Author: claimsbot

1. A method of forming a metal alloy with a first coefficient of thermal expansion that can be directly attached, joined or bonded to a semiconductor or ceramic material, the metal alloy’s first coefficient of thermal expansion substantially matching a second coefficient of thermal expansion of the semiconductor or ceramic material prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material, the method comprising the steps of:
selecting a semiconductor or ceramic material,
determining the second coefficient of thermal expansion of the selected semiconductor or ceramic material prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material,
forming the metal alloy using a composition of titanium and tungsten in which relative percentages of titanium and tungsten in the metal alloy are selected so that the first coefficient of thermal expansion of the metal alloy prior to being directly attached, joined or bonded the semiconductor or ceramic material substantially matches the second coefficient of thermal expansion of the selected semiconductor or ceramic material prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material, and
wherein the titanium and tungsten alloy being a binary metal compound only.
2. The method of claim 1, wherein the relative percentages of titanium and tungsten in the metal alloy are selected according to an equation given by:
\u03b1
=
\u2211
i

\u2062
\u03b1
i

\u2062

V
i
where \u03b1 is the resultant coefficient of thermal expansion of the metal alloy, \u03b1i is the coefficient of thermal expansion of the individual metal element i, and Vi is the volume fraction of each atom in the alloy.
3. The method of claim 1, wherein the second coefficient of thermal expansion for the metal alloy is varied over a range from approximately 8.6 ppmCelsius to about 4.5 ppmCelsius by varying the relative amounts of the titanium and tungsten used to form the metal alloy.
4. The method of claim 1, wherein the semiconductor or ceramic material contains at least one active device or system selected from a group consisting of microelectronics, photonics, power electronics, monolithic microwave integrated circuits, microelectro-mechanical systems, nano-electro-mechanical systems, and thermo-electrics.
5. The method of claim 4, wherein the metal alloy is a heat sink that is joined to the semiconductor or ceramic material and that removes excess heat from the semiconductor or ceramic substrate.
6. The method of claim 1, wherein the semiconductor or ceramic material is a substrate containing at least one active device or system and wherein the metal alloy is a metal substrate that functions as a mechanical support and as a heat sinkheat spreader to transport heat away from the semiconductor or ceramic substrate.
7. The method of claim 6, wherein the semiconductor or ceramic substrate is bonded to the metal alloy substrate without the use of an intermediate layer.
8. The method of claim 1, wherein the alloy of titanium and tungsten is formed using powder metallurgy.
9. The method of claim 1, wherein the alloy of titanium and tungsten is formed using vapor deposition.
10. The method of claim 1, wherein the alloy of titanium and tungsten is formed using any one of the techniques including: mechanical alloying; solid-state reaction; melt spinning, and ion radiation.
11. The method of claim 1, wherein the alloy of titanium and tungsten has a fine finish that is achieved using a process selected from a group consisting of machining, micro-machining, electro-discharged machining, casting, milling and polishing.
12. The method of claim 6, wherein the heat sink has fins machined on the surface(s) not bonded to the semiconductor or ceramic substrate to facilitate the removal of heat from active devices made in a semiconductor or ceramic substrate bonded or mated to the heat sink.
13. The method of claim 6, wherein the heat sink has micro-channels in it through which water is forced to facilitate the removal of heat from a laser diode or an array of laser diodes.
14. The method of claim 6, wherein the heat sink has active cooling or refrigeration capability built into it to facilitate the removal of heat from semiconductor or ceramic substrate.
15. The method of claim 6, wherein the semiconductor or ceramic substrate contains a laser diode or an array of laser diodes, and wherein the heat sink has micro-channels in it through which water is forced to facilitate the removal of heat from the laser diode or array of laser diodes.
16. The method of claim 11, wherein the surface of the metal alloy substrate is polished prior to bonding to the semiconductor or ceramic substrate.
17. The method of claim 6, wherein the metal alloy substrate is a device selected from a group consisting of a mechanical support, a heat sink, at least one electrode to supply current andor voltage to active devices or systems on the semiconductor or ceramic substrate, and a metal shield to protect active devices formed on the semiconductor or ceramic substrate.
18. A method of forming a metal alloy with a first coefficient of thermal expansion that can be directly attached, joined or bonded to a semiconductor or ceramic material, the metal alloy’s first coefficient of thermal expansion substantially matching a second coefficient of thermal expansion of the semiconductor or ceramic material prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material, the method comprising the steps of:
selecting a semiconductor or ceramic material,
determining the second coefficient of thermal expansion of the selected semiconductor or ceramic material prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material,
forming the metal alloy using a composition of titanium and tungsten in which relative percentages of titanium and tungsten in the metal alloy are selected so that the first coefficient of thermal expansion of the metal alloy prior to being directly attached, joined or bonded to the semiconductor or ceramic material substantially matches the second coefficient of thermal expansion of the selected semiconductor or ceramic material prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material, the relative percentages of titanium and tungsten in the metal alloy being selected according to an equation given by:
\u03b1
=
\u2211
i

\u2062
\u03b1
i

\u2062

V
i
where \u03b1 is the resultant coefficient of thermal expansion of the metal alloy, a \u03b1i is the coefficient of thermal expansion of the individual metal element i, and Vi is the volume fraction of each atom in the alloy, and
wherein the titanium and tungsten alloy being a binary compound only.
19. The method of claim 18, wherein the second coefficient of thermal expansion for the metal alloy is varied over a range from approximately 8.6 ppmCelsius to about 4.5 ppmCelsius by varying the relative amounts of the titanium and tungsten used to form the metal alloy.
20. The method of claim 18, wherein the semiconductor or ceramic material contains at least one active device or system selected from a group consisting of microelectronics, photonics, power electronics, monolithic microwave integrated circuits, microelectro-mechanical systems, nano-electro-mechanical systems, and thermo-electrics.
21. The method of claim 18, wherein the metal alloy is a heat sink that removes excess heat from the semiconductor or ceramic substrate.
22. The method of claim 18, wherein the semiconductor or ceramic material is a substrate containing at least one active device or system and wherein the metal alloy is a metal substrate that functions as a mechanical support and as a heat sinkheat spreader to transport heat away from the semiconductor or ceramic substrate.
23. The method of claim 22, wherein the semiconductor or ceramic substrate is bonded to the metal alloy substrate without the use of an intermediate layer.
24. The method of claim 18, wherein the alloy of titanium and tungsten is formed using powder metallurgy.
25. The method of claim 18, wherein the alloy of titanium and tungsten is formed using vapor deposition.
26. The method of claim 18, wherein the alloy of titanium and tungsten is formed using any one of the techniques including: mechanical alloying; solid-state reaction; melt spinning, and ion radiation.
27. The method of claim 18, wherein the alloy of titanium and tungsten has a fine finish that is achieved using a process selected from a group consisting of machining, micro-machining, electro-discharged machining, casting, milling and polishing.
28. The method of claim 22, wherein the heat sink has fins machined on the surface(s) not bonded to the semiconductor or ceramic substrate to facilitate the removal of heat from active devices made in a semiconductor or ceramic substrate bonded or mated to the heat sink.
29. The method of claim 22, wherein the heat sink has micro-channels in it through which water is forced to facilitate the removal of heat from a laser diode or an array of laser diodes.
30. The method of claim 22, wherein the heat sink has active cooling or refrigeration capability built into it to facilitate the removal of heat from semiconductor or ceramic substrate.
31. The method of claim 22, wherein the semiconductor or ceramic substrate contains a laser diode or an array of laser diodes, and wherein the heat sink has micro-channels in it through which water is forced to facilitate the removal of heat from the laser diode or array of laser diodes.
32. The method of claim 27, wherein the surface of the metal alloy substrate is polished prior to bonding to the semiconductor or ceramic substrate.
33. The method of claim 22, wherein the metal alloy substrate has one or more functions including a mechanical support, a heat sink, electrodes to supply current andor voltage to active devices or systems on semiconductor substrate, and metal shielding to protect active devices made in the semiconductor substrate.
34. A method of forming a metal alloy substrate with a first coefficient of thermal expansion that can be directly attached, joined or bonded to a semiconductor or ceramic material substrate, the metal alloy’s first coefficient of thermal expansion substantially matching a second coefficient of thermal expansion of the semiconductor or ceramic material substrate to which the metal alloy is joined prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material substrate, the method comprising the steps of:
selecting a semiconductor or ceramic material substrate,
determining the second coefficient of thermal expansion of the selected semiconductor or ceramic material substrate prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material substrate,
forming the metal alloy using a composition of titanium and tungsten in which relative percentages of titanium and tungsten in the metal alloy are selected so that the first coefficient of thermal expansion of the metal alloy prior to being directly attached, joined or bonded to the semiconductor or ceramic material substrate substantially matches the second coefficient of thermal expansion of the selected semiconductor or ceramic material substrate prior to the metal alloy being directly attached, joined or bonded to the semiconductor or ceramic material substrate, the relative percentages of titanium and tungsten in the metal alloy being selected according to an equation given by:
\u03b1
=
\u2211
i

\u2062
\u03b1
i

\u2062

V
i
where \u03b1 is the resultant coefficient of thermal expansion of the metal alloy substrate, \u03b1i is the coefficient of thermal expansion of the individual metal element i, and Vi is the volume fraction of each atom in the alloy, the semiconductor or ceramic material substrate containing at least one active device or system, the metal alloy being a heat sink that removes excess heat from the semiconductor or ceramic substrate, and thus, the at least one active device or system, and
wherein the titanium and tungsten alloy being a binary metal compound only.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for treating a disease that requires induction of apoptosis for its treatment, a carcinomatous disease, a disease that requires protection against oxidation for its treatment, a disease that requires inhibition of active oxygen production for its treatment, a disease that requires inhibition of nitric monoxide production for its treatment, a disease that requires inhibition of lipid peroxide radical production for its treatment or a disease that requires immunoregulation for its treatment, the method comprising
administering a pharmaceutical composition which comprises as an active ingredient at least one member selected from the group consisting of:
(1) a compound selected from the group consisting of 3,6-anhydrogalactopyranose represented by the formula (I):
an aldehyde thereof, a hydrate thereof, and a 2-O-methylated derivative of said 3,6-anhydrogalactopyranose, said aldehyde or said hydrate; and
(2) a soluble saccharide containing the compound at its reducing end.
2. A method according to claim 1, wherein the saccharide is a product produced by acid decomposition under acidic conditions below pH 7 andor enzymatic digestion of a substance containing at least one compound selected from the group consisting of 3,6-anhydrogalactopyranose represented by said formula I, an aldehyde or a hydrate thereof, and a 2-0-methylated derivative of the 3,6-anhydrogalactopyranose, said aldehyde or said hydrate.
3. A method according to claim 2, wherein the substance containing at least one compound selected from the group consisting of 3,6-anhydrogalactopyranose represented by formula I, an aldehyde and a hydrate thereof, and 2-0-methylated derivatives of the 3,6-anhydrogalactopyranose, the aldehyde and the hydrate is at least one substance selected from the group consisting of agar, agarose and carrageenan.
4. A method according to claim 1, wherein the saccharide is at least one saccharide selected from the group consisting of agarobiose, agarotetraose, agarohexaose, agarooctaose, \u03ba-carabiose, and \u03b2-D-galactopyranosyl-3,6-anhydro-2-O-methyl-L-galactose.

1. A method, comprising facilitating a processing of andor processing (1) data andor (2) information andor (3) at least one signal, the (1) data andor (2) information andor (3) at least one signal based, at least in part, on the following:
a generating, at a mobile phone, of an exercise program based, at least in part, on one or more physical parameters input by a user via a user interface;
a controlling of the user interface so as to provide guidance to a user during performance of the exercise program; and
a controlling of the user interface so as to display a plurality of fitness disciplines, wherein one or more of the plurality of fitness disciplines may be selected by the user via the user interface.
2. A method according to claim 1, wherein the (1) data andor (2) information andor (3) at least one signal are further based, at least in part, on the following:
an aerobic fitness value for the user based on physiological information input by the user.
3. A method according to claim 2, wherein at least one of the plurality of fitness disciplines is associated with a variable exercise duration parameter, and wherein the (1) data andor (2) information andor (3) at least one signal are further based, at least in part, on the following:
a setting of the variable exercise duration parameter on the basis of the physiological information input using the input device.
4. A method according to claim 3, wherein the physiological information comprises information relating to aerobic fitness for the user.
5. A method according to claim 3, wherein the (1) data andor (2) information andor (3) at least one signal are further based, at least in part, on the following:
a calculation of a duration of the exercise program by multiplying a base duration by a value obtained from the aerobic fitness value for the user.
6. A method according to claim 5, wherein the (1) data andor (2) information andor (3) at least one signal are further based, at least in part, on the following:
physiological information at the end of an exercise program for which guidance has been provided; and
a modification of the aerobic fitness value in dependence on the physiological information input at the end of an exercise program for which guidance has been provided.
7. A method according to claim 6, wherein the (1) data andor (2) information andor (3) at least one signal are further based, at least in part, on the following:
a modification of the aerobic fitness value at predetermined times.
8. A method according to claim 7, wherein the predetermined times are at intervals between the range of 3 to 8 weeks.
9. A method according to claim 7, wherein the modification of the aerobic fitness value comprises determining an expected performance, determining an actual performance from the physiological information received after the exercise program, comparing the expected performance and the actual performance, and increasing or decreasing the aerobic fitness value depending on a result of the comparison.
10. A method according to claim 2, wherein the (1) data andor (2) information andor (3) at least one signal are further based, at least in part, on the following:
a generating of the exercise program based, at least in part, on different intensity classes, wherein ratios of the different intensities classes are determined by the aerobic fitness value.
11. A non-transitory computer-readable storage medium carrying one or more sequences of one or more instructions which, when executed by one or more processors, cause an apparatus to at least perform the following steps:
generating, at a mobile phone, an exercise program based, at least in part, on one or more physical parameters input by a user via a user interface;
controlling the user interface so as to provide guidance to a user during performance of the exercise program; and
controlling the user interface so as to display a plurality of fitness disciplines, wherein one or more of the plurality of fitness disciplines may be selected by the user via the user interface.
12. A non-transitory computer-readable storage medium according to claim 11, wherein the apparatus is caused to further perform:
determining an aerobic fitness value for the user based on physiological information input by the user.
13. A non-transitory computer-readable storage medium according to claim 12, wherein at least one of the plurality of fitness disciplines is associated with a variable exercise duration parameter, and wherein the apparatus is caused to further perform:
setting the variable exercise duration parameter on the basis of the physiological information input using the input device.
14. A non-transitory computer-readable storage medium according to claim 13, wherein the physiological information comprises information relating to aerobic fitness for the user.
15. (canceled)
16. (canceled)
17. (canceled)
18. (canceled)
19. (canceled)
20. (canceled)
21. An apparatus comprising:
at least one processor; and
at least one memory including computer program code for one or more programs,
the at least one memory and the computer program code configured to, with the at least one processor, cause the apparatus to perform at least the following,
generate, at a mobile phone, an exercise program based, at least in part, on one or more physical parameters input by a user via a user interface;
control the user interface so as to provide guidance to a user during performance of the exercise program; and
control the user interface so as to display a plurality of fitness disciplines, wherein one or more of the plurality of fitness disciplines may be selected by the user via the user interface.
22. An apparatus according to claim 21, wherein the apparatus is further caused to:
determine an aerobic fitness value for the user based on physiological information input by the user.
23. An apparatus according to claim 22, wherein at least one of the plurality of fitness disciplines is associated with a variable exercise duration parameter, and wherein the apparatus is further caused to:
set the variable exercise duration parameter on the basis of the physiological information input using the input device.
24. An apparatus according to claim 23, wherein the physiological information comprises information relating to aerobic fitness for the user.
25. A method according to claim 23, wherein the apparatus is further caused to:
calculate a duration of the exercise program by multiplying a base duration by a value obtained from the aerobic fitness value for the user.
26. An apparatus of claim 21, wherein the apparatus is a mobile phone further comprising:
user interface circuitry and user interface software configured to facilitate user control of at least some functions of the mobile phone through use of a display and configured to respond to user input; and
a display and display circuitry configured to display at least a portion of a user interface of the mobile phone, the display and display circuitry configured to facilitate user control of at least some functions of the mobile phone.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of monitoring operation of a refrigerant-cycle system, the method comprising:
measuring operating characteristics of the refrigerant-cycle system using a plurality of sensors, the refrigerant-cycle system including a condenser unit and an evaporator unit, the condenser unit including a condenser and a compressor, and the evaporator unit including an evaporator and a fan; and
using a processing system, receiving the measurements from the plurality of sensors and outputting data regarding operation of the refrigerant-cycle system to a remote monitoring system.
2. The method of claim 1 wherein the measuring operating characteristics of the refrigerant-cycle system includes measuring an electrical quantity indicative of power consumption of the refrigerant-cycle system using an electrical sensor.
3. The method of claim 2 further comprising:
calculating an amount of work done by the refrigerant-cycle system; and
calculating an efficiency of the refrigerant-cycle system based on the amount of work done by the refrigerant-cycle system and the power consumption of the refrigerant-cycle system.
4. The method of claim 3 further comprising:
determining, using the remote monitoring system, an expected efficiency of the refrigerant-cycle system based on an identification code of the refrigerant-cycle system; and,
based on the efficiency of the refrigerant-cycle system and the expected efficiency of the refrigerant-cycle system, at least one of:
notifies an owner of the refrigerant-cycle system that the efficiency of the refrigerant-cycle system is low;
notifies the owner of the refrigerant-cycle system to seek service; and
selectively adjusts operation of the refrigerant-cycle system.
5. The method of claim 3 further comprising:
determining, using the remote monitoring system, an expected efficiency of the refrigerant-cycle system based on an identification code of the refrigerant-cycle system; and
determining, using the remote monitoring system, a relative efficiency of the refrigerant-cycle system based on the expected efficiency and the efficiency of the refrigerant-cycle system.
6. The method of claim 5 further comprising notifying an owner of the refrigerant-cycle system that the efficiency of the refrigerant-cycle system is low in response to the relative efficiency of the refrigerant-cycle system being less than a predetermined value.
7. The method of claim 5 further comprising notifying an owner of the refrigerant-cycle system to seek service in response to the relative efficiency of the refrigerant-cycle system being less than a predetermined value.
8. The method of claim 5 further comprising selectively adjusting operation of the refrigerant-cycle system in response to the relative efficiency of the refrigerant-cycle system being less than a predetermined value for at least a predetermined period.
9. The method of claim 5 further comprising transmitting an instruction to a thermostat to increase a setpoint temperature in response to the relative efficiency of the refrigerant-cycle system being less than a predetermined value for a predetermined period, wherein the thermostat controls operation of the condenser unit and the evaporator unit based on the setpoint temperature.
10. The method of claim 3 further comprising displaying the efficiency of the refrigerant-cycle system on a display.
11. The method of claim 3 further comprising providing at least one of charts and plots of data related to the efficiency of the refrigerant-cycle system.
12. A monitoring system for monitoring operation of a refrigerant-cycle system, the monitoring system comprising:
a plurality of sensors measuring operating characteristics of the refrigerant-cycle system, the refrigerant-cycle system including a condenser unit and an evaporator unit, the condenser unit including a condenser and a compressor, and the evaporator unit including an evaporator and a fan; and
a processing system that receives the measurements from the plurality of sensors and that outputs data regarding operation of the refrigerant-cycle system to a remote monitoring system.
13. The monitoring system of claim 12 wherein the plurality of sensors include an electrical sensor measuring an electrical quantity indicative of power consumption of the refrigerant-cycle system.
14. The monitoring system of claim 13 wherein the processing system:
calculates an amount of work done by the refrigerant-cycle system; and
calculates an efficiency of the refrigerant-cycle system based on the amount of work done by the refrigerant-cycle system and the power consumption of the refrigerant-cycle system.
15. The monitoring system of claim 14 further comprising the remote monitoring system, wherein the remote monitoring system:
determines an expected efficiency of the refrigerant-cycle system based on an identification code of the refrigerant-cycle system; and,
based on the efficiency of the refrigerant-cycle system and the expected efficiency of the refrigerant-cycle system, at least one of:
notifies an owner of the refrigerant-cycle system that the efficiency of the refrigerant-cycle system is low;
notifies the owner of the refrigerant-cycle system to seek service; and
selectively adjusts operation of the refrigerant-cycle system.
16. The monitoring system of claim 14 further comprising the remote monitoring system, wherein the remote monitoring system:
determines an expected efficiency of the refrigerant-cycle system based on an identification code of the refrigerant-cycle system; and
determines a relative efficiency of the refrigerant-cycle system based on the expected efficiency and the efficiency of the refrigerant-cycle system.
17. The monitoring system of claim 16 wherein the remote monitoring system notifies an owner of the refrigerant-cycle system that the efficiency of the refrigerant-cycle system is low in response to the relative efficiency of the refrigerant-cycle system being less than a predetermined value.
18. The monitoring system of claim 16 wherein the remote monitoring system notifies an owner of the refrigerant-cycle system to seek service in response to the relative efficiency of the refrigerant-cycle system being less than a predetermined value.
19. The monitoring system of claim 16 wherein the remote monitoring system selectively adjusts operation of the refrigerant-cycle system in response to the relative efficiency of the refrigerant-cycle system being less than a predetermined value for at least a predetermined period.
20. The monitoring system of claim 16 wherein:
the remote monitoring system transmits an instruction to a thermostat to increase a setpoint temperature in response to the relative efficiency of the refrigerant-cycle system being less than a predetermined value for a predetermined period, and
the thermostat controls operation of the condenser unit and the evaporator unit based on the setpoint temperature.
21. The monitoring system of claim 14 wherein the processing system displays the efficiency of the refrigerant-cycle system on a display.
22. The monitoring system of claim 14 wherein the processing system provides at least one of charts and plots of data related to the efficiency of the refrigerant-cycle system.