Author: claimsbot

1. A method for slicing a single crystal, wherein the single crystal is sliced by irradiating a portion to be sliced with an ultra short pulse laser beam while supplying a gas containing hydrogen radicals that react with atoms constituting the single crystal to become stable gaseous molecules in the vicinity of the portion under slicing.
2. The method for slicing a single crystal according to claim 1, wherein the ultra short pulse laser beam is an excimer laser.
3. The method for slicing a single crystal according to claim 1, wherein the ultra short pulse laser is a mode-locking type Q-switched laser.
4. The method for slicing a single crystal according to claim 2, wherein the ultra short pulse laser is a mode-locking type Q-switched laser.
5. The method for slicing a single crystal according to claim 1, wherein concentration of the hydrogen radicals in the gas is 10% or less.
6. The method for slicing a single crystal according to claim 1, wherein the single crystal is a silicon.
7. The method for slicing a single crystal according to claim 6, wherein the single crystal wafer is sliced from the single crystal so that the single crystal wafer should satisfy a relationship of thickness of single crystal wafer (\u03bcm)diameter of single crystal wafer (mm)\u22663.
8. The method for slicing a single crystal according to claim 7, wherein the single crystal wafer is sliced from the single crystals so that the main surface of the single crystal wafer has a plane or a plane equivalent to a plane tilting with respect to a 100 axis of the single crystal by angles of \u03b1 (0\xb0<\u03b1<90\xb0) for the 011 direction, for \u03b2 (0\xb0<\u03b2<90\xb0) the 01-1 direction and \u03b3 (0\xb0\u2266\u03b3<450\xb0) for the 10-1 or 101 direction.
9. The method for slicing a single crystal according to claim 6, wherein the single crystal wafer is sliced from the single crystal so that the main surface of the single crystal wafer has a plane or a plane equivalent to a plane tilting with respect to a 100 axis of the single crystal by angles of \u03b1 (0\xb0<\u03b1<90\xb0) for the 011 direction, \u03b2 (0\xb0<\u03b2<90\xb0) for the 01-1 direction and \u03b3 (0\xb0\u2266\u03b3<45\xb0) for the 10-1 or 101 direction.
10. The method for slicing a single crystal according to claim 1, wherein stock removal for slicing is 5 \u03bcm or less.
11. The method for slicing a single crystal according to claim 10, wherein the single crystal wafer is sliced from the single crystal so that the single crystal wafer should satisfy a relationship of thickness of single crystal wafer (\u03bcm)diameter of single crystal wafer (mm)\u22663.
12. The method for slicing a single crystal according to claim 1, wherein the single crystal wafer is sliced from the single crystal so that the main surface of the single crystal wafer has a plane or a plane equivalent to a plane tilting with respect to a 100 axis of the single crystal by angles of \u03b1 (0\xb0<\u03b1<90\xb0) for the 011 direction, \u03b2 (0\xb0<\u03b2<90\xb0) for the 01-1 direction and \u03b3 (0\xb0\u2266\u03b3<45\xb0) for the 10-1 or 101 direction.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A heat exchanger for cooling a heat generating body, the heat exchanger including a frame forming an outer casing and a fin member having a plurality of fins forming flow channels for a coolant, the fin member being placed in the frame, wherein
the frame includes a first wall part to which an intervening member is welded so that the intervening member is interposed between the frame and the heat generating body, the intervening member having a different linear expansion coefficient from a linear expansion coefficient of the frame,
the first wall part of the frame includes an elastically deformable portion configured to be deformable in a direction along a mounting surface of an outer surface of the first wall part, on which mounting surface the intervening member is placed, and
the elastically deformable portion includes a protrusion protruding into the frame, the protrusion having a U-shaped groove configuration having a U-shaped cross section that opens outward of the frame and linearly extending along the mounting surface in a direction intersecting with a coolant flowing direction.
2. The heat exchanger according to claim 1, wherein the protrusion is integrally formed in the wall part by drawing.
3. The heat exchanger according to claim 1, wherein the protrusion is provided to extend to inner wall surfaces of both side walls of the frame in the direction intersecting with the coolant flowing direction.
4. The heat exchanger according to claim 1, wherein the protrusion linearly extends in a direction perpendicular to the coolant flowing direction.
5. The heat exchanger according to claim 1, wherein the protrusion includes protrusions arranged side by side at predetermined intervals in the coolant flowing direction, and
the fins are placed between the protrusions located adjacently in the coolant flowing direction.
6. The heat exchanger according to claim 5, wherein
the heat exchanger is configured to cool a plurality of heat generating bodies arranged side by side in the coolant flowing direction,
the first wall part includes a low-heat generation portion on which a heat generating body having a relatively small heat generation amount among the heat generating bodies is placed through the intervening member, and
of the protrusions, a protrusion located upstream in the flow channel from and adjacent to the low-heat generation portion has a shorter protruding height protruding into the frame than a protruding height of other protrusion.
7. The heat exchanger according to claim 6, wherein a flow channel section of the coolant flow channel, the flow channel section including the low-heat generation portion, is deeper in flow channel depth than other flow channel sections are.
8. A semiconductor device including:
the heat exchanger according to claim 1;
a semiconductor element that is the heat generating body; and
the intervening member welded to the first wall part of the frame and located between the semiconductor element and the first wall part.
9. A method for manufacturing a heat exchanger for cooling a heat generating body, the heat exchanger including a frame forming an outer casing and a fin member having a plurality of fins forming flow channels for coolant, the fin member being placed in the frame, the method comprising:
a forming step of forming the frame including a first wall part to which an intervening member to be interposed between the frame and the heat generating body is welded; and
an assembling step of assembling the heat exchanger by placing the fin member in the frame formed in the forming step,
the forming step including drawing to form the protrusion protruding into the frame integral with the first wall part so that the protrusion has a U-shaped groove configuration having a U-shaped cross section that opens outward of the frame and linearly extending along a mounting surface on which the intervening member is to be placed, of the outer surface of the first wall part.
10. A method for manufacturing a semiconductor device comprising:
the heat exchanger manufactured by the heat exchanger manufacturing method according to claim 9;
a semiconductor element that is the heat generating body; and
an intervening member to be interposed between the first wall part of the frame and the semiconductor element, the intervening member having a different linear expansion coefficient from a linear expansion coefficient of the frame, the method comprising:
a welding step of placing the intervening member on the mounting surface of the first wall part of the frame and then welding the intervening member to the first wall part.

What is claimed is:

1. A precision bearing for feed modules of automatic placement machines, comprising:
a forced guidance portion to guide the feed modules in a manner exhibiting play displaceably on the automatic placement machine in a longitudinal direction of the feed modules, and
a precision guidance portion to position the feed modules without play in an end region of the precision bearing.
2. The precision bearing as claimed in claim 1, wherein the precision guidance portion in the end region takes up essentially all of the bearing forces.
3. The precision bearing as claimed in claim 1, wherein the end region is coupled to the forced guidance portion via a transition element.
4. The precision bearing as claimed in claim 3, wherein the transition element is of ramp-like design.
5. The precision bearing as claimed in claim 1, wherein the precision guidance portion comprises bearing elements with inclined areas, each formed on one of the automatic placement machine and on the feed module and capable of being coupled to one another to receive the feed module.
6. The precision bearing as claimed in claim 5, wherein the inclined areas have an angle of inclination of 45.
7. The precision bearing as claimed in claim 5, wherein the bearing elements have one of an M-shaped and a V-shaped design.
8. The precision bearing as claimed in claim 5, wherein the inclined areas are oriented in the longitudinal direction of the feed modules.
9. The precision bearing as claimed in claim 5, wherein the inclined areas adjoin one another and are formed with bearing elements of the automatic placement machine and of the feed modules coupled to one another and in each case a cavity remains at a low end between two inclined areas of the automatic placement machine.
10. The precision bearing as claimed in claim 1,
wherein the forced guidance portion has at least one dovetail-like groove which tapers toward the bottom of the groove,
wherein the forced guidance portion has at least one sliding block whose form essentially corresponds to the groove, and
wherein the groove and the sliding block are formed in such a way that when the sliding block is arranged in the groove, a cavity remains at the bottom of the groove.
11. The precision bearing as claimed in claim 10, wherein the at least one dovetail-like groove includes a plurality of grooves arranged on the automatic placement machine and the sliding block is in each case arranged on the feed modules.
12. The precision bearing as claimed in claim 10, wherein a wipe-off device is fitted on the sliding block, by which device objects can be removed from the groove.
13. The precision bearing as claimed in claim 1, further comprising:
a precision hole substantially in the end region; and
a positioning pin, which can engage essentially without play into the precision hole.
14. The precision bearing as claimed in claim 13, wherein the precision hole is formed in the automatic placement machine and the positioning pin is formed on the feed module.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. Nail Works, a nail polish bottle containing at least one side wall extending from the bottom wall, the sidewall defining a mouth of the bottle; a volume of nail polish solution disposed in the bottle; a lid able to be removed from the mouth of the bottle; a wand depending from the lid, the wand having a distal end brush or any known application device used for painting nails; the lid having either a stationary or a sliding nail. The nail depicting the color of paint contained within the bottle.
2. The nail being thin with an innate concave dimension giving it the sleekness necessary to lie flush on the user’s nail bed and swipe paint clean.
3. The sliding nail, according to claim 1, may extend up over the top surface of the lid and retract to its original position confined within the scope of the lid.
4. The sliding nail, according to claim 1, may be confined lying horizontally within the borders of the lid’s diameter, sliding sideways upon use.
5. The sliding nail, according to claim 1, may slide out from the lid’s top surface and retract back into its original position.