Author: claimsbot

1. A simulation model for simulating an integrated circuit (IC) in a ball grid array package, the simulation model implemented using a simulator, comprising:
an inputoutput model comprising mathematical elements enabled to model input and output characteristics of the integrated circuit:
a bump model enabled to simulate parasitic characteristics of a solder bump connection, the bump model comprising a resistance coupled in series with an inductance, the bump model connected to the inputoutput model; and
a package planes model enabled to simulate effects of package planes on operation of the integrated circuit, the package planes model connected to the bump model;
wherein the package planes model comprises:
a first inductor connecting signal planes to ground; and
a second inductor connecting the signal planes to power, wherein the package planes model represents power, ground and signal planes in the IC of the package.
2. The simulation model of claim 1, further comprising a package bypass capacitor model wherein the model comprises a capacitor connected between the ground plane and the power plane.
3. The simulation model of claim 1, wherein the package bypass capacitor model further comprises an inductor connected in series with the capacitor between the ground plane and the power plane.
4. The simulation model of claim 3, wherein the package bypass capacitor model further comprises a resistor connected in series with the capacitor and the inductor.
5. The simulation model of claim 1, wherein the series connected inductor and resistor of the bump model further represents the inductance and resistance of solder bumps in the integrated circuit package.
6. The simulation model of claim 1, further comprising a ball model configured to simulate parasitic characteristics of a solder ball connection, the ball model comprising a plurality of series connected resistor and inductors, the ball model being connected to the package planes model.
7. The simulation model of claim 6, wherein the series connected inductor and resistor of the ball model further represents the inductance and resistance of solder balls in the IC package.
8. The simulation model of claim 1, wherein the package comprises a flip-chip ball grid array (FCBGA).
9. The simulation model of claim 1, wherein the first and second inductors are represented by a coupling factor.
10. The simulation model of claim 1, further comprising elements with values set to simulate the effect of power supply droop, ground bounce and cross talk.
11. The simulation model of claim 10, wherein the elements further comprise an inputoutput buffer used with the bump model.
12. The simulation model of claim 1, further comprising a printed circuit board (PCB) model comprising transmission lines for connecting to the ball model, the PCB model representing a board on which the integrated circuit package is mounted.
13. The simulation model of claim 12, wherein the PCB model further comprises a plurality of pairs of series connected inductors and resistors to represent vias in a PCB.
14. A method for simulating electrical properties of a system including an integrated circuit (IC) provided in a package with external connections to the package formed by a ball grid array, the method comprising:
modeling, using a simulator, balls of the ball grid array comprising a plurality of series connected resistor and inductor pairs, each series-connected pair representing a ball of the ball grid array; and
modeling package planes comprising transmission lines connected to the plurality of series-connected resistor and inductor pairs of the ball model, the modeling of the package planes representing power, ground and signal planes in the integrated circuit package;
wherein modeling of the package planes comprises generating a first inductance value representing the inductor connecting the signal planes to the ground plane and a second inductance value representing the inductor connecting the signal planes to the power plane.
15. The simulation method of claim 14, further comprising:
modeling bumps of the IC comprising a plurality of series connected resistor and inductor, each series representing a bump of the IC.
16. A non-transitory computer-readable medium having instructions which when executed on a computer perform a method comprising:
modeling balls of the ball grid array comprising a plurality of series connected resistor and inductor pairs, each series-connected pair representing a ball of the ball grid array; and
modeling package planes comprising transmission lines connected to the plurality of series-connected resistor and inductor pairs of the ball model, the modeling of the package planes representing power, ground and signal planes in the integrated circuit package;
wherein modeling of the package planes comprises generating a first inductance value representing the inductor connecting the signal planes to the ground plane and a second inductance value representing the inductor connecting the signal planes to the power plane.
17. The medium of claim 16, further comprising:
modeling bumps of the IC comprising a plurality of series connected resistor and inductor, each series representing a bump of the IC.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A composition having biocidal properties comprising:
pre-fabricated elastomeric particles,
a biocidal agent, and
an adhesive phase combining the pre-fabricated elastomeric particles and the biocidal agent,
wherein the pre-fabricated elastomeric particles and the adhesive phase are made of different materials, and
wherein the biocidal agent is present in the adhesive phase but is substantially absent from the pre-fabricated elastomeric particles.
2. The composition as claimed in claim 1, wherein the composition comprises, by weight,
about 78% to about 98% of the pre-fabricated elastomeric particles;
about 2.0% to about 20% of the adhesive phase; and
about 0.05% to about 2% of the biocidal agent.
3. The composition as claimed in claim 1, wherein the pre-fabricated elastomeric particles are about 0.2 to about 10.0 mm in diameter or length.
4. The composition as claimed in claim 1, wherein the pre-fabricated elastomeric particles comprise at least one selected from the group consisting of natural rubber, butadiene rubber, chloroprene rubber, chlorosulfonylpolyethelene rubber, epichlorohydrin rubber, ethylene-propylene diene rubber, ethylene vinyl acetate rubber, halo-butyl rubber, isobutene-isoprene rubber, nitrile-butadiene rubber, polyisoprene rubber, styrene-butadiene rubber, styrene-isoprene rubber, thermoplastic rubbers based on polyolefins, polyesters, styrene-butadiene polymers, polyurethanes, non-thermoplastic polyurethane rubbers, and plasticized polyvinyl chloride.
5. The composition as claimed in claim 1, wherein the pre-fabricated elastomeric particles are polymerized particles, recycled particles, pigmented particles, or mixtures thereof.
6. The composition as claimed in claim 1, wherein the adhesive phase comprises polyurethane.
7. The composition as claimed in claim 1, wherein the biocidal agent is selected from the group consisting of pyrithione acid, sodium pyrithione, potassium pyrithione, pyrithione disulfide magnesium sulfate, zinc pyrithione, silver in zeolite matrix, zinc in zeolite matrix, copper in zeolite matrix, tributyl tin oxide (TBTO), tributyl tin maleate (TBTM), para-chloro-xylene, hexachlorophene, 2,4,4\u2032 trichloro-2\u2032-hydroxydiphenyl ether (triclosan), imazalil sulphate, 3,5,3\u2032,4\u2032-tetrachlorosalicylanilide, N-nitroso-N-cyclohexyl hydroxylamine, 8-hydroxyquinoline, copper-8-hydroxy quinolinate, thiocarbamates, dithiocarbamates, zinc dimethyldithiocarbamate, 5-chloro-2-(2,4-dichlorophenoxy)phenol, polyhexamethylene biguanide hydrochloride, 2-phenylphenol, diiodomethyl-4-tolylsulfone, zinc-2-mercaptopyridine-N-oxide, N-alkyl-N,N-dimethyl-N-benzylammonium chloride, 3-(4-chlorophenyl)-1-(3,4-dichlorphenyl)urea (triclocarban), 2-(1,3-thiazol-4-yl)-1H-benzoimidazole (thiabendazole), 3-iodo-2-propynyl N-butylcarbamate, 3-benzobthien-2-yl-5,6-dihydro-1,4,2-oxathiazine 4-oxide, 2-(n-octyl)-3(2H)-isothiazolone (OIT), N-butyl-1,2-benzisothiazolin-3-one, 4,5-dichloro-2-octyl-3(2H)-isothiazolone, 2-methyl-4-isothiazoline-3-one cyclopropyl-N\u2032-(1,1-dimethylethyl)-6-methylthio-1,3,5-triazine-2,4-diamine, 1,3-dicyano-2,4,5,6-tetrachlorobenzene, 3,4,4\u2032-trichlorocarbanilide, 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DIURON), 1 2-(2,4-dichlorophenyl)-4-propyl-1,2-dioxolan-2-ylmethyl-1H-1,2,4-triazole (propiconazole), 10,10-oxybisphenoxy arsine (OBPA), 1-(4-chlorophenyl)-4,4-dimethyl-3-(1,2,4-triazol-1-ylmethyl)pentan-3-ol (tebuconazole), 2-(thiocyanomethylthio)benzothiazole, 2,3,5,6 tetrachloro-4-(methyl sulphonyl)pyridine, 2,4,4-tricloro-2-hydroxydiphenylether, 4-chloro-3,5-dimethyl-phenol, 5-hydroxymethoxymethyl-1-1aza-3,7-dioxabicyclo-octane, 2,4,5,6-tetrachloro-1,3-benzenedicarbonitrile (chlorothalonil), bis(tri-n-butyltin)oxide, N-(fluorodichloromethylthio)phthalimide, N-(trichloromethyl-thio)-4-cyclohexene-1,2-dicarboximide, N,N-dimethyl dichlorophenyl urea, p-chloro-m-cresol, o-phenylphenol, pentachlorophenol, silver compounds, sodium-o-phenyl phenoxide, tebuconazole, tetrachloroisophthalonitrile, tetramethylthiuram disulfide and a mixture thereof.
8. The composition as claimed in claim 1, wherein the pre-fabricated elastomeric particles comprise recycled elastomeric particles and pigmented elastomeric particles, and wherein the composition comprises, by weight, about 68% to about 83% of the recycled elastomeric particles;
about 10% to about 15% of the pigmented elastomeric particles;
about 2.0% to about 20% of the adhesive phase; and
about 0.05% to about 2% of the biocidal agent.
9. The composition as claimed in claim 7, wherein
the recycled elastomeric particles comprise SBR;
the pigmented elastomeric particles comprise EPDM;
the polymeric binder comprises polyurethane; and
the biocidal agent is zinc pyrithione, N-butyl-1,2-benzisothiazolin-3-one, or silver.
10. A method for preparing an elastomeric composition, comprising:
(a) preparing elastomeric particles;
(b) mixing a biocidal agent, an adhesive phase and the elastomeric particles together to form a mixture; and
(c) curing or polymerizing the mixture of step (b) to form an elastomeric solid.
11. The method as claimed in claim 10, wherein step (b) is a two-step process comprising:
(i) preparing an adhesive phase solution by mixing an adhesive phase, a liquid carrier and a biocidal agent, and
(ii) adding the adhesive phase solution comprising the biocidal agent to elastomeric particles, and
wherein the curing of step (c) is carried out under compression.
12. The method as claimed in claim 10, wherein the elastomeric particles of step (a) are prepared by granulation of a reclaimed elastomeric product.
13. The method as claimed in claim 10, wherein step (b) is carried out with about 0.05 to about 2 weight % of the biocidal agent, about 2.0 to about 20 weight % of the adhesive phase, and about 78% to about 98% of the elastomeric particles.
14. The method as claimed in claim 10, wherein the elastomeric particles are prepared from rubber selected from the group consisting of natural rubber, butadiene rubber, chloroprene rubber, chlorosulfonylpolyethelene rubber, epichlorohydrin rubber, ethylene-propylene diene rubber, ethylene vinyl acetate rubber, halo-butyl rubber, isobutene-isoprene rubber, nitrile-butadiene rubber, polyisoprene rubber, styrene-butadiene rubber, styrene-isoprene rubber, thermoplastic rubbers based on polyolefins, polyesters, styrene-butadiene polymers, polyurethanes, non-thermoplastic polyurethane rubbers, and plasticized polyvinyl chloride.
15. The method as claimed in claim 10, wherein the elastomeric particles are polymerized particles, recycled particles, pigmented particles or mixtures thereof.
16. The method as claimed in claim 10, wherein the adhesive phase comprises polyurethane.
17. The method as claimed in claim 10, wherein the biocidal agent is selected from the group consisting of pyrithione acid, sodium pyrithione, potassium pyrithione, pyrithione disulfide magnesium sulfate, zinc pyrithione, silver in zeolite matrix, zinc in zeolite matrix, copper in zeolite matrix, tributyl tin oxide (TBTO), tributyl tin maleate (TBTM), para-chloro-xylene, hexachlorophene, 2,4,4\u2032 trichloro-2\u2032-hydroxydiphenyl ether (triclosan), imazalil sulphate, 3,5,3\u2032,4\u2032-tetrachlorosalicylanilide, N-nitroso-N-cyclohexyl hydroxylamine, 8-hydroxyquinoline, copper-8-hydroxy quinolinate, thiocarbamates, dithiocarbamates, zinc dimethyldithiocarbamate, 5-chloro-2-(2,4-dichlorophenoxy)phenol, polyhexamethylene biguanide hydrochloride, 2-phenylphenol, diiodomethyl-4-tolylsulfone, zinc-2-mercaptopyridine-N-oxide, N-alkyl-N,N-dimethyl-N-benzylammonium chloride, 3-(4-chlorophenyl)-1-(3,4-dichlorphenyl)urea (triclocarban), 2-(1,3-thiazol-4-yl)-1H-benzoimidazole (thiabendazole), 3-iodo-2-propynyl N-butylcarbamate, 3-benzobthien-2-yl-5,6-dihydro-1,4,2-oxathiazine 4-oxide, 2-(n-octyl)-3(2H)-isothiazolone (OIT), N-butyl-1,2-benzisothiazolin-3-one, 4,5-dichloro-2-octyl-3(2H)-isothiazolone, 2-methyl-4-isothiazoline-3-one cycloprop yl-N\u2032-(1,1-dimethylethyl)-6-methylthio-1,3,5-triazine-2,4-diamine, 1,3-dicyano-2,4,5,6-tetrachlorobenzene, 3,4,4\u2032-trichlorocarbanilide, 3-(3,4-dichlorophenyl)-1,1-dimethylurea (DIURON), 12-(2,4-dichlorophenyl)-4-propyl-1,2-dioxolan-2-ylmethyl-1H-1,2,4-triazole (propiconazole), 10,10-oxybisphenoxy arsine (OBPA), 1-(4-chlorophenyl)-4,4-dimethyl-3-(1,2,4-triazol-1-ylmethyl)pentan-3-ol (tebuconazole), 2-(thiocyanomethylthio)benzothiazole, 2,3,5,6 tetrachloro-4-(methyl sulphonyl)pyridine, 2,4,4-tricloro-2-hydroxydiphenylether, 4-chloro-3,5-dimethyl-phenol, 5-hydroxymethoxymethyl-1-1aza-3,7-dioxabicyclo-octane, 2,4,5,6-tetrachloro-1,3-benzenedicarbonitrile (chlorothalonil), bis(tri-n-butyltin)oxide, N-(fluorodichloromethylthio)phthalimide, N-(trichloromethyl-thio)-4-cyclohexene-1,2-dicarboximide, N,N-dimethyl dichlorophenyl urea, p-chloro-m-cresol, o-phenylphenol, pentachlorophenol, silver compounds, sodium-o-phenyl phenoxide, tebuconazole, tetrachloroisophthalonitrile, tetramethylthiuram disulfide and a mixture thereof.
18. The method as claimed in claim 10, wherein the elastomeric particles comprises recycled elastomeric particles and pigmented elastomeric particles, and wherein the elastomeric composition is prepared with, by weight,
about 68% to about 83% of the recycled elastomeric particles;
about 10% to about 15% of the pigmented elastomeric particles;
about 2.0% to about 20% of the adhesive phase; and
about 0.05% to about 2% of the biocidal agent.
19. The method as claimed in claim 18, wherein
the recycled elastomeric particles comprise SBR,
the pigmented elastomeric particles comprise EPDM,
the polymeric binder comprises polyurethane, and
the biocidal agent is zinc pyrithione, N-butyl-1,2-benzisothiazolin-3-one, or silver.
20. An elastomeric sheet having biocidal properties fabricated from a composition comprising, by weight,
about 78% to about 98% of pre-fabricated elastomeric particles;
about 2.0% to about 20% of an adhesive phase; and
about 0.05% to about 2% of a biocidal agent,
wherein the pre-fabricated elastomeric particles and the adhesive phase are made of different materials, and
wherein the biocidal agent is present in the adhesive phase but is substantially absent from the pre-fabricated elastomeric particles.
21. The elastomeric sheet as claimed in claim 20, wherein the pre-fabricated elastomeric particles are about 0.2 to about 10.0 mm in diameter or length.
22. The elastomeric sheet as claimed in claim 20, wherein the pre-fabricated elastomeric particles are recycled crumb rubber.
23. The elastomeric sheet as claimed in claim 20, wherein
the pre-fabricated elastomeric particles comprise recycled elastomeric particles prepared from SBR and pigmented elastomeric particles prepared from EPDM;
the adhesive phase comprises polyurethane; and
the biocidal agent is zinc pyrithione, N-butyl-1,2-benzisothiazolin-3-one, or silver.
24. The elastomeric sheet as claimed in claim 20, wherein the elastomeric sheet is used as supporting medium, protective cover or decorative pad.
25. The elastomeric sheet as claimed in claim 24, wherein the supporting medium is a resilient elastomeric flooring mat.

1-20. (canceled)
21. An animal trap comprising:
an animal enclosure having a first animal access opening and a second animal access opening into an interior sized to receive an animal to be trapped;
a first door movably mounted at said first access opening, the door operative in an opened position to reveal the first access opening and spring-biased to swing toward a closed position to block the first access opening;
a second door movably mounted at said second access opening, the door operative in an opened position to reveal the second access opening and in a closed position to block the second access opening;
a set mechanism having a set lever and a spring, said set lever pivotally mounted above said animal enclosure and movable through a range of movement between a set position and a closed position for securing at least the first door in the opened position when the trap is set, said spring providing said spring bias to move at least said first door to said closed position when the trap is tripped;
a first connecting mechanism connecting said first door to said set lever;
a second connecting mechanism connecting said second door to said set lever; and
a trip mechanism configured to actuate a pivot action of the set mechanism from the set position toward the first door to reach a tripped position, said pivot action causing at least the first connecting mechanism to move toward the first door and enabling at least the first door to move from the opened position to the closed position.
22. The animal trap of claim 21, wherein said trap is configured to operate as either a one-door-opening trap or as a two-door-opening trap, said pivotal action of said set mechanism acting to close both doors substantially simultaneously when the trap is operating as a two-door-opening trap.
23. The animal trap of claim 22, wherein said first connecting mechanism includes a first elongated flexible member having first and second ends, said first end of said first elongated flexible member being connected to said first door and said second end of said first elongated flexible member being connected to said set lever.
24. The animal trap of claim 23, wherein said set lever has a U-shaped portion and two set lever ends, said set lever being pivotally mounted by said two set lever ends so that said U-shaped portion is movable by pivoting on said set lever ends, said second end of said first elongated flexible member being coupled to said U-shaped portion, said set lever remaining coupled to said first elongated flexible member during pivotal movement of said U-shaped portion through said set lever range of motion.
25. The animal trap of claim 24, wherein said second connecting mechanism includes a second elongated flexible member having first and second ends, said first end of said second elongated flexible member being connected to said second door, and said second end of said second elongated flexible member being connected to said U-shaped portion of said set lever, said set lever remaining coupled to said second elongated flexible member during pivotal movement of said U-shaped portion through said set lever range of motion.
26. The animal trap of claim 25, wherein said first elongated flexible member and said second elongated flexible member include a first cable and a second cable, respectively, said trap including a cable guide mechanism configured to engage said second cable when said trap is set for two-door-opening operation.
27. The animal trap of claim 26, wherein said cable guide mechanism is a wire-form hook having an opening facing the first door and a closed face nearest the set mechanism, said second cable entering said opening and being held against said closed face when said second cable is tensioned between its first and second ends.
28. The animal trap of claim 27, wherein said trap further includes at least one cable management component mounted on the top of the trap to direct the second cable toward the cable guide mechanism.
29. The animal trap of claim 28, wherein said cable management component includes at least one element having an opening through which said second cable passes to keep said second cable properly aligned.
30. The animal trap of claim 29, wherein said cable management component opening is substantially in longitudinal alignment with a point at which said second cable is secured to the second door.
31. The animal trap of claim 29, wherein an entry edge of said hook opening is substantially in longitudinal alignment with said cable management component opening and said exit edge of said hook opening is substantially in longitudinal alignment with a point at which said second cable is attached to said U-shaped portion of said set lever.
32. An animal trap comprising:
an animal enclosure having a roof and a pair of opposed animal access openings into an interior sized to receive an animal to be trapped;
a first door movably mounted at a first access opening, the first door operative in an opened position to reveal the first animal access opening and in a closed position to block the first animal access opening;
a second door movably mounted at a second access opening, the second door operative in an opened position to reveal the second animal access opening and in a closed position to block the second animal access opening;
a set mechanism mounted on the roof of the trap and including a pivotally mounted set lever movable between a tripped position and a set position, said set lever configured to open at least said first door when placed in said set position;
an actuating mechanism coupled to said set lever so as to be movable therewith and also coupled to said first and second doors;
said trap configured to operate as either a one-door-opening trap or as a two-door-opening trap depending upon positioning of the actuating mechanism when the set lever is placed in the set position, said second door remaining closed when the set lever is in the set position and the trap is operating as a one-door opening trap and, when said trap is operating as a two-door opening trap, said set mechanism opening both doors when placed in said set position;
a trip mechanism configured to actuate pivotal movement of the set mechanism lever from the set position to the tripped position to enable the first door to move from the opened position to the closed position to trap an animal within the enclosure when said trap is operating as a one-door opening trap; and
said pivotal movement of said set mechanism lever in response to said trip mechanism enabling both the first and second doors to move from their open to their closed positions substantially simultaneously to trap an animal when the trap is operating as a two-door-opening trap.
33. The animal trap of claim 32, wherein said actuating mechanism includes a first cable secured at a first end to said first door and at a second end thereof to said set lever, and a second cable connected at a first end thereof to said second door and at a second end thereof to said set lever.
34. The animal trap of claim 33, wherein said trap includes a cable guide for directing the second cable through a 180 change in direction when said trap is operating as a two-door opening trap, said second cable being disengaged from said cable guide when said trap is operating as a one-door opening trap.
35. The animal trap of claim 34, wherein said trap further includes a cable management component mounted on top of the trap, said cable management component having at least one opening therein through which said second cable passes to keep said second cable properly aligned.
36. The animal trap of claim 35, wherein said cable management component includes a longitudinally extending handle having handle bases mounted on top of the trap, said handle bases having respective openings extending longitudinally therethrough and in longitudinal alignment with one another to receive said second cable, said handle openings being substantially in longitudinal alignment with a point at which said first end of said second cable is secured to the second door.
37. The animal trap of claim 35, wherein an entry edge of said cable guide is substantially in longitudinal alignment with said opening in said cable management component and an exit edge of said cable guide is substantially in longitudinal alignment with a point at which said second end of said second cable is attached to said set lever.
38. The animal trap of claim 34, wherein said cable guide is mounted on said second door.
39. The animal trap of claim 38, wherein said second cable extends from said second door, through the cable management component opening, along the cable guide where said second cable is directed through said 180 degree change in direction, and to the set lever when the trap is set and operating as a two-door opening trap.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An encapsulating package comprising:
a package main body section having a hollow section; and
an electronic device provided in the hollow section in the package main body section,
in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section,
in a vicinity of the through hole, there being provided a low-melting point section having a melting point lower than that of the package main body section, and
in the through hole, there being provided a sealing section in which the low-melting point section in the vicinity of the through hole is partly heated and the low-melting point section is melted to thereby block the through hole,
wherein the hollow section is vacuumed via the through hole, and the through hole is blocked in a vacuum atmosphere to thereby vacuum encapsulate the electronic device,
wherein inside the package main body section, at a position which is contactable with a laser beam irradiated through the through hole, there is mounted a getter material capable of adsorbing gas molecules,
wherein the electronic device is an infrared ray receiving element, and
in a portion of the package main body section which opposes to a light receiving section of the infrared ray receiving element, there is provided an infrared ray transmitting hole and an infrared ray transmitting window material is bonded so as to block the infrared ray transmitting hole.
2. The encapsulating package according to claim 1,
wherein the package main body section is configured such that a first main body section and a second main body section are bonded via the hollow section,
the through hole is formed in the second main body section, and
the low-melting point section is formed in an entire surface of the second main body section including an inner periphery section of the through hole.
3. The encapsulating package according to claim 1,
wherein the low-melting point section is partly heated and melted by a laser beam,
a thickness of the low-melting point section is set so that a volume of the low-melting point section to be melted is greater than a volume of the through hole, and
a spot diameter of the laser beam is set greater than a diameter of the through hole.
4. The encapsulating package according to claim 1, wherein the low-melting point section is Sn or an alloy material including Sn.
5. An encapsulating package comprising:
a package main body section having a hollow section; and
an electronic device provided in the hollow section in the package main body section,
in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and
in the through hole, there being provided a sealing section in which vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole,
wherein the hollow section is vacuumed via the through hole, and the through hole is blocked in a vacuum atmosphere to thereby vacuum encapsulate the electronic device,
wherein inside the package main body section, at a position which is contactable with a laser beam irradiated through the through hole, there is mounted a getter material capable of adsorbing gas molecules,
wherein the electronic device is an infrared ray receiving element, and
in a portion of the package main body section which opposes to a light receiving section of the infrared ray receiving element, there is provided an infrared ray transmitting hole, and an infrared ray transmitting window material is bonded so as to block the infrared ray transmitting hole.
6. The encapsulating package according to claim 5,
wherein the package main body section includes a wiring substrate, and
the electronic device is electrically connected to the wiring substrate.
7. The encapsulating package according to claim 6,
wherein on a surface of the wiring substrate, there is formed a continuous conductor pattern which surrounds a periphery of the electronic device, and
a width of the conductor pattern is wider than a bonding width of a structure to be bonded with the wiring substrate.
8. The encapsulating package according to claim 6, wherein on a same surface of the wiring substrate as a surface having the electronic device provided thereon, and inside and outside of the hollow section, there is provided an external terminal which is electrically connected to the electronic device.
9. The encapsulating package according to claim 6, wherein on a surface of the wiring substrate where the electronic device is provided, and on a surface reverse-opposite of the surface having the electronic device provided thereon, there is formed an external terminal which is electrically connected to the electronic device.
10. The encapsulating package according to claim 6, wherein Au is formed at least on either one of a surface of the conductor pattern formed on the wiring substrate, and a surface of the external terminal.
11. The encapsulating package according to claim 6, wherein the wiring substrate uses a ceramics material or Si for a base material thereof
12. The encapsulating package according to claim 6, wherein the package main body section excluding the wiring substrate includes an alloy material including at least Ni.
13. The encapsulating package according to claim 5, wherein the package main body section includes a semiconductor material, a metallic material such as Ni, Fe, Co, Cr, Ti, Au, Ag, Cu, Al, Pd, and Pt, an alloy material having these as a primary component thereof, a glass material, or a ceramics material.
14. A printed circuit board comprising an encapsulating package according to claim 5.
15. The electronic device comprising an encapsulating package according to claim 5.
16. The electronic device comprising a printed circuit board according to claim 14.
17. The encapsulating package according to claim 5, wherein the through hole is formed in a tapered shape, a diameter of which gradually becomes smaller with approach from a surface of the package main body section to an opposite side surface.
18. The encapsulating package according to claim 5, wherein the through hole is formed in a tapered shape, a diameter of which gradually becomes smaller with approach from a surface of the package main body section to a depth-wise center of the through hole.
19. The encapsulating package according to claim 5, wherein the through hole is formed so as to be diagonal with respect to a thickness direction of the package main body section.
20. The encapsulating package according to claim 5,
wherein the package main body section includes a cylindrical section formed in a cylinder shape, and a plate section formed in a plate shape, and
the plate section and the cylindrical section are bonded so that the plate section blocks a cylinder hole of the cylindrical section.
21. The encapsulating package according to claim 5, wherein the hollow section is filled with a nitrogen gas or an inert gas.