Author: claimsbot

1. A dual-band inverted-F antenna, comprising:
a first radiating unit having a first long side and a first short side;
a second radiating unit having a second long side and a second short side, wherein the second long side is disposed opposite to the first short side of the first radiating unit; and
a third radiating unit having a first radiating part, a second radiating part, and a third radiating part, wherein the second radiating part and the third radiating part are extended respectively from one side of the first radiating part, and a gap exists between the third radiating unit and the first radiating unit.
2. The dual-band inverted-F antenna of claim 1, wherein the first radiating unit and the second radiating unit operate in a first band.
3. The dual-band inverted-F antenna of claim 2, wherein the first band is compliant with the IEEE 802.11bg standard between 2.4 GHz and 2.5 GHz.
4. The dual-band inverted-F antenna of claim 2, wherein a length of the first long side and a length of the second long side are roughly equal to one quarter of the wavelengths in the first band.
5. The dual-band inverted-F antenna of claim 1, wherein the third radiating unit operates in a second band.
6. The dual-band inverted-F antenna of claim 5, wherein the second band is compliant with the IEEE 802.11a standard between 4.5 GHz and 5.85 GHz.
7. The dual-band inverted-F antenna of claim 1, wherein the first radiating part, the second radiating part, and the third radiating part of the third radiating unit are quadrangles.
8. The dual-band inverted-F antenna of claim 5, wherein, in the third radiating unit, the first radiating part, the second radiating part, and the third radiating part are trapezoids, the lower bases of the second radiating part and the third radiating part are part of the upper base of the first radiating part, and the second and third radiating parts are extended from the upper base of the first radiating part.
9. The dual-band inverted-F antenna of claim 8, wherein the sum of lengths of the upper bases of the second radiating part and the third radiating part is greater than or equal to one third of a length of the lower base of the first radiating part.
10. The dual-band inverted-F antenna of claim 8, wherein a length of the upper base of the second radiating part is greater than a length of the upper base of the third radiating part.
11. The dual-band inverted-F antenna of claim 8, wherein a length of the lower base of the first radiating part is about one quarter of the wavelengths in the second band.
12. The dual-band inverted-F antenna of claim 1 further comprising an impedance matching unit, wherein one side of the impedance matching unit is disposed opposite to the third radiating unit, and another side of the impedance matching unit is disposed opposite to the first radiating unit.
13. The dual-band inverted-F antenna of claim 12, wherein the impedance matching unit is a polygonal.
14. The dual-band inverted-F antenna of claim 1 further comprising a substrate, wherein the first radiating unit, the second radiating unit, and the third radiating unit are disposed on the substrate.
15. The dual-band inverted-F antenna of claim 14, wherein the substrate is a print circuit board (PCB).
16. The dual-band inverted-F antenna of claim 1, wherein the gap has an L shape.
17. The dual-band inverted-F antenna of claim 1, wherein the first radiating unit and the second radiating unit have respectively a feed-in point and a ground point.
18. The dual-band inverted-F antenna of claim 17 further comprising a conducting unit, wherein the conducting unit has a conductor in electrical contact with the feed-in point and a ground conductor in electrical contact with the ground point.
19. The dual-band inverted-F antenna of claim 18, wherein the conducting unit is a coaxial cable.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A system for manufacturing a multiple density substrate for differential impact energy absorption with a mold having a mold cavity of a predetermined shape, a first set of unbonded beads having a first density, and a second set of unbonded beads having a second density, the system comprising:
a casing for receiving the first set of unbonded beads, the casing being configured to be positioned in the mold cavity to leave a void in the mold cavity;
a mechanism for injecting a sufficient amount of the second set of unbonded beads into the void; and
a mechanism for bonding the first and second sets of beads together with steam to define a molded set of bonded beads having the predetermined shape.
2. The system of claim 1 wherein the casing has a higher melting temperature than the first and second sets of unbonded beads.
3. The system of claim 1 wherein the casing has a melting temperature that is sufficiently low such that the casing is meltable when the first and second sets of beads are bonded together.
4. The system of claim 1 wherein the casing is a premolded casing having a predetermined shape.
5. The system of claim 1 wherein the casing is a bag.
6. The system of claim 1 wherein the casing is a mesh bag.
7. The system of claim 6 wherein the mesh bag has a higher melting temperature than the first and second sets of unbonded beads.
8. The system of claim 1 wherein the casing comprises a low melt polymer bag.
9. The system of claim 1 wherein the mechanism for injecting the second set of unbonded beads includes a nozzle in communication with the cavity.
10. A system for manufacturing a multiple density substrate using a first set of unbonded beads having a first density, and a second set of unbonded beads having a second density different than the first density, the system comprising:
a mold having a cavity and an injection hole in communication with the cavity; and
a casing for receiving the first set of unbonded beads, the casing being configured to be positioned in the mold cavity with the first set of unbonded beads received therein so as to leave a void in the mold cavity;
wherein the injection hole of the mold is configured to receive the second set of unbonded beads and to introduce the second set of unbonded beads into the void.
11. The system of claim 10 wherein the casing has a higher melting temperature than the first and second sets of unbonded beads.
12. The system of claim 10 wherein the casing has a melting temperature that is sufficiently low such that the casing is meltable when the beads are bonded together.
13. The system of claim 10 wherein the casing is a premolded casing having a predetermined shape.
14. The system of claim 10 wherein the casing is a bag.
15. The system of claim 10 wherein the casing is a mesh bag.
16. The system of claim 15 wherein the mesh bag has a higher melting temperature than the first and second sets of unbonded beads.
17. The system of claim 10 wherein the casing comprises a low melt polymer bag.
18. The system of claim 10 further comprising a nozzle configured to extend into the injection hole for injecting the second set of unbonded beads through the injection hole.
19. The system of claim 10 wherein the mold has a steam hole in communication with the cavity, the steam hole being configured to receive steam and to introduce the steam into the cavity to bond the beads together.

1. Method for producing fatty acid esters of monovalent alkyl alcohols by base-catalyzed transesterification of triglycerides from natural or synthetic oils andor fats, which contain free fatty acids as interfering accompanying substances,
wherein initially the oils andor fats are processed with an immiscible basic glycerin phase so as to neutralize the free fatty acids and cause them to pass over into the glycerin phase, and subsequently,
following separation of the glycerin phase by means of monovalent alcohols, the triglycerides are subjected to transesterification in an agitator vessel, using a base as a catalyst, to form said fatty acid esters, characterized in that following separation of the fatty acid esters, the basic glycerin phase, produced during transesterification of the triglycerides is used for processing the oils andor fats for removal of the free fatty acids, with the minimum quantity of catalyst used being calculated, relative to 1,000 g of the oil to be processed, as a function of the acid number of the oil and the mean molar mass of the oil, according to the equations (I) to (III):
with an acid number satisfying the inequation (I)
SZ<(0.084 mol1,000 g of oil)*M(KOH)*Y(I)
according to equation (II)
minimum quantity of cat1,000 g of oil0.088 mol100 g oil*y(II)
or else according to equation (III)
minimum quantity of cat1,000 g oil(SZMKOH)*(0.0380.084)(III)
with
Y (880 gmol)(mean molar mass of the used oil) and
SZacid number of the oil used (g KOH)(1,000 g of oil).
2. Method according to claim 1, wherein a base and an alkyl alcohol are added for transesterification to the triglycerides produced following said step of preprocessing with an immiscible basic glycerin phase, and wherein after transesterification, a fraction rich in fatty acid esters of monovalent alkyl alcohols is separated, with the fraction separated first, which is rich in fatty acid esters of monovalent alkyl alcohols, being mixed with a base and an alkyl alcohol for further transesterification and wherein, following transesterification, a second fraction rich in fatty acid esters of monovalent alcohols is separated.
3. Method according to claim 1, wherein metal hydroxides andor alcoholates or their alkyl alcoholic solutions are used as the base.
4. Method according to claim 1, wherein the separation of said fractions rich in fatty acid esters of monovalent alkyl alcohols is carried out using phase separation.
5. Method according to claim 1, wherein, prior to the respectively last phase separation, the reaction mixture is washed with 5 or more % by weight of water, relative to the weight of the mixture containing fatty acid esters, which is used in this step.
6. Method according to claim 5, wherein low-boiling components are expelled from said fraction rich in fatty acid esters of monovalent alkyl alcohols following the respectively last phase separation.
7. Method according to claim 4, wherein a vessel is used for separating the fractions rich in fatty acid esters of monovalent alkyl alcohols, into which the respective starting mixture is supplied at or below the liquidliquid phase boundary and from which the fraction to be separated is removed in the upper third of said vessel.
8. Method according to claim 6, wherein an evaporator is used to expel said low-boiling components, in which the fraction separated last is conducted over a first surface heated to between 90 and 120 C. and in which said low-boiling components are deposited on a second surface.
9. Method according to claim 1, wherein vegetable oils are used as a starting material.
10. Method according to claim 1, wherein alkyl alcohols containing 1 to 10 carbon atoms are used.
11. Method according to claim 1, wherein said step of pre-processing with said basic glycerin phase is carried out in an agitator vessel for a duration of between 1 and 60 minutes.
12. Method according to claim 11, wherein the duration of said pre-processing step is between 5 and 15 minutes.
13. Method according to claim 1, wherein 5 to 15% of the basic glycerin phase produced during transesterification are used in said pre-processing step.
14. Method according to claim 1, wherein, in addition to said basic glycerin phase produced during transesterification, additional glycerin andor base isare used for removing said free fatty acids.
15. Method according to claim 14, wherein additionally industrial glycerin or pharmaceutical glycerin is used, in which KOH, NaOH or sodium ethylate are dissolved.
16. Method according to claim 1, wherein the total quantity of basic transesterification catalyst used is between 1 and 4 times greater than the minimum quantity of catalyst according to claim 1.
17. Method according to claim 1, wherein the total quantity of alcohol used corresponds to between 1.2 and 1.4 mol per mol of bound fatty acid fractions.
18. Method according to claim 1, characterized in that a fraction X of said basic glycerin phase produced during transesterification of the triglycerides is re-used, following separation of said fatty acid esters, for the transesterification reaction, with the acid number satisfying the inequation (IV):
SZ<(0.084 mol1,000 g of oil)*M(KOH)*Y(IV)
and with the minimum quantity of catalyst to be used (relative to 1,000 g of the oil to be processed) as well as the fraction X of the basic glycerin phase to be re-used for transesterification being so selected that the equations(V) and (VI) are satisfied at the same time:
minimum quantity of cat1,000 g oil(0.088 mol1,000 g of oilX* 0.084 mol1,000 g of oil))*Y(V)minimum quantity of cat1,000 g oilSZMKOH)*(0.0880.084 * (1X))(VI)
with
Y(880 gmol)(mean molar mass of the used oil)
SZacid number of the used oil (g KOH)(1,000 g of oil)
Xfraction of the basic glycerin phase, which is re-used for transesterification.
19. Method according to claim 1, characterized in that the free fatty acids or their salts, respectively, which are separated using the basic glycerin phase, are subjected to post-esterification with alkyl alcohol.
20. Method of producing fuel for diesel engines, encompassing a method for producing fatty acid esters of monovalent alkyl alcohols according to claim 1.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method for producing an electronic package possessing controlled impedance characteristics, said method comprising the steps of:
providing a first substrate comprising a dielectric material; applying a first conductive layer on at least one surface of said first substrate, said first conductive layer having a first thickness;
plating a second conductive layer on an opposite surface of said first substrate, said second conductive layer having a second thickness; laminating a second dielectric substrate to said first substrate forming a laminated substrate so as to cause at least said first and second conductive layers to comprise an innerlayer intermediate said laminated substrate; forming holes in said laminate substrate, and filling at least some of said holes with a conductive paste material to provide electrical communication with said first and second conductive layers.
2. A method for producing an electronic package as claimed in claim 1, wherein said laminated substrate includes external surfaces each provided with said conductive layers, and etching said external conductive layers to predetermined thicknesses.
3. A method for producing an electronic package as claimed in claim 1, wherein said holes comprise deep blind holes and buried holes and through-extending holes forming vias in said laminated substrate.
4. A method for producing an electronic package as claimed in claim 1, wherein at least one external surface of said first and second conductive layers on each said first and second substrate is etched to form a personalized printed wiring pattern.
5. A method for producing an electronic package as claimed in claim 1, wherein a plurality of said laminated substrate are combined to form a composite for a multilayer electronic package.
6. A method for producing an electronic package as claimed in claim 1, wherein said electronic package comprises a printed wiring board.
7. A method for producing an electronic package as claimed in claim 5, wherein at least one through-extending hole is formed in said composite between the opposite surfaces of said laminated substrate, said conductive paste material being filled into said at least one through-hole so as to provide electrical communication between respective of said first and second conductive layers.
8. A method for producing an electronic package as claimed in claim 7, wherein said at least one through-extending hole is a drilled hole.
9. An electronic package possessing controlled impedance characteristics, comprising:
a first substrate comprising a dielectric material; a first conductive layer applied on at least one surface of said first substrate, said first conductive layer having a first thickness;
a second conductive layer plated on an opposite surface of said first substrate, said second conductive layer having a second thickness; a second dielectric substrate laminated to said first substrate forming a laminated substrate so as to cause at least said first and second conductive layers to comprise an innerlayer intermediate said laminated substrate; holes formed in said laminate substrate, and at least some of said holes being filled with a conductive paste material to provide electrical communication with said first and second conductive layers.
10. An electronic package as claimed in claim 9, said laminated substrate include external surfaces each provided with said conductive layers, and said external conductive layers are etched to predetermined thicknesses.
11. An electronic package as claimed in claim 9, wherein said holes comprise deep blind holes and buried holes and through-extending holes forming vias in said laminated substrate.
12. An electronic package as claimed in claim 9, wherein at least one external surface of said first and second conductive layers on each said first and second substrate is etched to form a personalized printed wiring pattern.
13. An electronic package as claimed in claim 9, wherein a plurality of said laminated substrate are combined to form a composite for a composite for a multilayer electronic package.
14. An electronic package as claimed in claim 9, wherein said electronic package comprises a printed wiring board.
15. An electronic package as claimed in claim 13, wherein at least one through-extending hole is formed in said composite between the opposite surfaces of said laminated substrate, said conductive paste material being filled into said at least one through-hole so as to provide electrical communication between respective of said first and second conductive layers.
16. An electronic package as claimed in claim 15, wherein said at least one through-extending hole is a drilled hole.