Author: claimsbot

1. A method for removing intervertebral disc material, comprising the steps of:
creating a working channel from a patient’s skin to an intervertebral disc space;
providing a protector, said protector having a longitudinal axis and including retractor having first and second generally rectangular, planar blade members fixed in position relative to one another to form a generally V-shaped construct for establishing a barrier, said construct having a longitudinal axis extending in a generally parallel orientation relative to said longitudinal axis of said protector;
positioning said protector near an entrance into said intervertebral disc space between said working channel and at least two of neural tissue, dura tissue, and vasculature adjacent to said entrance such that said first blade member prevents neural tissue from migrating into said working channel, and said second blade member prevents at least one of dura tissue and vasculature from migrating into said channel;
inserting a brush member through the working channel into said intervertebral disc space, said brush member having a length ranging from 0.25 to 4.0 inches, a diameter ranging from 0.082 to 1.225 inches, and a plurality of bristle members disposed in a helical configuration defining a capacity for carrying intervertebral disc material wherein said protector prevents contact between said brush member, said neural tissue and said at least one of dura tissue and vasculature;
manipulating said brush member within said intervertebral disc space to receive intervertebral disc material within said brush member; and
removing said brush member from said intervertebral disc space.
2. The method of claim 1, wherein said step of creating a working channel to the intervertebral disc space is accomplished via at least one of percutaneous surgical procedure and an open surgical procedure.
3. The method of claim 1, wherein said protector further comprises a cannula dimensioned to extend to said entrance of said intervertebral disc space, said cannula having an inner lumen dimensioned to slideably receive said brush member for passage into said intervertebral disc space.
4. The method of claim 3, wherein said cannula includes a lip member at a distal end thereof dimensioned to retract at least one of said neural tissue, dura tissue, and vasculature adjacent to said spine.
5. The method of claim 3, wherein said inner lumen of said cannula and said brush member have approximately the same cross-sectional shape.
6. The method of claim 1, wherein said brush member includes a stem member, and further including the step of providing a drive assembly capable of engaging with said stem member for manipulating said brush member within said intervertebral disc space.
7. The method of claim 6, wherein said drive assembly comprises one of a powered drive assembly coupled to said stem member and a manual drive assembly coupled to said stem member.
8. The method of claim 7, wherein said powered drive assembly is a power drill.
9. The method of claim 7, wherein said manual drive assembly includes a handle member capable of being coupled to said stem member.
10. The method of claim 9, wherein said manual drive assembly includes an extension member coupled to said handle and a quick-connect coupling assembly for releasable connection to said stem member.
11. The method of claim 7, wherein said drive assembly includes a stop member coupled to said stem member for controlling the depth to which said brush member can be advanced into said intervertebral disc space.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed:

1. A method for forming a stackable wafer in an implantable device, comprising:
forming an opening extending substantially through the wafer;
depositing conductive material within the opening to substantially fill the opening;
forming a bump on an upper surface of the wafer adjacent the conductive material; and
forming a contact pad on a lower surface of the wafer adjacent the conductive material.
2. The method set forth in claim 1 wherein forming an opening further comprises exposing a selected portion of the upper surface of the wafer to a reactive ion etching process for a preselected duration of time.
3. The method set forth in claim 1 wherein depositing conductive material within the opening further comprises depositing at least one of copper, tungsten, nickel, and aluminum within the opening.
4. The method set forth in claim 1 wherein depositing conductive material within the opening further comprises depositing a layer of conductive material over the upper surface of the wafer and within the opening, and removing a portion of the layer of conductive material overlying the upper surface of the wafer.
5. The method set forth in claim 4 wherein removing a portion of the layer of conductive material further comprises performing a chemical mechanical polishing of the layer of conductive material to remove a portion of the layer of conductive material overlying the upper surface of the wafer.
6. The method of claim 1 wherein forming a bump on an upper surface of the wafer further comprises forming a bump wherein at least a portion of a surface of the bump is wettable.
7. The method of claim 1 wherein forming a contact pad on a lower surface of the wafer further comprises forming a contact pad wherein at least a portion of a surface of the contact pad is wettable.
8. The method of claim 1 wherein forming an opening extending substantially through the wafer further comprises forming the opening extending substantially through a substrate of the wafer.
9. The method of claim 8 wherein forming an opening extending substantially through the wafer further comprises forming the opening extending substantially through a substrate of the wafer and any additional process layers formed on the substrate.
10. The method set forth in claim 1 wherein depositing conductive material within the opening further comprises depositing conductive material in contact with at least one conductive layer disposed within the wafer.
11. A method for forming a stacked arrangement of a first and second wafer in an implantable device, comprising:
forming an opening extending substantially through the first wafer;
depositing conductive material within the opening to substantially fill the opening in the first wafer;
forming a bump on an upper surface of the first wafer adjacent the conductive material;
forming a contact pad on a lower surface of the first wafer adjacent the conductive material;
forming an opening extending substantially through the second wafer;
depositing conductive material within the opening to substantially fill the opening in the second wafer;
forming a bump on an upper surface of the second wafer adjacent the conductive material;
forming a contact pad on a lower surface of the second wafer adjacent the conductive material;
positioning the first wafer adjacent the second wafer with the bump of the first wafer being adjacent the contact pad of the second wafer; and
coupling the bump of the first wafer with the contact pad of the second wafer.
12. The method set forth in claim 11 wherein coupling the bump of the first wafer with the contact pad of the second wafer further comprises soldering the bump of the first wafer with the contact pad of the second wafer.
13. The method set forth in claim 11 wherein forming an opening in the first wafer further comprises exposing a selected portion of the upper surface of the first wafer to a reactive ion etching process for a preselected duration of time.
14. The method set forth in claim 11 wherein depositing conductive material within the opening of the first wafer further comprises depositing at least one of copper, tungsten, nickel, and aluminum within the opening of the first wafer.
15. The method set forth in claim 11 wherein depositing conductive material within the opening of the first wafer further comprises depositing a layer of conductive material over the upper surface of the first wafer and within the opening, and removing a portion of the layer of conductive material overlying the upper surface of the first wafer.
16. The method set forth in claim 15 wherein removing a portion of the layer of conductive material further comprises performing a chemical mechanical polishing of the layer of conductive material to remove a portion of the layer of conductive material overlying the upper surface of the first wafer.
17. The method of claim 11 wherein forming a bump on an upper surface of the first wafer further comprises forming a bump wherein at least a portion of a surface of the bump is wettable.
18. The method of claim 11 wherein forming a contact pad on a lower surface of the second wafer further comprises forming a contact pad wherein at least a portion of a surface of the contact pad is wettable.
19. The method of claim 11 wherein forming an opening extending substantially through the firs wafer further comprises forming the opening extending substantially through a substrate of the first wafer.
20. The method of claim 19 wherein forming an opening extending substantially through the first wafer further comprises forming the opening extending substantially through the substrate of the first wafer and any additional process layers formed on the substrate.
21. The method set forth in claim 11 wherein depositing conductive material within the opening of the first wafer further comprises depositing conductive material in contact with at least one conductive layer disposed within the first wafer.

1. A flooring system comprising:
a flexible sheet floor panel, comprising:
a first end, a second end, a third end, a fourth end, a top surface, a side surface extending downwardly from the top surface to define a periphery of the floor panel, and a bottom surface, the top surface having a visible decorative pattern, the bottom surface of the floor panel having a recess which extends about the periphery of the floor panel, the recess defined by a recess wall and a recess surface, the recess wall extending from the bottom surface of the floor panel to the recess surface as a continuous planar surface, the recess surface extending from the side surface of the floor panel to the recess wall as a continuous planar surface, wherein the side surface terminates at the top surface and at the recess surface, the periphery comprising the first, second, third and fourth ends of the floor panel;
a longitudinal axis extending from the first end of the floor panel to the second end of the floor panel;
a transverse axis extending from the third end of the floor panel to the fourth end of the floor panel; and

a joining member coupled to the floor panel by an adhesive positioned between the recess surface of the recess and a top surface of the joining member, the adhesive adhering the top surface of the joining member to the recess surface of the recess, a bottom surface of the joining member and the bottom surface of the floor panel being essentially flush with each other, the joining member comprising:
at least one layer selected from at least one of a film and tape;
a first portion that extends substantially parallel to the longitudinal axis, the first portion: (1) protruding transversely beyond the fourth end of the floor panel in a first transverse direction; and (2) protruding longitudinally beyond the first end of the floor panel in a first longitudinal direction; and
the first portion having a first end and a second end, the second end of the first portion being offset from the second end of the floor panel in the first longitudinal direction;
a second portion that extends substantially parallel to the transverse axis, the second portion protruding longitudinally beyond the first end of the floor panel in the first longitudinal direction, the second portion having a first end that is offset from the third end of the floor panel in the first transverse direction.
2. The flooring system of claim 1, wherein the side surface extends from the top surface to the recess surface as a continuous planar surface, and wherein the periphery of the floor panel defines an outermost boundary of the floor panel.
3. The flooring system of claim 1, wherein the thickness of the recess is about 5 to 9 mils and the thickness of the joining member is about 4 to 8 mils.
4. The flooring system of claim 3, wherein the thickness of the recess is about 7 to 9 mils and the thickness of the joining member is about 6 to 8 mils.
5. The flooring system of claim 1, wherein the floor panel is a substantially flexible sheet material.
6. The flooring system of claim 5, wherein the substantially flexible sheet material comprises plastic, vinyl, polyvinyl chloride, or polyester.
7. The flooring system of claim 1, wherein the joining member is a film comprising plastic, vinyl, polyvinyl chloride, polyester, polyolefin, or nylon.
8. The flooring system of claim 1, wherein each of the recess and the joining member has a rectangular transverse cross-section.
9. The flooring system of claim 1 wherein the floor panel has a length measured from the first end of the floor panel to the second panel end of the floor panel; wherein the first portion of the joining member has a length measured from the first end of the first portion to the second end of the first portion; and wherein the length of the first portion is substantially equal to the length of the floor panel.
10. The flooring system of claim 1 wherein the first and second portions of the joining member are integrally formed such that the joining member is a single component.
11. The flooring system of claim 1, wherein the first portion of the joining member protruding longitudinally beyond the first end of the floor panel forms a first marginal end portion of the joining member, and wherein the first marginal end portion has a first exposed surface.
12. The flooring system of claim 11, wherein adhesive is applied to the first exposed surface, thereby forming a first adhesive surface.
13. The flooring system of claim 12, wherein the first adhesive surface is covered by a release layer.
14. The flooring system of claim 1, wherein the first portion protruding transversely beyond the fourth end of the floor panel forms a second marginal end portion of the joining member, and wherein the second marginal end portion has a second exposed surface.
15. The flooring system of claim 14, wherein adhesive is applied to the second exposed surface, thereby forming a second adhesive surface.
16. The flooring system of claim 15, wherein the second adhesive surface is covered by a release layer.
17. The flooring system of claim 1, wherein the offset from the second end of the first portion of the joining member and the second end of the floor panel forms a third marginal end portion on the floor panel, and wherein the third marginal end portion has a third exposed surface being formed from at least part of the recess surface of the floor panel.
18. A flooring system comprising:
a flexible sheet floor panel, comprising:
a first end, a second end, a third end, a fourth end, a top surface, a side surface extending downwardly from the top surface to define a periphery of the floor panel, and a bottom surface, the top surface having a visible decorative pattern, the bottom surface of the floor panel having a recess which extends about the periphery of the floor panel, the recess defined by a recess wall and a recess surface, the recess wall extending from the bottom surface of the floor panel to the recess surface as a continuous planar surface, the recess surface extending from the side surface of the floor panel to the recess wall as a continuous planar surface, wherein the side surface terminates at the top surface and at the recess surface, the periphery comprising the first, second, third and fourth ends of the floor panel;
a longitudinal axis extending from the first end of the floor panel to the second end of the floor panel;
a transverse axis extending from the third end of the floor panel to the fourth end of the floor panel; and

a joining member coupled to the floor panel by an adhesive positioned between the recess surface of the recess and a top surface of the joining member, the adhesive adhering the top surface of the joining member to the recess surface of the recess, a bottom surface of the joining member and the bottom surface of the floor panel being essentially flush with each other, the joining member comprising:
at least one layer selected from at least one of a film and tape;
a first portion that extends substantially parallel to the longitudinal axis, the first portion: (1) protruding transversely beyond the fourth end of the floor panel in a first transverse direction; and (2) protruding longitudinally beyond the first end of the floor panel in a first longitudinal direction; and
the first portion having a first end and a second end, the second end of the first portion being offset from the second end of the floor panel in the first longitudinal direction.
19. A flooring system comprising:
a flexible sheet floor panel, comprising:
a first end, a second end, a third end, a fourth end, a top surface, a side surface extending downwardly from the top surface to define a periphery of the floor panel, and a bottom surface, the top surface having a visible decorative pattern, the bottom surface of the floor panel having a recess which extends about the periphery of the floor panel, the recess defined by a recess wall and a recess surface, the recess wall extending from the bottom surface of the floor panel to the recess surface as a continuous planar surface, the recess surface extending from the side surface of the floor panel to the recess wall as a continuous planar surface, wherein the side surface terminates at the top surface and at the recess surface, the periphery comprising the first, second, third and fourth ends of the floor panel;
a longitudinal axis extending from the first end of the floor panel to the second end of the floor panel;
a transverse axis extending from the third end of the floor panel to the fourth end of the floor panel; and

a joining member coupled to the floor panel by an adhesive positioned between the recess surface of the recess and a top surface of the joining member, the adhesive adhering the top surface of the joining member to the recess surface of the recess, a bottom surface of the joining member and the bottom surface of the floor panel being essentially flush with each other, wherein the joining member protrudes longitudinally beyond the first end of the floor panel in the first longitudinal direction and protrudes transversely beyond the fourth end of the floor panel in a first transverse direction, wherein the joining member comprises at least one layer selected from at least one of a film and tape.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method comprising:
receiving a plurality of control packets through a control plane tunnel that communicates control traffic for a plurality of virtual private networks (VPNs) among a plurality of autonomous systems;
for each control packet, identifying a routing instance of the control packet according to a control tag of the control packet to yield a plurality of routing instances, at least two routing instances distinct from each other;
routing the control packets according to the routing instances;
receiving a plurality of data packets through a data plane tunnel that communicates data traffic for the VPNs among the autonomous systems, the data plane tunnel being separate from the control plane tunnel in a single link;
for each data packet, identifying a forwarding instance of the data packet for the data packet according to a data tag of the data packet to yield a plurality of forwarding instances, at least two forwarding instances distinct from each other; and
forwarding the data packets according to the forwarding instances, wherein the single link carries the routing instance and the forwarding instance and the control tag identifies the routing instance and the data tag identifies the forwarding instance.
2. The method of claim 1, further comprising:
receiving a plurality of route distinguishers, each route distinguisher identifying a VPN; and
mapping each route distinguisher to the VPN that the each route distinguisher identifies.
3. The method of claim 1, further comprising:
receiving a plurality of route distinguishers, a first route distinguisher identifying a first VPN, a second route distinguisher identifying a second VPN, the first VPN and the second VPN having the same IP prefix, the first route distinguisher distinct from the second route distinguisher; and
mapping each route distinguisher to the VPN that the each route distinguisher identifies.
4. The method of claim 1, further comprising:
receiving a next control packet for a VPN;
labeling the next control packet with a route distinguisher corresponding to the VPN; and
sending the next control packet through the control plane tunnel.
5. The method of claim 1, further comprising:
receiving a next data packet for a VPN;
labeling the next data packet with a route distinguisher corresponding to the VPN; and
sending the next data packet through the data plane tunnel.
6. The method of claim 1, at least two autonomous systems of the plurality of autonomous systems being connected by the control plane tunnel over one or more transit autonomous systems.
7. An apparatus comprising:
an interface configured to:
receive a plurality of control packets through a control plane tunnel that communicates control traffic for a plurality of virtual private networks (VPNs) among a plurality of autonomous systems; and
receive a plurality of data packets through a data plane tunnel that communicates data traffic for the VPNs among the autonomous systems, the data plane tunnel being separate from the control plane tunnel in a single link; and

one or more processors configured to:
for each control packet, identify a routing instance of the control packet according to a control tag of the control packet to yield a plurality of routing instances, at least two routing instances distinct from each other;
route the control packets according to the routing instances;
for each data packet, identify a forwarding instance of the data packet for the data packet according to a data tag of the data packet to yield a plurality of forwarding instances, at least two forwarding instances distinct from each other; and
forward the data packets according to the forwarding instances, wherein the single link carries the routing instance and the forwarding instance and the control tag identifies the routing instance and the data tag identifies the forwarding instance.
8. The apparatus of claim 7, the one or more processors further configured to:
receive a plurality of route distinguishers, each route distinguisher identifying a VPN; and
map each route distinguisher to the VPN that the each route distinguisher identifies.
9. The apparatus of claim 7, the one or more processors further configured to:
receive a plurality of route distinguishers, a first route distinguisher identifying a first VPN, a second route distinguisher identifying a second VPN, the first VPN and the second VPN having the same IP prefix, the first route distinguisher distinct from the second route distinguisher; and
map each route distinguisher to the VPN that the each route distinguisher identifies.
10. The apparatus of claim 7, the one or more processors further configured to:
receive a next control packet for a VPN;
label the next control packet with a route distinguisher corresponding to the VPN; and
send the next control packet through the control plane tunnel.
11. The apparatus of claim 7, the one or more processors further configured to:
receive a next data packet for a VPN;
label the next data packet with a route distinguisher corresponding to the VPN; and
send the next data packet through the data plane tunnel.
12. The apparatus of claim 7, at least two autonomous systems of the plurality of autonomous systems being connected by the control plane tunnel over one or more transit autonomous systems.
13. One or more non-transitory computer readable media when executed by a computer are configured to:
receive a plurality of control packets through a control plane tunnel that communicates control traffic for a plurality of virtual private networks (VPNs) among a plurality of autonomous systems; and
for each control packet, identify a routing instance of the control packet according to a control tag of the control packet to yield a plurality of routing instances, at least two routing instances distinct from each other;
route the control packets according to the routing instances;
receive a plurality of data packets through a data plane tunnel that communicates data traffic for the VPNs among the autonomous systems, the data plane tunnel being separate from the control plane tunnel in a single link;
for each data packet, identify a forwarding instance of the data packet for a data packet according to a data tag of the data packet to yield a plurality of forwarding instances, at least two forwarding instances distinct from each other; and
forward the data packets according to the forwarding instances, wherein the single link carries the routing instance and the forwarding instance and the control tag identifies the routing instance and the data tag identifies the forwarding instance.
14. The media of claim 13, further configured to:
receive a plurality of route distinguishers, each route distinguisher identifying a VPN; and
map each route distinguisher to the VPN that the each route distinguisher identifies.
15. The media of claim 13, further configured to:
receive a plurality of route distinguishers, a first route distinguisher identifying a first VPN, a second route distinguisher identifying a second VPN, the first VPN and the second VPN having the same IP prefix, the first route distinguisher distinct from the second route distinguisher; and
map each route distinguisher to the VPN that the each route distinguisher identifies.
16. The media of claim 13, further configured to:
receive a next control packet for a VPN;
label the next control packet with a route distinguisher corresponding to the VPN; and
send the next control packet through the control plane tunnel.
17. The media of claim 13, further configured to:
receive a next data packet for a VPN;
label the next data packet with a route distinguisher corresponding to the VPN; and
send the next data packet through the data plane tunnel.