Author: claimsbot

1. A process of preparing a hydroxy functional soybean oil, the process comprising:
(A) providing a reactor;
(B) adding a raw soybean oil and an organic acid having 1 to 3 carbon atoms to the reactor to form an organic phase and an aqueous phase;
(C) heating the organic phase and the aqueous phase to about 50 to 135\xb0 C. with agitation generating a hot mixture;
(D) metering a 35 to 70% weightweight of hydrogen peroxidewater to the hot mixture of (C) generating a reaction mixture;
(E) heating the reaction mixture in a range of 50 to 135\xb0 C. for about 1 to 24 hours;
(F) stripping off the bulk of the organic acid, water and other low boilers at or below 150\xb0 C. and at a negative pressure that does not exceed 60 mmHg until the reaction mixture tests for an acid number of about 4.0 mg KOHg or less.
2. The process of claim 1, further comprising a nitrogen sparge during the stripping step (F).
3. The process of claim 1, further comprising forcing, under pressure, a material selected from the group consisting of (i) steam, and, (ii) a gas non-reactive with the soybean oil, up through the reaction mixture to remove high boiling impurities and organic acids during the stripping step (F).
4. A hydroxy functional soybean oil suitable for use in preparing polyurethanes when prepared by the process of claim 1.
5. A hydroxy functional soybean oil having an acid number of about 4 mg KOHg or less, 0.1% ww or less of water, and 0.1% ww or less of organic acid used to prepare the hydroxy functional soybean oil.
6. A process of preparing a hydroxy functional soybean oil having an acid number of about 4 mg KOHg or less, the process comprising contacting a raw soybean oil with hydrogen peroxide and an organic acid in the presence of water for a sufficient period of time, a sufficient temperature, and a sufficient pressure to form hydroxyl groups from unsaturated moieties in the raw soybean oil, and thereafter separating any volatiles from the hydroxy functional soybean oil by distillation, wherein the organic acid has from 1 to 3 carbon atoms.
7. The process of claim 6, wherein the raw soybean oil is contacted with a combination of the peroxide and organic acid essentially simultaneously.
8. The process of claim 6, wherein the raw soybean oil is contacted with the organic acid first, and then contacted with the peroxide.
9. The process of claim 6, wherein the raw soybean oil is contacted with the peroxide first and then is contacted with the organic acid.
10. The process of claim 6, wherein the time of reaction is from 1 to 24 hours.
11. The process of claim 6, wherein the temperature ranges from about 50\xb0 C. to about 135\xb0 C.
12. The process of claim 6, wherein the amount of organic acid that is used is less than about 2.0 mass units per mass unit of raw soybean oil.
13. The process of claim 6, wherein the organic acid that is used is a mixture of two organic acids.
14. The process of claim 6, wherein the amount of peroxide that is used ranges from about 0.1 to about 6.0 equivalents per mole of raw soybean oil.
15. The process of claim 6, wherein there is additionally present a solvent.
16. The process of claim 6, wherein the distillation is carried out at a distillation temperature at or below 150\xb0 C.
17. The process of claim 16, wherein there is a negative pressure applied during the distillation that does not exceed about 60 mmHg.
18. The process of claim 17, wherein the distillation temperature and negative pressure are continued until the hydroxy functional soybean oil tests for an acid number of about 4 mg KOHg or less.
19. The process of claim 6, wherein the distillation is a wiped film evaporation, short path distillation, packed column stripping, or a combination of thereof.
20. A hydroxy functional soybean oil suitable for use in preparing polyurethanes when prepared by the process of claim 6.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A wire management system comprising:
a top portion configures to receive a plurality of wires having a first groove extending between a pair of openings in the top portion;
a bottom portion configured to prevent the plurality of wires in the first groove from being exposed; and
wherein the top portion covers the bottom portion and the top portion and bottom portion are connected by a fastener and wherein the wire management system is configured to fit into an aperture in a predetermined location.
2. The wire management system of claim 1, further comprising a chute extending from a side of the top portion, configured to protect the wire from damage.
3. The wire management system of claim 1 wherein the fastener is a hinge mechanism.
4. The wire management system of claim 1 wherein the top portion and bottom portion are connected by a least one fastener.
5. The wire management system of claim 4 wherein the plurality of fasteners includes latches.
6. The wire management system of claim 5 wherein the plurality of fasteners includes a hinge mechanism.
7. The wire management system of claim 1 wherein the pair of openings in the top portion further comprise wire rakes configured to route the plurality of wires.
8. The wire management system of claim 1 wherein the bottom portion further comprises a second groove extending between a pair of openings in the bottom portion, and configured to receive a second wire.
9. A wire management system for routing wires in an aircraft comprising:
an aircraft having a floor panel;
a top portion configures to receive a plurality of wires having a first groove extending between a pair of openings in the top portion;
a bottom portion configured to prevent the plurality of wires in the first groove from being exposed; and
wherein the top portion covers the bottom portion and the top portion and bottom portion are connected by a fastener and wherein the wire management system is configured to fit into an aperture in the floor panel of the aircraft system.
10. The wire management system of claim 9, further comprising a chute extending from a side of the top portion, configured to protect the wire from damage.
11. The wire management system of claim 9 wherein the fastener is a hinge mechanism.
12. The wire management system of claim 9 wherein the top portion and bottom portion are connected by a least one fastener.
13. The wire management system of claim 12 wherein the plurality of fasteners includes latches.
14. The wire management system of claim 13 wherein the plurality of fasteners includes a hinge mechanism.
15. The wire management system of claim 9 wherein the pair of openings in the top portion further comprise wire rakes configured to route the plurality of wires.
16. The wire management system of claim 9 wherein the bottom portion further comprises a second groove extending between a pair of openings in the bottom portion, and configured to receive a second wire.
17. A wire management system comprising:
a top portion configures to receive a plurality of wires having a first groove extending between a pair of openings in the top portion;
a bottom portion configured to prevent the plurality of wires in the first groove from being exposed;
a chute extending from a side of the top portion, configured to protect the plurality of wires from damage;
a pivoting connection configured to connect the top portion and bottom portion; and
wherein the wire management system is configured to fit into an aperture in a predetermined location.
18. The wire management system of claim 17 wherein the openings in the top portion further comprise wire rakes configured to route the wire.
19. The wire management system of claim 17 wherein the bottom portion further comprises a second groove extending from a plurality of openings in the bottom portion, and configured to receive a plurality of wires.

1. A microparticle for use in delivering an agent or agents to a cell, the microparticle comprising:
a) a polymer shell;
b) an agent or agents for delivery to a cell; and
c) a peptide component comprising a hydrophobic moiety wherein the hydrophobic moiety is capable of anchoring the peptide to the polymer shell and the peptide is intended to target the microparticle to a receptor on the surface of the cell.
2. The microparticle according to claim 1 wherein the polymer shell is biodegradable andor biocompatible.
3. The microparticle according to claim 1 wherein the polymer shell is made from polyesters such as polylactide, polyglycolide, copolymers of lactide and glycolide, polyhydroxybutyrate, polycaprolactone, copolymers of lactic acid and lactone, copolymers of lactic acid and PEG, copolymers of a-hydroxy acids and \u03b1-amino acids(polydepsipeptides), polyanhydrides, polyorthoesters, polyphosphazenes, copolymers of hydroxybutyrate and hydroxyvalerate, poly(ethylene carbonate), copoly(ethylene carbonate), polyethylene terephthalate, polystyrenelatex polymers, or mixtures of these polymers.
4. The microparticle according to claim 1 wherein the microparticle has a size of 10 nm to 200 \u03bcm in diameter.
5. The microparticle according to claim 1 wherein the agent is a therapeutic, pharmaceutical, pharmacological, diagnostic, cosmetic, prophylatic, herbicidal, pesticidal andor fertilizer agent.
6. The microparticle according to claim 5 wherein the agent is an antigen.
7. The microparticle according to claim 1 for use in delivery of the agent to cells which are in vitro or in vivo.
8. The microparticle according to claim 1 which has been adapted to be administered by injection, topically or mucosally.
9. The microparticle according to claim 1 wherein the hydrophobic moiety is derived from cholesterol, retinoic acid, C10-C22 fatty acids such as stearic acid (C18) and the like.
10. The microparticle according to claim 1 wherein the hydrophobic moiety is a lipid soluble cytotoxic drugs, e.g. etoposide and methotrexate diester; pyrenes or compounds derived therefrom e.g. pyrene butyric acid, benzo(a)pyrene, 3-hydroxybenzo(a)pyrene and benzo(a)pyrene-7,8-dihydrodiol; retinyl derived compounds e.g. N-retinoyl-L-leucyl DOX-14-linoleate; polyunsaturated compounds, e.g. \u03b2-carotene; hormones e.g. estradiol, testosterone and aldosterone and the like; diphenylhydantoin; bishydroxycoumarin; pentobarbital; perfluorinated cholesteryl oleate; anthracycline AD-32; PCMA cholesteryl oleate.
11. The microparticle according to claim 1 wherein the peptide is intended to target the ApoB receptor.
12. The microparticle according to claim 11 wherein the peptide component designed to bind to the ApoB receptor comprises either or both of the Apo B binding site sequence(s) depicted below in the same peptide or in the form of dimers or in different peptides:
(1) Lys Ala Glu Tyr Lys Lys Asn Lys His Arg His; or
(2) Arg Leu Thr Arg Lys Arg Gly Leu Lys;
and analogues thereof which are capable of binding to the Apo B100 receptor site.
13. A formulation comprising a microparticle according to claim 1 for use in delivering an agent to a cell.
14. The formulation according to claim 13 wherein the formulation is a pharmaceutical formulation and optionally comprises a pharmaceutical carrier therefore.
15. The formulation according to claim 13 further comprising an agent designed to minimise or reduce aggregation of cells.
16-17. (canceled)
18. A method of forming a peptide modified polymer microparticle, which comprises:
a) forming a non-aqueous solution comprising a polymer, and an agent or agents;
b) forming a dispersion of an aqueous liquid in the non-aqueous solution; sonicating the dispersion so as to form microparticles; and
c) evaporating off the non-aqueous solution so as to leave an aqueous liquid comprising the microparticles, wherein the hydrophobically modified peptide may be included in the initial non-aqueous solution, or may be added to the aqueous liquid after microparticle formation.
19. The method according to claim 18 wherein an emulsifier is included in the initial aqueous liquid.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A multigate Schottky diode comprising:
an electrically conducting active semiconductor region that forms part of the semiconductor substrate, such that an electrically insulating substrate region splits the active semiconductor region into sub portions;
first and second metallic contact arms on the active semiconductor region forming ohmic contacts therewith, the ohmic contacts being spaced apart on the active semiconductor region to define a gate receiving channel therebetween;
a base, which electrically connects the first metallic contact arm to the second metallic contact arm; and
a single metallic gate strip comprising:
a plurality of metallic gate fingers, such that a gate finger is on at least two of the sub portions, the metallic gate fingers being electrically connected to one another by the single metallic gate strip and being in contact with the active semiconductor region to form Schottky junctions, the Schottky junctions being spaced apart on the active semiconductor region and extending at least partially along the gate receiving channel; and
a contact portion at least partially along the gate receiving channel and between the metallic gate fingers is supported directly by the insulating substrate region, such that the contact portion is separated from the active semiconductor region.
2. A multigate Schottky diode as claimed in claim 1, the Schottky junctions being arranged in recesses in the active semiconductor region.
3. A multigate Schottky diode as claimed in claim 1, wherein the active semiconductor region forms part of a face of the semiconductor substrate, the active semiconductor region being received by the electrically insulating substrate region.
4. A multigate Schottky diode as claimed in claim 3, wherein the gate fingers extend off the active semiconductor region onto the insulating substrate region, the gate fingers being connected together at a gate connector on the insulating substrate region.
5. A multigate Schottky diode as claimed in claim 3, wherein the contact arms extend off the active semiconductor region onto the insulating substrate region, the contact arms being connected together on the insulating region.
6. A multigate Schottky diode as claimed in claim 1, wherein the active semiconductor region is n doped.
7. A multigate Schottky diode as claimed in claim 1, wherein the active semiconductor region is received by an ion implanted electrically insulating substrate region.