Author: claimsbot

1. A method for creating a database for carrying out a technical simulation, comprising the steps of:
a) determining first and second entities within a technical application representing a physical or technical value respectively;
b) providing a first vector model comprising a plurality of first nodes which are subjected to the first entity, and second nodes, with the second entity as the output variable, the second nodes being subdivided into a first subset and a second subset, and the second nodes of the first subset being also subjected to the first entity,
c) determining the transfer functions between one of the first nodes and one of the second nodes in each case, by a first simulation program,
d) storing a first matrix with the transfer functions between the first nodes and the second nodes of the first subset and storing of a second matrix with the transfer functions between the first nodes and the second nodes of the second subset, and
e) repeating steps a to d with regard to the second entity and a third entity, by a second simulation program.
2. The method as claimed in claim 1, further comprising:
a) loading the first matrix and the second matrix,
b) linking up of the first matrix and the second matrix for linking up the underlying vector models, and
c) storing the linked-up first and second matrices as a system model.
3. A simulation method comprising:
a) loading of a system model from a database created by a method as claimed in claim 2,
b) initialization of the simulation,
c) calculating the simulation with boundary conditions taken into consideration, and
d) storing of the simulation results.
4. A simulation method as claimed in claim 3, in which the system model comprises only the first matrix.
5. A simulation method as claimed in claim 3, in which the system model comprises the linking up of at least the first matrix and the second matrix.
6. A method for presenting the results of a simulation comprising:
a) loading results of a simulation method as claimed in claim 3,
b) expanding of the results, and
c) generating graphic output of the results.
7. A computer program product on a computer-readable medium with computer-readable instructions for carrying out a method as claimed in claim 1.
8. A computer system programmed to perform the steps as claimed in claim 1.
9. A system for creating a database for carrying out a technical simulation, comprising:
means for determining first and second entities within a technical application representing a physical or technical value respectively;
means for providing a first vector model comprising a plurality of first nodes which are subjected to the first entity, and second nodes, with the second entity as the output variable, the second nodes being sub divided into a first subset and a second subset, and the second nodes of the first subset being also subjected to the first entity,
a simulation program for determining the transfer functions between one of the first nodes and one of the second nodes in each case,
means for storing a first matrix with the transfer functions between the first nodes and the second nodes of the first subset and storing of a second matrix with the transfer functions between the first nodes and the second nodes of the second subset.
10. The system as claimed in claim 9, further comprising:
means for loading the first matrix and the second matrix,
means for linking up of the first matrix and the second matrix for linking up the underlying vector models, and
means for storing the linked-up first and second matrices as a system model.
11. The system as in claim 10, further comprising:
means for loading of the system model from a database,
initialization means for performing of the simulation,
means for calculating the simulation with boundary conditions taken into consideration, and
means for storing of the simulation results.
12. The system as claimed in claim 11, in which the system model comprises only the first matrix.
13. The system as claimed in claim 11, in which the system model comprises the linking up of at least the first matrix and the second matrix.
14. The system as claimed in claim 11, further comprising:
means for loading of the simulation results,
means for expanding of the results, and
means for generating graphic output of the results.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An optical disc drive, comprising:
a light source that emits a light beam;
a beam dividing element that divides the light beam emitted by the light source into a main beam and a plurality of sub-beams such that each of the plurality of sub-beams has a light amount smaller than that of the main beam;
an objective lens that converges each of the main beam and the plurality of sub-beams onto a recording surface of an optical disc;
an astigmatism producer that gives astigmatism to each of the main beam and the plurality of sub-beams which passed through the objective lens after reflecting from the recording surface of the optical disc;
a signal generator that has sensors respectively provided for receiving the main beam and at least two of the plurality of sub-beams which passed through the astigmatism producer, each of the sensors comprising four sensor segments, the signal generator processing output signals of the sensors in accordance with a differential astigmatic method to generate a focus error signal;
an optical element that adjusts, without blocking transmission of a central portion of the main beam, an intensity distribution of the main beam by causing a maximum light amount of the main beam to be positioned away from a pupil center of the main beam, a radial distance between the position of the maximum light amount of the main beam and the pupil center to be within 70% of a pupil diameter of the main beam, and an intensity of the main beam to gradually decrease from the position of the maximum light amount to a periphery of the main beam,
wherein the main beam and each of the sub-beams are incident on the optical element, and
the optical element comprises a diffraction structure that provides a predetermined intensity distribution to an incident beam, and is provided on a surface of the objective lens.
2. The optical disc drive according to claim 1, wherein the radial distance between the position of the maximum light amount of the main beam and the pupil center is within 50% of the pupil diameter of the main beam.
3. The optical disc drive according to claim 1, wherein the radial distance between the position of the maximum light amount of the main beam and the pupil center is greater than 20% of the pupil diameter of the main beam.
4. The optical disc drive according to claim 1, wherein the main beam has an intensity distribution equal to a Gaussian distribution after being reflected from the recording surface of the optical disc.
5. The optical disc drive according to claim 1, wherein:
each of the sensors has four sensor segments, and
the signal generator generates the focus error signal in accordance with an astigmatic method.
6. The optical disc drive according to claim 1, wherein the signal generator generates an RF signal based on an output signal of a sensor for the main beam.
7. The optical disc drive according to claim 1, wherein the signal generator generates the focus error signal based on output signals of at least two of the sensors provided for the plurality of sub-beams.
8. The optical disc drive according to claim 7, wherein the signal generator generates the focus error signal further based on an output signal of a sensor for the main beam.
9. The optical disc drive according to claim 1, wherein the signal generator generates the focus error signal based on output signals of at least two of the sensors for the main beam and the plurality of sub-beams.
10. The optical disc drive according to claim 1, wherein the optical element adjusts an intensity distribution of each of the sub-beams so that the main beam and the sub-beams all have the same intensity distribution.
11. The optical disc drive according to claim 1, wherein the signal generator processes the output signals of the sensors in accordance with the differential astigmatic method to generate the focus error signal by receiving a first diagonal sum signal and a second diagonal sum signal from each of the sensors, combining the first diagonal sum signals to generate a combined first diagonal sum signal, combining the second diagonal sum signals to generate a combined second diagonal sum signal, and generating the focus error signal by calculating a difference between the combined first diagonal sum signal and the combined second diagonal sum signal.
12. The optical disc drive according to claim 11, wherein the first diagonal sum signal of each sensor is a sum of an output level of a first sensor segment and an output level of a second sensor segment arranged diagonal to the first sensor segment, and the second diagonal sum signal of each sensor is a sum of an output level of a third sensor segment and an output level of a fourth sensor segment arranged diagonal to the third sensor segment.
13. The optical disc drive according to claim 1, wherein the adjusted intensity distribution of the main beam gradually decreases from the maximum level to each of the periphery and pupil center.
14. The optical disc drive according to claim 1, the adjustment of the intensity distribution of main beam being structured to decrease noise generated due to focus error signal resulting from a portion of the main beam being incident onto a sensor of a sub-beam.
15. The optical disc drive according to claim 1, wherein maximum light amount of main beam is positioned away from pupil center by adjusting a diffraction efficiency of a diffraction structure on a surface of the objective lens.
16. An optical disc drive, comprising:
a light source that emits a light beam;
a beam dividing element that divides the light beam emitted by the light source into a main beam and a plurality of sub-beams such that each of the plurality of sub-beams has a light amount smaller than that of the main beam;
an objective lens that converges each of the main beam and the plurality of sub-beams onto a recording surface of an optical disc;
an astigmatism producer that gives astigmatism to each of the main beam and the plurality of sub-beams which passed through the objective lens after reflecting from the recording surface of the optical disc;
a signal generator that has sensors respectively provided for receiving the main beam and at least two of the plurality of sub-beams which passed through the astigmatism producer, each of the sensors comprising four sensor segments, the signal generator processing output signals of the sensors in accordance with a differential astigmatic method to generate a focus error signal;
an optical element that adjusts an intensity distribution of the main beam by causing, without blocking transmission of a central portion of the main beam a maximum light amount of the main beam to be positioned away from a pupil center of the main beam, a radial distance between the position of the maximum light amount of the main beam and the pupil center to be within 70% of a pupil diameter of the main beam, and an intensity of the main beam to gradually decrease from the position of the maximum light amount to a periphery of the main beam,
wherein the main beam and each of the sub-beams are incident on the optical element, and
the optical element comprises a coating that provides a predetermined intensity distribution to an incident beam, and is provided on a surface of the objective lens.
17. The optical disc drive according to claim 16, wherein the signal generator processes the output signals of the sensors in accordance with the differential astigmatic method to generate the focus error signal by receiving a first diagonal sum signal and a second diagonal sum signal from each of the sensors, combining the first diagonal sum signals to generate a combined first diagonal sum signal, combining the second diagonal sum signals to generate a combined second diagonal sum signal, and generating the focus error signal by calculating a difference between the combined first diagonal sum signal and the combined second diagonal sum signal.
18. The optical disc drive according to claim 17, wherein the first diagonal sum signal of each sensor is a sum of an output level of a first sensor segment and an output level of a second sensor segment arranged diagonal to the first sensor segment, and the second diagonal sum signal of each sensor is a sum of an output level of a third sensor segment and an output level of a fourth sensor segment arranged diagonal to the third sensor segment.
19. The optical disc drive according to claim 16, wherein the adjusted intensity distribution of the main beam gradually decreases from the maximum level to each of the periphery and pupil center.
20. The optical disc drive according to claim 16, the adjustment of the intensity distribution of main beam being structured to decrease noise generated due to focus error signal resulting from a portion of the main beam being incident onto a sensor of a sub-beam.

What is claimed is:

1. A metal bumping structure on the inputoutput connector of a substrate or wafer, which is a metal conductor composed of multiple metal layers overlap the connector pad, and it is characterized in that: the multiple metal layers which overlap to outer or upper metal layer is thinner than the inner or lower metal layer, and the outer or upper metal layer that form the pillar style whose conductivity, connectivity and corrosion resist are better than the inner or lower metal layer, such that the bumping connector has better conductivity, connectivity and not easy to be corroded.
2. The structure according to claim 1, wherein the multiple metal layers of the metal bumping structure is made of metal, its alloy or its compound.
3. The structure according to claim 1, wherein the metal bumping, structure is composed of double metal layer that overlap on connector pad, the inner or lower layer is Ni, its alloy or its compound, and the outer or upper layer is Au, its alloy or its compound.
4. The structure according to claim 3, wherein the deposition to the inner or lower metal layer, its alloy or its compound of the metal bumping, structure is repressed by the photoresist.
5. The structure according to claim 3, wherein the deposition to the outer or upper metal layer, its alloy or its compound of the metal bumping structure is repressed by the photoresist.
6. The structure according to claim 3, wherein the deposition to the inner or lower metal layer, its alloy or its compound of the metal bumping structure, and the deposition to the outer or upper metal layer, its alloy or its compound of the metal bumping structure are repressed by the photoresist.
7. The structure according to claim 1, wherein the metal bumping structure is composed of triple metal layer that overlap on connector pad, the inner or lower layer is Pd, its alloy or its compound, the middle layer is Ni, its alloy or its compound, and the outer or upper layer is Au, its alloy or its compound.
8. The structure according to claim 7, wherein the deposition to the inner or lower metal layer, its alloy or its compound and the middle metal layer of the metal bumping structure is repressed by the photoresist.
9. The structure according to claim 7, wherein the deposition to the outer or upper metal layer, its alloy or its compound and the middle metal layer of the metal bumping structure is repressed by the photoresist.
10. The structure according to claim 7, wherein the deposition to the inner or lower metal layer, its alloy or its compound and the middle metal layer of the metal bumping structure and the deposition to the outer or upper metal layer, its alloy or its compound and the middle metal layer of the metal bumping structure both are repressed by the photoresist.
11. The structure according to claim 1, wherein the outer metal layer of the multi-metal layer of the metal bumping structure is not extended to the rim of pillar, that is not to fully cover the inner or lower metal layer.
12. The structure according to claim 1, wherein the outer metal layer of the multi-metal layer of the metal bumping structure extends to the rim of pillar, that is fully cover the inner or lower metal layer such that not to be corroded.
13. The structure according to claim 1, wherein the metal bumping structure is constructed upon the inputoutput connector pad, and the bumping edge does not exceed the pad area.
14. The structure according to claim 1, wherein the metal bumping structure is constructed upon the inputoutput connector pad, and the bumping edge exceeds the pad area but does not exceed the one-second pitch between two pads.
15. The structure according to claim 1, wherein the metal bumping structure of the inputoutput connector pad conductor is composed of Al, Cu, Ag, Au, their alloies or their compounds, in order to construct and make use of the same or different metals, such that the well connectivity is obtained.
16. A method for manufacturing metal bumping structure on the inputoutput connector of a substrate or wafer, comprising the steps of electroless plating accompanies photoresist, exposure, developing and photoresist removing to construct a metal conductor of the multiple metal layers upon the inputoutput connector pad.
17. A method according to claim 16, in the step of electroless plating, which the metal ion is replaced in the silvent or, performing chemical reduction method in the solvent contains reducing agent, single or repeat mixing both of the former processes to attain, and adjust it depend on the elements or the concentration of the solvent to deposit a metal, its alloy or its compound, such that to construct the overlap of the multiple metal layers, and the outer or upper metal layer is thinner than the inner or lower metal layer, then the flatness of the top bumping connector without extension of the metal bumping is formed.
18. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Coating photoresist;
(2) Adding mask to exposure;
(3) Developing to expose the metal of the pad;
(4) Pre-treatment of the electroless plating;
(5) Plating a metal layer by electroless plating method;
(6) Photoresist removing;
(7) By electroless plating method, plating an another metal onto the surface of the metal layer to construct the bumping
19. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 18 wherein, when the original metal of the pad is Al, the manufacturing steps (4) (5) (7) are separately modified to:
(4) The Al on the pad is replaced by Zn, its alloy or its compound;
(5) In the step (4), the surface of Zn is replaced by Ni, its alloy or its compound;
(7) In the step (5), the upper edge and the rim surface of the Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
20. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 18 wherein, when the original metal of the pad is Cu, the manufacturing steps (4) (5) (7) separately modify to:
(4) The Cu on the pad surface is replaced by Pd, alloy or compound;
(5) In the step (4), the surface of the Pd is replaced by Ni, its alloy or its compound;
(8) In the step (5), the upper edge and the rim surface of the Ni is replaced or deposited by Au, its alloy or its compound
so as to construct the bumping.
21. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 17, it comprises the steps of:
(1) Coating photoresist;
(2) Adding mask to exposure;
(3) Developing to expose the metal of the pad;
(4) Pre-treatment of the electroless plating;
(5) Plating one metal layer by electroless plating method;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (5) to construct the bumping;
(7) Photoresist removing;
(8) By electroless plating method, again plating the same metal in the step (6) on the rim of the metal formed by step (5)
so as to construct the bumping.
22. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 21 wherein, when the original metal of the pad is Al, the manufacturing steps (4) (5) (6) (8) are separately modified to:
(4) The Al on the pad is replaced by Zn, alloy or compound;
(5) In the step (4), the surface of Zn is replaced by Ni, its alloy or its compound;
(6) In the step (5), the upper edge surface of Ni is replaced or deposited by Au, its alloy or its compound;
(8) In the step (5), the rim surface of Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
23. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 21 wherein, when the original metal of the pad is Cu, the manufacturing steps (4) (5) (6) (8) are separately modified to:
(4) The Cu on the pad is replaced by Pd, its alloy or its compound;
(5) In the step (4), the surface of Pd is replaced by Ni, its alloy or its compound;
(6) In the step (5), the upper edge surface of Ni is replaced or deposited by Au, its alloy or its compound;
(8) In the step (5), the rim surface of Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
24. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Coating photoresist;
(2) Adding mask to exposure;
(3) Developing to expose the metal of the pad;
(4) Pre-treatment of the electroless plating;
(5) Plating one metal layer by electroless plating method;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (5);
(7) Photoresist removing;
so as to construct the bumping.
25. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 24 wherein, when the original metal of the pad is Al, the manufacturing steps (4) (5) (6) are separately modified to:
(4) The Al on the pad is replaced by Zn, its alloy or its compound;
(5) In the process number four, the surface of the Zn is replaced by Ni, alloy or compound;
(6) In the step (5), the upper edge and the rim surface of Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
26. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 24 wherein, when the original metal of the pad is Cu, the manufacturing steps (4) (5) (6) are separately modified to:
(4) The Cu on the pad surface is replaced by Pd, its alloy or its compound;
(5) In the step (4), the surface of Pd is replaced by Ni, its alloy or its compound;
(6) In the step (5), the upper edge and the rim surface of Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
27. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Pre-treatment of the electroless plating;
(2) Plating one metal layer by electroless plating method;
(3) By electroless plating method, plating an another metal on the surface of the metal layer formed by process number two;
(4) Coating photoresist;
(5) Adding mask to exposure;
(6) Developing to expose the top metal of the pad;
(7) By electroless plating method, plating the same thicker metal on the top surface of the metal layer formed by step (2);
(8) Photoresist removing;
So as to construct the bumping.
28. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 27 wherein, when the original metal of the pad is Al, the manufacturing steps (1) (2) (3) (7) are separately modified to:
(1) The Al on the pad is replaced by Zn, its alloy or its compound;
(2) In the step (1), the surface of Zn is replaced by Ni, its alloy or its compound;
(3) In the step (2), the surface of Ni is replaced or deposited by Au, its alloy or its compound;
(7) In the step (3), the top surface of the Au is deposited thicker by Au, its alloy or its compound;
so as too construct the bumping.
29. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 27 wherein, when the original metal of the pad is Cu, the manufacturing steps (1) (2) (3) (7) are separately modified to:
(1) The Cu on the pad surface is replaced by Pd, its alloy or its compound;
(2) In the step (1), the surface of Pd is replaced by Ni, its alloy or its compound;
(3) In the step (2), the surface of Ni is replaced or deposited by Au, its alloy or its compound;
(7) In the step (3), the top surface of the Au is deposited by a thicker layer of Au, its alloy or its compound;
so as to construct the bumping.
30. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Pre-treatment of the electroless plating;
(2) Plating one metal layer by electroless plating method;
(3) Coating photoresist;
(4) Adding mask to exposure;
(5) Developing to expose the top metal of the pad;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (2);
(7) Photoresist removing;
so as to construct the bumping.
31. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16 wherein, when the original metal of the pad is Al, the manufacturing steps (1) (2) (3) are separately modified to:
(1) Pre-treatment of the electroless plating;
(2) Plating one metal layer by electroless plating method;
(3) Coating photoresist;
(4) Adding mask to exposure;
(5) Developing to expose the top metal of the pad;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (2);
(7) Photoresist removing;
so as to construct the bumping.
32. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 30 wherein, when the original metal of the pad is Cu, the manufacturing steps (1) (2) (3) are separately modified to:
(1) The Cu of the pad surface is replaced by Pd, its alloy or its compound;
(2) In the step (1), the surface of the Pd is replaced by Ni, its alloy or its compound;
(3) In the step (2),. the surface of the Ni is replaced or deposited by Au, its alloy or its compound;
so as to construct the bumping.
33. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 16, it comprises the steps of:
(1) Pre-treatment of the electroless plating;
(2) Plating one metal layer by electroless plating method;
(3) Coating photoresist;
(4) Adding mask to exposure;
(5) Developing to expose the top metal of the pad;
(6) By electroless plating method, plating an another metal on the surface of the metal layer formed by step (2);
(7) Photoresist removing;
(8) By electroless plating method, plating a thicker layer of metal same as that used in step (6) on the rim of the metal formed by step (2) and on the top surface of the metal layer formed by step (6);
so as to construct the bumping.
34. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 33 wherein, when the original metal of the pad is Al, the manufacturing steps (1) (2) (3) (8) are separately modified to:
(1) The Al on the pad surface is replaced by Zn, its alloy or its compound;
(2) In the step (1), the surface of Zn is replaced by Ni, its alloy or its compound;
(3) In the step (2), the surface of Ni is replaced or deposited by Au, its alloy or its compound;
(8) The rim in the step (2) and the top surface in the step (6) are plating thicker layers of metal same as that used in step (6);
so as to construct the bumping.
35. The method for manufacturing a metal bumping structure on the inputoutput connector of a substrate or according to claim 33 wherein, when the original metal of the pad is Cu, the manufacturing steps (1) (2) (3) (8) are separately modified to:
(1) The Cu of the pad surface is replaced by Pd, its alloy or its compound;
(2) In the step (1), the surface of the Pd is replaced by Ni, its alloy or its compound;
(3) In the step (2), the surface of Ni is replaced or deposited by Au, its alloy or its compound;
(8) The rim in the step (2) and the top surface in the step (6) are plating thicker layers of metal same as that used in step (6);
so as to construct the bumping.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A binding for a snowboard or other type of board, comprising:
a base plate structure comprising:
a lower plate that is mountable on a board;
an upper plate that is adapted to receive a boot and is mounted above the lower plate in a spaced relationship;
a spring-based suspension system connecting the upper plate to the lower plate;
wherein the spring-based suspension system is compressed by the application of force and thereby absorbs vibration and shock.
2. The binding of claim 1 wherein the upper and lower plates each comprise a plurality of flanges extending outwards from a footprint area of the plates, the flanges of the upper plate being aligned with corresponding flanges of the lower plate.
3. The binding of claim 2 wherein the suspension system comprises a plurality of springs, one spring being connected between each flange of the upper plate and its corresponding flange on the lower plate.
4. The binding of claim 2 further comprising an aperture in each flange.
5. The binding of claim 4 further comprising a bolt extending upwardly through each aperture of each flange of the lower plate and being fixedly mounted thereto.
6. The binding of claim 5 wherein the bolt passes though the corresponding aperture of the upper plate, and further comprising an end cap attached to the distal end of the bolt.
7. The binding of claim 6 wherein the suspension system comprises a plurality of springs, one spring between each pair of flanges around each bolt.
8. The binding of claim 7 further comprising spring seats engaging each end of each spring.
9. The binding of claim 1 further comprising a pair of lateral brackets mounted on the top of the upper plate, one along each lateral edge, inside the laterally extending flanges.
10. The binding of claim 1 further comprising a boot attachment apparatus connected to the base plate structure.
11. The binding of claim 10 wherein the boot attachment apparatus comprises:
a heel portion;
a toe retainer apparatus;
a mid-boot retainer apparatus.
12. The binding of claim 11 wherein the toe retainer apparatus comprises a toe retainer, a strap connecting the toe retainer to the binding, and a tensioning and releasing buckle in the strap.
13. The binding of claim 12 wherein the mid-boot retainer apparatus comprises a mid-boot retainer, a strap connecting the mid-boot retainer to the binding, and a tensioning and releasing buckle in the strap.
14. The binding of claim 11 further comprising a pair of lateral brackets mounted on the top of the upper plate, one along each lateral edge, inside the laterally extending flanges.