Author: claimsbot

1. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
steering the spinal acess device to a position adjacent an outer surface of the spinal dura matter using visualization information provided by the spinal access device;
displacing the spinal dura matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a disc augmentation device for treating intervertebral disc degeneration.
2. The method according to claim 1 wherein the augmentation device provides structural support to the annulus.
3. The method according to claim 1 wherein the augmentation device seals a torn annulus.
4. The method according to claim 1 wherein the augmentation device adds additional material to the nucleus.
5. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
steering the spinal acess device to a position adjacent an outer surface of the spinal dura matter using visualization information provided by the spinal access device;
displacing the spinal dura matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a nucleus decompression device for treating intervertebral disc degeneration.
6. The method according to claim 5 wherein the nucleus decompression device removes a portion of the nucleus.
7. The method according to claim 5 wherein the nucleus decompression device shrinks a portion of the nucleus.
8. A system for intervertebral disc augmentation comprising:
a spinal access device configured to deliver a disc augmentation device to an intervertebral disc comprising:
at least one disc augmentation device;
an elongate body;
a direct visualization device; and
a working channel.
9. The system of claim 8 wherein augmentation includes repairing a herniated disc.
10. The system of claim 8 wherein augmentation includes supporting a damaged annulus.
11. The system of claim 8 wherein augmentation includes sealing an annulus.
12. The system of claim 8 wherein augmentation includes the addition of material to the nucleus.
13. The system of claim 8 wherein the spinal access device includes an expanding structure.
14. The system of claim 13 wherein the expanding structure is mesh, a balloon, or an atraumatic element.
15. The system of claim 13 wherein expanding the expanding structure deforms a portion of the spinal dura matter.
16. The system of claim 13 wherein expanding the structure creates a working area.
17. The system of claim 8 wherein the visualization information is provided from an image generated by a sensor located on the instrument.
18. The system of claim 8 wherein the augmentation device further comprises at least one mesh, cage, barrier, patch, scaffold, sealing means, hydrogels, silicones, or growth factors.
19. The system of claim 8 wherein the augmentation device is an ablation device.
20. A system for intervertebral nuclear decompression comprising:
a spinal access device configured to deliver a nuclear decompression device to an intervertebral disc comprising:
a nuclear decompression device;
an elongate body;
a direct visualization device;
a working channel; and
a dissection tip.
21. The system according to claim 20 wherein the decompression device further comprises a temperature-controlled energy element.
22. The system according to claim 21 wherein the energy element may be a thermal energy device that delivers resistive heat, radiofrequency, coherent and incoherent light, microwave, ultrasound or liquid thermal jet energies to the nucleus.
23. The system of claim 20 wherein the spinal access device includes an expanding structure.
24. The system of claim 23 wherein the expanding structure is mesh, a balloon, or an atraumatic element.
25. The system of claim 23 wherein expanding the expanding structure deforms a portion of the spinal dura matter.
26. The system of claim 23 wherein expanding the structure creates a working area.
27. The system of claim 20 wherein the visualization information is provided from an image generated by a sensor located on the instrument.
28. A method of diagnosing disc degeneration in a patient, said method comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
steering the spinal access device using visualization information provided by the spinal access device;
displacing the spinal dura matter with a portion of the spinal access device to create a working area; and
assessing the condition of one or more intervertebral discs.
29. The method according to claim 28 wherein the spinal access device comprises a material or marker to enhance visualization of the structure using an imaging modality outside of the body.
30. The method according to claim 29 further comprising receiving visualization information from an imaging modality outside of the body.
31. The method according to claim 30 wherein the imaging modality comprises fluoroscopy.
32. The method according to claim 30 wherein the imaging modality comprises magnetic resonance imaging.
33. The method according to claim 28 wherein the visualization information is provided from an image generated by a sensor located on the instrument.
34. The method according to claim 28 wherein the spinal access device includes a sensor for collecting diagnostic data.
35. A kit for augmenting the intervertebral disc, the kit comprising:
at least one disc augmentation device;
a spinal access device having direct visualization capabilities; and
instructions for implanting the at least one disc augmentation device using the spinal access device.
36. A kit for decompressing the nucleus of an intervertebral disc, the kit comprising:
at least one nucleus decompression device;
a spinal access device having direct visualization capabilities; and
instructions for decompressing the nucleus of an intervertebral disc using the spinal access device.
37. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
displacing the spinal column matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a disc augmentation device for treating intervertebral disc degeneration.
38. The method according to claim 37 wherein the spinal access device is steered to a position within the spinal column using the direct visualization capability of the spinal access device.
39. The method according to claim 37 wherein the augmentation device provides structural support to the annulus.
40. The method according to claim 37 wherein the augmentation device seals a torn annulus.
41. The method according to claim 37 wherein the augmentation device adds additional material to the nucleus.
42. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
displacing the spinal column matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a nucleus decompression device for treating intervertebral disc degeneration.
43. The method according to claim 42 wherein the spinal access device is steered to a position within the spinal column using the direct visualization capability of the spinal access device.
44. The method according to claim 42 wherein the nucleus decompression device removes a portion of the nucleus.
45. The method according to claim 42 wherein the nucleus decompression device shrinks a portion of the nucleus.
46. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
displacing the spinal column matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a stimulation electrode device for treating intervertebral disc degeneration.
47. The method according to claim 46 wherein the spinal access device is steered to a position within the spinal column using the direct visualization capability of the spinal access device.
48. A method for treating intervertebral disc degeneration, comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
steering the spinal access device using visualization information provided by the spinal access device;
displacing the spinal column matter with a portion of the spinal access device to create a working area; and
using the spinal access device to deliver a stimulation electrode device for treating intervertebral disc degeneration.
49. A spinal access device configured to deliver a disc augmentation device to an intervertebral disc, said device comprising:
a therapeutic device;
an elongate body;
a direct visualization device; and
at least one working channel.
50. A system for intervertebral nuclear decompression comprising:
a spinal access device configured to deliver a nuclear decompression device to an intervertebral disc comprising:
a nuclear decompression device;
an elongate body;
a direct visualization device; and
a working channel.
51. A method of diagnosing disc degeneration in a patient, said method comprising:
introducing a spinal access device having direct visualization capability into a portion of the spine;
displacing the spinal dura matter with a portion of the spinal access device to create a working area; and
assessing the condition of one or more intervertebral discs.
52. A system for treating spinal disease comprising:
a spinal access device configured to deliver a therapeutic device to a spinal column comprising:
a therapeutic device;
an elongate body;
a direct visualization device; and
at least one working channel.
53. A system for treating spinal disease comprising:
a spinal access device configured to deliver a therapeutic device to a spinal column comprising:
a therapeutic device;
an elongate body;
a direct visualization device;
at least one working channel; and
at least one irrigation or aspiration channel.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A wiring electronic component to be incorporated into an electronic device package in which a circuit element is disposed therein, the circuit element including a semiconductor chip and the electronic device package including vertical wiring connected to the circuit element and external electrodes, the wiring electronic component comprising:
a support portion having a two-layer structure, said two-layer structure having a reinforcement plate bonded to a back side of an insulation material via a separable adhesive; and
a plurality of vertical wiring portions separably connected to the support portion so as to form the vertical wiring.
2. A wiring electronic component according to claim 1, wherein the plurality of vertical wiring portions are formed on the support portion by means of plating.
3. A wiring electronic component according to claim 2, wherein horizontal wiring portions connected to the vertical wiring portions are formed.
4. A wiring electronic component according to claim 3, wherein the support portion is formed by bonding a tape to the entirety of one side of a stainless steel plate, a silicon substrate, or a glass substrate, the tape being formed of the insulation material in the form of thin film.
5. A wiring electronic component according to claim 4, wherein a seed layer of metal is formed on the insulation material, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
6. A wiring electronic component according to claim 3, wherein a stainless steel plate, a silicon substrate, or a glass substrate is used as the support portion, a seed layer is formed on the support portion via a separation assisting layer, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
7. A wiring electronic component according to claim 1, wherein said reinforcement plate is connected to the semiconductor chip in a first state, said reinforcement plate being disconnected from the semiconductor chip in a second state, said insulation material being connected to one or more of said vertical wiring portions in the first state and the second state.
8. A wiring component according to claim 7, wherein said insulation material and the semiconductor chip define a space in a first wiring electronic component configuration, wherein resin fills said space such that said resin engages said insulation material in the second wiring electronic component configuration.
9. A method of manufacturing a wiring electronic component to be incorporated in an electronic device package in which a circuit element is disposed therein, the circuit element including a semiconductor chip and the electronic device package including external electrodes connected to the circuit element via vertical wiring, the method comprising:
providing a support portion comprising a two-layer structure, said two-layer structure comprising reinforcement plate and insulation material, said reinforcement plate being bonded to a back side of the insulation material via a separable adhesive; and
forming a plurality of vertical wiring portions for the vertical wiring through plating such that the vertical wiring portions are detachably connected to the support portion.
10. A method of manufacturing a wiring electronic component according to claim 9, wherein, after horizontal wiring portions are formed on the support portion, the vertical wiring portions to be connected to the horizontal wiring portions are formed.
11. A method of manufacturing a wiring electronic component according to claim 10, wherein a stainless steel plate, a silicon substrate, or a glass substrate is used as the support portion, a seed layer is formed on the support portion via a separation assisting layer, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
12. A method of manufacturing a wiring electronic component according to claim 10, wherein the support portion is formed by bonding a tape to the entirety of one side of a stainless steel plate, a silicon substrate, or a glass substrate, the tape being formed of said insulation material in the form of thin film.
13. A method of manufacturing a wiring electronic component according to claim 12, wherein a seed layer of metal is formed on the insulation material, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
14. A method of manufacturing a wiring electronic component according to claim 9, further comprising:
connecting one or more of the vertical wiring portions to the semiconductor chip with each of the vertical wiring portions connected to the reinforcement plate;
removing said reinforcement plate after said one or more of the vertical wiring portions is connected to the semiconductor chip such that said insulation material remains connected to the semiconductor chip and said one or more of the vertical wiring portions is disconnected from said reinforcement plate.
15. A method of manufacturing a wiring electronic component according to claim 14, further comprising:
filling a space defined by at least the semiconductor chip and said insulation material with resin prior to removing said reinforcement plate, said resin engaging the semiconductor chip and said insulation material.
16. A method of manufacturing a wiring electronic component, the method comprising:
providing a semiconductor chip;
providing a support portion comprising a reinforcement plate, a separable adhesive and insulation material, said reinforcement plate being detachably connected to a rear side of said insulation material via said separable adhesive;
forming a plurality of vertical wiring portions for vertical wiring via plating such that the vertical wiring portions are detachably connected to the support portion;
connecting said support portion to said semiconductor chip, wherein each of said plurality of vertical wiring portions is connected to said semiconductor chip;
removing said reinforcement plate from said insulation material with each of said plurality of vertical wiring portions connected to said semiconductor chip such that said reinforcement plate is disconnected from said insulation material and each of said plurality of said vertical wiring portions, wherein each of said wiring portions remains connected to said insulation material with said reinforcement plate removed from said insulation material.
17. A method of manufacturing a wiring electronic component according to claim 16, further comprising:
filling a space defined by at least said semiconductor chip and said insulation material with resin prior to removing said reinforcement plate, said resin engaging the semiconductor chip and said insulation material.
18. A method of manufacturing a wiring electronic component according to claim 17, further comprising:
forming horizontal wiring portions, each of said horizontal wiring portions engaging one of said vertical wiring portions, said insulation material comprising another side opposite said rear side, each of said horizontal wiring portions engaging said another side, each of said horizontal wiring portions being connected to said semiconductor substrate via one of said vertical wiring portions.

1. A method for making a vehicle interior panel comprising:
positioning a slipsheet on a liner;
placing the liner on a substrate board;
forming the liner and substrate board into an interior panel;
forming a cavity by removing a portion of the substrate board from the interior panel adjacent to the slipsheet position; and
positioning a lamp in the cavity.
2. The method of claim 1, further comprising:
adhering the lamp onto the interior panel.
3. The method of claim 1, wherein the step of forming the liner further comprises:
heating the liner and substrate board and molding the substrate board to form the vehicle interior panel.
4. The method of claim 1, wherein the step of positioning a slipsheet further comprises:
positioning a mylar slipsheet on the liner.
5. The method of claim 1, further comprising:
removing excess liner material and substrate material on an outer edge of the interior panel.
6. The method of claim 1, wherein the step of forming a cavity further comprises:
using a water jet to cut away substrate material.
7. The method of claim 1, further comprising:
positioning a proximity sensor adjacent to the cavity.
8. A method for making a vehicle interior panel comprising:
forming an interior panel with a liner, a substrate, and a removable slipsheet disposed therebetween;
removing a portion of the substrate adjacent to the slipsheet to form a cavity;
positioning a lamp in the cavity; and
displaying a visual indicator on an interior side of the interior panel that denotes the position of the lamp behind the liner.
9. The method of claim 8, further comprising:
positioning a proximity sensor adjacent to the cavity.
10. The method of claim 9, wherein the step of positioning a lamp in the cavity further comprises:
installing a light source in the cavity that emits light through the liner.
11. The method of claim 10, wherein the step of positioning a lamp in the cavity further comprises:
installing at least one light emitting diode in the lamp.
12. The method of claim 11, wherein the step of positioning a lamp in the cavity further comprises:
installing a light diffuser between the liner and the lamp.
13. The method of claim 8, further comprising:
operably connecting a lens on the lamp that is visible through the liner.
14. The method of claim 8, further comprising:
printing indicia on the liner below the lamp.
15. A method of positioning a vehicle lamp comprising:
forming an interior panel from a liner and a substrate board;
forming a cavity in the interior panel by removing a portion of the substrate board from the liner;
positioning a lamp in the cavity; and
displaying a visual indicator on an interior side of the interior panel that denotes the position of the lamp behind the liner.
16. The method of claim 15, wherein the step of positioning a lamp in the cavity further comprises:
installing a light source in the cavity that emits light through the liner.
17. The method of claim 16, wherein the step of installing a light source further comprises:
installing a light emitting diode in the cavity that emits light visible on the interior side of the interior panel.
18. The method of claim 15, further comprising:
operably connecting a lens on the lamp that is visible through the liner.
19. The method of claim 15, further comprising:
printing indicia on the liner below the lamp.
20. The method of claim 15, wherein the step of forming an interior panel from a liner and a substrate board further comprises:
forming the liner to include a first textured material adjacent to the substrate board and a second textured material adjacent to the cavity.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electrostatic actuator comprising:
a fixed electrode;
an electric charge charging unit electrically insulated from the fixed electrode; and
a moving electrode spaced apart from the fixed electrode and the electric charge charging unit.
2. The electrostatic actuator of claim 1, further comprising an insulating substrate on which the fixed electrode is formed.
3. The electrostatic actuator of claim 2, further comprising an insulating layer formed on the fixed electrode,
wherein the electric charge charging unit is formed on the insulating layer, and
the moving electrode is formed over the electric charge charging unit so that the moving electrode is opposite to the fixed electrode and the electric charge charging unit.
4. The electrostatic actuator of claim 2, wherein:
the electric charge charging unit is spaced apart from the fixed electrode and is formed over the insulating substrate, and
the moving electrode is formed over the fixed electrode and the electric charge charging unit so that the moving electrode is opposite to the fixed electrode and the electric charge charging unit.
5. The electrostatic actuator of claim 1, further comprising an anti-discharge layer formed on a surface of the electric charge charging unit.
6. The electrostatic actuator of claim 1, wherein:
a driving voltage is applied between the fixed electrode and the moving electrode, and
the moving electrode is moved by means of a first electrostatic force between the fixed electrode and the moving electrode and a second electrostatic force between the electric charge charging unit and the moving electrode, by the driving voltage.
7. The electrostatic actuator of claim 6, wherein a part of the moving electrode is moved by means of the first and second electrostatic forces.
8. The electrostatic actuator of claim 6, wherein:
the first and second electrostatic forces comprise electrostatic attraction, and the moving electrode is moved toward the fixed electrode.
9. The electrostatic actuator of claim 1, wherein the electric charge charging unit previously stores electric charges.
10. A method of driving an electrostatic actuator, comprising a fixed electrode, an electric charge charging unit electrically insulated from the fixed electrode, and a moving electrode spaced apart from the fixed electrode and the electric charge charging unit, the method comprising the steps of:
charging the electric charge charging unit with electric charges; and
applying a driving voltage between the fixed electrode and the moving electrode,
11. The method of claim 10, wherein the step of charging the electric charges comprises the steps of:
applying a voltage to the electric charge charging unit, and
electrically floating the electric charge charging unit charged with the electric charges.
12. The method of claim 10, wherein the step of charging the electric charges comprises the step of charging the electric charges into the electric charge charging unit by a tunneling method through an electric field.
13. Non-volatile memory comprising:
a fixed electrode;
an electric charge charging unit electrically insulated from the fixed electrode; and
a moving electrode spaced apart from the fixed electrode and the electric charge charging unit.
14. A logic circuit device comprising:
a fixed electrode;
an electric charge charging unit electrically insulated from the fixed electrode; and
a moving electrode spaced apart from the fixed electrode and the electric charge charging unit.
15. A switch comprising:
a fixed electrode and a contact electrode spaced apart from each other;
an electric charge charging unit spaced apart from the fixed electrode with an insulating layer intervened therebetween; and
a moving electrode formed over the fixed electrode, the electric charge charging unit, and the contact electrode.
16. The switch of claim 15, wherein:
a driving voltage is applied between the fixed electrode and the moving electrode, and the moving electrode is moved by means of a first electrostatic force between the fixed electrode and the moving electrode and a second electrostatic force between the electric charge charging unit and the moving electrode, by the driving voltage, so that the moving electrode is brought in contact with the contact electrode.
17. The switch of claim 16, further comprising a protrusion formed at a portion where the moving electrode is brought in contact with the contact electrode,
18. The switch of claim 15, further comprising an anti-discharge layer formed on a surface of the electric charge charging unit.
19. The switch of claim 15, wherein the electric charge charging unit previously stores electric charges.
20. The switch of claim 15, further comprising an insulating substrate on which the fixed electrode and the contact electrode are formed.
21. The switch of claim 20, further comprising a support member for supporting the moving electrode over the insulating substrate.
22. The electrostatic actuator of claim 1, wherein the electric charge charging unit is formed from any one of an electrical conductor, ONO (Oxide-Nitride-Oxide), a ferroelectric material, and an electret.