Author: claimsbot

1. A method of securing an industrial control system, comprising:
operating the industrial control system in an open mode, wherein communications between a plurality of devices of the industrial control system are unencrypted when the industrial control system is in the open mode;
exchanging security tokens between the plurality of devices of the industrial control system; and
ceasing operating the industrial control system in the open mode and instead operating the industrial control system in a secure mode, wherein the communications between the plurality of devices of the industrial control system are encrypted using the security tokens when the industrial control system is operating in the secure mode.
2. The method of claim 1, comprising the plurality of devices acquiring respective security tokens from a security server of the industrial control system.
3. The method of claim 2, wherein acquiring respective security tokens comprises the plurality of devices acquiring respective certificates from a certificate authority (CA) hosted by the security server.
4. The method of claim 1, wherein the plurality of devices comprises a human machine interface (HMI) system, a manufacturing execution system (MES), a supervisor control and data acquisition (SCADA) system, or a distributed control system (DCS), or a combination thereof.
5. The method of claim 1, wherein the plurality of devices includes a device hosting an industrial control system configuration application.
6. The method of claim 1, wherein the plurality of devices includes an industrial controller.
7. The method of claim 1, wherein the plurality of devices includes a field device configured to perform at least one measurement of the operation of a monitored system.
8. The method of claim 7, wherein the monitored system comprises a gas turbine system, an automated manufacturing system, a petroleum refinery system, a chemical production system, a gasification system, an automated power generation system, a power plant, a steam turbine system, or a wind turbine system, or a combination thereof.
9. A method of securing an industrial control system, comprising:
transmitting unencrypted data between a first device and a second device of an industrial control system;
generating a first security token and a second security token for the first and second devices, respectively, using at least one processor of the industrial control system;
exchanging the first and second security tokens between the first and second devices of the industrial control system; and
ceasing transmitting unencrypted data between the first and second devices, and subsequently only transmitting encrypted data between the first and second devices, wherein the encrypted data is encrypted based on the first and second security tokens.
10. The method of claim 9, wherein the security tokens comprise certificates including at least one key.
11. The method of claim 10, comprising generating the encrypted data based on the at least one key of the first and second security tokens.
12. The method of claim 9, wherein exchanging the first and second security tokens between the first and second devices comprises:
the first device verifying an identity of the second device using the second security token; and
the second device verifying an identity of the first device using the first security token.
13. The method of claim 9, wherein the first device comprises a human machine interface (HMI) system and the second device comprises an industrial controller.
14. The method of claim 9, wherein the first device comprises a device hosting an industrial control system configuration application and the second device comprises an industrial controller.
15. The method of claim 9, wherein the first device comprises a field device and the second device comprises an industrial controller.
16. The method of claim 9, wherein transmitting the encrypted data between the first and second devices comprises establishing a secure socket layer (SSL) connection between the first and second devices and using the SSL connection to transmit the encrypted data between the first and second devices.
17. A system, comprising:
an industrial control network comprising a plurality of devices that includes an industrial controller, wherein the plurality of devices is configured to:
exchange respective security tokens between the plurality of devices over the industrial control network;
cease exchanging unencrypted data over the industrial control network; and
exchange encrypted data over the industrial control network, wherein the encrypted data is generated based on the respective security tokens.
18. The system of claim 17, wherein the plurality of devices includes a device hosting an industrial control system configuration application.
19. The system of claim 17, wherein the plurality of devices includes a human machine interface (HMI) system, manufacturing execution system (MES), a supervisor control and data acquisition (SCADA) system, or a distributed control system (DCS), or a combination thereof.
20. The system of claim 17, wherein the plurality of devices comprises a security server configured to generate the respective security tokens for the plurality of devices.
21. The system of claim 20, wherein the security server comprises a certificate authority (CA) configured to generate respective certificates for the plurality of devices as the respective security tokens of the plurality of devices.
22. The system of claim 17, wherein the plurality of devices is configured to perform mutual authentication using the respective security tokens of the plurality of devices.
23. The system of claim 17, wherein the plurality of devices is configured to use the respective security tokens to establish at least one secure socket layer (SSL) connection over the industrial control network.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A process for making a support for an electrophoretic medium comprising the steps of:
applying a coating consisting essentially of agarose to a corona treated surface of a polymeric film by transferring a layer of a solution of agarose onto the corona treated surface, while
maintaining the pH of the agarose solution which is being transferred between about 8 and about 11, and
maintaining the concentration of the agarose solution which is being transferred between about 0.1 and about 0.4% agarose by weight.
2. The process of claim 1, further comprising:
exposing an agarose powder to a reducing atmosphere, and
creating the agarose solution by dissolving the treated agarose powder in a solvent.
3. The process of claim 2, wherein the exposing step further comprises exposing the agarose powder to a reducing atmosphere for at least 12 hours.
4. The process of claim 2, wherein the exposing step comprises,
(i) introducing a reducing atmosphere above the agarose powder,
(ii) exposing the agarose powder to said reducing atmosphere, and
(iii) repeating steps (i) and (ii) at least once.
5. The process of claim 4, wherein steps (i) and (ii) are repeated at least three times.
6. A process for making a support for an electrophoretic medium comprising the steps of:
applying a coating consisting essentially of agarose to a corona treated surface of a polyester film by transferring a layer of a solution of agarose onto the corona treated polyester surface, while
maintaining the pH of the agarose solution which is being transferred between about 8 and about 11, and
maintaining the concentration of the agarose solution which is being transferred between about 0.1 and about 0.4% agarose by weight.
7. The process of claim 6, wherein the polymeric film is a polyester selected from the group comprising polyethylene terephthalate, polybutylene terephthalate, polytrimethylene terephthalate, polycyclohexylenedimethylene terephthalate, polyurethanes, co-polymers thereof and combinations thereof.
8. The process of claim 7, wherein the polyester is a biaxially-oriented polyethylene terephthalate.
9. The process of claim 6, wherein the agarose solution is an aqueous solution.
10. The process of claim 6, further comprising evaporating a solvent from the agarose solution transferred to the polyester film.
11. The process of claim 1, wherein a thickness of the agarose coating after drying is between a monolayer and about 0.00025 mm.
12. The process of claim 6, further comprising:
exposing agarose powder to a CO atmosphere, and
creating the agarose solution by dissolving the CO-treated agarose powder in a solvent.
13. The process of claim 12, wherein the exposing step further comprises contacting the agarose powder with gaseous CO for at least 12 hours.
14. The process of claim 12, wherein the exposing step comprises,
(i) introducing a CO atmosphere above the agarose powder,
(ii) exposing the agarose powder to gaseous CO, and
(iii) repeating steps (i) and (ii) at least once.
15. The process of claim 14, wherein steps (i) and (ii) are repeated at least three times.
16. The process of claim 6, wherein the thickness of the agarose coating after drying is between a monolayer and about 0.00025 mm.
17. The process of claim 6, wherein an agarose in the agarose solution comprises LE agarose, ME agarose, or a combination thereof.
18. The process of claim 6, wherein an agarose in the agarose solution comprises LE agarose.
19. The process of claim 6, wherein the pH of the agarose solution is maintained between about 9 and about 11.
20. The process of claim 6, wherein the concentration of the agarose solution is maintained between about 0.2 and about 0.4% agarose by weight.
21. The process of claim 6, wherein the concentration of the agarose solution is maintained between about 0.2 and about 0.4% agarose by weight and said agarose solution comprises LE agarose.

1. A method for encapsulating a semiconductor device, the method comprising:
providing a semiconductor device with a top surface and a bottom surface;
positioning the bottom surface adjacent to a first mold portion comprising a separation component which separates a first pressure region adjacent to the bottom surface and a second pressure region adjacent to the top surface;
reducing a pressure in the first pressure region along the bottom surface to affix the bottom surface to the first mold portion;
positioning a second mold portion over the first mold portion and the semiconductor device, the second mold portion and the first mold portion defining a cavity enclosing the semiconductor device;
evacuating gasses in the second pressure region adjacent to the top surface of the semiconductor device through a first vacuum hole; and
applying an encapsulant to the top surface of the semiconductor device.
2. The method of claim 1, further comprising ejecting the semiconductor device after the applying the encapsulant, the ejecting being performed by engaging ejection pins located in the first mold portion.
3. The method of claim 1, wherein a release film is located on the second mold portion.
4. The method of claim 1, wherein the reducing the pressure along the bottom surface is performed by evacuating an ambient atmosphere through a second vacuum hole located through the first mold portion.
5. The method of claim 1, further comprising curing the encapsulant.
6. The method of claim 1, wherein the separation component has a circular shape.
7. A method of manufacturing a semiconductor device, the method comprising:
placing a semiconductor device onto a first molding piece, the semiconductor device and the first molding piece delineating a first pressure region between them;
sealing the semiconductor device into a molding chamber using a second molding piece, the molding chamber having a second pressure region outside the first pressure region;
reducing a first pressure in the first pressure region without affecting a second pressure in the second pressure region;
reducing the second pressure in the second pressure region without affecting the first pressure in the first pressure region; and
encapsulating the semiconductor device within the mold.
8. The method of claim 7, further comprising ejecting the semiconductor device after the encapsulating the semiconductor device, the ejecting being performed by engaging ejection pins located in the first molding piece.
9. The method of claim 7, wherein a release film is located on the second molding piece.
10. The method of claim 7, wherein the reducing the second pressure is performed by reducing the second pressure through a first vacuum hole located through the first molding piece.
11. The method of claim 10, wherein the reducing the first pressure is performed by evacuating an ambient atmosphere through a second vacuum hole located through the first molding piece.
12. The method of claim 7, further comprising curing the encapsulant.
13. The method of claim 7, wherein the first molding piece comprises a separating material between the first pressure region and the second pressure region.
14. A method of manufacturing a device, the method comprising:
providing a molding chamber with a top piece and a bottom piece, the bottom piece having a first opening and a second opening separated by a barrier material;
placing a semiconductor device onto the bottom piece, the placing the semiconductor device forming a first region operationally connected to the first opening and a second region operationally connected to the second opening;
sealing the molding chamber by connecting the top piece to the bottom piece;
removing a first atmosphere in the first region through the first opening;
separately removing a second atmosphere in the second region through the second opening; and
encapsulating the semiconductor device after the removing the first atmosphere and the second atmosphere.
15. The method of claim 14, further comprising ejecting the semiconductor device after the encapsulating the semiconductor device, the ejecting being performed by engaging ejection pins located in the bottom piece.
16. The method of claim 14, wherein a release film is located on the top piece.
17. The method of claim 14, wherein the barrier material comprises a first concentric ring separating the first region from the second region.
18. The method of claim 17, wherein the bottom piece comprises a second concentric ring separating the first region into a third region and a fourth region.
19. The method of claim 14, further comprising curing the encapsulant.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A uniplanar bone screw for adjusting a position of a rod, comprising: a main body having a shaft with a threaded part; a rocker coupled to and moveable relative to the main body, wherein the rocker is configured to at least partially receive the rod; a rod-securing element configured to secure the rod between the rocker and the rod-securing element and relative to the main body, wherein the rod-securing element includes a fulcrum serving as an axis of rotation about which the rod rotates, wherein the rod-securing element comprises a screw directly abuts the rod, wherein the main body includes a screw head coupled to the shaft, wherein the screw head includes a slot configured to at least partially receive the rod and the rocker; and a guide feature in one of the slot and the rocker and a guide channel in the other of the slot and the rocker, wherein the guide channel is configured to receive the guide feature to guide movement of the rocker relative to the main body.
2. The uniplanar bone screw of claim 1, wherein the threaded portion is configured to at least partially be received within a spine.
3. The uniplanar bone screw of claim 1, wherein the guide feature comprises a projection.
4. The uniplanar bone screw of claim 1, wherein the slot includes a first interior sidewall and a second interior sidewall and a bottom surface that extends from the first interior sidewall to the second interior sidewall.
5. The uniplanar bone screw of claim 4, wherein the bottom surface of the slot supports the rocker.
6. The uniplanar bone screw of claim 4, wherein the bottom surface of the slot and a surface of the rocker each include substantially elongated surfaces configured to facilitate translational movement of the rocker relative to the main body.
7. The uniplanar bone screw of claim 4,
wherein the bottom surface of the slot is one of:
(i) substantially flat in a first direction and in a second direction,
(ii) substantially curved in the first direction and in the second direction,
(ii) substantially flat in the first direction and substantially curved in the second direction, and
(iv) substantially curved in the first direction and substantially flat in the second direction, and

wherein the second direction is substantially perpendicular to the first direction.
8. The uniplanar bone screw of claim 4, wherein the bottom surface of the slot includes a pointed portion.
9. The uniplanar bone screw of claim 1, wherein the rocker includes a taper that contacts the rod.
10. The uniplanar bone screw of claim 1, wherein the rocker includes an upper portion and wherein the upper portion includes a surface that is configured to interface with and at least partially support the rod.
11. The uniplanar bone screw of claim 1,
wherein the rocker includes a substantially elliptic portion, a first wing extending from a first end of the substantially elliptic portion and a second wing extending from a second end of the substantially elliptic portion, and
wherein the substantially elliptic portion, the first wing and the second wing are configured to confine the rocker within the main body.
12. The uniplanar bone screw of claim 1, wherein the rocker comprises one of a sliding rod support and a swing.
13. The uniplanar bone screw of claim 12, wherein the shape of the sliding rod support is one of substantially convex and substantially concave.
14. The uniplanar bone screw of claim 12, wherein the swing includes holes for receiving guide features that are configured to couple the swing to the main body.
15. The uniplanar bone screw of claim 12, wherein the swing includes one or more suspension lines that suspend the swing from the main body.
16. The uniplanar bone screw of claim 12, wherein the center of the sliding rod support serves as an axis of rotation about which the sliding rod support rotates.
17. The uniplanar bone screw of claim 12, wherein one of a swing hole of the swing and a projection serve as an axis of rotation about which the swing rotates.
18. The uniplanar bone screw of claim 12, wherein when the rod-securing element is secured, the swing at least one of contacts a bottom surface of a slot of the main body such that a load is distributed and translates.
19. The uniplanar bone screw of claim 1, wherein the se lead includes a bottom portion and a top portion that is detachably coupled to the bottom portion.
20. The uniplanar bone screw of claim 1, wherein the rocker is configured to at least one of translate and rotate within the slot.
21. The uniplanar bone screw of claim 1, wherein an angle of rotation of the rod is determined by the distance of the center of the rocker from the fulcrum of the rod-securing element.
22. The uniplanar bone screw of claim 1, wherein the fulcrum comprises a cone-shape and a pointed portion of the cone directly abuts the rod.