Author: claimsbot

1. An inter-vehicle communication apparatus using visible light communication, comprising:
a spreading code application unit for applying a spreading code to transmission data desired to be transmitted; and
a transmission unit for generating a transmission frame based on the transmission data to which the spreading code is applied, and transmitting the transmission frame via a lighting lamp of a vehicle,
wherein the transmission frame includes a preamble field required to synchronize the transmission frame, a data field required to transmit the transmission data, and a position field required to provide hopping information of the transmission data,
wherein the spreading code application unit applies an identical spreading code to the transmission data and applies Spreading Factors (SFs) having different magnitudes to fields of the transmission frame.
2. The inter-vehicle communication apparatus of claim 1, wherein the data field is configured to transmit the transmission data hopped using at least one of a time hopping scheme, a code hopping scheme, and a combination of the time hopping and code hopping schemes.
3. The inter-vehicle communication apparatus of claim 2, wherein the position field indicates which pattern, among patterns corresponding to the time hopping scheme, the code hopping scheme, and the combination of the code hopping and time hopping schemes, has been used to hop the transmission data.
4. The inter-vehicle communication apparatus of claim 1, wherein the spreading code application unit applies a spreading factor greater than that of the data field to the preamble field, and applies a spreading factor greater than that of the data field and less than that of the preamble field to the position field.
5. An inter-vehicle communication apparatus using visible light communication, comprising:
a spreading code application unit for applying a spreading code to transmission data desired to be transmitted; and
a transmission unit for generating a transmission frame based on the transmission data to which the spreading code is applied, and transmitting the transmission frame via a lighting lamp of a vehicle,
wherein the transmission frame includes a preamble field required to synchronize the transmission frame, a data field required to transmit the transmission data, and a position field required to provide hopping information of the transmission data,
wherein the spreading code application unit applies different spreading codes to the transmission data depending on a transmission direction of the transmission data, and applies spreading factors having an identical magnitude to fields of the transmission frame.
6. The inter-vehicle communication apparatus of claim 5, wherein the spreading code application unit applies a first spreading code to transmission data that is transferred to a vehicle located behind the corresponding vehicle via a right lighting lamp provided on a right portion of the corresponding vehicle, and applies a third spreading code to transmission data that is transferred to a vehicle located on a right side of the corresponding vehicle via the right lighting lamp.
7. The inter-vehicle communication apparatus of claim 5, wherein the spreading code application unit applies a first spreading code to transmission data that is transferred to a vehicle located behind the corresponding vehicle via a left lighting lamp provided on a left portion of the corresponding vehicle, and applies a second spreading code to transmission data that is transferred to a vehicle located on a left side of the corresponding vehicle via the left lighting lamp.
8. The inter-vehicle communication apparatus of claim 5, wherein the data field is configured to transmit the transmission data hopped using at least one of a time hopping scheme, a code hopping scheme, and a combination of the time hopping and code hopping schemes.
9. The inter-vehicle communication apparatus of claim 8, wherein the position field indicates which pattern, among patterns corresponding to the time hopping scheme, the code hopping scheme, and the combination of the code hopping and time hopping schemes, has been used to hop the transmission data.
10. An inter-vehicle communication method using visible light communication, comprising:
applying a spreading code to transmission data desired to be transmitted;
generating a transmission frame including a preamble field, a position field, and a data field, based on the transmission data to which the spreading code is applied; and
transmitting the generated transmission frame via a lighting lamp of a vehicle,
wherein the applying the spreading code to the transmission data is configured to apply an identical spreading code to the transmission data and apply Spreading Factors (SFs) having different magnitudes to fields of the transmission frame.
11. The inter-vehicle communication method of claim 10, wherein when the spreading factors are applied to the fields of the transmission frame, a spreading factor greater than that of the data field is applied to the preamble field, and a spreading factor greater than that of the data field and less than that of the preamble field is applied to the position field.
12. The inter-vehicle communication method of claim 10, wherein the generating the transmission frame is configured such that the data field is required to transmit the transmission data hopped using at least one of a time hopping scheme, a code hopping scheme, and a combination of the time hopping and code hopping schemes.
13. The inter-vehicle communication method of claim 10, wherein the generating the transmission frame is configured such that the position field provides hopping information of the transmission data, wherein the hopping information indicates which pattern, among patterns corresponding to a time hopping scheme, a code hopping scheme, and a combination of the code hopping and time hopping schemes, has been used to hop the transmission data.
14. An inter-vehicle communication method using visible light communication, comprising:
applying a spreading code to transmission data desired to be transmitted;
generating a transmission frame including a preamble field, a position field, and a data field, based on the transmission data to which the spreading code is applied; and
transmitting the generated transmission frame via a lighting lamp of a vehicle,
wherein the applying the spreading code to the transmission data is configured to apply different spreading codes to the transmission data depending on a transmission direction of the transmission data, and apply spreading factors having an identical magnitude to fields of the transmission frame.
15. The inter-vehicle communication method of claim 14, wherein when the different spreading codes are applied to the transmission data, a first spreading code is applied to transmission data that is transferred to a vehicle located behind the corresponding vehicle via a left lighting lamp provided on a left portion of the corresponding vehicle, and a second spreading code is applied to transmission data that is transferred to a vehicle located on a left side of the corresponding vehicle via the left lighting lamp.
16. The inter-vehicle communication method of claim 14, wherein when the different spreading codes are applied to the transmission data, a first spreading code is applied to transmission data that is transferred to a vehicle located behind the corresponding vehicle via a right lighting lamp provided on a right portion of the corresponding vehicle, and a third spreading code is applied to transmission data that is transferred to a vehicle located on a right side of the corresponding vehicle via the right lighting lamp.
17. The inter-vehicle communication method of claim 14, wherein the generating the transmission frame is configured such that the data field is required to transmit the transmission data hopped using at least one of a time hopping scheme, a code hopping scheme, and a combination of the time hopping and code hopping schemes.
18. The inter-vehicle communication method of claim 14, wherein the generating the transmission frame is configured such that the position field provides hopping information of the transmission data, wherein the hopping information indicates which pattern, among patterns corresponding to a time hopping scheme, a code hopping scheme, and a combination of the code hopping and time hopping schemes, has been used to hop the transmission data.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for assembling an integrated circuit (IC) package, comprising the steps of:
(A) attaching a first surface of an IC die to a first surface of a substrate;
(B) coupling a heat sink assembly to a second surface of the IC die and to a first contact pad on the first surface of the substrate to provide a conductive path from the IC die to the first surface of the substrate, comprising the steps of:
(1) attaching a first surface of a first heat sink element to the second surface of the IC die; and
(2) attaching a second heat sink element to a second surface of the first heat sink element and to the first contact pad;

(C) coupling a pad located on the second surface of the IC die to a bond pad of the first heat sink element.
2. The method of claim 1, wherein the pad is an IO pad, wherein step (B) comprises the step of:
(3) forming an electrically conductive path from the pad of said IC die to the first contact pad.
3. The method of claim 1, wherein step (B) comprises the step of:
attaching the heat sink assembly to the second surface of said IC die with a thermally conductive adhesive layer.
4. The method of claim 1, wherein step (2) includes the step of:
attaching a surface of the second heat sink element to the second surface of the first heat sink element with a thermally and electrically conductive adhesive layer.
5. The method of claim 1, wherein step (2) includes the step of:
attaching a first arm portion of the second heat sink element to the first contact pad on the first surface of the substrate.
6. The method of claim 5, further comprising the step of:
(D) attaching a second arm portion of the second heat sink element to a second contact pad on the first surface of the substrate.
7. The method of claim 6, further comprising the step of:
(E) electrically isolating the first arm portion and second arm portion.
8. The method of claim 1, wherein step (2) includes the step of:
filling at least one perforation in the second heat sink element with a thermally conductive adhesive material.
9. The method of claim 1, further comprising the step of:
(D) encapsulating the IC die and at least a portion of the heat sink assembly on the first surface of the substrate.
10. The method of claim 1, wherein step (A) comprises the step of:
mounting the IC die in a flip chip orientation.
11. The method of claim 1, wherein step (A) comprises the step of:
electrically coupling a conductive bump on a surface of the heat sink assembly to the pad of the IC die through a passivation opening in the second surface of the IC die, wherein the pad is an IO pad.
12. The method of claim 1, wherein the second surface of the first heat sink element includes the bond pad.

1. A photothermographic material comprising a micro-particle dispersion dispersed in an organic solvent having a water content of not more than 10%, the micro-particle dispersion having a hydrophobic protective colloid and manufactured by a method comprising the steps of:
(a) dispersing micro-particles in a hydrophilic dispersant to form a hydrophilic micro-particle dispersion having the hydrophilic dispersant as a protective colloid, and
(b) adding a dispersant to the hydrophilic micro-particle dispersion, the dispersant having a functional group capable of ion bonding with a hydrophilic group of the hydrophilic dispersant.
2. A photothermographic material comprising a support having thereon a layer containing a photosensitive emulsion, photo-insensitive organic silver salt grains and a binder, wherein the photosensitive emulsion comprises a micro-particle dispersion dispersed in an organic solvent having a water content of not more than 10% and having a hydrophobic protective colloid, wherein the micro-particles are silver halide grains, and
wherein the micro-particle dispersion is manufactured by a method comprising the steps of:
(a) dispersing micro-particles in a hydrophilic dispersant to form a hydrophilic micro-particle dispersion having the hydrophilic dispersant as a protective colloid, and
(b) adding a dispersant to the hydrophilic micro-particle dispersion, the dispersant having a functional group capable of ion bonding with a hydrophilic group of the hydrophilic dispersant.
3. The photothermographic material of claim 2, wherein the photosensitive emulsion is prepared by addition of the micro-particle dispersion having a hydrophobic protective colloid to the photo-insensitive silver salt grains, the micro-particle dispersion being manufactured by the method comprising the steps of:
(a) dispersing micro-particles in a hydrophilic dispersant to form a hydrophilic micro-particle dispersion having the hydrophilic dispersant as a protective colloid, and
(b) adding a dispersant to the hydrophilic micro-particle dispersion, the dispersant having a functional group capable of ion bonding with a hydrophilic group of the hydrophilic dispersant.
4. The photothermographic material of claim 1, wherein the organic solvent may be methyl ethyl ketone or a combination of methyl ethyl ketone and at least one other organic solvent.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A device, comprising:
a substrate;
a first heater on the substrate;
a second heater spaced from the first heater on the substrate, the first heater being larger in area than the second heater;
a first microfluidic chamber aligned with the first heater and the second heater;
a first nozzle aligned with the first chamber; and
a channel region in fluid communication with the first microfluidic chamber and the first nozzle, the first heater being separated from the channel region by the second heater, the first nozzle being separated from the channel region by the second heater.
2. The device of claim 1, further comprising:
an inlet path through the substrate,
the inlet path being in fluid communication with the channel region, the first microfluidic chamber, and the first nozzle.
3. The device of claim 2, further comprising:
a third heater formed on the substrate;
a fourth heater formed on the substrate;
a second microfluidic chamber aligned with the third heater and the fourth heater; and
a second nozzle aligned with the second chamber, the second nozzle being in fluid communication with the inlet path, the channel region, and the second chamber.
4. The device of claim 3 wherein the third heater has a larger area than the fourth heater.
5. The device of claim 3, further comprising:
a first contact pad;
a second contact pad;
a third contact pad;
a first electrical trace coupled between the first heater and the first contact pad;
a second electrical trace coupled between the second heater and the second contact pad; and
a third electrical trace coupled between the third heater and the third contact pad.
6. The device of claim 5 wherein the fourth heater is coupled to the second electrical trace.
7. The device of claim 1, further comprising:
a first contact pad;
a second contact pad;
a first electrical trace coupled between the first heater and the first contact pad; and
a second electrical trace coupled between the second heater and the second contact pad.
8. The device of claim 7, further comprising a third electrical trace between the first heater and the second heater.
9. The device of claim 7 wherein the first electrical trace is coupled to a first side of the first heater and a first side of the second heater and the second electrical trace is coupled to a second side of the first heater and a second side of the second heater.
10. The device of claim 1 wherein the first nozzle is positioned between the first heater and the second heater.
11. The device of claim 1 wherein the first nozzle includes a first axis passing through a center of the first nozzle and the first axis passes through a center point of the first heater.
12. A device, comprising:
a substrate;
a plurality of first heaters on the substrate;
a plurality of second heaters on the substrate, each second heater having a smaller area than each first heater, each second heater having an outer edge;
a plurality of chambers, each chamber having an area that encompasses one of the first heaters and one of the second heaters;
a plurality of nozzles, each chamber being associated with one of the nozzles, each nozzle having an outer diameter, the outer diameter of each nozzle being non-overlapping with the outer edge of each second heater; and
an inlet path in fluid communication with each of the plurality of chambers, each second heater being closer to the inlet path than each first heater.
13. The device of claim 12 wherein each nozzle is positioned between one of the first heaters and one of the second heaters.
14. The device of claim 12 wherein an axis through each nozzle is aligned with a center point of each of the first heaters.
15. A method, comprising:
forming a first heater on a substrate with a first area;
forming a second heater with a second area spaced from the first heater on the substrate, the first area being larger than the second area;
forming a first microfluidic chamber, the first chamber covering the first heater and the second heater;
forming a first nozzle aligned with the first chamber;
forming an inlet path through the substrate, the inlet path being in fluid communication with the first nozzle and the first microfluidic chamber, the first nozzle being separated from the inlet path by the second heater.
16. The method of claim 15, further comprising:
forming a third heater on the substrate adjacent to the first heater;
forming a fourth heater spaced from the third heater on the substrate, the third heater being larger than the fourth heater;
forming a second microfluidic chamber, the second chamber covering the third heater and the fourth heater; and
forming a second nozzle aligned with the second chamber.
17. The method of claim 16, further comprising:
forming a channel in fluid communication with the inlet path, the first chamber, and the second chamber, the channel including a neck portion that has a first width, the each of the first chamber and the second chamber having a same second width, the first width being smaller than the second width.