1460737974-0d25e958-5106-4af5-84bd-eafc76f7d826

1. A travel vibration suppressing device of a work vehicle, connected to a hydraulic cylinder for operating a work machine and adapted to suppress vibration during vehicle travel, the travel vibration suppressing device comprising:
an accumulator configured to be connected to the hydraulic cylinder;
a control valve configured to bring about communication or blocking between the hydraulic cylinder and the accumulator;
a vehicle speed detecting device configured to detect vehicle speed of the work vehicle;
a work machine state determination section configured to determine whether the state of the work machine is an excavating state in which excavation is expected to be performed using the work machine, or a normal state in which excavation by the work vehicle is not performed; and
a control unit configured to control the control valve according to the determination result of the work machine state determination section; wherein
the control unit is configured to
upon determining the state of the work machine to be the excavating state, switch from a state of communication between the hydraulic cylinder and the accumulator to a blocked state when the vehicle speed changes from a speed exceeding a first speed to a speed which is equal to or less than the first speed, and
upon determining the state of the work machine to be the normal state, switch from the state of communication between the hydraulic cylinder and the accumulator to the blocked state when the vehicle speed changes from a speed exceeding a second speed which is lower than the first speed to a speed which is equal to or less than the second speed.
2. The travel vibration suppressing device in a work vehicle according to claim 1, wherein
the control unit is configured to
in the excavating state, place the hydraulic cylinder and the accumulator in the state of communication therebetween when the vehicle speed is equal to or greater than a third speed which is higher than the first speed; and
in the normal state, place the hydraulic cylinder and the accumulator in the state of communication therebetween when the vehicle speed is equal to or greater than a fourth speed which is higher than the second speed.
3. The travel vibration suppressing device in a work vehicle according to claim 1, wherein the work machine has a boom lifted and lowered by the hydraulic cylinder, and a bucket rotatably mounted to the distal end of the boom via a hinge pin, and
the work machine state determination section is configured to determine the state of the work machine from the height of the bucket.
4. The travel vibration suppressing device in a work vehicle according to claim 3, wherein
the work machine state determination section is configured to
determine that the excavating state exists when the height of the bucket is equal to or less than a predetermined height, and
determine that the normal state exists when the height of the bucket exceeds the predetermined height.
5. The travel vibration suppressing device in a work vehicle according to claim 3, wherein
the work machine state determination section is configured to
determine that the excavating state exists when the height of the bucket is equal to or less than a first height, and
determine that the normal state exists when the height of the bucket is equal to or greater than a second height which is higher than the first height, and

the control unit is configured to
execute control such that the state of the work machine remains in the excavating state until the height of the bucket reaches the second height when transitioning from the excavating state to the normal state, and
execute control such that the state of the work machine remains in the normal state until the height of the bucket reaches the first height when transitioning from the normal state to the excavating state.
6. The travel vibration suppressing device in a work vehicle according to claim 3, wherein
the work machine state determination section is configured to designate the height of the hinge pin as the height of the bucket when determining the state of the work machine.
7. The travel vibration suppressing device in a work vehicle according to claim 3, wherein
the work machine state determination section is configured to
determine that the excavating state exists when the height of the bucket is equal to or less than a first height,
determine that the normal state exists when the height of the bucket is equal to or greater than a second height which is higher than the first height, and
determine that an intermediate state exists when the height of the bucket is lower than the second height which is higher than the first height, and

the control unit is configured to
upon determining the state of the work machine to be the intermediate state, place the hydraulic cylinder and the accumulator in the communicating state when the vehicle speed is equal to or greater than the third speed, and place the hydraulic cylinder and the accumulator in the blocked state when the vehicle speed is equal to or less than the second speed.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. Apparatus for testing semiconductor integrated circuit devices in wafer form, the apparatus comprising:
a test head,
a wafer prober for presenting successive wafers to be tested to the test head from beneath the test head,
a probe card support mechanism attached to the wafer prober for supporting a probe card beneath the test head, and
a lifting mechanism attached to the wafer prober for lifting the test head above the wafer prober,
and wherein upon lifting the test head above the wafer prober, the probe card support mechanism can move horizontally relative to the test head between an inserted position in which the probe card support mechanism is positioned to enable the probe card to engage contact elements of the test head and an extended position in which the probe card can be removed from the probe card support mechanism.
2. Apparatus according to claim 1, further comprising a probe card changer body attached to the wafer prober and wherein the probe card support mechanism includes a probe card tray attached to the probe card changer body, the probe card tray being movable relative to the probe card changer body between a retracted position and a projecting position.
3. Apparatus according to claim 2, comprising attachment elements to which the probe card changer body is attached, the test head being releasably engageable to the attachment elements, and wherein the lifting mechanism is effective between the wafer prober and the attachment elements.
4. Apparatus according to claim 3, wherein the attachment elements are docking bars and the test head is releasably engageable to the docking bars by a cam mechanism.
5. Apparatus according to claim 2, wherein the probe card tray is moveable vertically relative to the probe card changer body when the test head is lifted above the wafer prober.
6. Apparatus according to claim 1, wherein the test head includes a pogo tower.
7. Apparatus according to claim 1, wherein the probe card support mechanism is attached to the lifting mechanism and the lifting mechanism is releasably attached to the test head.
8. A method of modifying an apparatus for testing semiconductor integrated circuit devices in wafer form, the apparatus comprising a test head and a wafer prober for presenting successive wafers to be tested to the test head from beneath the test head, said method comprising:
disengaging the test head from the wafer prober,
attaching a lifting mechanism to the wafer prober,
attaching a probe card support mechanism to the wafer prober for supporting a probe card, and
engaging the test head with the lifting mechanism,
whereby the lifting mechanism can be employed to lift the test head above the wafer prober and upon lifting the test head above the wafer prober, the probe card support mechanism can move horizontally relative to the test head between an inserted position in which the probe card support mechanism is positioned to enable the probe card to engage contact elements of the test head and an extended position in which the probe card can be removed from the probe card support mechanism.
9. A method according to claim 8, wherein the apparatus includes attachment elements and the method comprises attaching the lifting mechanism to the attachment elements whereby the attachment elements may be elevated relative to the wafer prober.
10. A method according to claim 9, wherein the step of engaging the test head with the lifting mechanism comprises docking the test head to the attachment elements.
11. A method according to claim 8, wherein the apparatus includes docking bars and the method comprises attaching the lifting mechanism to the docking bars whereby the docking bars may be elevated relative to the wafer prober.
12. A method according to claim 8, comprising attaching the probe card support mechanism to the lifting mechanism and releasably attaching the lifting mechanism to the test head.
13. A method according to claim 8, wherein the method further comprises:
moving the card support mechanism to the extended position,
placing a probe card into the probe card support mechanism, and
moving the probe card support mechanism to the inserted position.

1460737966-ce0db9c3-03e1-4e3f-a0dc-6aac682defa6

1. A multilayer film element comprising a flexible dielectric carrier layer having a layer thickness of less than 800 \u03bcm, comprising a first electrically conductive layer, in which a first coil-shaped conductor track is shaped in a first region of the film element, comprising a second electrically conductive layer, in which a second coil-shaped conductor track is shaped in the first region, wherein the dielectric carrier layer is arranged between the first and second electrically conductive layers and the first and second conductor tracks overlap at least in regions and are coupled to one another to form an antenna structure, and wherein a first conductor track section comprising at least a three-quarter turn of the first coil-shaped conductor track overlaps at least in regions a second conductor track section comprising at least a three-quarter turn of the second coil-shaped conductor track with respect to a direction perpendicular to the plane spanned by the carrier layer,
wherein, in a region comprising t turns of the first conductor track section, the first conductor track section completely overlaps the second conductor track section and in this region along the first conductor track section in at least one first direction, lying in the plane spanned by the carrier layer, the extent of the second conductor track is less than the extent of the first conductor track by the value r, where t\u2267\xbc and r\u2267100 \u03bcm.
2. The multilayer film element as claimed in claim 1, wherein along the first conductor track section in a second direction, lying in the plane spanned by the carrier layer, the extent of the second conductor track is at least 50 \u03bcm less than the extent of the first conductor track, wherein the first and second directions form a right angle.
3. The multilayer film element as claimed in claim 1, wherein, along the first conductor track section in the second direction, the extent of the second conductor track is between 200 and 400 \u03bcm less than the extent of the first conductor track.
4. The multilayer film element as claimed in claim 1, wherein, along the first conductor track section, the difference in the extent of the first and second conductor tracks in the first direction is greater than 20%, than the difference in the extent of the first and second conductor tracks in the second direction.
5. The multilayer film element as claimed in claim 1, wherein t is chosen from the range \xbe to 1.
6. The multilayer film element as claimed in claim 1, wherein t\u2267\xbe.
7. The multilayer film element as claimed in claim 1, wherein r is \u2267400 \u03bcm.
8. The multilayer film element as claimed in claim 1, wherein r\u2266400 \u03bcm.
9. The multilayer film element as claimed in claim 1, wherein the first coil-shaped conductor track and the second coil-shaped conductor track have the same turns direction.
10. The multilayer film element as claimed in claim 1, wherein the first andor second coil-shaped conductor track areis substructured in the first conductor track section andor in the second conductor track section, and areis substructured in zigzag fashion or in wavy-line-shaped fashion.
11. The multilayer film element as claimed in claim 10, wherein the first andor second conductor track areis substructured in the first conductor track section andor in the second conductor track section in accordance with a periodic substructuring function, wherein the period of the substructuring function is less than 5 mm.
12. The multilayer film element as claimed in claim 1, wherein the first conductor track has a third conductor track section, which adjoins the first conductor track section, and the conductor track width of the third conductor track section is less than the conductor track width of the first conductor track section.
13. The multilayer film element as claimed in claim 12, wherein the conductor track width of the third conductor track section is less than the conductor track width of the first conductor track section by at least 100 \u03bcm.
14. The multilayer film element as claimed in claim 12, wherein the conductor track width of the third conductor track section is between 10 and 50% of the conductor track width of the first conductor track section.
15. The multilayer film element as claimed in claim 12, wherein the third conductor track section comprises at least one turn of the first coil-shaped conductor track.
16. The multilayer film element as claimed in claim 12, wherein the third conductor track section, with respect to the coil-shaped embodiment of the first conductor track as inner conductor track section, is adjacent to the first conductor track section.
17. The multilayer film element as claimed in claim 12, wherein the first conductor track section comprises the outermost three-quarter turn of the first coil-shaped conductor track.
18. The multilayer film element as claimed in claim 1, wherein the first conductor track section has a conductor track width of 0.5 to 5 mm.
19. The multilayer film element as claimed in claim 1, wherein, along the first conductor track section in the first direction, the extent of the second conductor track is between 200 and 400 \u03bcm less than the extent of the first conductor track.
20. The multilayer film element as claimed in claim 1, wherein the first direction is the longitudinal direction of the carrier layer.
21. The multilayer film element as claimed in claim 1, wherein the first and second electrically conductive layers are structured by means of a printing method.
22. The multilayer film element as claimed in claim 1, wherein the layer thickness of the first andor of the second electrically conductive layer is not constant.
23. The multilayer film element as claimed in claim 1, wherein the first and second conductor tracks are connected to one another via at least one electrically conductive plated-through hole through the carrier layer.
24. The multilayer film element as claimed in claim 1, wherein the first and second conductor tracks are capacitively andor inductively coupled to one another.
25. The multilayer film element as claimed in claim 1, wherein the first andor second conductor track in each case havehas between two and three turns.
26. The multilayer film element as claimed in claim 1, wherein a first and a second electrode area are formed in the first andor in the second electrically conductive layer, said electrode areas in each case being electrically connected to the first andor second conductor track.
27. The multilayer film element as claimed in claim 26, wherein a first and a second electrode area are formed both in the first and in the second electrically conductive layer, wherein the first electrode areas at least partly overlap and are connected to one another via an electrically conductive plated-through hole, and the second electrode areas at least partly overlap and are connected to one another via an electrically conductive plated-through hole.
28. The multilayer film element as claimed in claim 26, wherein the first electrode area is connected to the first conductor track and the second electrode area is connected to the second conductor track.
29. The multilayer film element as claimed in claim 26, wherein a third conductor track is shaped in the first andor the second electrically conductive layer, said third conductor track being connected to the first or second electrode area and being capacitively andor inductively coupled to the first andor second conductor track.
30. The multilayer film element as claimed in claim 29, wherein the third conductor track extends over at least 40% of the width of the multilayer film element.
31. The multilayer film element as claimed in claim 26, wherein the multilayer film element has an electrical circuit, which is electrically connected to the first and second electrode areas.
32. The multilayer film element as claimed in claim 26, wherein the first and second electrode areas in each case have a size of in each case at least 2 mm2.
33. The multilayer film element as claimed in claim 26, wherein the electrode areas are arranged in a corner of the film element.
34. The multilayer film element as claimed in claim 1, wherein the film element has a card-type shaping.
35. The multilayer film element as claimed in claim 1, wherein the carrier layer has a layer thickness of between 250 \u03bcm and 12 \u03bcm.
36. The multilayer film element as claimed in claim 1, wherein the first and second electrically conductive layers are applied on opposite surfaces of the carrier layer.
37. The multilayer film element as claimed in claim 1, wherein the carrier layer has a plastic film and a decorative layer.
38. The multilayer film element as claimed in claim 1, wherein a decorative layer is arranged between the first and second conductor tracks andor on that side of the first andor second conductor track which is remote from the carrier layer.
39. The multilayer film element as claimed in claim 37, wherein the decorative layer in conjunction with the first andor second electrically conductive layer provides an optically variable security element.
40. The multilayer film element as claimed in claim 1, wherein a relief structure that generates an optically variable effect is impressed into the first andor second conductor track.
41. The multilayer film element as claimed in claim 37, wherein the decorative layer is a layer having a microscopic or macroscopic surface relief having a diffractive optical effect or a surface relief in the form of lens structures, matt structures or blazed grating, a thin-film layer system, a liquid crystal layer or a layer comprising optically active pigments, and the decorative layer is arranged in the film element in such a way that it at least partly overlaps the first andor second conductor track.
42. A method for producing a multilayer film element comprising the following steps:
providing a flexible dielectric carrier layer having a layer thickness of less than 800 \u03bcm;
applying a first electrically conductive layer, in which a first coil-shaped conductor track having a first conductor track section comprising at least a three-quarter turn of the coil-shaped first conductor track is shaped in a first region of the film element, to a first surface of the carrier layer; and
applying a second electrically conductive layer, in which a second coil-shaped conductor track having a second conductor track section comprising at least a three-quarter turn of the second coil-shaped conductor track is shaped in the first region, to a second surface of the carrier layer, said second surface lying opposite the first surface, in such a way that the first and second conductor tracks overlap at least in regions and are coupled to one another to form an antenna structure, wherein, in a region comprising t turns of the first conductor track section, the first conductor track section completely overlaps the second conductor track section and in this region along the first conductor track section in at least one first direction, lying in the plane spanned by the carrier layer, the extent of the second conductor track is less than the extent of the first conductor track by the value r, where t\u2267\xbc and r\u2267100 \u03bcm.
43. The method for producing a multilayer film element as claimed in claim 42, wherein for applying the first andor second electrically conductive layer, in a first step, an electrically conductive base layer structured by means of a printing method is applied and a galvanic reinforcement layer is then applied to the base layer, wherein the base layer and the galvanic reinforcement layer consist of different materials.
44. The method for producing a multilayer film element as claimed in claim 43, wherein the base layer is applied to the carrier layer by means of a printing method.
45. The method for producing a multilayer film element as claimed in claim 44, wherein the base layers are printed onto the opposite surfaces of the carrier layer by means of two printing units synchronized with one another.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electrical terminal connector assembly for a vehicle having a first component adapted for electrical connection to a second component, the electrical terminal connector assembly comprising:
an electrical wire operatively connected to an electrical source and adapted for connection to an electrical terminal of the second component at an end of the wire; and
a protective cover defining an interior and having a flexible portion movable between expanded and compressed states, the protective cover providing three conditions for the connector assembly including:
a pre-connected condition prior to an electrical connection between the wire and the terminal of the second component in which the cover is expanded and the end of the wire located within the interior of the cover,
a connected condition in which the protective cover is compressed and the end of the wire is secured to the terminal of the second component within the interior of the cover, and
a disconnected condition in which the cover is expanded and the terminal of the second component is fractured, the end of the electrical wire and a fractured portion of the terminal are located within the interior of the cover to prevent a short circuit of the electrical wire.
2. (canceled)
3. (canceled)
4. The electrical terminal connector assembly of claim 21, wherein the flexible portion is biased towards the expanded state.
5. The electrical terminal connector assembly of claim 21, wherein the protective cover is made of rubber.
6. The electrical terminal connector assembly of claim 21, wherein the first vehicle component is a battery.
7. The electrical terminal connector assembly of claim 6, wherein the second vehicle component is a starter.
8. The electrical terminal connector assembly of claim 6, wherein the wire is a non-fused battery cable.
9. A vehicle comprising:
a first vehicle component having an electrical terminal;
a second vehicle component having an electrical terminal;
a wire operatively connected to an electrical source and having a first end electrically connected to the terminal of the first vehicle component and a second end electrically connected to the terminal of the second vehicle component;
a protective cover having an interior and a flexible portion movable between expanded and compressed states and the protective cover providing three conditions including:
a pre-connected condition, in which the protective cover is expanded and the second end of the electrical wire is located within the interior of the cover;
a connected condition, in which the cover is compressed and the second end of the electrical wire is secured to the terminal of the second vehicle component within the interior of the cover; and,
a disconnected condition in which the cover is expanded and the terminal of the second component is fractured, the second end of the electrical wire and a fractured portion of the terminal are located within the interior of the cover to prevent a short circuit of the electrical wire.
10. (canceled)
11. (canceled)
12. The vehicle of claim 23, wherein the flexible portion is biased towards the expanded state.
13. The vehicle of claim 23, wherein the protective cover is made of rubber.
14. The vehicle of claim 23, wherein the first vehicle component is a battery.
15. The vehicle of claim 14, wherein the second vehicle component is a starter.
16. The vehicle of claim 14, wherein the wire is a non-fused battery cable.
17. A method comprising the steps of:
providing a first vehicle component having a first electrical terminal;
providing a second vehicle component having a second electrical terminal;
providing a wire for electrically connecting the vehicle components and operatively connecting the wire to an electrical source;
providing a protective cover having an interior and a flexible portion movable between expanded and compressed conditions;
connecting a first end of the wire to the first electrical terminal of the first vehicle component;
connecting a second end of the wire to the second electrical terminal of the second vehicle component, wherein the protective cover is compressed and the second end of the electrical wire is secured to the second terminal within the interior of the cover;
expanding the protective cover to position the second end of the electrical wire and a fractured portion of the second terminal within the interior of the protective cover to prevent a short circuit of the electrical wire when the second vehicle component fractures.
18. The method of claim 17, wherein the first vehicle component is a battery, the second vehicle component is a starter, and the wire is a non-fused battery cable.
19. The method of claim 17, wherein the flexible portion of the protective cover further comprises:
a plurality of corrugations;
a first end having a first perimeter, wherein the first end is substantially fixed with respect to the wire in both the expanded and compressed conditions; and
a second end having a second perimeter, wherein the second perimeter is substantially larger than the first perimeter, and wherein the second end extends beyond the fractured portion of the second terminal in the expanded condition.
20. The method of claim 17, wherein the step of expanding the protective cover further comprises expanding the protective cover to position a fractured portion of the second vehicle component, which is different from the fractured portion of the second terminal, within the interior of the protective cover when the second vehicle component fractures.
21. The electrical terminal connector assembly of claim 1, wherein the flexible portion of the protective cover further comprises:
a plurality of corrugations;
a first end having a first perimeter, wherein the first end is substantially fixed with respect to the wire in both the expanded and compressed conditions; and
a second end having a second perimeter, wherein the second perimeter is substantially larger than the first perimeter, and wherein the second end extends beyond the fractured portion of the second terminal in the expanded condition.
22. The electrical terminal connector assembly of claim 1, wherein the disconnected condition further comprises a fractured portion of the second component, which is different from the fractured portion of the terminal, located within the interior of the cover.
23. The vehicle of claim 9, wherein the flexible portion of the protective cover further comprises:
a plurality of corrugations;
a first end having a first perimeter, wherein the first end is substantially fixed with respect to the wire in both the expanded and compressed conditions; and
a second end having a second perimeter, wherein the second perimeter is substantially larger than the first perimeter, and wherein the second end extends beyond the fractured portion of the second terminal in the expanded condition.
24. The vehicle of claim 9, wherein the disconnected condition further comprises a fractured portion of the second component, which is different from the fractured portion of the terminal, located within the interior of the cover.