Author: claimsbot

1. A polishing method comprising;
a process of preparing a substrate having
an interlayer insulating layer carrying a surface composed of a concave portion and a convex portion,
a barrier layer coating the interlayer insulating layer along its surface, and
a conductive substance layer filling the concave portion to coat the barrier layer,

a first polishing process of polishing the conductive substance layer to expose the barrier conductor layer on the convex portion of the interlayer insulating layer and the conductive substance layer filling the concave portion of the interlayer insulating layer,
a second polishing process of polishing the exposed barrier layer and the exposed conductive substance layer on the concave portion to expose the convex portion of the interlayer insulating layer, the barrier layer coating the concave portion of the interlayer insulating layer and the conductive substance layer filling the concave portion while feeding a polishing slurry, and
a third polishing process of over polishing a part of the convex portion of the interlayer insulating layer,
wherein the polishing slurry comprises a surfactant, a metal oxide dissolving agent and water.
2. The polishing method according to claim 1, wherein the second polishing process and the third polishing process are conducted in one step.
3. The polishing method according to claim 1, wherein the surfactant is at least one selected from nonionic surfactants and anionic surfactants.
4. The polishing method according to claim 1, wherein the surfactant is at least one selected from perfluoroalkanesulfonic acids and derivatives thereof.
5. The polishing method according to claim 1, wherein the surfactant is contained in a proportion of 0.00001 to 20 wt %.
6. The polishing method according to claim 1, wherein the polishing slurry further comprises an organic solvent.
7. The polishing method according to claim 1, wherein the polishing slurry further comprises abrasive, wherein the surface of the abrasive is modified with an alkyl group.
8. A polishing method comprising:
a process of preparing a substrate having
an interlayer insulating layer carrying a surface composed of a concave portion and a convex portion,
a barrier layer coating the interlayer insulating layer along its surface, and
a conductive substance layer filling the concave portion to coat the barrier layer,

a first polishing process of polishing the conductive substance layer to expose the barrier conductor layer on the convex portion of the interlayer insulating layer and the conductive substance layer filling the concave portion of the interlayer insulating layer,
a second polishing process of polishing the exposed barrier layer and the exposed conductive substance layer on the concave portion to expose the convex portion of the interlayer insulating layer, the barrier layer coating the concave portion of the interlayer insulating layer and the conductive substance layer filling the concave portion while feeding a polishing slurry, and
a third polishing process of over polishing a part of the convex portion of the interlayer insulating layer,
wherein the polishing slurry comprises an organic solvent, a metal oxide dissolving agent and water.
9. The polishing method according to claim 8, wherein the second polishing process and the third polishing process are conducted in one step.
10. The polishing method according to claim 8, wherein the polishing slurry further comprises abrasive, wherein the surface of the abrasive is modified with an alkyl group.
11. A polishing method comprising:
a process of preparing a substrate having
an interlayer insulating layer carrying a surface composed of a concave portion and a convex portion,
a barrier layer coating the interlayer insulating layer along its surface, and
a conductive substance layer filling the concave portion to coat the barrier layer,

a first polishing process of polishing the conductive substance layer to expose the barrier conductor layer on the convex portion of the interlayer insulating layer and the conductive substance layer filling the concave portion of the interlayer insulating layer,
a second polishing process of polishing the exposed barrier layer and the exposed conductive substance layer on the concave portion to expose the convex portion of the interlayer insulating layer, the barrier layer coating the concave portion of the interlayer insulating layer and the conductive substance layer filling the concave portion while feeding a polishing slurry, and
a third polishing process of over polishing a part of the convex portion of the interlayer insulating layer,
wherein the polishing slurry comprises abrasive, wherein the surface of the abrasive is modified with an alkyl group, and water.
12. The polishing method according to claim 11, wherein the second polishing process and the third polishing process are conducted in one step.
13. The polishing method according to claim 11, wherein said abrasive, wherein the surface of the abrasive is modified with an alkyl group, is at least one selected from silica, alumina, ceria, titania, zirconia and germania, wherein the surface is modified with an alkyl group.
14. The polishing method according to claim 11, wherein the polishing slurry further comprises a metal oxide dissolving agent.
15. The polishing method according to claim 11, wherein the polishing slurry further comprises at least one selected from a surfactant an organic solvent.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A solid-state imaging device comprising:
an imaging pixel region where a plurality of imaging pixels is disposed;
a vertical selecting circuit for outputting pixel signals from imaging pixels of respective columns on a selected row of the imaging pixel region to vertical signal lines provided respectively for the columns;
charge integrating amps provided respectively for the vertical signal lines of the columns so as to receive inputs of pixel signals from imaging pixels of the respective columns;
holding elements that allow the input pixel signals to be held in the charge integrating amps even in periods when the charge integrating amps are in a standby state; and
a horizontal selecting circuit for transferring pixel signals output from the respective charge integrating amps by a horizontal signal line,
wherein,
the charge integrating amps have feedback capacitors implemented by variable capacitors.
2. A solid-state imaging device comprising:
an imaging pixel region where a plurality of imaging pixels is disposed;
a vertical selecting circuit for outputting pixel signals from imaging pixels of respective columns on a selected row of the imaging pixel region to vertical signal lines provided respectively for the columns;
amps provided respectively for the vertical signal lines of the columns so as to receive inputs of pixel signals from imaging pixels of the respective columns;
a plurality of horizontal signal lines;
a horizontal selecting circuit for assigning pixel signals held by the amps of the respective columns to the plurality of horizontal signal lines so that the pixel signals are transferred by the plurality of horizontal signal lines; and
a multiplexer for sequentially selecting the plurality of horizontal signal lines to generate serial data including output pixel signals based on the pixel signals transferred by the plurality of horizontal signal lines,
wherein,
shielding lines that are based on a reference potential of the multiplexer are provided between the plurality of horizontal signal lines.
3. A solid-state imaging device comprising:
an imaging pixel region where a plurality of imaging pixels is disposed;
a vertical selecting circuit for outputting pixel signals from imaging pixels of respective columns on a selected row of the imaging pixel region to vertical signal lines provided respectively for the columns;
amps provided respectively for the vertical signal lines of the columns so as to receive inputs of pixel signals from imaging pixels of the respective columns;
a plurality of horizontal signal lines;
a horizontal selecting circuit for assigning pixel signals held by the amps of the respective columns to the plurality of horizontal signal lines so that the pixel signals are transferred by the plurality of horizontal signal lines;
a multiplexer for sequentially selecting the plurality of horizontal signal lines to generate serial data including output pixel signals based on the pixel signals transferred by the plurality of horizontal signal lines; and
a reference-potential generating unit for generating a reference potential based on a black level of the pixel signals output through the horizontal signal lines, wherein the reference potential is used as a reference potential for an output amp of the multiplexer.
4. A solid-state imaging device comprising:
an imaging pixel region where a plurality of imaging pixels is disposed;
a vertical selecting circuit for outputting pixel signals from imaging pixels of respective columns on a selected row of the imaging pixel region to vertical signal lines provided respectively for the columns;
amps provided respectively for the vertical signal lines of the columns so as to receive inputs of pixel signals from imaging pixels of the respective columns;
a plurality of horizontal signal lines; and
a horizontal selecting circuit for assigning pixel signals held by the amps of the respective columns to the plurality of horizontal signal lines so that the pixel signals are transferred by the plurality of horizontal signal lines,
wherein,
the amps are charge integrating amps, the charge integrating amps having feedback capacitors implemented by variable capacitors.

1. A method for a transaction card franchiser providing email notification for transaction card customization as a stand-in service on behalf of a transaction card issuer, comprising the steps of:
the transaction card franchiser receiving a customized transaction card image, wherein the customized transaction card image is submitted for approval by a transaction card applicant to the transaction card issuer;
the transaction card franchiser storing the customized image on a database of the transaction card franchiser;
the transaction card franchiser providing email information of the applicant to an email generation engine as a stand-in service on behalf of the transaction card issuer, wherein the email information of the applicant was received from the transaction card issuer;
the transaction card franchiser providing a transaction card issuer access portal that provides access to the database to the transaction card issuer and allows the transaction card issuer to review the customized image submitted by the applicant;
the transaction card franchiser receiving an approval or rejection of the customized image, wherein the approval or rejection is determined by the transaction card issuer; and
the transaction card franchiser generating an approval or rejection email and sending the email to the applicant.
2. The method of claim l, wherein the customized image is submitted for approval by the transaction card applicant using a card customization services website of the transaction card issuer.
3. The method of claim 2, wherein the applicant is prompted to provide the email information along with the customzied image.
4. The method of claim 1 , wherein an image reviewer of the transaction card issuer approves or rejects the customized image based on predetermined image guidelines.
5. The method of claim 1, wherein the approval or rejection email comprises an automatically generated, pre-formatted, approval or rejection email.
6. The method of claim l, further comprising the step of generating an audit trail of the customized image and emailing the audit trail to the issuer and the applicant.
7. The method of claim 1, further comprising the transaction card franchiser receiving account information about the applicant and merging the customized image and the account information to generate a composite merged file.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electronic apparatus comprising:
a metal core substrate having a first surface on which a first electrode is formed and a second surface opposite to the first surface, the metal core substrate is provided with a core member interposed between the first surface and the second surface, a first wiring layer constituted by an insulating layer formed on said core member at a side of the first surface and a conductive layer connected to the first electrode, and a second wiring layer constituted by an insulating layer formed on said core member at a side of the second surface and a conductive layer connected to a second electrode formed on the second surface of the metal core substrate;
an electronic part having a first main surface on which a terminal is formed and a second main surface opposite to the first main surface; and
a printed circuit board having a first side on which a third electrode soldered to the second electrode of the metal core substrate is formed and a second side opposite to the first side, a metal plate is provided at the second side, wherein:
the core member has a window filled with an insulating material,
the metal core substrate has a first via hole formed in the first surface of the metal core substrate and exposing the core member, a second via hole formed in the second surface of the metal core substrate and exposing the core member, and a through hole extended through the insulating material filled in the window of the core member and electrically connecting the conductive layer of the first wiring layer and the conductive layer of the second wiring layer formed on the second surface of the metal core substrate,
the electronic part is disposed in the first via hole so that the second main surface is in contact with a surface of the core member exposed by the first via hole and the terminal is connected to the first electrode by a bonding wire,
a first heat radiating electrode is provided in the second via hole to be in contact with another surface of the core member exposed by the second via hole,
a second heat radiating electrode is provided in the printed circuit board and extended between the first side and the second side of the printed circuit board, and
the first heat radiating electrode is connected to the second heat radiating electrode via a solder so that heat generated by the electronic part is radiated through the core member, the first heating radiating electrode, the solder, and the second heat radiating electrode in this order toward the metal plate.
2. An electronic apparatus according to claim 1, wherein
the metal plate provided at the second side of the printed circuit board is formed of a material selected from a group consisting of an iron series alloy containing at least any one of nickel, chrome, cobalt and aluminum; an iron series composite material obtained by applying a copper clad to the iron series alloy; tungsten; copper; molybdenum; tantalum; nickel; and aluminum.
3. An electronic apparatus according to claim 1, wherein
the second heat radiating electrode is formed of a solder charged in a via hole which is formed in the printed circuit board and extended between the first side and the second side thereof.
4. An electronic apparatus according to claim 1, wherein
the second heating radiating electrode is formed of a solder or a copper provided in the second via hole formed in the metal core substrate.
5. An electronic apparatus according to claim 1, wherein
the core member is a metal plate to which a copper plating is applied.