Author: claimsbot

1. A porous anode, comprising:
a porous first ceramic material; and
an electronically conductive material disposed along the inner walls of at least one pore of the porous first ceramic material,
the electronically conductive material comprising a second ceramic material; the anode being produced by
adding a salt of the second ceramic material to the porous first ceramic material;
heating the resulting structure so as to give rise to the porous anode comprising the electronically conductive material being disposed along the inner walls of the pores of the porous ceramic first material, and

there being substantially no metal added to the anode.
2. The anode as claimed in claim 1, wherein the first ceramic material is selected from the group consisting of YSZ, Gd- and Sm-doped ceria, Sc-doped ZrO2, doped LaGaMnO, and mixtures thereof.
3. The anode as claimed in claim 2, wherein the first ceramic material is YSZ.
4. The anode as claimed in claim 1, wherein the second ceramic material is selected from the group consisting of ceria, Gd or Sm-doped ceria, LaCrO3, SrTiO3, Y-doped SrTiO3, Sr-doped LaCrO3, and mixtures thereof.
5. The anode as claimed in claim 4, wherein the second ceramic material is ceria.
6. The anode as claimed in claim 4, wherein the second ceramic material is LaCrO3.
7. The anode as claimed in claim 6, wherein the second ceramic material is Sr-doped LaCr03.
8. The porous anode according to claim 1, wherein the porous first ceramic material is sintered to an electrolyte.
9. The porous anode according to claim 1, wherein the porous first ceramic material is bonded to an electrolyte.
10. A solid oxide fuel cell comprising:
the anode of claim 1;
a cathode; and
an electrolyte disposed at least partially between the cathode and the anode.
11. The solid oxide fuel cell as claimed in claim 10, wherein the cathode is comprised of material selected from the group consisting of Sr-doped LaMnO3, LaFeO3, LaCoO3, metals selected from Fe and Ag, and mixtures thereof.
12. The solid oxide fuel cell as claimed in claim 10, wherein the electrolyte is selected from the group consisting of YSZ, Sc-doped ZrO2, Gd- and Sm-doped CeO2, LaGaMnO, and mixtures thereof.
13. The solid oxide fuel cell as claimed in claim 10, wherein the first ceramic material of the anode is selected from the group consisting of YSZ, Gd- and Sm-doped ceria, Sc-doped ZrO2, doped LaGaMnO, and mixtures thereof.
14. The solid oxide fuel cell as claimed in claim 13, wherein the first ceramic material is YSZ.
15. The solid oxide fuel sell as claimed in claim 10, wherein no metal is used in making the anode.
16. The solid oxide fuel cell as claimed in claim 10, wherein the second ceramic material used in the anode is selected from the group consisting of ceria, doped ceria such as Gd or Sm-doped ceria, LaCrO3, SrTiO3, Y-doped, SrTiO3, Sr-doped LaCrO3, and mixtures thereof.
17. The solid oxide fuel cell as claimed in claim 16, wherein the second ceramic material is ceria.
18. The solid oxide fuel cell as claimed in claim 17, wherein the
second ceramic material is Sr-doped LaCrO3.
19. A porous anode, comprising:
a porous first ceramic material; and
an electronically conductive material disposed along the inner walls of at least one pore of the porous first ceramic material,
the electronically conductive material comprising a second ceramic material;

the anode being produced by
adding a salt of the second ceramic material to the porous first ceramic material;
heating the resulting structure so as to give rise to the porous anode,
the porous anode comprising electronically conductive material disposed along the inner walls of the pores of the porous ceramic first material,
the anode containing less than about 5% weight metal, based on the total weight of the anode.
20. The porous anode according to claim 19, wherein the porous first ceramic material is sintered to an electrolyte.
21. The porous anode according to claim 19, wherein the porous first ceramic material is bonded to an electrolyte.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A sensor unit comprising a sensor for correcting detection signals using initial calibration parameters with a working voltage supplied thereto, and a housing fixing in position a circuit board on which the sensor is mounted, said sensor being configured to write the initial calibration parameters with a calibration voltage that is higher than the working voltage supplied to an input end of the sensor,
wherein the sensor unit further comprises a voltage stabilizing circuit for stabilizing a voltage value of a supply power source to said working voltage, and wiring for supplying said calibration voltage to the sensor, said voltage stabilizing circuit and said wiring being provided parallel to each other between the input end of the sensor and a power source connecting end for the sensor on the circuit board, and a switching portion which can disconnect the wiring, wherein an access hole is formed in the housing through which the switching portion is accessible to disconnect the wiring.
2. The sensor unit of claim 1 wherein said wiring comprises a lead wire and wherein said switching portion comprises a redundant portion of said wiring.
3. The sensor unit of claim 1 wherein said switching portion comprises a switch for opening and closing the wiring.
4. The sensor unit of claim 2 further comprising a fixing member configured to close the access hole, thereby keeping the switching portion in a disconnected position.
5. The sensor unit of claim 4 wherein said fixing member is an insulating and waterproof packing material.
6. The sensor unit of claim 5 wherein said packing material is made of at least one of silicon resin, urethane resin and epoxy resin.
7. The sensor unit of claim 5 wherein the sensor is mounted on one side of the circuit board, wherein the access hole faces the other side of the circuit board, wherein the switching portion is located in the access hole, and wherein the housing has a board support surface supporting the other side of the circuit board around the access hole.
8. The sensor unit of claim 1 wherein the housing supports a shaft and bearings, and wherein said sensor constitutes a non-contact type rotary encoder in cooperation with an encoder that rotates together with the shaft.
9. The sensor unit of claim 3 further comprising a fixing member configured to close the access hole, thereby keeping the switching portion in a disconnected position.
10. The sensor unit of claim 6 wherein the sensor is mounted on one side of the circuit board, wherein the access hole faces the other side of the circuit board, wherein the switching portion is located in the access hole, and wherein the housing has a board support surface supporting the other side of the circuit board around the access hole.
11. The sensor unit of claim 2 wherein the housing supports a shaft and bearings, and wherein said sensor constitutes a non-contact type rotary encoder in cooperation with an encoder that rotates together with the shaft.
12. The sensor unit of claim 3 wherein the housing supports a shaft and bearings, and wherein said sensor constitutes a non-contact type rotary encoder in cooperation with an encoder that rotates together with the shaft.
13. The sensor unit of claim 4 wherein the housing supports a shaft and bearings, and wherein said sensor constitutes a non-contact type rotary encoder in cooperation with an encoder that rotates together with the shaft.
14. The sensor unit of claim 5 wherein the housing supports a shaft and bearings, and wherein said sensor constitutes a non-contact type rotary encoder in cooperation with an encoder that rotates together with the shaft.
15. The sensor unit of claim 6 wherein the housing supports a shaft and bearings, and wherein said sensor constitutes a non-contact type rotary encoder in cooperation with an encoder that rotates together with the shaft.
16. The sensor unit of claim 7 wherein the housing supports a shaft and bearings, and wherein said sensor constitutes non-contact type rotary encoder in cooperation with an encoder that rotates together with the shaft.

1. A system on chip (SoC) with a low power mode, the SoC comprising:
a power part supplying a main clock signal and controlling analog and digital power supply at a normal mode and supplying a sub clock signal and turning analog power off at a low power mode;
a radio frequency (RF) part generating the main clock signal at the normal mode and stopping operation at the low power mode, under the control of the power part; and
a control part operating according to the main clock signal at the normal mode and operating according to the sub clock signal at a low power mode, under to the control of the power part.
2. The SoC of claim 1, wherein the power part comprises:
a power controller controlling the supply of the main clock signal together with the supply of the analog and digital power at the normal mode and controlling the supply of the sub clock signal together with turning the analog power off at the low power mode;
a sub clock generator generating the sub clock signal; and
a clock selector selecting the main clock signal at the normal mode, selecting the sub clock signal at the low power mode, and supplying the selected one to the control part.
3. The SoC of claim 2, wherein the sub clock generator generates the sub clock signal having a lower frequency than that of the main clock signal.
4. The SoC of claim 1, wherein the RF part comprises:
an analog regulator operating under the control of the power part;
a main clock generator generating the main clock signal according to an operation voltage from the analog regulator; and
an RF transceiver transmitting and receiving a preset RF signal.
5. The SoC of claim 1, wherein the control part comprises:
a digital regulator operating under the control of the power part;
a main controller operating according to the main clock signal at the normal mode and operating according to the sub clock signal at the low power mode, under the control of the power part; and
an interface connected to the main controller and processing data transfer with an external peripheral device.
6. A method of driving an SoC comprising a power part, an RF part, and a control part, the method comprising:
performing, at the power part, a normal mode comprising selecting a main clock signal generated at the RF part, supplying the selected main clock signal to the control part, and supplying power to the RF part and the control part;
determining whether a low power mode is selected and performing the normal mode when the low power mode is not selected;
performing, when the low power mode is selected, the low power mode comprising selecting a sub clock signal, supplying the selected sub clock signal to the control part, and stopping power supply of the RF part; and
determining whether it is selected to release the low power mode, performing the low power mode when it is selected not to release the low power mode, and performing the normal mode when it is selected to release the low power mode.
7. The method of claim 6, further comprising:
determining whether an end is selected when it is selected to release the low power mode;
performing the normal mode when the end is not selected; and
ending an entire process when the end is selected.
8. The method of claim 6, wherein the power part controls analog and digital power supply together with supplying the main clock signal at the normal mode and turns analog power off together with supplying the sub clock signal at the low power mode.
9. The method of claim 8, wherein the RF part operates and generates the main clock signal at the normal mode, under the control of the power part.
10. The method of claim 9, wherein the control part operates according to the main clock signal at the normal mode and operates according to the sub clock signal at the low power mode, under the control of the power part.
11. The method of claim 10, wherein the power part comprises:
a power controller controlling the supply of the main clock signal together with the supply of the analog and digital power at the normal mode and controlling the supply of the sub clock signal together with turning the analog power off at the low power mode;
a sub clock generator generating the sub clock signal; and
a clock selector selecting the main clock signal at the normal mode, selecting the sub clock signal at the low power mode, and supplying the selected one to the control part.
12. The method of claim 11, wherein the sub clock generator generates the sub clock signal having a lower frequency than that of the main clock signal.
13. The method of claim 10, wherein the RF part comprises:
an analog regulator operating under the control of the power part;
a main clock generator generating the main clock signal according to an operation voltage from the analog regulator; and
an RF transceiver transmitting and receiving a preset RF signal.
14. The method of claim 10, wherein the control part comprises:
a digital regulator operating under the control of the power part;
a main controller operating according to the main clock signal at the normal mode and operating according to the sub clock signal at the low power mode, under the control of the power part; and
an interface connected to the main controller and processing data transfer with an external peripheral device.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An artificial nail, comprising:
a nail platform having a top surface, a bottom surface, and a thickness defined between the top surface and the bottom surface;
electroluminescence material connected to the nail platform; and
an electric circuit electrically connected to the electroluminescence material, the electric circuit including a driver module disposed on the nail platform providing alternating current to the electroluminescence material, and the driver module is disposed above or below the electroluminescence material.
2. An artificial nail according to claim 1, wherein the electroluminescence material is disposed on the top surface of the nail, and the electroluminescence material covers the entire area of the top surface.
3. An artificial nail according to claim 1, wherein the electroluminescence material is embedded in the thickness of the nail platform.
4. An artificial nail according to claim 1, wherein le nail is configured as an artificial fingernail or an artificial toenail.
5. An artificial nail according to claim 1, wherein the electroluminescence material is an electroluminescent film.
6. An artificial nail according to claim 5, comprising a masking material disposed on the electroluminescent film.
7. An artificial nail according to claim 1, wherein the electroluminescence material is disposed on the top surface of the nail platform and further comprising electroluminescence material on the bottom surface of the nail platform.
8. An artificial nail according to claim 1, further comprising a light emitting diode connected to the nail platform.
9. A nail decorating product, comprising:
a nail platform having a first major surface, a second major surface generally opposed to the first major surface, and a thickness defined between the first and second major surfaces:
an electroluminescence material connected to the nail platform;
an electric circuit electrically connected to the electroluminescence material, the electric circuit including a driver module on the nail platform that converts direct current into alternating current the driver module is disposed above or below the electroluminescence material, a direct current power source, and a switch that controls the flow of current to the electroluminescence material,
10. A nail decorating product according to claim 9, wherein the power source is replaceable.
11. A nail decorating product according to claim 9, wherein the power source is rechargeable.
12. A nail decorating product according to claim 9, wherein the power source is a battery.
13. A nail decorating product according to claim 9, wherein the switch. is at least one of a light emitting diode-type switch, a leaf-type switch, a magnet switch, or a mercury switch.
14. A nail decorating product according to claim 9, wherein the nail is configured as an artificial fingernail or an artificial toenail.
15. A nail decorating product according to claim 9, wherein the electroluminescence material is an electroluminescent film, and further comprising a protective layer over the electroluminescent film.
16. The nail decorating product of claim 9, wherein the electroluminescence material is disposed on the first major surface which is a top surface of the nail platform, and the electroluminescence material covers the entire area of the top surface.