Author: claimsbot

1. A sealing system configured to seal a housing, the housing having a pressurizable stroke space in relation to a movable rod, the pressurizable stroke space is formed about an axis, the sealing system comprising a seal including:
a) a first dynamic sealing portion configured to seal between the seal and the rod, and
b) a second static sealing portion configured to seal between the seal and the housing,
c) the first and the second sealing portions formed integrally with each other,
d) the first sealing portion merges via a material thin point into the second sealing portion to suppress a flow of a sealing material from the second sealing portion into the first sealing portion when pressurized.
2. The sealing system as claimed in claim 1, wherein the second sealing portion is surrounded in a cross section apart from the material thin point on all sides by the housing and a press-on element in order to build up a predetermined pressure in the second sealing portion.
3. The sealing system as claimed in claim 1, wherein the material thin point has a thickness of less than 0.5 mm.
4. The sealing system as claimed in claim 1, wherein the material thin point has a thickness of less than 0.1 mm.
5. The sealing system as claimed in claim 1, wherein the material thin point has a thickness of less than 0.05 mm.
6. The sealing system as claimed in claim 1, wherein the material thin point encircles the axis as a ring.
7. The sealing system as claimed in claim 6, wherein the material thin point includes a rectangular cross section.
8. The sealing system as claimed in claim 3, wherein the thickness is a smallest distance between two opposite boundary lines in a cross section of the material thin point where the two opposite boundary lines extend perpendicularly to the axis.
9. The sealing system as claimed in claim 1, wherein the first sealing portion extends parallel to the axis and, on an outer side thereof facing away from the rod, has a compression volume connected to the stroke space, in which the first sealing portion presses against the rod at a pressure prevailing in the stroke space.
10. A method for installing a sealing system configured to seal a housing, the housing having a pressurizable stroke space in relation to a movable rod, the pressurizable stroke space is formed about an axis, the sealing system comprising a seal including:
a) a first dynamic sealing portion configured to seal between the seal and the rod, and
b) a second static sealing portion configured to seal between the seal and the housing,
c) the first and the second sealing portions formed integrally with each other,
d) the first sealing portion merges via a material thin point into the second sealing portion to suppress a flow of a sealing material from the second sealing portion into the first sealing portion when pressurized, the method comprising:
i) arranging the seal in a sealing seat where the sealing seat is formed in the housing,
ii) pressing the seal into the sealing seat with a material thin point being produced or dimensionally stabilized between the first and the second sealing portion,
iii) prestressing the second sealing portion, which is surrounded on all sides in a cross section apart from the material sealing point, by pressurization in such a manner that said second sealing portion, by means of plastic deformation, completely fills the space available thereto.
11. The method as claimed in claim 10 further comprising: clamping the second sealing portion and elastically compressing without a material thereof flowing through the thin point.
12. The method as claimed in claim 10 further comprising: providing a first sealing portion on an inner side facing the rod with a sliding element, of which a portion is pressed in when the seal is pressed into the first sealing portion.
13. The method as claimed claim 10 further comprising: during the pressing the seal, subjecting the first portion and the second sealing portion to a pressing-in force parallel to the axis.
14. The method as claimed in claim 10 further comprising: during the pressing the seal, elastically or plastically deforming the first sealing portion with a press-on force directed radially inward with respect to the rod.
15. The method as claimed in claim 10 further comprising: during the pressing the seal, elastically deforming the second sealing portion with a press-on force counter to an enclosure.
16. A sealing system configured to seal a housing, the housing having a pressurizable stroke space in relation to a movable rod, the pressurizable stroke space is formed about an axis, the sealing system comprising a seal including:
a) a first dynamic sealing portion configured to seal between the seal and the rod, and
b) a second static sealing portion configured to seal between the seal and the housing,
c) the first and the second sealing portions formed integrally with each other,
d) a press-on element including an annular projection configured to subject the seal to a press-on force in an axial direction to displace a sealing material of the seal radially in a plastic or elastic manner so that the annular projection produces a material thin point, in which the first sealing portion merges via the material thin point into the second sealing portion to suppress a flow of a sealing material from the second sealing portion into the first sealing portion when pressurized.
17. The sealing system of claim 16 further comprising: a sliding element configured to be pressed into a region of the first sealing portion to form a form-fitting connection in the axial direction between the first sealing portion and the sliding element.
18. The sealing system as claimed in claim 16, wherein the material thin point has a thickness of less than 0.5 mm.
19. The sealing system as claimed in claim 16, wherein the material thin point encircles the axis as a ring and the material thin point includes a rectangular cross section.
20. The sealing system as claimed in claim 19, wherein the thickness is a smallest distance between two opposite boundary lines in a cross section of the material thin point where the two opposite boundary lines extend perpendicularly to the axis.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for ensuring a connection to a configuration protocol server on a data network by a customer premises equipment via a network connection, the method comprising the steps of:
issuing a request for a customer premises equipment network address from the customer premises equipment to the configuration protocol server via the network connection;
the network connection determining whether a connection can be made to the configuration protocol server, and if not, responding to the customer premises equipment by sending a temporary network address and a lease time to the customer premises equipment, whereby the lease time limits the time of validity of the temporary network address;
issuing a request to renew the temporary network address when the lease time expires;
the network connection determining whether a connection can be made to the configuration protocol server, and if not, responding to the customer premises equipment by sending an acknowledge message;
when the network connection determines that the connection can be made to the configuration protocol, the network connection sending a NACK message declining to acknowledge the request to renew the temporary network address;
the customer premises equipment receiving the NACK message and sending a request for the customer premises equipment network address; and
the network connection communicating the request for the customer premises equipment network address to the configuration protocol server.
2. A method as claimed in claim 1, wherein the network connection comprises a communications device for connecting the customer premises equipment to a local network, the local network being connected to the data network via a network interconnection device.
3. A method as claimed in claim 2, wherein the communications device further comprises a temporary configuration server.
4. A method as claimed in claim 2, wherein the network interconnection device further comprises a temporary configuration server.
5. A method as claimed in claim 1, wherein the network connection comprises a communications device for connecting the customer premises equipment to a local network, the local network being connected to the data network via a network interconnection device.
6. A method as claimed in claim 5, wherein the communications device further comprises a temporary configuration server.
7. A method as claimed in claim 5, wherein the network interconnection device further comprises a temporary configuration server.
8. A method for ensuring a connection to a configuration protocol server on a data network by a customer premises equipment via a network connection, the method comprising the steps of:
issuing a request for a customer premises equipment network address from the customer premises equipment to the configuration protocol server via the network connection;
the network connection determining whether a connection can be made to the configuration protocol server, and if not, responding to the customer premises equipment by sending a temporary network address and a lease time to the customer premises equipment, whereby the lease time limits the time of validity of the temporary network address;
issuing a request to renew the temporary network address when the lease time expires; and
the network connection determining whether a connection can be made to the configuration protocol server, and if not, responding to the customer premises equipment by sending an acknowledge message.
9. A method as claimed in claim 8, wherein the network connection comprises a communications device for connecting the customer premises equipment to a local network, the local network being connected to the data network via a network interconnection device.
10. A method as claimed in claim 9, wherein the communications device includes a cable modem, the local network includes a cable network and the network interconnection device includes a cable modem termination system.
11. A method as claimed in claim 8, wherein the configuration protocol server is a dynamic host configuration protocol (DHCP) server.
12. A method as claimed in claim 8, wherein the customer premises equipment network address used by the customer premises equipment is an Internet protocol (IP) address.
13. A method as claimed in claim 8, wherein the lease time is less than 10 seconds.
14. A method as claimed in claim 8, wherein the data network includes a connection to the Internet.
15. A method for ensuring a connection to a configuration protocol server on a data network by a customer premises equipment via a network connection, the method comprising the steps of:
issuing a request for a customer premises equipment network address from the customer premises equipment to the configuration protocol server via the network connection;
the network connection determining whether a connection can be made to the configuration protocol server, and if not, responding to the customer premises equipment by sending a temporary network address and a lease time to the customer premises equipment, whereby the lease time limits the time of validity of the temporary network address;
issuing a request to renew the temporary network address when the lease time expires;
the network connection determining whether a connection can be made to the configuration protocol server, and if not, responding to the customer premises equipment by sending an acknowledge message;
when the network connection determines that the connection can be made to the configuration protocol, the network connection sending a NACK message declining to acknowledge the request to renew the temporary network address;
the customer premises equipment receiving the NACK message and sending a request for the customer premises equipment network address; and
the network connection communicating the request for the customer premises equipment network address to the configuration protocol server.
16. A method as claimed in claim 15, wherein the network connection comprises a communications device for connecting the customer premises equipment to a local network, the local network being connected to the data network via a network interconnection device.
17. A method as claimed in claim 16, wherein the communications device includes a cable modem, the local network includes a cable network and the network interconnection device includes a cable modem termination system.
18. A method as claimed in claim 15, wherein the configuration protocol server is a dynamic host configuration protocol (DHCP) server.
19. A method as claimed in claim 15, wherein the customer premises equipment network address used by the customer premises equipment is an Internet protocol (IP) address.
20. A method as claimed in claim 15, wherein the lease time is less than 10 seconds.
21. A method as claimed in claim 15, wherein the data network includes a connection to the Internet.

1. An integrated circuit capacitor, comprising:
lower and upper capacitor electrodes; and
a capacitor dielectric layer extending between said lower and upper capacitor electrodes, said capacitor dielectric layer comprising a composite of a first dielectric layer extending directly on said lower capacitor electrode, a second dielectric layer extending directly on said upper capacitor electrode and a third dielectric layer extending between the first and second dielectric layers, said third dielectric layer having a higher crystallization temperature characteristic relative to the first and second dielectric layers and a thickness less than respective thicknesses of the first and second dielectric layers;
wherein the third dielectric layer is formed of Al2O3 or AlN; and
wherein the first and second dielectric layers are formed of ZrO2; and
wherein at least one of the first and second dielectric layers comprises nitrogen-doped ZrO2.
2. The capacitor of claim 1, further comprising a capping layer on said upper capacitor electrode, said capping layer comprising a material selected from a group consisting of silicon germanium, polysilicon and tungsten.
3. An integrated circuit capacitor comprising:
a lower electrode and an upper electrode; and
at least one first dielectric layer and at least one second dielectric layer interposed between the lower electrode and the upper electrode, the first dielectric layer extending directly on the lower electrode and the second dielectric layer extending directly on the first dielectric layer opposite to the lower electrode,
wherein the second dielectric layer has a higher crystallization temperature than that of the first dielectric layer and is thinner than the first dielectric layer;
wherein the first dielectric layer is a nitrogen-doped ZrO2 layer and the second dielectric layer is an Al2O3 layer or an AlN layer.
4. The integrated circuit capacitor of claim 3, wherein the first dielectric layer and the second dielectric layer are alternately stacked two and more times.
5. The integrated circuit capacitor of claim 3, wherein the higher crystallization temperature of the second dielectric layer raises the crystallization temperature of the first dielectric layer and the second dielectric layer during a back-end processing of the integrated circuit capacitor.
6. The integrated circuit capacitor of claim 3, wherein the second dielectric layer has a thickness of the range between 0.1 nm and 2 nm.
7. An integrated circuit capacitor, comprising:
lower and upper capacitor electrodes on a substrate; and
a capacitor dielectric layer extending between said lower and upper capacitor electrodes, said capacitor dielectric layer comprising a composite of a first dielectric layer extending directly on said lower capacitor electrode, a second dielectric layer extending directly on said upper capacitor electrode and a third dielectric layer extending between the first and second dielectric layers, said first and second dielectric layers comprising ZrO2 and said third dielectric layer comprising at least one of Al2O3 and AlN and having a thickness less than respective thicknesses of said first and second dielectric layers.
8. The capacitor of claim 7, further comprising a capping layer on said upper capacitor electrode, said capping layer comprising a material selected from a group consisting of silicon germanium, polysilicon and tungsten.
9. An integrated circuit capacitor, comprising:
a lower electrode and an upper electrode on a substrate; and
at least one first dielectric layer and at least one second dielectric layer extending between said lower and upper electrodes, said first dielectric layer extending directly on said lower electrode and said second dielectric layer extending between said first dielectric layer and said upper electrode and contacting said first dielectric layer;
wherein said second dielectric layer is thinner than said first dielectric layer; and
wherein said first dielectric layer is a ZrO2 layer and said second dielectric layer is an Al2O3 layer or an AlN layer having a higher crystallization temperature relative to said first dielectric layer.
10. The capacitor of claim 9, wherein said at least one first dielectric layer comprises two first dielectric layers and said at least one second dielectric layer comprises two second dielectric layers; and wherein said first and second dielectric layers are stacked in an alternating arrangement.
11. The capacitor of claim 9, wherein said second dielectric layer has a thickness in a range from about 0.1 nm to about 2 nm.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A photolithography system comprising:
an illumination source configured to produce electromagnetic radiation; and
a reticle having reduced thermal load, said reticle comprising:
a transparent flat substrate;
dielectric lands placed on said transparent flat substrate; and
electromagnetic radiation blocking lands placed on said dielectric lands;
wherein said dielectric lands have a reflectance greater than about sixty percent,

whereby electromagnetic radiation passing through said transparent flat substrate is reflected from said dielectric lands prior to reaching said electromagnetic radiation blocking lands resulting in less energy being absorbed in the reticle and the thermal load being reduced.
2. The photolithography system of claim 1, wherein said dielectric lands of said reticle comprise alternating layers of quarter-wave film of a higher refractive index and a lower refractive index than a refractive index of the transparent flat substrate.
3. The photolithography system of claim 1, wherein said dielectric lands of said reticle are reflective for any predetermined wavelength of electromagnetic radiation from 157 to 365 nanometers.
4. The photolithography system of claim 1, wherein said electromagnetic radiation blocking lands of said reticle are made of chrome.
5. The photolithography system of claim 1, wherein said electromagnetic radiation blocking lands of said reticle are made of aluminum.
6. The photolithography system of claim 1, wherein said transparent flat substrate of said reticle is selected from the group consisting of quartz, fluoride doped quartz, and calcium fluoride.