Author: claimsbot

1. An apparatus for bonding substrates, comprising:
a first chamber having a first surface plate upon which a first substrate can be mounted;
a second chamber mounted opposite the first chamber, the second chamber having a second surface plate upon which a second substrate can be mounted; and
an alignment unit installed in at least one of the first chamber and the second chamber, wherein the alignment unit can adjust a position of a surface plate of the chamber in which it is mounted via a six-degrees-of-freedom alignment procedure, wherein the alignment unit comprises:
a connector plate coupled to a surface plate of the chamber in which it is mounted, wherein the connector plate can be displaced during the six-degrees-of-freedom alignment procedure,
a support plate, and
a plurality of actuators installed between the connector plate and the support plate, wherein a first end of each of the actuators is pivotally coupled to the connector plate, and wherein a second end of each of the actuators is pivotally coupled to the support plate.
2. The apparatus of claim 1, wherein the plurality of actuators comprise six actuators installed at different locations around the connector plate and support plate.
3. The apparatus of claim 2, wherein the six actuators are installed in three pairs, and wherein each pair of actuators forms a V shape.
4. The apparatus of claim 1, further comprising a controller that controls movements of the six actuators.
5. The apparatus of claim 4, wherein the controller controls the six actuators so that the surface plate coupled to the connector plate is aligned such that it is parallel with the other surface plate of the apparatus.
6. The apparatus of claim 4, further comprising a plurality of distance sensors that are mounted on one of the first surface plate and the second surface plate, wherein the distance sensors detect a distance between corresponding points on the first and second surface plates.
7. The apparatus of claim 6, wherein the distance sensors are coupled to the controller, and wherein the controller uses information provided by the distance sensors to control movements of the actuators to cause the first and second surface plates to be aligned with one another.
8. The apparatus of claim 7, further comprising at least one camera mounted on the apparatus such that the camera can capture an image of alignment marks of substrates mounted on the first and second surface plates, and wherein the controller uses an image from the at least one camera to control the actuators to cause the first and second surface plates to be aligned in X axis and Y axis directions.
9. The apparatus of claim 1, wherein the alignment unit is located between the first chamber and the first surface plate, wherein the connector plate is coupled to the first surface plate, and wherein the support plate is coupled to the first chamber.
10. The apparatus of claim 1, wherein the alignment unit is located between the second chamber and the second surface plate, wherein the connector plate is coupled to the second surface plate, and wherein the support plate is coupled to the second chamber.
11. The apparatus of claim 1, wherein the first surface plate comprises a plurality of first surface plates, wherein each actuator is located between the first chamber and a corresponding one of the first surface plates.
12. The apparatus of claim 11, wherein the second surface plate comprises a plurality of second surface plates, and wherein an alignment unit is located between the second chamber and a corresponding one of each of the second surface plates.
13. The apparatus of claim 12, wherein a plurality of distance sensors are mounted on each of the plurality of first surface plates, and wherein the distance sensors detect a distance between corresponding parts of the first and second surface plates.
14. An apparatus for bonding substrates, comprising:
a first chamber having a first surface plate upon which a first substrate can be mounted;
a second chamber mounted opposite the first chamber, the second chamber having a second surface plate upon which a second substrate can be mounted; and
an alignment unit installed adjacent at least one of the first chamber and the second chamber, wherein the alignment unit can adjust a position of a surface plate of the chamber to which it is adjacent via a six-degrees-of-freedom alignment procedure, wherein the alignment unit comprises:
a connector plate coupled to a surface plate of the chamber in which it is mounted, wherein the connector plate can be displaced during the six-degrees-of-freedom alignment procedure,
a support plate, and
a plurality of actuators installed between the connector plate and the support plate, wherein a first end of each of the actuators is pivotally coupled to the connector plate, and wherein a second end of each of the actuators is pivotally coupled to the support plate.
15. The apparatus of claim 14, wherein the alignment unit supports the first chamber, and wherein the connector plate of the alignment unit is coupled to the first chamber.
16. The apparatus of claim 14, wherein the alignment unit supports the second chamber, and wherein the connector plate of the alignment unit is coupled to the second chamber.
17. The apparatus of claim 14, wherein the alignment unit supports the first surface plate in such a way that the connector plate of the alignment unit is coupled to the first surface plate, and such that the plurality of actuators pass through the first chamber.
18. The apparatus of claim 17, further comprising a bellows that surrounds and encloses the plurality of actuators to seal the actuators and a through-opening of the first chamber.
19. The apparatus claim 14, wherein the alignment unit supports the second surface plate in such a way that the connector plate of the alignment unit is coupled to the second surface plate, and such that the plurality of actuators pass through the second chamber.
20. The apparatus according of claim 19, further comprising a bellows that surrounds the plurality of actuators to seal the actuators and a through-opening of the second chamber.
21. An apparatus for bonding substrates, comprising:
a first chamber having a first surface plate upon which a first substrate can be mounted;
a second chamber mounted opposite the first chamber, the second chamber having a second surface plate upon which a second substrate can be mounted;
an alignment unit installed on at least one of the first surface plate and the second surface plate, wherein the alignment unit can adjust a position of a substrate mounted on the surface plate to which it is attached via a six-degrees-of-freedom alignment procedure,
a plurality of first chuck plates coupled to the first surface plate; and
a plurality of first chucks mounted on corresponding ones of the first chuck plates, wherein the first chucks can hold a substrate, wherein the alignment unit comprises a plurality of first alignment units, wherein each first alignment unit is mounted between one of the first chuck plates and the first surface plate such that a connector plate of each first alignment unit is coupled to a first chuck plate and a support plate of each first alignment unit is coupled to the first surface plate, and each first alignment unit includes an actuator installed between the connector plate and the support plate, wherein a first end of each of the actuators is pivotally coupled to the connector plate, and wherein a second end of each of the actuators is pivotally coupled to the support plate.
22. The apparatus of claim 21, further comprising:
a plurality of second chuck plates that are coupled to the second surface plate; and
a plurality of second chucks mounted on corresponding ones of the second chuck plates, wherein the second chucks can hold a substrate.
23. The apparatus of claim 22, wherein the alignment unit further comprises a plurality of second alignment units, and wherein each second alignment unit is mounted between one of the second chuck plates and the second surface plate such that the connector plate of each second alignment unit is coupled to a second chuck plate and the support plate of each second alignment unit is coupled to the second surface plate.
24. The apparatus of claim 1, wherein the six-degrees-of-freedom alignment procedure include X-axis direction, Y-axis direction, Z-axis direction, roll, pitch and yaw aligning operations.
25. The apparatus of claim 14, wherein the six-degrees-of-freedom alignment procedure include X-axis direction, Y-axis direction, Z-axis direction, roll, pitch and yaw aligning operations.
26. The apparatus of claim 21, wherein the six-degrees-of-freedom alignment procedure include X-axis direction, Y-axis direction, Z-axis direction, roll, pitch and yaw aligning operations.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A communication device for satellite communication via a satellite antenna unit, said communication unit including:
a RF-converter for converting routed information carrying signals into RF-signals,
a RF-signal amplifier, and
a communication router with an internet communication unit,
characterised in that the communication router, the RF-converter and the RF-signal amplifier are placed inside a sealed housing, which in a transport position forms a portable integral unit, and which in an active position forms the base for the satellite antenna unit.
2. The communication device according to claim 1, wherein the communication router includes means for antenna position control and function monitoring.
3. The communication device according to claim 2, wherein the communication device further includes an encoder for information carrying signals for compression encoding incoming signals to be passed on to the RF-converter via said communication router.
4. The communication device according to any of the previous claims, wherein the transmission capacity is between 256 kbits and 2 Mbits.
5. The communication device according to claim 4, wherein the transmission capacity is between 512 kbits and 2 Mbits.
6. The communication device according to claim 5, wherein the transmission capacity is about 2 Mbits.
7. The communication device according to any of the previous claims, wherein the Internet communication unit is arranged to favour the transmission of video signals before other Internet traffic.
8. A link system for satellite communication including:
a communication device according to any of claims 1-7, and
an antenna unit being connected to an output of the RF signal amplifier, said antenna unit including an antenna positioner for directing a satellite antenna to a selected satellite for transmitting the amplified RF-signals to the selected satellite.
9. The system according to claim 8, wherein an operator terminal is connected to the communication device for communication with the internet communication unit and the antenna positioner of the antenna unit.
10. The system according to claim 9, wherein the operator terminal includes a terminal router for packing the compression encoded signals.
11. The system according to claim 9 or 10, wherein the encoder for information carrying signals is positioned in the operator terminal.
12. The system according to any of claims 8-11, wherein the system further includes a hood, the sealed housing of the communication device together with the hood form parts of a case which in the transport position is arranged to contain the antenna unit.

1. A device for manufacturing a composite laminated structure into which pins are inserted to reinforce in the inter-layer performance or to attach and connect a plurality of laminated members to one another, comprising:
a bottom guide located on a composite laminated structure in a pre- or post-cured state, the bottom guide including first pins that are inserted into a plurality of vertical holes of the composite laminated structure respectively; and
a top guide on the vertical bottom guide, and the top guide including guide pins that are vertically movable at positions corresponding to the first pins.
2. The device for manufacturing a composite laminated structure according to claim 1, further comprising:
a load adding means that is located on the top guide to add more load to the top guide in such a manner that the guide pins are inserted into the holes to press the pins, and thereby to be inserted into the composite laminated structure in a pre- or post-cured state.
3. The device for manufacturing a composite laminated structure according to claim 2, wherein the load adding means adds load using any one or more physical forces which are selected from pressure load addition by curing pressure, vibration load addition by ultrasonic wave or vibration, and gravitation load addition by a gravitational substance.
4. (canceled)
5. The device for manufacturing a composite laminated structure according to claim 1, wherein the bottom guide is attached at its lower surface to a film for preventing deviation of the first pins prior to the process for inserting into the composite laminated structure in a pre- or post-cured state.
6.-9. (canceled)
10. The device for manufacturing a composite laminated structure according to claim 1, wherein the holes have walls formed by pipe or tube walls in the holes.
11. The device for manufacturing a composite laminated structure according to claim 1, wherein the top guide and bottom guide are made of a metal or composite material.
12. A method of producing a manufacturing device of a composite laminated structure according claim 1, comprising the steps of:
a1) laminating a prepreg to form a composite laminated structure, or placing the composite laminated structure in a post-cured state;
b1) placing a release film on the composite laminated structure;
c1) laminating a prepreg for the bottom guide with a thickness reflecting the length of the guide pins;
d1) placing a release film on the laminated prepreg for the bottom guide;
e1) laminating a prepreg for the top guide with a thickness adequate to fix the guide pins on the release film;
f1) applying curing pressure onto the laminated prepreg for the top guide to cure the composite laminated structure, a body of the top guide, and a body of the bottom guide at the same time; and
g1) having the guide pins in the cured body of the top guide, and forming the holes in the body of the bottom guide.
13. A method of manufacturing a composite laminated structure using a manufacturing device of the composite laminated structure according to claim 1, comprising the steps of:
a2) placing a composite laminated structure in a pre- or post-cured state;
b2) placing a bottom guide including the first pins, which are inserted into the composite laminated structure in a pre- or post-cured state, within the holes;
c2) placing a top guide including guide pins, which are formed at positions corresponding to the first pins, on the bottom guide; and
d2) inserting the first pins into the composite laminated structure in a pre- or post-cured state by pressing the first pins with the guide pins while the top guide and the bottom guide are approaching each other.
14. A composite laminated structure, wherein the structure is made by using a method for manufacturing the composite laminated structure according to claim 13.
15. A method of combining composite laminated structural members using a manufacturing device of the composite laminated structure according to claim 1, comprising the steps of:
a3) placing composite laminated structural members in which a bottom composite laminated structural member, and top composite laminated structural members are sequentially arranged from the bottom, on a work table;
b3) placing a bottom guide including the first pins, which are inserted into the laminated composite laminated structural members within the holes, on a combining portion of the laminated composite laminated structural members;
c3) placing a top guide including guide pins, which are formed at positions corresponding to the first pins, on the bottom guide; and
d3) inserting the pins into the composite laminated structure in a pre- or post-cured state by pressing the first pins with the guide pins while the top guide and the bottom guide are approaching each other.
16. The method of combining composite laminated structural members according to claim 15, wherein the bottom composite laminated structural member, and top composite laminated structural members are combined through a first combining process including adhesion, compression, and thermal adhesion.
17. A composite laminated structure, wherein the structure is made by using a method of combining the composite laminated structural members according to claim 15.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for separation of fat images and water images according to the two-point Dixon method dependent on the T*2 decay, comprising the steps of:
(S1): with a magnetic resonance data acquisition unit, acquiring three fat-water images from a patient in the unit, respectively corresponding to echoes at echo times TE1, TE2, TE3 after an RF excitation pulse, wherein a first and a third of said fat-water images exhibit the same phase;
(S2): in a processor, calculating a T*2 map from the two equiphase images;
(S3): in said processor, correcting the T*2 influence in one of the two equiphase fat-water images and in the counter-phase fat-water image; and
(S4): in an image computer, reconstructing a pure T*2-corrected fat image and a pure T*2-corrected water image according to the two-point Dixon method using the T*2-corrected equiphase and counter-phase fat-water images from Step (S3).
2. A method according to claim 1, comprising acquiring said fat-water images in step (S1) with the magnetization vectors of water (W) and fat (F) being parallel and pointing either in the same direction (W+F) or in the opposite direction (W\u2212F).
3. A method according to claim 2, wherein step (S2) comprises:
calculating the T*2 map from the two equiphase images ensues by the equation
T
2
*

=
TE
\u2062
\u2062
3

–

TE
\u2062
\u2062
1
ln
\u2061

(

S
1

)
–

ln
\u2061

(

S
3

)
,
\u2062
wherein
S
i

\u2061

(

x
,
y

)
=
(
W
\u2061

(

x
,
y

)
\xb1

F
\u2061

(

x
,
y

)
)

\xb7

\u2147

–

TEi
T
2
*

\u2061

(

x
,
y

)
And represents the measured MR signal for the voxel (x, y) from the i-th echo and i=1, 2, 3.
4. A method according to claim 3, wherein Step (S3) comprises:
correcting the T*2 influence in one of the two equiphase (i=1, 3) fat water images and in the counter-phase (i=2) fat-water image ensues by the equation
S
i
\u2032

=
S
i

\xb7

\u2147
TE
\u2062
\u2062
1
T
2
*
=

W
\xb1

F
.
5. A method according to claim 1, comprising, in step (S1):
acquiring said echoes as spin echoes or gradient echoes, and for spin echoes, replacing T*2 with T2.
6. A magnetic resonance apparatus for separation of fat images and water images according to the two-point Dixon method dependent on the T*2 decay, comprising:
a magnetic resonance data acquisition unit;
a control unit that operates said magnetic resonance data acquisition unit to acquire three fat-water images from a patient in the unit, respectively corresponding to echoes at echo times TE1, TE2, TE3 after an RF excitation pulse, wherein a first and a third of said fat-water images exhibit the same phase;
a processor configured to calculate a T*2 map from the two equiphase images;
said processor being configured to correct the T*2 influence in one of the two equiphase fat-water images and in the counter-phase fat-water image; and
an image computer configured to reconstruct a pure T*2-corrected fat image and a pure T*2-corrected water image according to the two-point Dixon method using the T*2-corrected equiphase and counter-phase fat-water images.
7. A non-transitory computer-readable medium loadable into a computerized system that operates a magnetic resonance imaging apparatus, said non-transitory computer-readable medium being encoded with programming instructions, and said programming instructions causing said computerized system to:
(operate a magnetic resonance data acquisition unit of the magnetic resonance imaging apparatus to acquire three fat-water images from a patient in the unit, respectively corresponding to echoes at echo times TE1, TE2, TE3 after an RF excitation pulse, wherein a first and a third of said fat-water images exhibit the same phase;
Calculate a T*2 map from the two equiphase images;
correct the T*2 influence in one of the two equiphase fat-water images and in the counter-phase fat-water image; and
reconstruct a pure T*2-corrected fat image and a pure T*2-corrected water image according to the two-point Dixon method using the T*2-corrected equiphase and counter-phase fat-water images.