Author: claimsbot

1. A deuterium-enriched compound of formula I or a pharmaceutically acceptable salt thereof:
wherein R1-R36 are independently selected from H and D; and
the abundance of deuterium in R1-R36 is at least 3%, provided that when R34-R36 are D, then at least one other R is D.
2. A deuterium-enriched compound of claim 1, wherein the abundance of deuterium in R1-R36 is selected from at least 3%, provided that when R34-R36 are D, then at least one other R is D. The abundance can also be at least 6%, at least 11%, at least 17%, at least 22%, at least 28%, at least 33%, at least 39%, at least 44%, at least 50%, at least 56%, at least 61%, at least 67%, at least 72%, at least 78%, at least 83%, at least 89%, at least 94%, and 100%.
3. A deuterium-enriched compound of claim 1, wherein the abundance of deuterium in R1-R2 is selected from at least 50% and 100%.
4. A deuterium-enriched compound of claim 1, wherein the abundance of deuterium in R3-R16 and R26-R36 is selected from at least 4%, at least 6%, at least 14%, at least 19%, at least 26%, at least 32%, at least 39%, at least 45%, at least 52%, at least 58%, at least 65%, at least 71%, at least 77%, at least 84%, at least 90%, at least 97%, and 100%.
5. A deuterium-enriched compound of claim 1, wherein the abundance of deuterium in R17-R25 is selected from at least 11%, at least 22%, at least 33%, at least 44%, at least 56%, at least 67%, at least 78%, and 100%.
6. A deuterium-enriched compound of claim 1, wherein the compound is selected from compounds 1-4 of Table 1.
7. A deuterium-enriched compound of claim 1, wherein the compound is selected from compounds 5-8 of Table 2.
8. An isolated deuterium-enriched compound of formula I or a pharmaceutically acceptable salt thereof:
wherein R1-R36 are independently selected from H and D; and
the abundance of deuterium in R1-R36 is at least 3%, provided that when R34-R36 are D, then at least one other R is D.
9. An isolated deuterium-enriched compound of claim 8, wherein the abundance of deuterium in R1-R36 is selected from at least 3%, provided that when R34-R36 are D, then at least one other R is D. The abundance can also be at least 6%, at least 11%, at least 17%, at least 22%, at least 28%, at least 33%, at least 39%, at least 44%, at least 50%, at least 56%, at least 61%, at least 67%, at least 72%, at least 78%, at least 83%, at least 89%, at least 94%, and 100%.
10. An isolated deuterium-enriched compound of claim 8, wherein the abundance of deuterium in R1-R2 is selected from at least 50% and 100%.
11. An isolated deuterium-enriched compound of claim 8, wherein the abundance of deuterium in R3-R16 and R26-R36 is selected from at least 4%, at least 6%, at least 14%, at least 19%, at least 26%, at least 32%, at least 39%, at least 45%, at least 52%, at least 58%, at least 65%, at least 71%, at least 77%, at least 84%, at least 90%, at least 97%, and 100%.
12. An isolated deuterium-enriched compound of claim 8, wherein the abundance of deuterium in R17-R25 is selected from at least 11%, at least 22%, at least 33%, at least 44%, at least 56%, at least 67%, at least 78%, and 100%.
13. An isolated deuterium-enriched compound of claim 8, wherein the compound is selected from compounds 1-4 of Table 1.
14. An isolated deuterium-enriched compound of claim 8, wherein the compound is selected from compounds 5-8 of Table 2.
15. A mixture of deuterium-enriched compounds of formula I or a pharmaceutically acceptable salt thereof:
wherein R1-R36 are independently selected from H and D; and
the abundance of deuterium in R1-R36 is at least 3%, provided that when R34-R36 are D, then at least one other R is D.
16. A mixture of deuterium-enriched compound of claim 15, wherein the abundance of deuterium in R1-R36 is selected from at least 3%, provided that when R34-R36 are D, then at least one other R is D. The abundance can also be at least 6%, at least 11%, at least 17%, at least 22%, at least 28%, at least 33%, at least 39%, at least 44%, at least 50%, at least 56%, at least 61%, at least 67%, at least 72%, at least 78%, at least 83%, at least 89%, at least 94%, and 100%.
17. A mixture of deuterium-enriched compound of claim 15, wherein the compound is selected from compounds 1-4 of Table 1.
18. A mixture of deuterium-enriched compound of claim 15, wherein the compound is selected from compounds 5-8 of Table 2.
19. A pharmaceutical composition, comprising: a pharmaceutically acceptable carrier and a therapeutically effective amount of a compound of claim 1 or a pharmaceutically acceptable salt form thereof.
20. A method for treating a disease selected from benign prostatic hyperplasia andor prostate cancer comprising: administering, to a patient in need thereof, a therapeutically effective amount of a compound of claim 1 or a pharmaceutically acceptable salt form thereof.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An integrated circuit (IC) package comprising:
a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
at least one capacitor within the IC mounting region, wherein the at least one capacitor comprises top and bottom surfaces, each having a plurality of terminals of first and second polarity types, wherein a selected terminal of first polarity type on the bottom surface is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a selected terminal of second polarity type on the bottom surface is physically and electrically coupled to a second conductor of the plurality of conductors, and wherein the at least one capacitor is mounted atop and at a diagonal to the first and second conductors to which it is electrically coupled; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to selected terminals of first and second polarity types on the top surface of the capacitor.
2. The IC package recited in claim 1, wherein the first conductor is to couple to a first potential, and the second conductor is to couple to a second potential.
3. The IC package recited in claim 1, wherein the at least one capacitor is mounted atop at least three conductors.
4. The IC package recited in claim 1, wherein the at least one capacitor is a capacitor array.
5. The IC package recited in claim 1, wherein the plurality of capacitor terminals are disposed over substantially the entire top and bottom surfaces.
6. The IC package recited in claim 1, wherein the plurality of conductors are substantially parallel to one another.
7. The IC package recited in claim 1 and comprising a plurality of capacitors distributed substantially throughout the IC mounting region, each capacitor being in electrical contact with at least one of the conductors.
8. The IC package recited in claim 1, wherein the conductors include pads.
9. An integrated circuit (IC) package comprising:
a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
a plurality of capacitors distributed substantially throughout the IC mounting region, wherein each capacitor comprises top and bottom surfaces, each having a plurality of terminals of first and second polarity types, wherein a selected terminal of first polarity type on the bottom surface of each capacitor is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a selected terminal of second polarity type on the bottom surface of each capacitor is physically and electrically coupled to a second conductor of the plurality of conductors; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to selected terminals of first and second polarity types on the top surface of the capacitors.
10. The IC package recited in claim 9, wherein the plurality of capacitors comprises a plurality of sets of capacitors, each set comprising one or more capacitors aligned substantially end-to-end.
11. The IC package recited in claim 9, wherein the first conductor is to couple to a first potential, and the second conductor is to couple to a second potential.
12. The IC package recited in claim 9, wherein at least one capacitor is mounted atop at least three conductors.
13. The IC package recited in claim 9, wherein at least one capacitor is a capacitor array.
14. The IC package recited in claim 9, wherein the plurality of capacitor terminals are disposed over substantially, the entire top and bottom surfaces.
15. The IC package recited in claim 9, wherein the plurality of conductors are substantially parallel to one another.
16. The IC package recited in claim 9, wherein the conductors include pads.
17. An integrated circuit (IC) package comprising:
a substrate having a substantially planar upper surface entirely throughout an IC mounting region and a plurality of conductors within the IC mounting region on the upper surface;
a plurality of capacitors within the IC mounting region, wherein each capacitor comprises top and bottom surfaces, each having terminals of first and second polarity types, wherein a terminal of first polarity type on the bottom surface is physically and electrically coupled to a first conductor of the plurality of conductors, wherein a terminal of second polarity type on the bottom surface is physically and electrically coupled to a second conductor of the plurality of conductors; and
an IC comprising a plurality of IC terminals on a surface thereof, wherein the IC terminals are physically and electrically coupled to terminals of first and second polarity types on the top surface of the capacitors.
18. The IC package recited in claim 17, wherein the first conductor is to couple to a first potential, and the second conductor is to couple to a second potential.
19. The IC package recited in claim 17, wherein the at least one capacitor is mounted atop at least three conductors.
20. The IC package recited in claim 17, wherein the at least one capacitor is a capacitor array.
21. The IC package recited in claim 17, wherein the plurality of capacitor terminals are disposed over substantially the entire top and bottom surfaces.
22. The IC package recited in claim 17, wherein the plurality of conductors are substantially parallel to one another.
23. The IC package recited in claim 17 and comprising a plurality of capacitors distributed substantially throughout the IC mounting region, each capacitor being in electrical contact with at least one of the conductors.
24. The IC package recited in claim 17, wherein the conductors include pads.

What is claimed is:

1. A polymeric composition which comprises
1. a matrix material which
(a) provides a continuous phase, and
(b) comprises precursors which will react together to form a crosslinked polymer;

and
2. a rheological modifier (RHM) which
(a) comprises a crystalline polymer having an onset of melting temperature To and a peak melting temperature Tp which is (i) from 20 C. to 200 C., and (ii) such that TpTo is less than Tp0.7,
(b) is uniformly distributed in the matrix material,
(c) is at least partially soluble in the matrix material when the composition is subjected to a treatment which consists of maintaining the composition at a temperature above Tp under conditions such that the precursors do not react together to form a crosslinked resin, and
(d) becomes at least partially insoluble in the matrix material when the composition is subjected to said treatment at a temperature above Tp and is then cooled to a temperature below To,
the composition

(A) having a viscosity above Tp which is less than its viscosity below Tp; and
(B) having a viscosity at a temperature below To which is substantially greater than the viscosity at the same temperature of a composition which is identical except that it does not contain the rheological modifier.
2. A composition according to claim 1 wherein the matrix material and the RHM and the relative amounts thereof are such that the composition, in the absence of any solid fillers, has a viscosity at (Tp10) C. which is at least twice its viscosity at (Tp10) C.
3. A composition according to claim 2 which has a viscosity at (Tp10) C. which is at least 5 times its viscosity at (Tp10) C.
4. A composition according to claim 2 wherein the matrix material and the RHM and the relative amounts thereof are such that the composition, in the absence of any solid non-polymeric fillers, has a viscosity at 20 C. which is at least twice the viscosity at 20 C. of a composition which is identical except that it does not contain the RHM.
5. A composition according to claim 4 which has a viscosity at 20 C. which is at least 5 times the viscosity at 20 C. of a composition which is identical except that it does not contain the RHM.
6. A composition according to claim 1 wherein the crystalline polymer is an SCC polymer.
7. A composition according to claim 6 wherein (TpTo) is less than 10 C.
8. A composition according to claim 7 wherein Tp is from 25 to 120 C.
9. A composition according to claim 8 wherein Tp is from 35 C. to 70 C.
10. A composition according to claim 6 wherein the crystalline polymer comprises (a) units derived from a monomer containing an n-alkyl group containing 12 to 50 carbon atoms and (b) at least 10% of units derived from a second monomer; and the matrix material comprises at least 10% of the second monomer or of units which are part of a polymer and are derived from the second monomer.
11. A composition according to claim 10 wherein the crystalline polymer contains 10 to 50% of units derived from the second monomer, and the matrix material contains 20 to 50% of the second monomer.
12. A composition according to claim 11 wherein the second monomer is styrene.
13. A composition according to claim 10 wherein the crystalline polymer contains 10 to 50% of units derived from the second monomer, and the matrix material comprises a polymer containing 10 to 70%, based on the matrix material, of units derived from the second monomer.
14. A composition according to claim 13 wherein the matrix material comprises precursors for an acrylate polymer and the second monomer is an alkyl acrylate or an alkyl methacrylate in which the alkyl group contains 1 to 4 carbon atoms.
15. A composition according to claim 1 wherein the matrix material comprises an unsaturated polyester and a copolymerizable monomer.
16. A composition according to claim 1 wherein the matrix material comprises precursors for an epoxy resin.
17. A composition according to claim 1 which is in the form of a sheet molding composite.
18. A composition according to claim 1 which is at a temperature below To and which has at least one of the following characteristics
(1) at least 30% by weight of the crystalline polymer is present in the form of discrete volumes which do not contain any material which takes part in the reaction which forms the crosslinked polymer,
(2) the composition, if it is maintained at 40 C., doubles in viscosity in less than 240 hours, e.g., in less than 24 hours,
(3) the RHM is not present in the form of discrete particles, and
(4) when the composition is heated from (Tp10) C. to (Tp10) C., there is an increase by a factor of less than 50, in the effective concentration of each of the materials which takes part in the reaction which forms the crosslinked polymer.
19. A method of making a composition as defined in claim 1 which comprises
(A) dispersing the RHM in at least part of the matrix material;
(B) heating the product of step (A) to a temperature above Tp under conditions such that the precursors do not react together to form a crosslinked polymer; and
(C) cooling the heated dispersion to a temperature below Tp.
20. A method of making a crosslinked polymer which comprises subjecting a composition as defined in claim 1 to conditions which cause the precursor to react to form a crosslinked polymer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An assembly for endoscope, comprising:
a tubular member at its external wall thereof having a first threaded portion, a second threaded portion, and a threadless middle portion located between the first and second threaded portions;
a positioning ring having a threaded part formed at an internal wall thereof and threaded with the second threaded portion of the tubular member, the positioning ring being axially movable along the tubular member by means of the aforesaid threaded connection; and
a sleeve having an opening and a threaded section formed at an internal wall thereof, the threaded section being shorter than the middle portion, the sleeve being threadedly sleeved onto the tubular member through the opening, the threaded section being located at the middle portion of the tubular member, the threaded section being stopped against an opposite end of the first threaded portion with respect to the middle portion, the positioning ring having a distal end pushed distally against the sleeve to position the sleeve onto the tubular member.
2. The assembly as defined in claim 1, wherein the tubular member comprises an opening and a body; the first threaded portion extends toward the body from the opening; the second threaded portion being located at the body.
3. The assembly as defined in claim 2, wherein the tubular member comprises a stopping portion located at an opposite end of the second threaded portion with respect to the opening for stopping the positioning ring from disengagement from the tubular member toward its rear end behind the second threaded portion.
4. The assembly as defined in claim 1, wherein the middle portion is smaller than the first and second threaded portions in external diameter to allow the positioning ring to be slidably moved along the middle portion.
5. The assembly as defined in claim 1, wherein threaded section of the sleeve is spaced from the opening.
6. The assembly as defined in claim 5, wherein the sleeve comprises a through hole running through an external wall thereof, a fully reflecting mirror being mounted in the sleeve and corresponding to the through hole.
7. The assembly as defined in claim 6, wherein the sleeve comprises a bevel formed at the through hole in sectional view; the fully reflecting mirror comprises a front surface aligned with the bevel.
8. The assembly as defined in claim 1, wherein external diameters of the first threaded portion and the second threaded portion are equal.
9. The assembly as defined in claim 1, wherein the sleeve is threadedly sleeved directly onto the tubular member through the opening.