Author: claimsbot

1. A lead pin, comprising: a shaft portion; and
a connection head portion provided to a top end side of the shaft portion, and having a diameter which is larger than a diameter of the shaft portion; wherein the connection head portion includes a bonding surface on an opposite side to the shaft portion side, and the bonding surface includes a flat surface provided in a center part, and extends to a convex surface which is provided in substantially a first ring shape at an outer periphery of the flat surface such that the flat surface is continuous with and smoothly joins the convex surface, wherein a peripheral edge of the flat surface and an inside edge of the convex surface meet at an identical height position and the flat surface does not protrude from the convex surface, the convex surface having a rounded portion with a radius R in substantially a convex shape, the convex surface extending from the peripheral edge of the flat surface to an inclining surface which is provided in substantially a second ring shape at an outside of the convex surface and a height of the inclining surface is lowered toward an outside gradually, the inclining surface widening toward the outside gradually, and wherein a diameter of the flat surface is larger than a diameter of a shaft portion.
2. The lead pin according to claim 1, wherein the inclining surface is a concave surface having a rounded portion with a radius R2 in substantially a concave shape.
3. The lead pin according to claim 1, wherein the inclining surface is straight along a radial cross section.
4. The lead pin according to claim 1, wherein the radius R is set in a range of 0.5 H to H, when H is a thickness of the connection head portion.
5. A wiring substrate with lead pin, comprising:
the lead pin set forth in claim 1; and
a wiring substrate including a pin connection portion; wherein the connection head portion of the lead pin is connected to the pin connection portion of the wiring substrate via a solder layer.
6. The wiring substrate with lead pin, according to claim 5, wherein the wiring substrate includes a chip connection portion on an opposite surface to a surface on which the pin connection portion is provided, and a semiconductor chip is connected to the chip connection portion of the wiring substrate by a reflow soldering.
7. The wiring substrate with lead pin, according to claim 5, wherein the solder layer exists only on a bonding surface side of the connection head portion of the lead pin.
8. A method of manufacturing a wiring substrate with lead pin, comprising:
preparing the lead pin set forth in claim 1, and
a wiring substrate including a pin connection portion on one surface and a chip connection portion on the other surface;
connecting the connection head portion of the lead pin to the pin connection portion via a solder layer in a state such that the pin connection portion of the wiring substrate is directed upward; and
connecting a semiconductor chip to the chip connection portion by a reflow soldering in a state that the chip connection portion of the wiring substrate is directed upward, and simultaneously making the solder layer connecting the lead pin reflow in a state that the lead pin hangs in midair under the wiring substrate.
9. The method of manufacturing a wiring substrate with lead pin, according to claim 8, wherein, in the step of making the solder layer connecting the lead pin reflow, an inclination of the lead pin which is fitted with an inclined state from a perpendicular direction is corrected toward the perpendicular direction side based on a reflow of the solder layer and gravitation.
10. The lead pin according to claim 1, wherein the inclining surface is a concave surface or straight along a radial cross section.
11. The lead pin according to claim 1, wherein the height is a height along an axial direction of the shaft portion.
12. The lead pin according to claim 1, wherein the radius R is a radius of substantially a cross section of a toroidal shape.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1-22. (canceled)
23. The process of claim 40, wherein said liquid plasticizer is selected from the group consisting of water; glycerol; propylene glycol; aqueous solutions of glycerol, propylene glycol, monosaccharides, and disaccharides; and invert and high fructose corn syrups.
24. The process of claim 40, wherein said liquid plasticizer is water.
25. The process of claim 40, further comprising cooling said extruded mixture.
26. The process of claim 40, wherein said encapsulate is selected from the group consisting of medications, pesticides, vitamins, preservatives, and flavoring agents.
27. The process of claim 40, wherein said encapsulate is a flavoring agent.
28. The process of claim 27, wherein said flavoring agent is selected from the group consisting of natural extracts, oleoresins, essential oils, protein hydrolysates, aqueous reaction flavors, compounded natural flavors, and artificial flavors.
29. The process of claim 27, wherein said flavoring agent comprises a plasticizer or an emulsifier.
30. The process of claim 40, wherein said extruder is a twin screw extruder.
31-39. (canceled)
40. A process for preparing an encapsulation composition, comprising:
(A) an encapsulate, encapsulated in:
(B) a glassy matrix, said matrix comprising:
60 to 99% by weight, based on the total weight of said matrix (B), of larch gum; and

1 to 40% by weight, based on the total weight of said matrix (B), of a low molecular weight carbohydrate or polyol, wherein said low molecular weight carbohydrate or polyol is selected from the group consisting of glucose, sucrose, maltose, lactose, 42 D.E. corn syrup solid, 36 D.E. corn syrup solid, erythritol, lactitol, mannitol, sorbitol, maltitol, isomalt, xylitol, hydrogenated corn syrup, hydrogenated glucose syrup, hydrogenated maltose syrup, hydrogenated lactose syrup, and a mixture thereof,
and wherein said glassy matrix has a glass transition temperature of from room temperature to 55.7\xb0 C.;
said process comprising:
(i) mixing matrix (B) with a liquid plasticizer and encapsulate (A) in an extruder, to obtain a melted mixture which comprises encapsulate (A) and matrix (B); and
(ii) extruding said melted mixture, to obtain an extruded mixture.
41. The process of claim 40, wherein said matrix (B) comprises:
60 to 80% by weight, based on the total weight of said matrix (B), of larch gum; and
20 to 40% by weight, based on the total weight of said matrix (B), of said low molecular weight carbohydrate or polyol.
42. The process of claim 40, wherein said glassy matrix has a glass transition temperature of from 30\xb0 C. to 55.7\xb0 C.
43. The process of claim 40, wherein said glassy matrix has a glass transition temperature of from 30\xb0 C. to 40\xb0 C.

1. A method comprising:
identifying a user-facing software application for analysis;
classifying the user-facing software application into a plurality of user-facing transactions;
rating each transaction according to at least one category; and
converting each rating into a numeric value.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for serial data transmission between a position measuring system and a processing unit, comprising:
transmitting position data and further data between said position measuring system and said processing unit in serial form as digital data words;
transmitting up-to-date position data between said position measuring system and said processing unit upon transmission of a position request command;
always transmitting further data, whose processing is not time-critical, immediately following said transmitting said up-to-date position data from said position measuring system to said processing unit;
transmitting several different position request commands, which are assigned different processing priorities;
transmitting a position request command for requesting said up-to-date position data;
always transmitting immediately following said position request command, further data, whose processing is not time-critical;
transmitting said up-to-date position data in accordance with said assigned different processing priorities;
having a position request signal arrive in said processing unit during said transmission of non-time-critical data;
interrupting said transmission of said non-time-critical data; and
immediately transmitting a position data request command to said position measuring system in the place of said non-time-critical data, whereupon said up-to-date position data are immediately transmitted from said position measuring system to said processing unit.
2. The method in accordance with claim 1, wherein said further data is transmitted from said position measuring system to said processing unit.
3. The method in accordance with claim 1, wherein said further data is transmitted from said processing unit to said position measuring system.
4. The method in accordance with claim 1, further comprising transmitting said up-to-date position data and said position request command in the form of digital data words of a predetermined word length, or as data packets comprising digital data words.
5. The method in accordance with claim 4, wherein with said transmitting of either of said digital data words or data packets, a data word identification is transmitted, which unequivocally identifies a beginning and type of said respective associated digital data word or data packet.
6. The method in accordance with claim 1, further comprising transmitting additional non-time-critical data in the form of digital data words of a predetermined word length, or as data packets comprising digital data words.
7. The method in accordance with claim 6, wherein said additional non-time-critical data comprises additional data and additional data commands.
8. The method in accordance with claim 1, wherein said interrupting said transmission of said non-time-critical data is completed at a later time after said up-to-date position data has been completely transmitted by said position measuring system to said processing unit.
9. The method in accordance with claim 1, further comprising interrupting said transmission of said non-time-critical data when a position request command arrives in said position measuring system during said transmission of non-time-critical data; and
transmitting said up-to-date position data to said position measuring system in place of said non-time-critical data.
10. The method in accordance with claim 1, wherein all data transmitted between said position measuring system and said processing unit are transmitted over a common data channel.
11. The method in accordance with claim 1, wherein data transmitted from said position measuring system to said processing unit are transmitted via a first data channel, and said data transmitted from said processing unit to said position measuring system are transmitted via a second data channel.
12. The method in accordance with claim 1, further comprising storing said non-time-critical data.
13. The method in accordance with claim 12, wherein said non-time-critical data is transmitted by said processing unit to said position measuring system and said storing comprises storing said transmitted non-time-critical data in a memory unit of said position measuring system.
14. The method in accordance with claim 13, further comprising storing non-time-critical data transmitted by said position measuring system in a second memory unit of said processing unit.
15. The method in accordance with claim 12, further comprising transmitting memory unit status data, which contain at least information regarding an actual memory status of a memory unit.
16. The method in accordance with claim 1, further comprising transmitting several different position request commands, which are assigned different processing priorities; and
transmitting said up-to-date position data in accordance with said assigned different processing priorities.
17. The method in accordance with claim 16, wherein said different processing priorities comprise:
a first position request command used for position control, which causes said transmission of said up-to-date position data to be at the highest priority; and
a second position request command used for digitizing a workpiece contour, which causes said transmission of said up-to-date position data at a lower priority relative to said first position request command.
18. The method in accordance with claim 16, further comprising interrupting transmission of position data which had been requested by a position request command of a first level of processing priority upon transmission of a position request command of a level of processing priority higher than said first level.
19. The method in accordance with claim 1, wherein said different processing priorities comprise:
a first position request command used for position control, which causes said transmission of said up-to-date position data to be at the highest priority; and
a second position request command used for digitizing a workpiece contour, which causes said transmission of said up-to-date position data at a lower priority relative to said first position request command.
20. The method in accordance with claim 1, further comprising interrupting transmission of position data which had been requested by a position request command of a first level of processing priority upon transmission of a position request command of a level of processing priority higher than said first level.
21. A method for serial data transmission between a position measuring system and a processing unit, comprising:
transmitting up-to-date position data from a position measuring system to a processing unit;
transmitting non-time critical data, subsequent to said transmitting up-to-date position data, from said position measuring system to said processing unit; and
transmitting related non-time-critical data over several blocks, between which up-to date position data is transmitted.
22. The method in accordance with claim 21, wherein parameters of said position measuring system are transmitted via said non-time-critical data.
23. The method in accordance with claim 21, wherein measured temperature values are transmitted via said non-time-critical data.
24. The method in accordance with claim 21, wherein diagnostic data of said position measuring system are transmitted via said non-time-critical data.
25. The method in accordance with claim 21, wherein assignment information is transmitted with each of said non-time-critical data.
26. The method in accordance with claim 21, further comprising requesting, via said processing unit, transmission of said non-time-critical data from said position measuring system.
27. The method in accordance with claim 21, wherein said non-time-critical data are transmitted in the form of digital data words of a preset word length or as data packets having digital data words.
28. The method in accordance with claim 21, wherein the data transmitted from the position measuring system to the processing unit are transmitted via a first data channel and the data transmitted from the processing unit to the position measuring system are transmitted via a second data channel.
29. The method in accordance with claim 21, wherein said transmitting said up-to-date position data takes place between said non-time-critical data.
30. A system for serial data transmission comprising:
a position measuring system;
a processing unit in communication with said position measuring system; and
means for transmitting up to date position data between said position measuring system and said processing unit and for transmitting non-time critical data subsequent to said transmitting said up to date position data, wherein transmission of related non-time-critical data takes place over several blocks, between which said up to date position data is transmitted.
31. The system in accordance with claim 30, further comprising;
a first data channel in communication with said position measuring system and said processing unit and transmitting data from said position measuring system to said processing unit; and
a second data channel in communication with said position measuring system and said processing unit and transmitting data from said processing unit to said position measuring system.
32. The system in accordance with claim 30, wherein a transmission of parameters of said position measuring system takes place via said non-time-critical data.
33. The system in accordance with claim 30, wherein a transmission of measured temperature values takes place via said non-time-critical data.
34. The system in accordance with claim 30, wherein a transmission of diagnostic data of said position measuring system takes place via said non-time-critical data.
35. The system in accordance with claim 30, wherein a transmission of assignment information takes place with said non-time-critical data.
36. The system in accordance with claim 30, wherein a transmission of said non-time-critical data takes place in the form of digital data words of a preset word length or as data packets having digital data words.
37. The system in accordance with claim 30, wherein said non-time-critical data is chronologically distributed over said several blocks.