1. An apparatus for removing a coating material from a tubing, comprising:
a tool body;
a tubing support having a first roller having a first rim and a second roller having a second rim, wherein the first roller and second roller are accommodated within the body, and wherein the first rim and the second rim stabilize the tubing on the first roller and the second roller;
a slider support;
a slider accommodated with the slider support and generally located above the tubing support;
a blade having an end with at least two cutting edges, said blade attached to the slider, wherein the tubing support, the slider support and the slider are accommodated within the tool body; and
an adjuster attached to the slider support and generally located below the tubing support.
2. The apparatus according to claim 1, wherein the blade has at least two ends, each end having at least two cutting edges.
3. The apparatus according to claim 1, wherein the blade has at least two cutting edges that are sharpened.
4. The apparatus according to claim 2, wherein the at least two cutting edges are sharpened.
5. The apparatus according to claim 1, wherein the adjuster is a rotatable wheel.
6. The apparatus according to claim 1, further comprising a first pin and a second pin which are utilized to accommodate the first roller and the second roller with the tool body.
7. The apparatus according to claim 1, wherein the blade is attached to the slider support by a fastener.
8. The apparatus according to claim 7, wherein the fastener is a screw.
9. An apparatus for removing a coating material from tubing, comprising:
means for positioning the tubing including a first roller and a second roller, wherein the first roller and the second roller each have a rim to stabilize the tubing when the tubing is positioned on the first roller and the second roller;
means for removing the coating material from the tubing, said removing means having an end with at least two cutting edges, said removing means generally located above the positioning means;
means for raising and lowering the removing means;
means for adjusting the raising and lowering means, said adjusting means generally located below said positioning means; and
means for supporting the positioning means, the removing means, the raising and lowering means and the adjusting means with each other as a tool.
10. The apparatus according to claim 9, wherein the means for removing the coating material is a blade.
11. The apparatus according to claim 10, wherein the at least two cutting edges are sharpened.
12. A method for removing a coating material from a tubing, comprising:
placing the tubing on a tubing support accommodated within a tool body;
connecting a blade having an end with at least two cutting edges to a slider and generally locating said slider above the tubing support;
providing an adjuster, wherein the adjuster includes a rotatable wheel, and connecting said adjuster to the slider at a location generally below the tubing support;
lowering the end of the blade onto the tubing until the cutting edges pierce the coating material on the tubing by changing the position of the slider via the adjuster; and
rotating the tool body around the tubing until the coating material is stripped from the tubing.
13. The method according to claim 12, wherein the at least two cutting edges are sharpened.
14. An apparatus for removing a coating material from a tubing, comprising:
a tool body;
a tubing support;
a slider support;
a slider accommodated with the slider support; and
a blade having an end with at least two cutting edges attached to the slider, wherein the tubing support, the slider support, and the slider are accommodated within the tool body.
15. The apparatus according to claim 14, wherein the at least two cutting edges are sharpened.
16. An apparatus for removing a coating material from a tubing, comprising:
a tool body;
a tubing support;
a slider support;
a slider accommodated with the slider support and generally located above the tubing support;
a blade having an end with at least two cutting edges, said blade attached to the slider, wherein the tubing support, the slider support and the slider are accommodated within the tool body; and
an adjuster attached to the slider support and generally located below the tubing support, wherein the adjuster includes a rotatable wheel.
17. The apparatus according to claim 16, wherein the blade is attached to the slider support body by a fastener.
18. The apparatus according to claim 17, wherein the fastener is a screw.
19. The apparatus according to claim 16, wherein the adjuster is a rotatable wheel.
20. The apparatus according to claim 16, wherein the slider support is a shaft.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method for adjusting the frequency of an attenuation pole of a dual-mode band pass filter, the method comprising the steps of:
forming a metal film on a surface of a dielectric substrate or within the dielectric substrate;
arranging a ground electrode such that the ground electrode overlaps with the metal film via at least a part of the dielectric substrate in a thickness direction of the dielectric substrate;
forming at least one opening in the metal film to couple two resonance modes;
forming an inputoutput coupling circuit coupled to the metal film;
forming a coupling portion capacitively coupled to a perimeter of the metal film via a gap;
forming an inputoutput portion coupled to the coupling portion, the inputoutput coupling circuit including the coupling portion and the inputoutput portion; and
moving at least one of the coupling portion and the inputoutput portion in a direction along the perimeter of the metal film for adjusting the frequency of the attenuation pole.
2. The method according to claim 1, wherein the dielectric substrate has a substantially rectangular plate configuration.
3. The method according to claim 1, wherein the metal film has one of a rhombic shape, a square shape, a rectangular shape, and a triangle shape.
4. The method according to claim 1, wherein the opening is formed in such a manner that the center of the opening coincides with the center of the metal film.
5. The method according to claim 1, further comprising the step of moving both of the coupling portion and the inputoutput portion in a direction along the perimeter of the metal film for adjusting the frequency of the attenuation pole.
However, the present invention is not restricted to the first and second preferred embodiments and can variously be modified according to the structure and coupling manner of the inputoutput coupling circuits.
FIGS. 10A and 10B are a schematic plan view and a partially cut-away front sectional view for illustrating a method for adjusting the frequency of an attenuation pole of a dual-mode band pass filter according to a third preferred embodiment of the present invention.
In a dual-mode band pass filter 21, a metal film 3 is embedded in a dielectric substrate 22. On an upper surface 22a of the dielectric substrate 22, inputoutput coupling circuits 25 and 26 are provided. Coupling portions 25a and 26a of the inputoutput coupling circuits 25 and 26 are arranged in such a manner that the portions 25a and 26a overlap with the metal film 3 via a dielectric substrate layer. In other words, in the first preferred embodiment, the inputoutput coupling circuits are flush with the metal film 3 and the coupling portions 5a and 6a are capacitively coupled to the metal film 3. However, as shown in FIGS. 10A and 10B, the inputoutput coupling circuits 25 and 26 may be located at positions that are different from that of the metal film 3. In this case, the dielectric substrate 22 has a multilayer structure that is formed by stacking a plurality of dielectric layers, and the coupling portions 25a and 26a are capacitively coupled to the metal film 3 via the dielectric-substrate layer.
In the third preferred embodiment of the present invention, by changing the coupling points of the inputoutput coupling circuits 25 and 26 and the metal film 3, as shown in the case of the first preferred embodiment, the attenuation-pole frequency can be changed.
In the first preferred embodiment, the coupling portions 5a and 6a are fixed and the positions of the inputoutput portions 5b and 6b are deviated. Alternatively, by moving the positions of the coupling portions 5a and 6a along the sidelines 3b and 3c, the frequency of the attenuation pole can be adjusted. In addition, both of the above two ways of adjusting may be used together. Similarly, in the third preferred embodiment, the frequency of the attenuation pole can be adjusted by changing the positions of the coupling portions 25a and 26a of the inputoutput coupling circuits 25 and 26 andor by deviating positions at which the inputoutput portions 25b and 26b are coupled to the coupling portions 25a and 26a.
Furthermore, as shown in the third preferred embodiment, in a dual-mode band pass filter capable of using the method of the present invention, the metal film may be embedded in the dielectric substrate. In addition, regarding the inputoutput coupling circuits, it is not necessary to form the circuits on the upper surface of the dielectric substrate. The inputoutput coupling circuits may be formed in the dielectric substrate. Additionally, it is not necessary to form the ground electrode 4, as shown in the first preferred embodiment, on the lower surface of the dielectric substrate. The ground electrode 4 may be formed in the dielectric substrate.
FIGS. 11A and 11B are a schematic plan view and a partially cut-away front sectional view for illustrating a method for adjusting the frequency of an attenuation pole according to a fourth preferred embodiment of the present invention.
In this preferred embodiment, a metal film 3 is embedded in a dielectric substrate 2, and inputoutput coupling circuits 35 and 36 defined by inductance coils are disposed on the dielectric substrate 2. The inputoutput coupling circuits 35 and 36 are directly and electrically connected to the metal film 3 via the via-hole electrodes 35a and 36a.
In other words, in the second preferred embodiment, the strip lines 15 and 16 as the inputoutput coupling circuits are connected to the metal film 3 such that the strip lines 15 and 16 are flush with the metal film 3. However, as shown in the fourth preferred embodiment of the present invention, the inputoutput coupling circuits 35 and 36 may be positioned at a height that is different from the height at which the metal film 3 is positioned. In the fourth preferred embodiment of the present invention, as in the case of the second preferred embodiment, the frequency of the attenuation pole can be changed by changing the positions of the via-hole electrodes 35a and 36a, that is, by changing the positions of points at which the inputoutput coupling circuits 35 and 36 are coupled to the metal film 3. In addition, the inputoutput coupling circuits may be embedded in the substrate.
In each of the first to fourth preferred embodiments,
As described above, according to the first to fourth preferred embodiments of the present invention, the metal film for forming a resonator is disposed on the dielectric substrate, and at least one opening is formed in the metal film to couple two resonance modes. Thus, the positions of the points at which the inputoutput coupling circuits are coupled to the metal film are not specifically restricted. As a result, by coupling the two resonance modes, band characteristics required as a dual-mode band pass filter can be obtained.
In the first preferred embodiment of the present invention, the inputoutput coupling circuits include the coupling portions, which are capacitively coupled to the metal film, and the inputoutput portions. Since at least either the coupling portions or the inputoutput portions are moved in a direction along the perimeter of the metal film facing via the gap, the frequency of the attenuation pole can be easily adjusted.
In the method according to the second preferred embodiment of the invention, the inputoutput coupling circuits are preferably defined by inductors. One end of each of the inputoutput coupling circuits is directly and electrically connected to the metal film, and the points at which the inputoutput coupling circuits are coupled to the metal film are moved along the perimeter of the metal film. With this arrangement, the frequency of the attenuation pole of the dual-mode band pass filter can be easily adjusted.
In the third preferred embodiment of the present invention, a dielectric multilayer structure between the metal film and the inputoutput coupling circuits. The inputoutput coupling circuits overlap with the metal film via the dielectric multilayer structure to be capacitively coupled to the metal film. In this arrangement, the frequency of an attenuation pole of the dual-mode band pass filter can easily be adjusted by moving the positions of the inputoutput coupling circuits along the perimeter of the metal film on the dielectric multilayer structure.
In the fourth preferred embodiment of the present invention, the insulating layer having via-hole electrodes is disposed between the inputoutput coupling circuits and the metal film. First side ends of the via-hole electrodes are electrically connected to the inputoutput coupling circuits, and the other ends thereof are electrically connected to the metal film. Thus, the frequency of the attenuation pole of the dual-mode band pass filter can easily be adjusted by moving the positions connecting the via-hole electrodes to the inputoutput coupling circuits and the metal film.
6. A method for adjusting the frequency of an attenuation pole of a dual-mode band pass filter, the method comprising the steps of:
forming a metal film on a surface of a dielectric substrate or within the dielectric substrate;
arranging a ground electrode such that the ground electrode overlaps with the metal film via at least a part of the dielectric substrate in a thickness direction of the dielectric substrate;
forming at least one opening in the metal film to couple two resonance modes; and
forming an inputoutput coupling circuit coupled to the metal film;
wherein the inputoutput coupling circuit includes at least one of a strip line and a microstrip line, one end of the strip line or the microstrip line is directly and electrically connected to the metal film, and a coupling point at which the at least one of the strip line and the microstrip line is connected to the metal film is moved on the perimeter of the metal film for adjusting the frequency of the attenuation pole.
7. The method according to claim 6, wherein the dielectric substrate has a substantially rectangular plate configuration.
8. The method according to claim 6, wherein the metal film has one of a rhombic shape, a square shape, a rectangular shape, and a triangle shape.
9. The method according to claim 6, wherein the opening is formed in such a manner that the center of the opening coincides with the center of the metal film.
10. The method according to claim 6, further comprising the step of moving both of the coupling portion and the inputoutput portion in a direction along the perimeter of the metal film for adjusting the frequency of the attenuation pole.
11. A method for adjusting the frequency of an attenuation pole of a dual-mode band pass filter, the method comprising the steps of:
forming a metal film on a surface of a dielectric substrate having a multilayer structure or with in the dielectric substrate;
arranging a ground electrode such that the ground electrode overlaps with the metal film via at least a part of the dielectric substrate in a thickness direction of the dielectric substrate;
forming at least one opening in the metal film to couple two resonance modes; and
forming an inputoutput coupling circuit coupled to the metal film;
wherein the metal film and the inputoutput coupling circuit are formed on different layers of the dielectric substrate, the inputoutput coupling circuit overlaps with the metal film via the dielectric layer so that the inputoutput coupling circuit is capacitively coupled to the metal film, and a point for coupling the inputoutput coupling circuit to the metal film is moved along the perimeter of the metal film on the dielectric layer for adjusting the frequency of the attenuation pole.
12. The method according to claim 11, wherein the dielectric substrate has a substantially rectangular plate configuration.
13. The method according to claim 11, wherein the metal film has one of a rhombic shape, a square shape, a rectangular shape, and a triangle shape.
14. The method according to claim 11, wherein the opening is formed in such a manner that the center of the opening coincides with the center of the metal film.
15. The method according to claim 11, further comprising the step of moving both of the coupling portion and the inputoutput portion in a direction along the perimeter of the metal film for adjusting the frequency of the attenuation pole.
16. A method for adjusting the frequency of an attenuation pole of a dual-mode band pass filter, the method comprising the steps of:
forming a metal film on a surface of a dielectric substrate or within the dielectric substrate;
arranging a ground electrode such that the ground electrode overlaps with the metal film via at least a part of the dielectric substrate in a thickness direction of the dielectric substrate;
forming at least one opening in the metal film to couple two resonance modes;
forming an inputoutput coupling circuit coupled to the metal film; and
forming an insulating layer having a via-hole electrode between the inputoutput coupling circuit and the metal film;
wherein one end of the via-hole electrode is electrically connected to the inputoutput coupling circuit and the other end thereof is electrically connected to the metal film, positions for connecting the via-hole electrode to the inputoutput coupling circuit and the metal film is moved along the perimeter of the metal film for adjusting the frequency of the attenuation pole.
17. The method according to claim 16, wherein the dielectric substrate has a substantially rectangular plate configuration.
18. The method according to claim 16, wherein the metal film has one of a rhombic shape, a square shape, a rectangular shape, and a triangle shape.
19. The method according to claim 16, wherein the opening is formed in such a manner that the center of the opening coincides with the center of the metal film.
20. The method according to claim 16, further comprising the step of moving both of the coupling portion and the inputoutput portion in a direction along the perimeter of the metal film for adjusting the frequency of the attenuation pole.