Author: claimsbot

1.-11. (canceled)
12. A method of performing for performing data-dependent MSMS analysis in a mass spectrometer, comprising:
acquiring an MS spectrum of ions generated from a sample;
identifying a plurality of precursor ion species for MSMS analysis based on the acquired MS spectrum;
sorting the plurality of precursor ion species according to at least one parameter to produce an ordered list of precursor ion species, the at least one parameter selected from the group consisting of charge state and mass-to-charge ratio; and
acquiring MSMS spectra of the precursor ion species in the sequence of the ordered list.
13. The method of claim 12, wherein the step of identifying a plurality of precursor ion species includes identifying the precursor ion species based on ion intensities in the MS spectrum.
14. The method of claim 12, wherein the step of acquiring an MS spectrum is performed at a first mass analyzer, and the step of acquiring MSMS spectra is performed at a second mass analyzer.
15. A method of performing mass spectrometry analysis in a mass spectrometer instrument having an ion store for accumulating a desired population of ions for subsequent analysis, and a mass analyzer for acquiring a mass spectrum of ions, the accumulation and acquisition operations occurring concurrently, the method comprising:
setting an ideal target population and a minimum target population;
identifying a plurality of ion species to be analyzed in an ordered sequence;
determining an analysis time for each of at least a subset of the plurality of precursor ion species, the analysis time being the total time required to complete an analysis cycle for acquisition of a mass spectrum;
calculating, for each of at least a subset of the plurality of ion species, an injection time based on the analysis time of a preceding ion species in the ordered sequence, the injection time yielding a population of the ion species that lies between the minimum target population and the ideal target population; and
accumulating each ion species in the ion store for the corresponding calculated injection time.
16. The method of claim 15, wherein the step of setting the ideal target population and the minimum target population includes receiving operator input representative of at least one of the ideal and minimum target populations.
17. A method of performing mass spectrometry analysis in a mass spectrometer instrument having an ion store for accumulating a desired population of ions for subsequent analysis, and a mass analyzer for acquiring a mass spectrum of ions, the accumulation and mass analysis operations occurring concurrently, the method comprising:
identifying a plurality of ion species to be analyzed;
determining, for each one of the plurality of ion species, an associated injection time and an analysis time;
constructing an ordered list of ion species by matching the analysis time of each of at least a subset of the plurality ion species to the injection time of another one of the ion species; and
performing repeated operations of concurrently accumulating in the ion store the Nth ion species on the ordered list and mass analyzing the N\u22121th ion species on the ordered list.
18. The method of claim 17, wherein the step of constructing an ordered list of ion species comprises:
repeatedly performing steps of:
selecting the ion species that has been most recently assigned to the ordered list;
identifying, from the group of ion species that have not yet been assigned to the ordered list, a next ion species having an injection time that most closely matches the analysis time of the selected ion species; and
assigning the identified next ion species to the ordered list after the selected ion species;

wherein the first ion species on the ordered list is selected by application of an intensity criterion.
19. The method of claim 17, wherein the step of constructing an ordered list of ion species comprises applying a travelling salesman algorithm.
20. A method of performing mass spectrometry analysis in a mass spectrometer instrument having an ion store for accumulating a desired population of ions for subsequent analysis, and a mass analyzer for acquiring a mass spectrum of ions, the accumulation and mass analysis operations occurring concurrently, the method comprising:
identifying a plurality of ion species to be analyzed;
constructing an ordered list of ion species;
determining, for each of at least a subset of ion species on the ordered list, an associated injection time; and
performing repeated operations of concurrently accumulating in the ion store the Nth ion species on the ordered list and mass analyzing the N\u22121th ion species on the ordered list; wherein at least one mass analysis parameter employed for mass analyzing the N\u22121th species is adjusted to match an analysis time of the N\u22121th ion species to the injection time of the Nth ion species.
21. The method of claim 20, wherein the mass analyzer is an orbital electrostatic trap, and the at least one mass analysis parameter is the transient duration.
22. The method of claim 20, wherein the mass analyzer is a two-dimensional quadrupole ion trap, and the at least one mass analysis parameter is the scan rate.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for detecting sources that are accessible over a network and which install spyware or other undesired content, comprising the steps of:
(a) producing a virtual machine on a computing device and installing an operating system on the virtual machine to create a virtual machine environment useful for testing a potential source accessible on the network, which may at least attempt to install spyware on the computing device of a user;
(b) automatically loading a potential source available on the network, within the virtual machine environment; and
(c) determining if the potential source has at least attempted to install spyware in the virtual machine environment.
2. The method of claim 1, wherein the potential sources include a Web page component that is capable of being rendered by a browser program, and wherein the step of loading the potential source within the virtual machine environment comprises the steps of:
(a) executing a browser program within the virtual machine environment;
(b) requesting the page that may comprise one of the potential sources from a remote site on the network using the browser program;
(c) loading the page into the browser program so that it is rendered;
(d) detecting any of a plurality of predefined triggers that are fired as a result of the page being loaded into the browser program and rendered; and
(e) if any of the plurality of predefined triggers is detected, determining that the page is at least attempting to perform a drive-by attack in the virtual machine environment.
3. The method of claim 2, wherein if any of the plurality of predefined triggers is detected, further comprising the step of executing anti-spyware software within the virtual machine environment to perform a spyware scan of the virtual machine environment to test for a definitive indication that spyware has been installed in the virtual machine environment.
4. The method of claim 1, wherein the potential sources include an executable file, and wherein the step of loading the potential source within the virtual machine environment comprises the steps of:
(a) installing the executable file within the virtual machine environment; and
(b) analyzing the virtual machine environment after the executable file is installed, to determine if installation of the executable file has caused any attack to be made within the virtual machine environment, the attack comprising executable code that is installed by a piggy-backed software module included with the executable file.
5. The method of claim 4, wherein the step of installing the executable file comprises the step of employing heuristics to emulate a user navigating and making selections in an installation process carried out by the executable file, when the executable file is executed within the virtual machine environment.
6. The method of claim 4, wherein the step of analyzing the virtual machine environment comprises the steps of:
(a) installing and executing an anti-spyware software program within the virtual machine environment; and
(b) employing the anti-spyware software program to analyze the virtual machine environment using predefined criteria, to determine whether installation of the executable file has caused any spyware to be installed within the virtual machine environment.
7. The method of claim 1, further comprising the step of automatically searching the network to find potential sources that attempt to attack a computing device of a user.
8. The method of claim 7, wherein the step of searching the network comprises the step of employing a crawler program to access a plurality of sites on the network.
9. The method of claim 8, wherein the crawler program successively follows links on pages on a site, to access other pages and other sites over the network.
10. The method of claim 1, further comprising the step of retaining data identifying each potential source that was found to have at least attempted an attack within the virtual machine environment.
11. A machine readable memory medium having machine instructions stored thereon for carrying out the steps of claim 1.
12. A system for detecting sources that are accessible over a network and which at least attempt an attack, where the attack can include installing spyware or other undesired content, comprising:
(a) a computing device having a memory, and a processor coupled to the memory for executing machine instructions that are stored therein; and
(b) an interface coupling the computing device in communication with the network, wherein the machine instructions cause the processor to automatically carry out a plurality of functions using the interface to communicate over the network, including:
(i) creating a virtual machine environment in which to test potential sources found on the network to determine if they at least attempt an attack, the machine instructions also causing the processor to install a clean operating system within the virtual machine environment;
(ii) automatically loading a potential source accessed over the network into the virtual machine environment for testing; and
(iii) determining if the potential source has at least attempted an attack in the virtual machine environment.
13. The system of claim 12, wherein the machine instructions stored in the memory further cause the processor to:
(a) execute a browser program in the virtual machine environment;
(b) from a remote site, automatically download a page having a component that is capable of being rendered as part of the page by a browser program, wherein the component may comprise a potential source that may at least attempt an attack in the virtual machine environment, the page being loaded into and rendered in the browser program;
(c) detecting any of a plurality of predefined triggers that are fired as a result of the page being loaded into the browser program and rendered; and
(d) if any of the plurality of predefined triggers is detected, determining that the page is at least attempting a drive-by attack in the virtual machine environment.
14. The system of claim 13, wherein if any of the plurality of predefined triggers is detected, the machine instructions further cause the processor to execute anti-spyware software within the virtual machine environment to perform a spyware scan of the virtual machine environment and test for a definitive indication that spyware has been installed in the virtual machine environment during an attack.
15. The system of claim 12, wherein a potential source that may at least attempt to install spyware comprises an executable file, so that the machine language instructions cause the processor to:
(a) install the executable file within the virtual machine environment; and
(b) analyze the virtual machine environment after the executable file is installed to determine if installation of the executable file has caused any drive-by attack to be made in the virtual machine environment by the executable file.
16. The system of claim 14, wherein to install the executable file, the machine language instructions cause the processor to employ heuristics to emulate a user navigating and making selections in an installation process carried out by the executable file, when the executable file is executed within the virtual machine environment.
17. The system of claim 14, wherein to analyze the virtual machine environment, the machine language instructions cause the processor to:
(a) install and execute an anti-spyware software program within the virtual machine environment; and
(b) employ the anti-spyware software program to analyze the virtual machine environment using predefined criteria, to determine whether installation of the executable file has caused any spyware to also be installed within the virtual machine environment, wherein installation of spyware comprises an attack.
18. The system of claim 12, wherein execution of the machine instructions define a crawler program and further cause the processor to employ the crawler program to access a plurality of sites on the network to search the network for potential sources of an attack.
19. The system of claim 18, wherein execution of the machine instructions further cause the processor to employ the crawler program to successively follow links on pages on a site, to access other pages and other sites on the network.
20. The system of claim 12, wherein execution of the machine instructions further cause the processor to retain data in the memory that identify each potential source that was found to have at least attempted an attack in the virtual machine environment.
21. A method for detecting a potential source that may at least attempt an attack on a user’s computing device if downloaded from a site, the potential source being detected in real-time and on-the-fly, in response to a user attempting to access the potential source at the site over a network, the method comprising the steps of:
(a) producing a virtual machine on a computing device that is also coupled to the site, to create a virtual machine environment that is configured for testing whether a potential source may attempt an attack after the user accesses the Web site with the browser program of the user;
(b) detecting that the user has initiated downloading the potential source from the site and into the browser program of the user, and in response, automatically loading the potential source in the virtual machine environment before enabling a browser program of the user to fully access the potential source;
(c) determining if the potential source has at least attempted an attack in the virtual machine environment; and
(d) if the potential source has attempted an attack in the virtual machine environment, prohibiting the browser program of the user from fully accessing the potential source.
22. The method of claim 21, further comprising the step of enabling installation of a module in the browser program of the user, the module being configured to prohibit the browser program of the user from fully accessing the potential source, if the potential source has attempted an attack in the virtual machine environment.
23. The method of claim 21, wherein the user initiates downloading of a page into the browser program of the user, and wherein the page includes a component that is capable of being rendered by a browser program and which may at least attempt an attack, further comprising the steps of:
(a) executing a browser program within the virtual machine environment;
(b) loading the page into the browser program executed within the virtual machine environment so that the page is rendered in said browser program;
(c) detecting any of a plurality predefined triggers that are fired as a result of the page being loaded into and rendered in the browser program executed within the virtual machine environment, wherein the plurality of triggers are indicative that the page may be at least attempting an attack; and
(d) if any of the plurality of predefined triggers is detected, determining that the page is at least attempting to perform a drive-by attack in the virtual machine environment.
24. The method of claim 23, wherein the page is downloaded into a sandbox that is not immediately accessible by the browser program of the user, while being also downloaded into the browser program executed within the virtual machine environment, the page downloaded into the sandbox not being transferred and enabled to be rendered for display in the browser program of the user unless none of the plurality of predefined triggers is detected in the virtual machine environment.
25. The method of claim 23, wherein the virtual machine environment is installed on a centralized computing device accessible by a plurality of client computing devices over a network, further comprising the step of employing the centralized computing device as a proxy for connecting each client computing device to selected sites over the network.
26. The method of claim 25, further comprising the step of storing data for safe sources that have previously been downloaded and determined not to have attempted an attack, so that when the browser program of the user is subsequently used to initiate a download of one of the safe sources, the safe source is transferred to the browser program of the user from the stored data for use therein without checking the safe source again to determine if it attempts an attack.
27. The method of claim 26, further comprising the steps of:
(a) hashing each safe source that was found not to have attempted an attack;
(b) storing a hash value for the safe source with the data for the safe source;
(c) when the user subsequently initiates access of a site to again download a potential source with the browser program of the user, and if the potential source generally corresponds to one of the safe sources for which the data are stored, hashing the potential source to produce a hash value for the potential source;
(d) comparing the hash value stored with the data for the safe source with the hash value for the potential source;
(e) providing the safe source to the browser program of the user for use therein if the hash value of the potential source matches the hash value of the safe source; and otherwise,
(f) testing the potential source in the virtual machine environment to determine if the potential source at least attempts an attack in the virtual machine environment before enabling the browser program of the user to fully access the potential source.
28. The method of claim 23, wherein if any of the plurality of predefined triggers is detected, further comprising the step of executing an anti-spyware program within the virtual machine environment for confirming whether the Web page is a potential source of spyware.
29. The method of claim 21, wherein the user initiates downloading of an executable file from the Web site with the browser program of the user, wherein the executable file may be a potential source if it includes a piggy-backed module that may at least attempt an attack when the executable file is executed.
30. The method of claim 29, further comprising the steps of
(a) installing the executable file in the virtual machine environment; and
(b) analyzing the virtual machine environment after the executable file is installed within the virtual machine environment, to determine if installation of the executable file has caused an attack in the virtual machine environment.
31. The method of claim 30, wherein the step of prohibiting the browser program of the user from completing access of the potential source comprises the step of preventing the browser program of the user from completing downloading of the executable file from the Web site.
32. The method of claim 30, wherein the step of installing the executable file within the virtual machine environment comprises the step of employing heuristics to emulate a user navigating and making selections in an installation process carried out by the executable file, when the executable file is executed within the virtual machine environment.
33. The method of claim 30, wherein the step of analyzing the virtual machine environment comprises the steps of:
(a) installing and executing an anti-spyware software program within the virtual machine environment; and
(b) employing the anti-spyware software program to analyze the virtual machine environment using predefined criteria, to determine whether installation of the executable file has caused any spyware to also be installed within the virtual machine environment.
34. The method of claim 21, further comprising the step of retaining data identifying each potential source that was found to have at least attempted an attack in the virtual machine environment.
35. The method of claim 21, wherein the potential source includes a plurality of components, further comprising the step of enabling successive components to be downloaded for access by the browser program of the user after each component has been determined not to have attempted an attack in the virtual machine environment, so that access of the plurality of components by the browser program of the user is staged to occur as quickly as the component has been found to be safe for use by the browser program of the user.
36. A machine readable memory medium having machine instructions stored thereon for carrying out the steps of claim 21.
37. A system for detecting a potential source of an attack by a Web page component in real-time and on-the-fly, where the potential source is downloadable from a site, the system acting in response to a user attempting to access the potential source at the site over a network, comprising:
(a) a client computing device running a user environment;
(b) a network interface that couples to the site over the network;
(c) a memory in which machine instructions are stored; and
(d) a processor, which is coupled to the network interface, and the memory, the processor executing the machine instructions stored in the memory to carry out a plurality of functions, including:
(i) producing a virtual machine, the virtual machine running an operating system to provide a virtual machine environment that is separate from the user environment;
(ii) in response to the user attempting to access a potential source of an attack from within the user environment, downloading the potential source into the virtual machine environment for testing of the potential source on-the-fly, wherein the testing must be completed before full access of the potential source is allowed to complete in the user environment; and
(iii) if the potential source is found to have at least attempted an attack within the virtual machine environment, precluding completion of the full access of the potential source within the user environment.
38. The system of claim 37, wherein the potential source of attack comprises a Web page, the machine language instructions further causing the processor to detect firing of any of a plurality of triggers that are predefined, represent events, and are employed for enabling a determination of whether the potential source is at least attempting an attack within the virtual machine environment.
39. The system of claim 38, wherein the plurality of predefined triggers include at least two of:
(a) launching of a new process within the virtual machine environment;
(b) creating a new file;
(c) modifying an existing file; and
(d) modifying a registry of the operating system within the virtual machine environment.
40. The system of claim 38, wherein if any of the plurality of triggers has been fired, the machine language instructions further cause the processor to run an anti-spyware scan in the virtual machine environment, as a definitive test for spyware that has been installed by the prospective source, and enabling completion of the full access of the prospective source of spyware within the user environment only if the anti-spyware scan fails to detect spyware in the virtual machine environment.
41. The system of claim 37, wherein while the potential source of an attack is being tested in the virtual machine environment, the machine instructions further cause the processor to enable download of the potential source into the user environment, but not access thereof, to reduce a delay before access of the potential source within the user environment can be enabled.
42. The system of claim 37, wherein the potential source includes an executable file that may carry out an attack when the executable file is executed, the machine instructions causing the processor to download and execute the executable file within the virtual machine environment, so that any attempt to carry out an attack in the virtual machine environment can be detected, causing execution of the executable file in the user environment to be precluded.
43. The system of claim 42, wherein the machine instructions further cause the processor to employ heuristics that simulate interaction and input of a user during an installation process, when automatically installing the executable file in the virtual machine environment.
44. The system of claim 42, wherein the machine instructions further cause the processor to run an anti-spyware scan in the virtual machine environment, as a definitive test for spyware that has been installed by the prospective source, and to execution of the executable file within the user environment only if the anti-spyware scan fails to detect spyware in the virtual machine environment.
45. The system of claim 37, wherein the processor and memory are installed on a proxy computing device that links the client computing device to the site, the virtual machine environment being disposed on the proxy computing device, which controls access of the potential source by the user environment.
46. The system of claim 45, wherein the proxy computing device stores data concerning potential sources of an attack that were previously tested and found to be safe by virtue of not attempting an attack, so that an attempt to access a potential source that has previously been tested and found not to have at least attempted an attack within the virtual machine environment will cause the processor to enable immediate access of the data corresponding to the potential source, by the user environment.
47. The system of claim 46, wherein the proxy computing device stores a hash value for each potential source that was previously tested and found to be safe, and wherein the machine instructions further cause the processor to determine if the potential source that a user is attempting to access at a site on the network is unchanged from the corresponding potential source that was previously tested and found safe, by comparing hash values of the potential source being accessed by the user with that of the corresponding potential source found safe.
48. The system of claim 37, wherein the potential source includes a plurality of components, execution of the machine instructions further causing the processor to enable transmission of each component to the client computing device in a staged fashion, after the component has been tested by the processor and found not to have attempted any attack within the virtual machine environment, so that tested components of the potential source are successively available for use in the user environment as soon as each component is tested and found safe for use therein.
49. The system of claim 37, wherein the user environment is running a browser program for accessing the Web site, further comprising a software module that is adapted to install within the browser program running in the user environment, the software module being controlled in response to the testing of the potential source of spyware being carried out in the virtual machine environment and being capable of precluding the browser program running in the user environment from completing access of the potential source, if the testing indicates that the potential source may have at least attempted an attack within the virtual machine environment.

1. A method of assembling an axle module by coupling an axle member and a pair of leaf springs, comprising:
a first step of disposing the axle member and the pair of leaf springs on a work stand in the same vertical relationship as in the actual state of use,
a second step of placing U-bolts over the pair of leaf springs from above and slipping the tips of the U-bolts all the way through to the rear side of the axle member, and
a third step of tightening nuts onto the tips of the U-bolts from below the axle member.
2. The method of assembling an axle module according to claim 1, wherein the pair of leaf springs is provided with a plurality of mounting holes used for mounting to a vehicle body frame and at least one pin passing through at least a pair of corresponding mounting holes in the pair of leaf springs is inserted in order to maintain the positional relationship of the pair of leaf springs prior to the third step.
3. The method of assembling an axle module according to claim 2, wherein a plurality of pins are inserted such that they pass through the corresponding mounting holes in the leaf springs.
4. The method of assembling an axle module according to claim 3, wherein a work stand having a construction supporting the pins or leaf springs such that the plurality of pins remain parallel during the tightening of the U-bolts is used as the work stand.
5. The method of assembling an axle module according to claim 1, wherein a period of time is provided which allows the axle member to move in the horizontal direction on the work stand while maintaining its position in the vertical direction.
6. The method of assembling an axle module according to claim 5, wherein the period of time, during which movement in the horizontal direction is possible, is a period of time that includes a period of time for carrying out the first step.
7. The method of assembling an axle module according to claim 5, wherein the period of time, during which movement in the horizontal direction is possible, is a period of time including a period of time for carrying out the second step.
8. The method of assembling an axle module according to claim 5, wherein the period of time, during which movement in the horizontal direction is possible, is a period of time including a period of time for carrying out the third step.
9. The method of assembling an axle module according to claim 1, wherein in the third step, tightening tools disposed on a carriage are moved to a position underneath the tips of the U-bolts, after which sockets installed in the tightening tools are raised and rotated to tighten the nuts using a preset torque.
10. The method of assembling an axle module according to claim 9, wherein a pair of U-bolts are provided for each leaf spring and the tightening of the plurality of nuts respectively pre-tightened on their tips is carried out in a concurrent manner.
11. An unfinished axle module product comprising an axle member, a pair of leaf springs arranged perpendicular to the axial direction of the axle member, and a plurality of U-bolts fastening the pair of leaf springs to the axle member,
wherein pins passing through the corresponding holes among the mounting holes provided in the pair of leaf springs for mounting to a vehicle body are inserted prior to mounting the axle module to a vehicle body.
12. An axle module assembly device comprising a work stand, an axle member table provided on the work stand, and leaf spring supports provided on the work stand and supporting a pair of leaf springs above the axle member disposed on the axle member table such that their longitudinal direction is perpendicular to the axial direction of the axle member,
wherein the axle member table includes means enabling movement in the horizontal direction relative to the work stand.
13. The axle module assembly device according to claim 12, wherein
the movable means includes two plates horizontally arranged and multiple ball bearings sandwiched between the two plates.
14. The axle module assembly device according to claim 12, comprising means for temporarily inhibiting the operation of the movable means and putting the axle member table in the standard position (X=0, Y=0).
15. An axle module assembly device comprising a carriage, a plurality of tightening tools disposed on the carriage with the respective sockets facing upwards and concurrently rotatably driven by power actuation, and movable means installed between the tightening tools and the carriage and used for adjusting the misalignment of the tips of the tightening tools.
16. The axle module assembly device according to claim 15, wherein the plurality of tightening tools are mounted as a single unit.
17. The axle module assembly device according to claim 16, wherein the unit comprises adjustment means for setting the relative position of the plurality of tightening tools in accordance with a plurality of specifications.
18. The axle module assembly device according to claim 15, wherein the plurality of tightening tools are mounted as a single unit, and
the axle module assembly device includes, as the movable means, means for enabling the unit to move in the horizontal direction and in the vertical direction.
19. The axle module assembly device according to claim 18, wherein
the movement enabling means includes bearing floating means enabling the unit to move in the horizontal direction.
20. The module assembly device according to claim 19, wherein
the movement enabling means include hoisting means enabling the bearing floating means to move in the vertical direction relative to the carriage.
21. The module assembly device according to claim 19, comprising a support structure supporting the unit at two points in a pivotable manner relative to the bearing-floating means.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method for connecting at least one solid conductive solder bump of an array of solid conductive solder bumps on a semiconductor device and at least one conductive contact site of a plurality of conductive contact sites of a first member, comprising: providing a semiconductor device having an array of solid conductive solder bumps; providing a first member having a plurality of conductive contact sites heating said at least one solder bump of said array of solid conductive solder bumps to a softening temperature Ts below a melting temperature of said at least one solder bump of said array of solid conductive solder bumps; and contacting at least one conductive contact site of said plurality of conductive contact sites by at least one solder bump of said array of solid conductive solder bumps of said semiconductor device using a pressure less than substantially 22 grams-force for the at least one solid conductive solder bump and another solid conductive solder bump said array of solid conductive solder bumps.
2. The method of claim 1, wherein said melting temperature of said array of solid conductive solder bumps is T degrees Centigrade higher than an ambient temperature To, and wherein the softening temperature Ts is in the range of about 0.5T to 0.95T above the ambient temperature To.
3. The method of claim 1, wherein said at least one solid conductive solder bump of said array of solid conductive solder bumps contacts said at least one conductive contact site of said plurality of conductive contact sites at a pressure not substantially exceeding about 10 grams-force.
4. The method of claim 1, wherein said at least one solid conductive solder bump of said array of solid conductive solder bumps contacts said plurality of conductive contact sites at a pressure of in the range of about 2 to 10 grams-force.
5. The method of claim 1, wherein said semiconductor device having said array of solid conductive solder bumps is directly heated by one of hot air convection and infrared radiation.
6. The method of claim 1, wherein said first member having said plurality of conductive contact sites is directly heated by said one of hot air convection, conduction from a heated object, and said infrared radiation.
7. The method of claim 1, wherein said semiconductor device and said first member are placed in a temperature controlled oven for heating to the softening temperature Ts.
8. The method of claim 1, wherein said semiconductor device is held in a chuck, said chuck being heated.
9. The method of claim 1, wherein said first member is held in a chuck, said chuck being heated.
10. The method of claim 1, wherein said at least one solid conductive solder bump of said array of solid conductive solder bumps of said semiconductor device contacts said at least one conductive contact site of said plurality of conductive contact sites of said first member being heated under compressive force to soften said at least one solid conductive solder bump of said array of solid conductive solder bumps for connection to said at least one conductive contact site of said plurality of conductive contact sites.
11. The method of claim 1, wherein said first member having said plurality of conductive contact sites is heated by electrical resistance wires.
12. The method of claim 1, wherein said first member and a substrate are mounted on a mounting board having an integral heater, said integral heater controlled to heat said first member to said softening temperature Ts.
13. The method of claim 1, wherein said array of solid conductive solder bumps comprise Sn-Pb solder having a lead content in the range of about 40 to about 98 percent, and said softening temperature Ts comprises a range of about 140 to 180 degrees C.
14. The method of claim 1, wherein said heating comprises predetermining a heating time X to heat said at least one solid conductive solder bump of said array of solid conductive solder bumps to said softening temperature Ts, and heating for said time X.
15. The method of claim 1, wherein said heating comprises initiating said heating, measuring a temperature of one of an insert, a die, and a substrate being heated, and stopping said heating to limit the temperature of said at least one solid conductive solder bump of said array of solid conductive solder bumps to no more than said softening temperature Ts.
16. A temporary method to attach at least one conductive solder bump of an array of conductive solder bumps on a semiconductor device to at least one conductive contact site of a plurality of conductive contact sites of a first member, comprising:
providing a semiconductor device having an array of conductive solder bumps;
providing a first member having a plurality of conductive contact sites;
heating said at least one conductive solder bump of said array of conductive solder bumps to a softening temperature Ts below a melting temperature of said at least one conductive solder bump of said array of conductive solder bumps; and
compressing at least one conductive solder bump of said array of conductive solder bumps on said semiconductor device to at least one conductive contact site of said plurality of conductive contact sites at a pressure less than substantially 22 grams-force and another conductive solder bump of said array of conductive solder bumps.
17. The method of claim 16, wherein said melting temperature of said at least one conductive solder bump of said array of conductive solder bumps is T degrees Centigrade higher than an ambient temperature To, and wherein said at least one conductive solder bump of said array of conductive solder bumps is heated to said softening temperature Ts is in the range of about 0.5T to 0.95T above the ambient temperature To.
18. The method of claim 16, wherein said at least one conductive solder bump of said array of conductive solder bumps is compressed to said at least one conductive contact site of said plurality of conductive contact sites at a pressure not exceeding about 10 grams-force.
19. The method of claim 16, wherein said at least one conductive solder bump of said array of conductive solder bumps is compressed to said at least one conductive contact site of said plurality of conductive contact sites at a pressure in the range of about 2 to 10 grams-force.
20. The method of claim 16, wherein said semiconductor device having said array of conductive solder bumps is directly heated by one of hot air convection and infrared radiation.
21. The method of claim 16, wherein said first member having said plurality of conductive contact sites is directly heated by one of hot air convection, conduction from a heated object, and infrared radiation.
22. The method of claim 16, wherein said semiconductor device and said first member are placed in a temperature controlled oven for heating to the softening temperature Ts.
23. The method of claim 16, wherein said semiconductor device is held and heated for transfer to said semiconductor device.
24. The method of claim 16, wherein said first member is held and heated for heat transfer to said first member to heat said at least one conductive contact site of said plurality of conductive contact sites.
25. The method of claim 16, wherein said at least one conductive solder bump of said array of conductive solder bumps of said semiconductor device is compressed to said at least one conductive contact site of said plurality of conductive contact sites of said first member being heated under compressive force to soften said at least one conductive solder bump of said array of conductive solder bumps for connection to said at least one conductive contact site of said plurality of conductive contact sites.
26. The method of claim 16, wherein said first member having said plurality of conductive contact sites is heated by electrical resistance wires.
27. The method of claim 16, wherein said first member and a substrate are mounted on a mounting board having an integral heater, and said integral heater is controlled to heat said first member to said softening temperature Ts.
28. The method of claim 16, wherein said array of conductive solder bumps comprise Sn-Pb solder having a lead content in the range of about 40 to about 98 percent, and said softening temperature Ts comprises a range of about 140 to 180 degrees Centigrade.
29. The method of claim 16, wherein said heating comprises predetermining a heating time X to heat said array of conductive solder bumps to said softening temperature Ts, and heating for said time X.
30. The method of claim 16, wherein said heating comprises measuring a temperature of one of an insert, a die, and a substrate being heated, and stopping said heating to limit a temperature of said array of conductive solder balls to said softening temperature Ts.
31. An apparatus for temporarily connecting at least one solder ball of at least one conductive contact site, said apparatus comprising:
a first member having at least one solder ball thereon;
a second member having at least one conductive contact site; apparatus for moving said first member against said second member for contact of said at least one solder ball to said at least one conductive contact site, said first member contacting said second member at a pressure less than substantially 22 grams-force for said at least one solder ball; and
heating apparatus for heating said at least one solder ball and said at least one conductive contact site to a submelting solder softening temperature Ts.
32. The apparatus of claim 31, wherein said at least one conductive contact site comprises a substantially flat surface.
33. The apparatus of claim 31, wherein said at least one conductive contact site comprises a recess for receiving a portion of a solder ball.
34. The apparatus of claim 31, wherein said at least one conductive contact site comprises a recess having at least one projection therein for deforming a solder ball inserted therein.
35. A testing apparatus for a semiconductor package having a ball grid array of solder balls on a surface thereof, said apparatus comprising:
an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for contacting said ball grid array of solder balls, and having a second surface;
a substrate having a first surface, having a second surface, said second surface of said insert secured to said first surface of said substrate, and having a pattern of conductive leads on said substrate for connecting to contact leads in a socket;
electrical leads connecting said array of conductive contact sites of said insert with said pattern of conductive leads of said substrate;
a test board having said socket with said contact leads to a testing circuit, said substrate and said insert insertable into said socket for contact of said pattern of conductive leads of said substrate with said contact leads of said socket; and
heating apparatus associated with at least one of said substrate, said insert and said socket.
36. The apparatus of claim 35, further comprising: power supply leads providing electrical power to said heating apparatus.
37. The apparatus of claim 35, wherein said heating apparatus comprises resistance conductors.
38. The apparatus of claim 35, further comprising a switch apparatus for turning said heating apparatus on and off.
39. The apparatus of claim 35, further comprising temperature sensing apparatus attached to one of said substrate, said insert, and said semiconductor package.
40. The apparatus of claim 39, further comprising a temperature controller for controlling said heating apparatus.
41. The apparatus of claim 39, wherein said temperature sensing apparatus comprises a thermocouple junction.
42. The apparatus of claim 35, wherein said heating apparatus includes a conductive layer of metal deposited on one of said first and second surfaces of said substrate.
43. The apparatus of claim 36, wherein said heating apparatus, said power supply leads and conductive leads are formed on said substrate.
44. An temporary connection apparatus for at least one solder ball on a first member to a corresponding contact site on a second member, said second member connected to a third member, said apparatus comprising:
a board having a socket thereon for accepting said first member, said second member, and said third member, said board having at least two through-holes extending therethrough;
an heating conductor mounted on a side of said third member;
at least two spring-loaded pogo pins mounted to project a pin portion upwardly through each of said at least two through-holes for contacting said third member; and
power leads connecting each pogo pin of said at least two spring-loaded pogo pins to a power supply for heating at least one of said first member, said second member, and said third member including said at least one solder ball and said at least one contact site.
45. The apparatus of claim 44, further comprising a temperature sensor mounted within said first member, said second member, and said third member connected to a temperature measuring circuit.
46. A heating apparatus for at least one solder ball under a compression force at a conductive contact site for an electrical connection, said apparatus comprising:
a first member having a surface having at least one solder ball thereon;
a second member having a surface having an array of conductive contact sites;
apparatus for compressing said first member against said second member for contacting said at least one solder ball said at least one conductive contact site, said first member compressed against said second member at a pressure less than substantially 22 grams-force per solder ball; and
heating apparatus for heating at least one of said at least one solder ball and said at least one conductive contact site to a submelting solder softening temperature Ts.
47. The apparatus of claim 46, wherein each of said plurality of conductive contact sites comprises a substantially flat surface.
48. The apparatus of claim 46, wherein each of said plurality of conductive contact sites comprises an indentation for receiving a portion of said at least one solder ball of said ball grid array of solder balls.
49. The apparatus of claim 46, wherein each of said plurality of conductive contact sites comprises an indentation having at least one projection extending thereinto.
50. A testing apparatus for a semiconductor assembly having a ball grid array of solder balls on a surface thereof, said apparatus comprising:
an insert formed of generally noncompliant material, said insert having a first surface including an array of conductive contact sites for contact with at least one solder ball of said ball grid array of solder balls and having a second surface;
a substrate having a first surface and a second surface, said second surface of said insert attached to said first surface of said substrate, a pattern of leads on said substrate for connection to contact leads in a socket;
electrical leads connecting said array of conductive contact sites of said insert having said pattern of leads of said substrate;
a test board having said socket and having said contact leads to a testing circuit, said substrate and said insert for insertion into said socket for electrical contact of said pattern of leads of said substrate with said contact leads of said socket;
heating apparatus associated with at least one of said substrate, said insert and said socket; and at least one power supply lead providing electrical power to said heating apparatus.
51. The apparatus of claim 50, wherein said heating apparatus comprises at least one resistance conductor.
52. The apparatus of claim 50, further comprising a switch apparatus connected to said heating apparatus for turning said heating apparatus on and off.
53. The apparatus of claim 50, further comprising temperature sensing apparatus attached to one of said substrate, said insert, and said semiconductor package.
54. The apparatus of claim 53, further comprising a temperature controller for controlling said heating apparatus.
55. The apparatus of claim 53, wherein said temperature sensing apparatus comprises a thermocouple junction.
56. The apparatus of claim 50, wherein said heating apparatus includes a conductive layer of metal deposited on one of said first and second surfaces of said substrate.
57. The apparatus of claim 50, wherein said heating apparatus, said at least one power supply lead and said pattern of leads are formed on said substrate.
58. A temporary connection apparatus for at least one solder ball on a first member to at least one corresponding contact site on a second member, said second member connected to a third member, said apparatus comprising:
a board having a socket for accepting said first member, said second member, and said third member, said board having at least two through-holes extending therethrough and having first and second through-hole axes generally perpendicular to said board;
at least one heating conductor mounted on an underside of said third member, said at least one heating conductor having junctions positioned intercepting said at least two through-hole axes of said first through-hole and said second through-hole extending through said board;
at least one spring-loaded pogo pin mounted to project a pin portion upwardly through each of said at least two through-holes of said board to contact said third member; and
at least one power lead for connecting said at least one spring-loaded pogo pin to a power supply for heating said first member, said second member, and said third member including at least one of said at least one solder ball and said at least one corresponding contact site.
59. The apparatus of claim 58, further comprising a temperature sensor mounted within said first, second and third members connected to a temperature measuring circuit.