Author: claimsbot

1. A method for controlling a point-to-multipoint transmission of a message in a mobile communication system, the method comprising
receiving the message,
storing the message in a buffer of the messages to be transmitted,
scheduling the message,
transmitting the message located in the buffer according to the predetermined scheduling,
determining a life time for the message, and
deleting the message from the buffer in response to the expiry of the life time.
2. A method as claimed in claim 1, comprising:
checking before transmitting the message, whether there is life time left, and
if there is, transmitting the message,
if there is not, deleting the message from the buffer.
3. A method as claimed in claim 2, comprising:
determining an acknowledgement time for the message to be transmitted as a group call,
transmitting the message to the group members,
waiting for the acknowledgements of the group members during the acknowledgement time,
checking after the expiry of the acknowledgement time, whether a predetermined part of the group members has acknowledged the message, and
if it has, deleting the message from the buffer,
if it has not, transmitting the message located in the buffer to the group members from whom an acknowledgement has not been received.
4. A method as claimed in claim 1, comprising:
receiving the message to be transmitted from another network element,
making a report on the successful transmission of the message in response to deleting the message from the buffer, and
transmitting the report to said another network element.
5. A method as claimed in claim 1, comprising:
receiving the message to be transmitted as a group call in the first network element,
storing the message in the buffer of the first network element,
transmitting the message to the second network element,
transmitting the message from the second network element to the group members,
waiting for the acknowledgements of the group members in the second network element during the acknowledgement time after the transmission,
making a report on the acknowledgements in the second network element after the expiry of the acknowledgement time, and
transmitting the report to the first network element.
6. A method as claimed in claim 5, comprising:
storing the message also in the buffer of the second network element,
deleting the message also from the buffer of the second network element in response to the expiry of the life time of the message,
checking in the second network element after the expiry of the acknowledgement time, whether a predetermined part of the group members has acknowledged the message, and
if it has, making a report on the acknowledgements and deleting the message from the buffer of the second network element,
if it has not, transmitting the message located in the buffer to the mobile stations from whom an acknowledgement has not been received.
7. A method as claimed in claim 6, comprising:
determining the maximum number of transmissions for the message in the second network element,
calculating the number of the realized transmissions,
checking before transmitting the message, whether the number of the realized transmissions is the same as the maximum number, and
if it is, making a report on the acknowledgements and deleting the message from the buffer of the second network element,
if it is not, transmitting the message located in the buffer.
8. A method as claimed in claim 6, comprising giving a report on the acknowledgements, if the message has been deleted from the buffer of the second network element before transmitting.
9. A method as claimed in claim 5, comprising the report including the group members who acknowledged the message as received.
10. A method as claimed in claim 9, comprising the first network element being arranged to transmit the message to the group members who did not acknowledge the group message, if these group members become reachable before the life time of the message expires.
11. A mobile communication system comprising at least one service centre to transmit a message as a point-to-multipoint transmission and at least one network element via which the message is transmitted to cells belonging to a destination area,
wherein the service centre is arranged to determine the remaining life time of the message and to check before transmitting the message, whether there is life time left and to transmit the message only if there is still life time left.
12. A mobile communication system as claimed in claim 11, wherein the network element is arranged to determine the remaining life time of the message and to check before transmitting the message, whether there is life time left and to transmit the message only if there is still life time left.
13. A mobile communication system as claimed in claim 11, wherein the network element is arranged to receive acknowledgements from the group members during a certain acknowledgement time and to transmit the information on the acknowledgments in one message to the service centre.
14. A network element of a mobile communication network which network supports the point-to-multipoint transmission of a message,
wherein the network element comprises
means for determining the remaining life time of a message to be transmitted point-to-multipoint, and
means for transmitting said message according to the scheduling of the message if there is still time left.
15. A network element as claimed in claim 14, wherein it also comprises
means for determining the acknowledgement time for the message to be transmitted as a multipoint group call which as to be acknowledged,
means for monitoring the acknowledgement until the acknowledgement time has expired, and
means for compiling the acknowledgements as one acknowledgement report.
16. A network element as claimed in claim 14, wherein it comprises means for transmitting the message to be transmitted as a multipoint group call which has to be acknowledged during the life time of the message to the group members who are reachable in the destination area of the message and who have not acknowledged the message as received.
17. A network element as claimed in claim 14, wherein it comprises a processor which is arranged to carry out software routines and that said means are implemented as software routines.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A device for housing both a portable electronic device and a medication delivery device, the device comprising:
a body having:
a first compartment for holding a portable electronic device; and
a second compartment for holding a medication delivery device.
2. The device of claim 1, wherein the portable electronic device is a mobile telephone.
3. The device of claim 1, wherein the medication delivery device is a device for injecting a quantity of epinephrine.
4. The device of claim 3, wherein the medication delivery device includes the quantity of epinephrine.
5. The device of claim 1, wherein the body includes a rigid frame and the second compartment is lined with a pliable material.
6. The device of claim 5, wherein the pliable material includes a silicone.
7. The device of claim 1, wherein the second compartment includes a cover for restraining the medication delivery device.
8. The device of claim 7, wherein the cover is secured in a closed position using at least one latch device.
9. The device of claim 8, wherein the at least one latch device includes a pair of latch devices, each of which must be released to open the cover and provide access to the second compartment.
10. A system for transporting a medication delivery device, the system comprising:
a medication delivery device; and
device for housing both a portable electronic device and the medication delivery device, the device comprising:
a body having:
a first compartment for holding the portable electronic device; and
a second compartment for holding the medication delivery device.
11. The system of claim 10, wherein the portable electronic device is a mobile telephone.
12. The system of claim 10, wherein the medication delivery device is a device for injecting a quantity of epinephrine.
13. The system of claim 12, wherein the medication delivery device includes the quantity of epinephrine.
14. The system of claim 10, wherein the body includes a rigid frame and the second compartment is lined with a pliable material.
15. The system of claim 14, wherein the pliable material includes a silicone.
16. The system of claim 10, wherein the second compartment includes a cover for restraining the medication delivery device.
17. The system of claim 16, wherein the cover is secured in a closed position using at least one latch device.
18. The system of claim 17, wherein the at least one latch device includes a pair of latch devices, each of which must be released to open the cover and provide access to the second compartment.

1. A total temperature probe comprising:
a hollow elongate shroud defined by a shroud wall that envelops a first cavity; the shroud wall comprising an inner skin and an outer skin which enclose a second cavity therebetween;
a temperature sensor mounted in the first cavity;

wherein, in use, fluid flow is received into the first cavity, passes through at least one aperture in the inner skin into the second cavity and thence passes out of the shroud through at least one aperture in the outer skin, such that heat conduction across the inner skin is minimal.
2. A total temperature probe as claimed in claim 1 wherein the inner skin and the outer skin are separated by a constant distance.
3. A total temperature probe as claimed in claim 1 wherein the first and second cavities are coextensive.
4. A total temperature probe as claimed in claim 1 wherein the shroud is annular.
5. A total temperature probe as claimed in claim 4 wherein the inner and outer skins are coaxial.
6. A total temperature probe as claimed in claim 1 wherein the shroud changes cross-sectional shape in the direction of fluid flow therethrough.
7. A total temperature probe as claimed in claim 6 wherein the shroud has a regular polygon cross-section at one or both of its ends.
8. A total temperature probe as claimed in claim 6 wherein the shroud has rectangular cross-section at an intermediate portion between its ends.
9. A total temperature probe as claimed in claim 1 wherein the temperature sensor comprises any one of the group comprising a thermocouple, a resistive temperature sensor or an optical temperature sensor.
10. A total temperature probe as claimed in claim 1 further comprising a pressure sensor.
11. A total temperature probe as claimed in claim 10 wherein the pressure sensor is located adjacent to the temperature sensor.
12. A total temperature probe as claimed in claim 10 wherein the temperature sensor also functions as a pressure sensor.
13. A total temperature probe as claimed in claim 10 wherein the pressure sensor is mounted in a tapping through the outer skin into the second cavity.
14. A total temperature probe as claimed in claim 1 wherein the at least one aperture in the inner skin is aligned with or downstream of the temperature sensor.
15. A total temperature probe as claimed in claim 1 wherein the at least one aperture in the outer skin is axially andor circumferentially displaced from the at least one aperture in the inner skin.
16. A total temperature probe as claimed in claim 1 wherein there is more than one aperture in the inner skin, the apertures being arranged in a regular array around the periphery of the inner skin.
17. A total temperature probe as claimed in claim 1 wherein there is more than one aperture in the outer skin, the apertures being arranged in a regular array around the periphery of the outer skin.
18. An arrangement comprising an array of total temperature probes as claimed in claim 1.
19. A gas turbine engine comprising a total temperature probe as claimed in claim 1.
20. A gas turbine engine comprising an arrangement as claimed in claim 18.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of integrating a first element having a first contact structure with a second element having a second contact structure, comprising:
forming said first and second contact structures from a metal selected from copper, tungsten, nickel, gold or alloys thereof;
forming said first and second contact structures to have an upper surface below respective surfaces of said first and second elements by no more than 20 nm;
forming a conductive pad connected to at least said first contact structure;
bonding a material in said first element to a material in said second element such that said first contact structure is directly connected to said second contact structure; and
heating said first and second elements at a temperature less than 400\xb0 C. to increase pressure between said first and second contact structures.
2. The method recited in claim 1, comprising:
heating at a temperature below 350\xb0 C.
3. The method recited in claim 1, comprising:
removing a native oxide from at least one of the first and second contact structures.
4. The method recited in claim 1, wherein said heating comprises forming a mechanical connection between the first and second contact structures.
5. The method recited in claim 1, comprising:
forming a palladium layer on at least one of said first and second contact structures.
6. The method recited in claim 1, comprising:
forming said first and second contact structures to have an upper surface below respective surfaces of said first and second elements by no more than 10 nm.
7. The method recited in claim 1, comprising:
forming said second contact structure to have a lateral area smaller than a lateral area of said first contact structure.
8. The method recited in claim 1, comprising:
forming said second contact structure having a first perimeter completely within a second perimeter of said first contact structure.
9. The method recited in claim 1, comprising:
etching a surface of at least one of said first and second elements adjacent to said first and second contact structures, respectively.
10. The method recited in claim 1, comprising:
controlling a height of a surface of at least one of said first and second elements with respect to said first and second contact structures, respectively.
11. The method recited in claim 10, comprising:
controlling said height using chemo-mechanical polishing.
12. The method recited in claim 10, comprising:
controlling said height using etching of said surface.
13. The method recited in claim 10, comprising:
controlling said height using a metal layer formed on said contact structures.
14. The method recited in claim 1, comprising:
heating said first and second elements after bonding to thermally expand at least one of said first and second contact structures.
15. The method recited in claim 1, comprising:
thinning one of said first and second elements after said bonding; and
performing said heating after said thinning.
16. The method recited in claim 1, comprising:
preferentially heating said first and second contact structures with respect to said materials of said first and second elements.
17. The method recited in claim 1, wherein said 20 nm is an average distance over an extent of the first and second contact structures.
18. An integration method, comprising:
forming a first contact structure in a first element electrically connected to a conductive pad, said first element having a first substrate;
forming a second element having at least one second contact structure;
forming said first and second contact structures to have an upper surface below respective surfaces of said first substrate and second element by no more than 20 nm;
removing a portion of said first substrate;
bonding said first substrate to said second element after said removing; and
directly contacting said first contact structure with said second contact structure.
19. The method recited in claim 18, wherein said 20 nm is an average distance over an extent of the first and second contact structures.
20. The method recited in claim 18, comprising:
forming said first and second contact structures to have an upper surface below respective surfaces of said first and second elements by no more than 10 nm.
21. The method recited in claim 18, comprising:
forming said second contact structure to have a lateral area smaller than a lateral area of said first contact structure.
22. The method recited in claim 18, comprising:
forming said second contact structure having a first perimeter completely within a second perimeter of said first contact structure.
23. The method recited in claim 18, comprising:
etching a surface of at least one of said first and second elements adjacent to said first and second contact structures, respectively.
24. The method recited in claim 18, comprising:
controlling a height of a surface of at least one of said first and second elements with respect to said first and second contact structures, respectively.
25. The method recited in claim 24, comprising:
controlling said height using chemo-mechanical polishing.
26. The method recited in claim 24, comprising:
controlling said height using etching of said surface.
27. The method recited in claim 24, comprising:
controlling said height using a metal layer formed on said contact structures.
28. The method recited in claim 18, comprising:
heating said first and second elements after said bonding to thermally expand at least one of said first and second contact structures.
29. The method recited in claim 18, comprising:
thinning one of said first and second elements after said bonding; and
performing said heating after said thinning.
30. The method recited in claim 18, comprising:
preferentially heating said first and second contact structures with respect to said materials of said first and second elements.
31. The method recited in claim 18, comprising:
heating said first and second elements at a temperature to increase pressure between said first and second contact structures.
32. The method recited in claim 31, comprising:
heating said first and second elements at a temperature to reduce the resistance of contact between said first and second contact structures.
33. The method recited in claim 31, comprising:
heating at a temperature less than 400\xb0 C.