or about 20 percent urea, or about 25 percent urea, or about 30 percent urea, or about 35 percent urea, or about 40 percent urea.
34. A topical analgesic drug composition according to claim 32, and further according to any of claims 3 to 17, and any combination of the elements defined therein.
35. A topical analgesic drug composition according to 33 or 34, and further comprising a pharmaceutically acceptable vehicle compatible with mammalian skin, and particularly, human skin.
36. A topical analgesic drug composition according to any of claims 33 to 35, wherein composition is a cream, or a is a spray, or is an ointment or is a gel, or is a lotion.
37. A topical analgesic drug composition according to any of claims 33 to 36, wherein the composition further comprises beta 1,3-D glucan.
38. A topical analgesic drug composition according to any of claims 33 to 37, wherein the composition further comprises lidocaine
39. A topical analgesic drug composition according to any of claims 33, 34, 35, 37 and 38, wherein the polyamine is incorporated into a patch.
40. Use of a composition of any of claims 33 to 39 in the treatment of a subject having a site of local discomfort.
41. Use of a composition of any of claims 33 to 38 in the production of a medicament for the treatment of a subject having a site of local discomfort andor subject having a site subject of nociceptive stimulation.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A blank for forming a collapsible field director structure, the blank comprising:
a sheet of nonconductive material having at least three panels thereon, one of the panels being a master panel and the other two panels being respective first and second slave panels,
each panel being substantially rectangular in shape and having a first and second surface thereon, wherein one of the surfaces is a front surface and the other of the surfaces is a rear surface, elongated upper and lower edges and two relatively shorter side edges, each panel being connected to at least one adjacent panel along an elongated edge,
the master panel having a line of articulation formed thereon, the line of articulation extending generally parallel to the upper edge thereof and subdividing the master panel into a mounting flange portion and a remainder portion, the remainder portion including a spacer section and a conductor section,
the conductor section of the master panel and both of the slave panels having at least two spaced-apart conductive regions thereon with a land being defined therebetween,
a region of adhesive material on:
the first surface of a first one of the panels; and
another region of adhesive material on:
the first surface on one of the other panels or the second surface of said first one of the panels; the slave panels each being foldable along an elongated edge thereof so that a surface of each of the slave panels is brought into confronting facial adjacency to and adhered against a surface of the master panel.
2. The blank of claim 1 wherein
one slave panel has at least one locking tab disposed along one elongated edge thereof, and wherein
the other slave panel has at least one locking tab disposed along the other elongated edge thereof.
3. The blank of claim 1 wherein said adhesive region is disposed on the front surface (102F) of the master panel (102); and said another adhesive region is disposed on the rear surface (102R) of the master panel (102).
4. The blank of claim 1 wherein said adhesive region is disposed on the front surface (102F) of the master panel (102); and said another adhesive region is disposed on the rear surface (106R) of the slave panel (106).
5. The blank of claim 1 wherein said adhesive region is disposed on the rear surface (104R) of the slave panel (104); and said another adhesive region is disposed on the rear surface (106R) of the slave panel (106).
6. The blank of claim 1 wherein said adhesive region is disposed on the rear surface (102R) of the master panel (102); and said another adhesive region is disposed on the rear surface (104R) of the slave panel (104).
7. The blank of claim 1 wherein said adhesive region is disposed on the rear surface (102R) of the master panel (102) and said another adhesive region is disposed on both the front surface (102F) of the master panel (102) and the rear surface (104R) of the slave panel (104).
8. The blank of claim 1 wherein said adhesive region is disposed on the front surface (102F) of the master panel (102), and said another adhesive region is disposed on both the rear surface (102R) of the master panel (102) and the rear surface (106R) of the slave panel (106).
9. The blank of claim 1 wherein said adhesive region is disposed on the rear surface (104R) of the slave panel (104) and said another adhesive region is disposed on both the rear surface (102R) of the master panel (102) and the rear surface (106R) of the slave panel (106).
10. The blank of claim 1 wherein said adhesive region is disposed on the rear surface (104R) of the slave panel (104) and said another adhesive region is disposed on both the front surface (102F) of the master panel (102) and the rear surface (106R) of the slave panel (106).
11. The blank of claim 1 wherein said adhesive region is disposed on both the front surface (102F) of the of the master panel (102) and the rear surface (104R) of the slave panel (104) and said another adhesive region is disposed on both the rear surface (102R) of the master panel (102) and the rear surface (106R) of the slave panel (106).