Author: claimsbot

1. A single use imaging device for use with and communicating with a control unit comprising:
a housing;
an image sensor;
an opening proximate to an optic mount and configured to facilitate transmission of light from said optics to said image sensor;
a memory comprising data representing characteristics of the imaging device;
a heat sink for transferring heat away from the image sensor;
a thermal pad that is in physical contact with said image sensor and said heat sink, such that said thermal pad electrically isolates said image sensor from said heat sink;
wherein said thermal pad is thermally conductive to conduct heat generated by said image sensor to said heat sink; and

an electronic communication circuit configured for providing electronic communication between said imaging device and said control unit.
2. The imaging device of claim 1, wherein said thermal pad is disposed between said image sensor and said heat sink, such that image sensor is electrically isolated from said heat sink.
3. The imaging device of claim 2, wherein said thermal pad is in substantial contact with said image sensor across substantially all of the surface area defined by a surface of the image sensor that faces the heat sink.
4. The imaging device of claim 2, wherein said thermal pad is in substantial contact with said image sensor at a portion that is less than all surface area defined by a surface of the image sensor that faces the heat sink.
5. The imaging device of claim 2, wherein said thermal pad is in substantial contact with said image sensor at a plurality of portions that are less than the entire surface area defined by a surface of the image sensor that faces the heat sink.
6. The imaging device of claim 1, wherein said thermal pad is in substantial contact with a single surface of said heat sink.
7. The imaging device of claim 1, wherein said thermal pad is in substantial contact with a plurality of surfaces of said heat sink.
8. The imaging device of claim 1, wherein said thermal pad is in substantial contact with said heat sink across substantially all surface area defined by the heat sink surfaces facing said thermal pad.
9. The imaging device of claim 1, wherein said thermal pad is in substantial contact with said heat sink at a portion that is less than the entire surface area defined by the heat sink surfaces facing said thermal pad.
10. The imaging device of claim 1, wherein said thermal pad is in substantial contact with said heat sink at a plurality of portions that are less than the entire surface area defined by the heat sink surfaces facing said thermal pad.
11. The imaging device of claim 1, wherein said thermal pad comprises a first portion that is thermally conductive and a second portion that is electrically isolating.
12. The imaging device of claim 1, wherein said thermal pad is flexible.
13. The imaging device of claim 1, wherein said thermal pad is substantially rigid.
14. The imaging device of claim 1, wherein said thermal pad is compressible.
15. The imaging device of claim 14, wherein said thermal pad is compressed between said image sensor and said heat sink.
16. A method for electrically isolating an image sensor in an imaging device while dissipating heat generated by said imaging sensor comprising;
powering on an imaging device comprising:
a housing;
an image sensor;
an opening proximate to an optic mount and configured to facilitate transmission of light from said optics to said image sensor;
a memory comprising data representing characteristics of the imaging device;
a heat sink for transferring heat away from the image sensor;
a thermal pad that is in physical contact with said image sensor and said heat sink, such that said thermal pad electrically isolates said image sensor from said heat sink;
wherein said thermal pad is thermally conductive to conduct heat generated by said image sensor to said heat sink; and
an electronic communication circuit configured for providing electronic communication between said imaging device and a control unit;

transferring heat generated by said imaging sensor to said heat sink via said thermal pad;
maintaining thermal connectivity between said imaging sensor and said heat sink via said thermal pad during the duration of operation; and
powering off said imaging device.
17. The method of claim 16, wherein the method further comprises monitoring thermal conditions of said imaging device; and wherein said imaging device is powered off when said monitoring of the thermal conditions returns a value out side of a predetermined range.
18. The method of claim 16, wherein the method further comprises monitoring thermal conditions of said imaging device; and wherein said imaging device remains powered on when said monitoring of the thermal conditions returns a value that is within a predetermined range.
19. The method of claim 16, wherein said imaging device transmits thermal data to the control unit.
20. The method of claim 19, wherein said control unit transmits an instruction to said imaging device in response to said thermal data.
21. The method of claim 16, wherein thermal data is recorded to said memory within said imaging device.
22. A system for obtaining imagery during a medical procedure comprising:
a single use imaging device comprising:
a housing;
an image sensor;
an opening proximate to an optic mount and configured to facilitate transmission of light from said optics to said image sensor;
a memory comprising data representing characteristics of the imaging device;
a heat sink for transferring heat away from said image sensor;
a thermal pad that is in physical contact with said image sensor and said heat sink, such that said thermal pad electrically isolates said image sensor from said heat sink;
wherein said thermal pad is thermally conductive to conduct heat generated by said image sensor to said heat sink; and

a control unit that electronically communicates with said imaging device.
23. The system of claim 22, wherein said thermal pad is disposed between said image sensor and said heat sink, such that image sensor is electrically isolated from said heat sink.
24. The system of claim 23, wherein said thermal pad is in substantial contact with said image sensor across substantially all of the surface area defined by a surface of the image sensor that faces the heat sink.
25. The system of claim 23, wherein said thermal pad is in substantial contact with said image sensor at a portion that is less than all surface area defined by a surface of the image sensor that faces the heat sink.
26. The system of claim 23, wherein said thermal pad is in substantial contact with said image sensor at a plurality of portions that are less than the entire surface area defined by a surface of the image sensor that faces the heat sink.
27. The system of claim 22, wherein said thermal pad is in substantial contact with a single surface of said heat sink.
28. The system of claim 22, wherein said thermal pad is in substantial contact with a plurality of surfaces of said heat sink.
29. The system of claim 22, wherein said thermal pad is in substantial contact with said heat sink across substantially all surface area defined by the heat sink surfaces facing said thermal pad.
30. The system of claim 22, wherein said thermal pad is in substantial contact with said heat sink at a portion that is less than the entire surface area defined by the heat sink surfaces facing said thermal pad.
31. The system of claim 22, wherein said thermal pad is in substantial contact with said heat sink at a plurality of portions that are less than the entire surface area defined by the heat sink surfaces facing said thermal pad.
32. The system of claim 22, wherein said thermal pad comprises a first portion that is thermally conductive and a second portion that is electrically isolating.
33. The system of claim 22, wherein said thermal pad is flexible.
34. The system of claim 22, wherein said thermal pad is substantially rigid.
35. The system of claim 22, wherein said thermal pad is compressible.
36. The system of claim 35, wherein said thermal pad is compressed between said image sensor and said heat sink.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A storage system for an apparatus that delivers a supply of pressurized breathable air to a patient, the apparatus including a flow generator having at least one of a control panel, a power inlet attachable to a power cord, and an outlet attachable to an air delivery conduit, the storage system comprising:
a container including a first portion and a second portion, the first portion providing a storage compartment adapted to receive the flow generator, and the second portion being movably mounted to the first portion for movement between (1) an open position in which the second portion uncovers the storage compartment to allow access to the storage compartment and (2) a closed position in which the second portion closes the storage compartment to inhibit access to the storage compartment,
wherein at least one of the first and second portions provides at least one opening therethrough that allows access to at least one of the control panel, the power inlet, and the outlet of the flow generator supported by the container when the container is in the closed position.
2. The storage system according to claim 1, further comprising a handle provided to at least one of the first and second portions.
3. The storage system according to claim 1, further comprising at least one additional storage compartment adapted to support at least one of a patient interface, an air delivery conduit, and a power cord.
4. The storage system according to claim 1, wherein at least one of the first and second portions is constructed at least in part of a sound proofing material adapted to muffle sound generated from the flow generator in use.
5. The storage system according to claim 1, wherein the opening is elongated and extends along a side wall of the container.
6. The storage system according to claim 1, wherein the first and second portions provide a base structured to maintain the container in a substantially upright position on a support surface.
7. The storage system according to claim 1, further comprising a cable management system structured to handle the air delivery conduit and the power cord of the apparatus.
8. The storage system according to claim 7, wherein the cable management system includes a rotatable reel.
9. The storage system according to claim 7, wherein the air delivery conduit includes a collapsible spring within its air passage that allows the air delivery conduit to assume a substantially flat condition.
10. A storage system for an apparatus that delivers a supply of pressurized breathable air to a patient, the apparatus including a flow generator having at least one of a control panel, a power inlet attachable to a power cord, and an outlet attachable to an air delivery conduit, the storage system comprising:
a container including a bottom wall and side walls extending from the bottom wall that define a storage compartment having an upwardly facing opening adapted to receive the flow generator;
at least one of the side walls providing at least one opening therethrough to allow access to at least one of the control panel, the power inlet, and the outlet of the flow generator supported by the container.
11. The storage system according to claim 10, wherein the container includes at least one additional storage compartment adapted to support at least one of a patient interface, an air delivery conduit, and a power cord.
12. The storage system according to claim 10, wherein the container is dimensioned to be received within a cabinet drawer.
13. The storage system according to claim 10, wherein the container is dimensioned to be received within a briefcase.
14. The storage system according to claim 10, further comprising a top portion adapted to cover the upwardly facing opening.
15. A stand for supporting a flow generator structured to generate a supply of pressurized breathable air to a patient, the stand comprising:
a base; and
spaced apart arms coupled to the base, the spaced apart arms configured and arranged to engage opposing walls of the flow generator to stably support the flow generator in a generally vertical orientation.
16. The stand according to claim 15, wherein one or both of the arms are adjustable to allow the support of flow generators having various lengths or widths.
17. A flow generator assembly, comprising:
a flow generator structured to generate a supply of pressurized breathable air to a patient; and
the stand according to claim 15.
18. The flow generator assembly according to claim 17, wherein one or both of the arms are adjustable to allow the support of flow generators having various lengths or widths.
19. The flow generator assembly according to claim 17, wherein the flow generator includes a height, a width and a length, and the height andor length are greater than the width.
20. The flow generator assembly according to claim 17, wherein a bottom surface of the flow generator is dimensioned to fit between the arms and to abut the base of the stand, with opposed surfaces of the opposed walls in a length direction of the flow generator being substantially parallel to inner surfaces of the arms.
21. The flow generator assembly according to claim 17, wherein the stand is structured to support the flow generator across its length or width.
22. A flow generator assembly, comprising:
a flow generator structured to generate a supply of pressurized breathable air to a patient; and
a bracket attachable to the flow generator and adapted to mount the flow generator to a bed or a wall adjacent the bed.
23. The flow generator assembly according to claim 22, wherein the bracket is adapted to engage a headboard of the bed.

1. An electric device with multi-screen, comprising:
a plurality of display modules; and
a plurality of flexible printed circuit boards, electrically connected between the display modules.
2. The electric device with multi-screen as recited in claim 1, wherein the display modules comprises:
a plurality of driving circuit boards, wherein each driving circuit board has a driving circuit; and
a plurality of display panels, wherein each display panel is correspondingly disposed on one of the driving circuit boards and electrically connecting to the driving circuit.
3. The electric device with multi-screen as recited in claim 2, wherein the display panels comprise at least one flexible display panel.
4. The electric device with multi-screen as recited in claim 2, wherein the display panels comprise at least one reflective display panel.
5. The electric device with multi-screen as recited in claim 4, wherein the display panels comprise electro-phoretic display panel, electro-wetting display panel or micro electro-mechanical system display panel.
6. The electric device with multi-screen as recited in claim 2, wherein the display panels comprise at least one touch panel.
7. The electric device with multi-screen as recited in claim 2, further comprising at least one radio frequency identification chip, disposed on the one of the driving circuit boards, and electrically connected to the driving circuit of the driving circuit board.
8. The electric device with multi-screen as recited in claim 2, wherein the amount of the display panels is less than the amount of the driving circuit boards.
9. The electric device with multi-screen as recited in claim 1, wherein the display modules are electrically connected to each other as a collar by the flexible printed circuit boards.
10. The electric device with multi-screen as recited in claim 1, further comprising:
a flexible substrate; and
a plurality of driving circuits, formed on the flexible substrate and isolated to each other, wherein each display module is a display panel disposed above one of the driving circuits and electrically connected to the corresponding driving circuit.
11. The electric device with multi-screen as recited in claim 1, wherein the display modules are connected to each other along a first direction.
12. The electric device with multi-screen as recited in claim 11, wherein the display modules are further connected to each other along a second direction.
13. The electric device with multi-screen as recited in claim 12, wherein the first direction is perpendicular to the second direction.
14. The electric device with multi-screen as recited in claim 1, further comprising a controlling module connected between two of the display modules, the controlling module comprising:
a signal receiving unit, used for receiving an input signal;
a signal processing unit, electrically connected to the signal receiving unit for generating a command based on the input signal;
an image signal generating unit, electrically connected to the signal processing unit for generating at least an image signal based on the command;
at least a storage unit, electrically connected to the image signal generating unit for storing the image signal; and
at least a signal transmitting unit, electrically connected to the storage unit for reading the image signal stored in the storage unit and transmitting the image signal to the corresponding one of the display modules.
15. The electric device with multi-screen as recited in claim 14, wherein the controlling module further comprises a switch unit, used to electrically connect the signal transmitting unit to one of the display modules selectively.
16. The electric device with multi-screen as recited in claim 14, wherein the controlling module comprises a plurality of storage units and a plurality of signal transmitting units, each signal transmitting unit is electrically connected to the corresponding one of the storage units.
17. The electric device with multi-screen as recited in claim 14, wherein the signal receiving unit is wireless signal receiver.
18. The electric device with multi-screen as recited in claim 14, wherein the signal receiving unit is wired signal receiver.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A device for reduction of power of electrical components comprising:
a chip as an electrical component;
means for measuring temperature of the chip; and
means for regulating an operating voltage of the chip based on the measured temperature of the chip wherein when said means for measuring the temperature of the chip senses a chip temperature that is less than a predetermined threshold temperature value which represents an idle state of the chip that is a low power state of the chip, said means for regulating the operating voltage of the chip changes the operating voltage of the chip to a minimum allowed voltage value at its idle state, wherein the threshold temperature representing the idle state of the chip is determined based on component speed characteristics of the chip and wherein the minimum allowed voltage and the threshold temperature maintain the component speed characteristics of the chip, while providing significant reduction in power consumption of the chip.
2. The device according to claim 1, wherein the chip is a silicon-based component.
3. The device according to claim 2, wherein the chip is one of a Si component, a Si-germanium component, a gallium arsenide component or other semiconductor component.
4. The device according to claim 1, wherein said means for measuring the temperature of the chip comprises a thermocouple.
5. The device according to claim 1, wherein said means for measuring the temperature of the chip comprises a thermal diode.
6. The device according to claim 1, wherein said means for regulating the operating voltage of the chip comprises an external voltage regulator.
7. The device according to claim 1, wherein said means for regulating the operating voltage of the chip comprises an internal linearswitched voltage regulator.
8. The device according to claim 1, wherein said means for regulating the operating voltage comprises firmware.
9. A device for reduction of power of electrical components comprising:
a chip as an electrical component;
a thermometer that outputs temperature of said chip;
a voltage regulator coupled to the output of the thermometer and to the chip wherein said voltage regulator reduces operating voltage of the chip when the output of the thermometer is less than a threshold temperature representing an idle state of the chip that is a low power state of the chip and said voltage regulator reduces the operating voltage of the electrical component to a minimum allowed voltage value in its idle state when the sensed temperature is below the threshold temperature, wherein the threshold temperature representing the idle state of the chip is determined based on component speed characteristics of the chip and wherein the minimum allowed voltage and the threshold temperature maintain the component speed characteristics of the chip, while providing significant reduction in power consumption of the chip.
10. The device according to claim 9, wherein the chip comprises one of silicon, silicon germanium, gallium arsenide, or other semiconductor material.
11. The device according to claim 9, wherein said thermometer comprises a thermal diode.
12. The device according to claim 9, wherein said voltage regulator comprises an external voltage regulator.
13. The device according to claim 9, wherein said voltage regulator comprises an internal linearswitched voltage regulator.
14. The device according to claim 9, wherein said voltage regulator regulates the operating voltage of the chip using firmware.
15. The device according to claim 9, further comprising a card on which at least two chips are disposed where the thermometer measures the temperature of each chip and the voltage regulator reduces the operating voltage of each respective chip when the measured temperature of the respective chip is less than the respective threshold temperature.
16. The device according to claim 9, further comprising a card on which at least two chips are disposed where the thermometer comprises an individual thermometer to measure the temperature of each chip and the voltage regulator comprises individual chip specific voltage regulators that are respectively associated with one of the at least two chips so that the operating voltage of the at least two chips is reduced when the output of the respective, individual thermometer is less than the respective threshold temperature.
17. The device according to claim 9, further comprising a card on which at least two chips are disposed where the thermometer measures the temperature of each chip and the voltage regulator comprises individual chip specific voltage regulators that are respectively associated with one of the at least two chips so that the operating voltage of the at least two chips is reduced when the output of the respective, individual thermometer is less than the respective threshold temperature.
18. The device according to claim 17, wherein a first voltage regulator reduces the operating voltage of at least two chips and a second voltage regulator reduces the operating voltage of another chip.
19. A method for reduction of power of electrical components, comprising:
measuring temperature of a chip or electrical component while the chip is ON; and
reducing an operating voltage delivered to the chip to a minimum allowed voltage when the measured temperature of the chip drops below a predefined threshold temperature representing an idle state of the chip that is a low power state of the chip wherein the predefined threshold temperature is selected to be a chip temperature below which the chip is presumed to be in the idle state, wherein the threshold temperature representing the idle state of the chip is determined based on component speed characteristics of the chip and wherein the minimum allowed voltage and the threshold temperature maintain the component speed characteristics of the chip, while providing significant reduction in power consumption of the chip.
20. The method according to claim 19, wherein the reduced operating voltage is changed to a nominal operating voltage, when the chip returns to a normal operating mode.
21. A machine-readable storage medium that provides instructions, which when executed by a computing platform, cause said computing platform to perform operations comprising a method for reduction of power of electrical components of:
measuring temperature of an electrical chip while the electrical chip is ON; and
reducing an operating voltage delivered to the chip to a minimum allowed voltage when the measured temperature of the chip drops below a predefined threshold temperature representing an idle state of the chip that is a low power state of the chip, wherein the threshold temperature representing the idle state of the chip is determined based on component speed characteristics of the chip and wherein the minimum allowed voltage and the threshold temperature maintain the component speed characteristics of the chip, while providing significant reduction in power consumption of the chip.
22. The machine-readable storage medium of claim 21, wherein the predefined threshold temperature is selected to be a chip temperature below which the chip is presumed to be in the idle state.
23. The machine-readable storage medium according to claim 21, wherein the reduced operating voltage is changed to a nominal operating voltage, when the chip returns to a normal operating mode.