Author: claimsbot

1. A grindstone for shaping a gear, wherein at least the outer layer portion of the toothed portion is configured of a metal-bonded super-abrasive layer.
2. A grindstone for shaping a gear according to claim 1, wherein the super-abrasive of said super-abrasive layer is composed of selected one of diamond and cubic boron nitride.
3. A grindstone for shaping a gear according to claim 1, wherein the profile of said super-abrasive layer is formed by electric discharge machining.
4. A grindstone for shaping a gear according to claim 3, wherein said electric discharge machining is a selected one of die sinking electric discharge machining and wire electric discharge machining.
5. A grindstone for shaping a gear according to claim 1, wherein said super-abrasive layer is formed of a multiplicity of super-abrasive sublayers.
6. A method of fabricating a gear-shaped grindstone for shaping a gear, wherein at least the outer layer portion of the tool portion is configured of a super-abrasive layer, said method comprising the steps of:
fixedly attaching a metal-bond material making up at least the outer layer portion of said toothed portion to a base metal; and
forming the profile of said outer layer portion by electric discharge machining.
7. A method of fabricating a gear-shaped grindstone for shaping a gear according to claim 6, further comprising the step of dressing said grindstone after electric discharge machining.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A laser protection arrangement with a safety cutoff, comprising:
a passive laser protection wall which stores the radiation energy of impinging radiation of a laser of a laser material processing installation;
a laser protection foil which undergoes a detectable change when struck by laser radiation being arranged in front in the direction of the laser radiation; and
at least one sensor being connected to the laser by a threshold switch in order to switch off the laser when the received detector signal exceeds or falls below a threshold value.
2. The laser protection arrangement according to claim 1, wherein the laser protection foil comprises an expandable plastic and is fixed in an expanded state, and the sensor is an expansion sensor.
3. The laser protection arrangement according to claim 2, wherein the laser protection foil is expanded in only one direction and the expansion sensor is an expansion measurement strip which is glued on in the expansion direction so that when struck by laser radiation the laser protection foil is destroyed at the point of incidence and a tear extends perpendicular to the expansion direction and leads to a drop in the tensile strain which is determined as a threshold value.
4. The laser protection arrangement according to claim 1, wherein the laser protection foil is a foil with at least one electric conductor path to which a voltage is applied or which carries current, and the sensor is a voltage measuring device or current measuring device so that when a conductor path is struck by laser radiation it melts and the voltage collapses or the current is interrupted.
5. The laser protection arrangement according to claim 4, wherein the electric conductor paths are embedded in the foil.
6. The laser protection arrangement according to claim 4, wherein the conductor paths are arranged on one side of the foil.
7. The laser protection arrangement according to claim 6, wherein the free side of the foil is coated with an electrically conductive layer so that a short circuit results when the foil melts due to the impingement of laser radiation.
8. The laser protection arrangement according to claim 1, wherein the laser protection foil is a foil with integrated optically conducting fibers comprising a fiber core and a fiber cladding, and the sensor is an optical sensor.
9. The laser protection arrangement according to claim 1, wherein the laser protection foil comprises a material which is transparent to the laser radiation and is provided on both sides with a layer reflecting the laser radiation so that when struck by laser radiation the layer is destroyed at the point of incidence and the laser radiation is coupled in so as to be guided to a sensor which is an optical sensor.
10. The laser protection arrangement according to claim 1, wherein the laser protection foil is a double foil which is formed by at least one gas-filled hollow chamber.
11. The laser protection arrangement according to claim 10, wherein the hollow chambers are filled with a special gas and the sensor is a gas sensor.
12. The laser protection arrangement according to claim 10, wherein an overpressure exists in the hollow chambers and the sensor is a pressure sensor.
13. The laser protection arrangement according to claim 10, wherein the double foil forming a hollow chamber is connected by a plurality of webs so that the expansion of the chamber is limited by the height of the webs.
14. The laser protection arrangement according to claim 10, wherein the laser protection foil is a bubble foil and the sensor is an acoustic sensor.
15. The laser protection arrangement according to claim 1, wherein the laser protection foil comprises an expandable plastic and is fixed in an expanded state and the detector is an acoustic sensor.
16. The laser protection arrangement according to claim 1, wherein a plurality of laser protection arrangements are combined to form a laser protection booth.
17. The laser protection arrangement according to claim 16, wherein the laser protection arrangements in each instance comprise a wall of identical height which are arranged next to one another so as to form the circumferential surface of the laser protection booth, and the laser protection foil is held in a frame so as to extend along the entire height, while the passive laser protection wall has a lower height.
18. The laser protection arrangement according to claim 17, wherein the laser protection arrangements define a ceiling surface of the laser protection booth which is formed by a laser protection foil.
19. The laser protection arrangement according to claim 16, wherein the laser protection foils are constructed according to claim 10 and are connected to one another in such a way that they form a freestanding booth around which the passive laser protection walls are arranged to form a laser protection booth.
20. A laser protection arrangement with a safety cutoff, comprising:
a passive laser protection wall which stores the radiation energy of impinging radiation of a laser of a laser material processing installation;
a laser protection foil which causes a detectable change when struck by laser radiation being arranged in front in direction of the laser radiation; and
at least one sensor being connected to the laser by a threshold switch in order to switch off the laser when the received detector signal exceeds or falls below a threshold value.

1. A procedure for the manufacture of molded parts, in particular threads or films, the procedure comprising:
forming at least two separate polymer solutions, wherein a first polymer solution comprises at least one polymer in a solvent containing amino-N-oxide and wherein the at least one polymer is selected from the group consisting of polysaccharide derivative and polyvinyl alcohol; and
simultaneously extruding the at least two separate polymer solutions to form a combined extrudate and precipitating the extrudate by bringing it into contact with a coagulant, wherein at least one of the polymer solutions contains at least one inorganic or organic additive selected from the group consisting of oxides, carbides, borides, nitrides, oxynitrides, sialones and aluminosilicates, carbon-containing materials, metal powders, metal salts, polymer fibers, particle suspensions, ceramic-forming low molecular compounds and ceramic-forming high-molecular compounds, the additive having a functional ability selected from the group consisting of catalytically active, electronically conductive, ionically conductive, piezoelectric, insulating, pore-forming, mechanically strengthening, absorbing active and surface active, and wherein the polymer solutions have a weight ratio of polymer to additive of 10:1 to 1:100.
2. The procedure according to claim 1, wherein at least two polymer solutions differ in at least one property selected from the group consisting of particle size, material composition and content of additives.
3. The procedure according to claim 1 wherein the additives have a particle size ranging from 0.01 to 1000 \u03bcm.
4. The procedure according to claim 1, wherein the polymer solutions are extruded at different volumetric rates.
5. The procedure according to claim 1, wherein the two or more polymer solutions are concentrically extruded and, to form massive bi- or multi-component threads, coagulated only from outside.
6. The procedure according to claim 1, wherein the two or more polymer solutions are concentrically extruded and, to form massive three-component threads, an additive dispersion is centrally supplied and coagulated from outside.
7. The procedure according to claim 1, wherein the volumetric ratio between the two or more extruded polymer solutions and a centrally supplied space-filling liquid or a gas is selected in such a way as to expand the polymer solution hose.
8. The procedure according to claim 1, wherein the two or more polymer solutions are concentrically extruded and, to form bi- or multi-component threads, coagulated from inside and outside.
9. The procedure according to claim 1, wherein th extrudate is stretched in an air gap before precipitation to set the dimensions of the core and jacket layers.
10. The procedure according to claim 1, wherein the coagulated extrudate is dried, and its polymer content is removed andor carbonized via thermal treatment.
11. The procedure according to claim 10, wherein the thermal treatment is conducted in a temperature range of 250 to 3500\xb0 C. in the presence of oxygen, inert gas or under a vacuum.
12. The procedure according to claim 10, wherein the thermal treatment takes place in a first stage at a lower temperature, and in a second stage at a higher temperature, and that oxidizing conditions prevail only in one of the two stages.
13. The procedure according to claim 1, wherein monohydrate of the N-oxide is used as the solvent.
14. The procedure according to claim 1, wherein cellulose is used as the polymer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A sample surface processing method comprising:
etching a sample having a mask material on a surface thereof by
generating a first plasma for etching the sample mounted on a sample stage provided in a vacuum chamber,
applying a high frequency bias to the sample stage, and

performing the surface processing of the sample on the sample stage by the first plasma, and then
removing a cured layer of the mask material on the sample resulting from heat input from the first plasma in the same vacuum chamber in which the etching is performed by
generating a second plasma of a mixed gas of an oxygen gas and a fluorine-containing gas introduced into the vacuum chamber,
applying a high frequency bias to the sample and
removing the cured layer of the mask material by the second plasma, and then

ashing the sample in the same vacuum chamber in which the etching is performed by
generating a third plasma of an oxygen gas introduced into the vacuum chamber,
stopping the high frequency bias, and
removing the mask material left after removal of the cured layer by the third plasma.
2. The sample surface processing method according to claim 1, wherein the pressure of the gas during the ashing is set at 0.2 to 2 Pa.
3. The sample surface processing method according to claim 1, wherein the fluorine-containing gas is preferably any of CHF3, CH2F2, CF4, and SF6.
4. The sample surface processing method according to claim 1, wherein the removal of the mask material of the sample and removal of a deposit attached to the sidewall of the vacuum chamber are performed at the same time during ashing.
5. The sample surface processing method according to claim 1, wherein removal of a deposit attached to the inner wall of the vacuum chamber is performed during ashing.
6. A sample surface processing method by a sample processing apparatus comprising: a vacuum chamber; means for generating a plasma in the vacuum chamber; a sample stage provided in the vacuum chamber for mounting a sample to be processed thereon; and a power source for applying a high frequency bias to the sample, wherein the surface processing method comprises:
etching a sample having a mask material on a surface thereof by
generating a first plasma in the vacuum chamber,
applying a high frequency bias to the sample stage, and
performing the surface processing of the sample on the sample stage by the first plasma, and then

performing ashing of the sample in the same vacuum chamber in which etching is performed to remove the mask material by
generating a second plasma of a mixed gas of an oxygen gas and a fluorine-containing gas;
applying a high frequency bias to the sample, and
removing only a cured surface layer of the mask material of the sample resulting from heat input from the first plasma by the second plasma; and then
generating a third plasma of an oxygen gas,
stopping the high frequency bias, and
performing the ashing by the third plasma for removing the mask material left after the removal of the cured surface layer
monitoring the plasma emission intensity of a reaction product in the vacuum chamber, and the changes in interference light; and
automatically determining the state of the surface processing based on the monitor result, and performing switching between supplying the oxygen gas and the mixed gas, and switching of the high frequency bias to the sample.
7. The sample surface processing method according to claim 6, wherein the pressure of the gas during ashing is set at 0.2 to 2 Pa.
8. The sample surface processing method according to claim 6, wherein the fluorine-containing gas is preferably any of CHF3, CH2F2, CF4, and SF6.
9. The sample surface processing method according to claim 6, wherein the removal of the mask material of the sample and removal of a deposit attached to the sidewall of the vacuum chamber are performed at the same time during ashing.
10. The sample surface processing method according to claim 6, wherein removal of a deposit attached to the inner wall of the vacuum chamber is performed during ashing.