Author: claimsbot

1. A method for verifying a server initiated function in a vehicle wireless communications system, said method comprising:
transmitting a service request from the server to the vehicle over a first communications link;
receiving the service request by the vehicle;
requesting that the server disconnect the first communications link;
initiating a call from the vehicle to the server over a second communications link;
confirming the service request from the server; and
performing the service request on the vehicle.
2. The method according to claim 1 wherein the first and second communications links are encoded.
3. The method according to claim 1 wherein the server only waits a predetermined period of time to receive the call from the vehicle.
4. The method according to claim 3 wherein the predetermined period of time is a few seconds.
5. The method according to claim 1 further comprising storing the service request to later perform the service request once it is confirmed.
6. The method according to claim 1 further comprising re-transmitting the service request once it has been confirmed.
7. The method according to claim 1 wherein the service request is to upgrade software in the vehicle.
8. A verification system for verifying a server initiated function in a vehicle wireless communications system, said verification system comprising:
means for transmitting a service request from the server to the vehicle over a first communications link;
means for receiving the service request by the vehicle;
means for requesting that the server disconnect the first communications link;
means for initiating a call from the vehicle to the server over a second communications link;
means for confirming the service request from the server; and
means for performing the service request on the vehicle.
9. The verification system according to claim 8 wherein the first and second communications links are encoded.
10. The verification system according to claim 8 wherein the server only waits a predetermined period of time to receive the call from the vehicle.
11. The verification system according to claim 10 wherein the predetermined period of time is a few seconds.
12. The verification system according to claim 8 further comprising means for storing the service request to later perform the service request once it is confirmed.
13. The verification system according to claim 8 further comprising means for re-transmitting the service request once it has been confirmed.
14. The verification system according to claim 8 wherein the service request is to upgrade software in the vehicle.
15. A vehicle wireless communications system, said system comprising:
a vehicle; and
a server, said server transmitting a service request to the vehicle over a first communications link, said vehicle requesting that the server disconnect the first communications link, said vehicle initiating a call to the server over a second communications link, said server confirming the service request from the server, and said vehicle performing the service request.
16. The system according to claim 15 wherein the first and second communications links are encoded.
17. The system according to claim 15 wherein the server only waits a predetermined period of time to receive the call from the vehicle.
18. The system according to claim 15 wherein the vehicle stores the service request to later perform the service request once it is confirmed.
19. The system according to claim 15 wherein the server re-transmits the service request once it has been confirmed.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method comprising:
providing a substrate comprising:
a host; and
a seed layer bonded to the host, the seed layer comprising a plurality of regions, wherein each region is completely separated from nearest neighbor regions at interfaces between the regions;
relaxing the seed layer, wherein adjacent regions of the seed layer are in direct contact with each other at interfaces between adjacent regions after relaxing the seed layer;
growing on the substrate a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;
wherein a top surface of a semiconductor layer grown on the seed layer has a lateral extent greater than or equal to each of the plurality of seed layer regions;
connecting the semiconductor structure to a mount;
removing the host; and
removing the seed layer.
2. The method of claim 1 wherein the light emitting layer is a III-nitride layer.
3. The method of claim 1 wherein the interfaces extend through an entire thickness of the seed layer.
4. The method of claim 1 wherein the interfaces are substantially free of chemical bonds between adjacent regions of the seed layer.
5. The method of claim 1 wherein each region has a lateral extent between 1 and 10 microns.
6. A method comprising:
providing a substrate comprising:
a host; and
a seed layer bonded to the host, the seed layer comprising a plurality of regions separated by interfaces, wherein adjacent regions are connected to form a continuous web of seed layer material, wherein gaps between seed layer regions at interfaces are less than one micron wide;
growing on the substrate a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;
wherein a top surface of a semiconductor layer grown on the seed layer has a lateral extent greater than or equal to each of the plurality of seed layer regions;
connecting the semiconductor structure to a mount;
removing the host; and
removing the seed layer.
7. The method of claim 6 wherein the light emitting layer is a III-nitride layer.
8. A method comprising:
providing a substrate comprising:
a host; and
a seed layer bonded to the host, the seed layer comprising a plurality of regions, wherein the seed layer is a crystalline material having a crystalline unit cell, wherein each seed layer region is shaped to have a rotational symmetry that is the same as a rotational symmetry of the crystalline unit cell, wherein each seed layer region is completely separated from nearest neighbor seed layer regions by a gap or interface;
growing on the substrate a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;
wherein a top surface of a semiconductor layer grown on the seed layer has a lateral extent greater than or equal to each of the plurality of seed layer regions;
connecting the semiconductor structure to a mount;
removing the host; and
removing the seed layer.
9. The method of claim 8 wherein the light emitting layer is a III-nitride layer.
10. The method of claim 8 wherein the seed layer is wurtzite and each seed layer region is shaped as a triangle or a hexagon.

1. A stacked microelectronic package, comprising:
a molded package body having an external vertical package sidewall;
a plurality of singulated microelectronic devices embedded within the molded package body
package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the external vertical package sidewall;
a cavity formed in an external surface of the molded package body between a first one of the package edge conductors and a second one of the package edge conductors; and
electrically conductive material in the cavity and in electrical contact with a first and a second one of the package edge conductors, wherein the conductive material in the cavity is within planform dimensions of the microelectronic package and sidewalls of the cavity cover all side edges of the electrically conductive material.
2. A stacked microelectronic package according to claim 1 wherein the package edge conductors are formed to electrically couple the plurality of microelectronic devices embedded within the molded package body.
3. A stacked microelectronic package according to claim 1 wherein the plurality of microelectronic devices comprises a first microelectronic device and a second microelectronic device located in different levels of the molded package body, and wherein the package edge conductors are formed to electrically couple the first microelectronic device to the second microelectronic device.
4. A stacked microelectronic package according to claim 3 wherein the cavity is formed in a step configuration that includes a run portion over a major surface of one of the levels of the molded package body, the run portion extending between and in contact with the external vertical package sidewall of a first level of the different levels and the external vertical package sidewall of a second level of the different levels.
5. A stacked microelectronic package according to claim 1 wherein a portion of the first and second one of the package edge conductors form part of the cavity.
6. A stacked microelectronic package according to claim 5 wherein the cavity extends beyond at least one of the first and second one of the package edge conductors.
7. A stacked microelectronic package according to claim 5 wherein the cavity extends to an intermediate location over at least one of the first and second one of the package edge conductors.
8. A stacked microelectronic package, comprising:
a molded package body having an external vertical package sidewall;
a first singulated microelectronic device embedded within a first level of the molded package body;
a second singulated microelectronic device embedded within a second level of the molded package body;
a first package edge conductor electrically coupled to the first microelectronic device and extending to the external vertical package sidewall, and a second package edge conductor electrically coupled to the second microelectronic device and extending to the external vertical package sidewall;
a cavity formed in an external surface of the molded package body between the first package edge conductor and the second package edge conductor; and
electrically conductive material in the cavity and in electrical contact with the first and second package edge conductors, wherein sidewalls of the cavity overlap all side edges of the electrically conductive material.
9. A stacked microelectronic package according to claim 8 wherein the first and second package edge conductors are formed to electrically couple the first and second microelectronic devices embedded within the molded package body.
10. A stacked microelectronic package according to claim 3 wherein the cavity is formed in a step configuration that includes a run portion over a major surface of one of the levels of the molded package body, the run portion extending between and in contact with the external vertical package sidewall of a first level of the different levels and the external vertical package sidewall of a second level of the different levels.
11. A stacked microelectronic package, comprising:
a molded package body having an external vertical package sidewall, a plurality of singulated microelectronic devices embedded within the molded package body, and package edge conductors electrically coupled to the plurality of microelectronic devices and extending to the external vertical package sidewall;
a cavity in an external surface of the molded package body between a first one of the package edge conductors and a second one of the package edge conductors, wherein the cavity is filled with electrically conductive material and top, bottom and side edges of the electrically conductive material are covered by the cavity.
12. A stacked microelectronic package as claimed in claim 11 wherein the first and second one of the package edge conductors are formed to electrically couple the plurality of microelectronic devices embedded within the molded package body.
13. A stacked microelectronic package as claimed in claim 11 wherein the plurality of microelectronic devices comprises a first microelectronic device and a second microelectronic device located in different levels of the molded package body, and wherein the first and second one of the package edge conductors are formed to electrically couple the first microelectronic device to the second microelectronic device.
14. A stacked microelectronic package as claimed in claim 11 wherein the cavity is formed between the first and second one of the package edge conductors and the conductive material is in contact with the first and second ones of the package edge conductors.
15. A stacked microelectronic package as claimed in claim 11 wherein the cavity is formed by removing a portion of the first and second one of the package edge conductors.
16. A stacked microelectronic package as claimed in claim 15 wherein the cavity is formed by extending the cavity beyond at least one of the first and second one of the package edge conductors.
17. A stacked microelectronic package as claimed in claim 15 wherein the cavity is formed by extending the cavity to an intermediate location over at least one of the first and second one of the package edge conductors.
18. A stacked microelectronic package as claimed in claim 13 wherein the cavity is formed in a step configuration that includes a run portion over a major surface of one of the levels of the molded package body, the run portion extending between and in contact with the external vertical package sidewall of a first level of the different levels and the external vertical package sidewall of a second level of the different levels.
19. A stacked microelectronic package as claimed in claim 18 wherein the conductive material in the cavity is within planform dimensions of the microelectronic package.
20. A stacked microelectronic package as claimed in claim 11 wherein the conductive material comprises one of a group consisting of: an electrically conductive adhesive, conductive polymer, a polymer filled with conductive particles, a metal alloy, metal coated organic particles, metal coated ceramic particles, solder paste, solder-filled adhesive, nanoparticle-filled ink, a metal-containing adhesive, a metal-containing epoxies, electrically-conductive pastes, indium, and bismuth.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A controlled release pharmaceutical formulation consisting essentially of:
(A) a compressed matrix core consisting of:
(i) 10 to 50 weight percent based on the total weight of the matrix core of a decongestant or pharmaceutically acceptable salt thereof;
(ii) 50 to 90 weight percent based on the total weight of the matrix core of a hydrogel forming polymer \u201cselected from the group consisting of hydroxypropyl methylcellulose, carboxymethylcellulose calcium, carboxymethylcellulose sodium, guar gum, hydroxyethyl cellulose, hydroxypropyl cellulose, methyl cellulose, acrylic acid crosslinked with polyalkenyl ethers or divinyl glycol, sodium alginate and polyethylene oxide\u201d;
(iii) 0 to 20 weight percent based upon the total weight of the matrix core of a filler selected from lactose, starch, dextrose or sucrose;
(iv) 0 to 5 weight percent based on the total weight of the matrix core of a glidant;
(v) 0 to 10 weight percent based on the total weight of the matrix core of one or more lubricants;

(B) an immediate release coating on said compressed matrix core which consists essentially of:
(i) 0.01 to 10 weight percent based on the total weight of the formulation of an antihistamine
(ii) 0 to 20 weight percent based upon the total weight of the formulation of a pharmaceutically acceptable binder which allows for immediate release of the antihistamine
(iii) 0 to 10 weight percent based on the total weight of the formulation of a lubricant; and
(iv) 0 to 10 weight percent based on the total weight of the formulation of an antiadherent; and

(C) optionally a polishing agent or color coating that coats the immediate release coating.
2. The formulation as defined in claim 1 wherein the hydrogel forming polymer is hydroxypropyl methylcellulose with an average molecular weight of 180,000 to 220,000.
3. The formulation as described in claim 1 wherein said polishing agent comprises candellila wax.
4. The formulation as described in claim 1 wherein:
(A) the compressed matrix core consists of:
(i) 20 to 40 wt % based on the total weight of the matrix core of a decongestant or pharmaceutically acceptable salt thereof;
(ii) 55 to 75 wt % based on the total weight of the matrix core of a hydrogel forming polymer;
(iii) 5 to 15 wt % based upon the total weight of the matrix core of a filler selected from lactose, starch, dextrose or sucrose;
(iv) 0.01 to 2 wt % based on the total weight of the matrix core of a glidant; and
(v) 0.01 to 5 wt % based on the total weight of the matrix core of a lubricant;

(B) the immediate release coating on said compressed matrix core which consists essentially of:
(i) 0.01 to 5 wt % based on the total weight of the formulation of a non-sedating antihistamine
(ii) 0.01 to 10 wt % based upon the total weight of the formulation of a pharmaceutically acceptable binder forming material which allows for immediate release of the non-sedating antihistamine (iii) 0.1 to 5 wt % based on the total weight of the formulation of a lubricant; and
(iv) 0.1 to 5 wt % based on the total weight of the formulation of an antiadherent.
5. A once a day, antihistamine and decongestant formulation consisting essentially of:
(A) a compressed matrix core consisting of:
(i) 10 to 50 wt % based on the total weight of the matrix core of pseudoephedrine or a pharmaceutically acceptable salt thereof;
(ii) 50 to 90 wt % based on the total weight of the matrix core of a single hydrogel forming polymer \u201cselected from the group consisting of hydroxypropyl methylcellulose, carboxymethylcellulose calcium, carboxymethylcellulose sodium, guar gum, hydroxyethyl cellulose, hydroxypropyl cellulose, methyl cellulose, acrylic acid crosslinked with polyalkenyl ethers or divinyl glycol, sodium alginate and polyethylene oxide\u201d;
(iii) 0 to 20 wt% based on the total weight of the matrix core of a filler selected from lactose, starch, dextrose or sucrose;
(iv) 0 to 5 wt % based on the total weight of the matrix core of an antiadherent;
(v) 0 to 10 wt % based on the total weight of the matrix core of a lubricant; and

(B) an immediate release coating on said compressed matrix core which consists essentially of;
(i) 0.01 to 10 wt % based on the total weight of the formulation of loratadine;
(ii) 0.1 to 20 wt % based on the total weight of the formulation of a pharmaceutically acceptable binder material which allows for immediate release of the loratadine;
(iii) 0 to 10 wt % of lubricant; and
(iv) 0 to 10 wt % of antiadherent; and

(C) optionally, a polishing agent or color coating that coats the immediate release coating.
6. The formulation described in claim 5 wherein:
(A) the compressed matrix core consists of:
(i) 20 to 40 wt % based on the total weight of the matrix core of pseudoephedrine or a pharmaceutically acceptable salt thereof;
(ii) 55 to 75 wt % based on the total weight of the matrix core of a hydrogel forming polymer;
(iii) 5 to 15 wt % based on the total weight of the matrix core of a filler selected from lactose, starch, dextrose or sucrose;
(iv) 0.01 to 2 wt % based on the total weight of the matrix core of an antiadherent;
(v) 0.01 to 5 wt % based on the total weight of the matrix core of a lubricant; and

(B) the immediate release coating on said compressed matrix core which consists essentially of;
(i) 0.1 to 5 wt % based on the total weight of the matrix core of loratadine;
(ii) 0.1 to 10 wt % based on the total weight of the matrix core of a pharmaceutically acceptable binder which allows for immediate release of the loratadine;
(iii) 0.1 to 5 wt % of lubricant; and
(iv) 0.1 to 5 wt % of antiadherent.
7. The formulation as defined in claim 5 wherein the polishing agent consists essentially of candellila wax.
8. The formulation as defined in claim 5 wherein the hydrogel polymer is hydroxypropyl methylcellulose having average molecular weight of 180,000 to 220,000.
9. The composition of claim 5 which exhibits the following blood level concentration of loratadine when administered under fasting conditions:
(a) from 1.5 to 3.0 ngml of the loratadine after 2.0 hours;
(b) from 0.75 to 1.5 ngml of loratadine after 4.0 hours;
(c) from 0.25 to 0.5 ngml of loratadine after 6.0 hours;
(d) from 0.1 to 0.3 ngml of loratadine after 8.0 hours.
10. The composition of claim 5 which exhibits the following blood level concentration of descarboethoxyloratadine when administered under fasting conditions:
(a) from 1.5 to 2.5 ngml of descarboethoxyloratadine after 6.0 hours;
(b) from 0.75 to 1.5 ngml of descarboethoxyloratadine after 12.0 hours;
(c) from 0.5 to 1.0 ngml of descarboethoxyloratadine after 24.0 hours.
11. The composition of claim 5 which exhibits the following blood level concentration of pseudoephedrine when administered under fasting conditions:
(a) from 50 to 150 ngml of pseudoephedrine after 3 hours;
(b) from 200 to 300 ngml of pseudoephedrine after 6.0 hours;
(c) from 200 to 250 ngml of pseudoephedrine after 12.0 hours;
(d) from 175 to 225 ngml of pseudoephedrine after 18.0 hours;
(e) from 75 to 125 ngml of pseudoephedrine after 24.0 hours.
12. The formulation as defined in claim 1 wherein the antihistamine is a non-sedating antihistamine.
13. The formulation as defined in claim 1 wherein the antihistamine is a piperidinoalkanol compound.
14. The formulation as defined in claim 1 wherein the antihistamine is loratatdine.
15. The formulation as defined in claim 1 wherein the decongestant is a pseudoephedrine salt selected from the group consisting of sulphate, sodium, calcium, or hydrochloride.
16. The formulation as defined in claim 1 wherein the hydrogel forming polymer is hydroxypropyl methylcelluose with an average molecular weight greater than 180,000.
17. The formulation as defined in claim 1 wherein said filler is lactose.
18. The formulation as defined in claim 1 wherein said glidant in the matrix core is colloidal silicon dioxide.
19. The formulation as defined in claim 1 wherein said lubricant in the matrix core is a mixture of magnesium stearate and glyceryl monostearate.
20. The formulation as defined in claim 1 wherein said binder in the immediate release coating comprises hydroxypropyl methylcellulose.
21. The formulation as defined in claim 1 wherein said lubricant in the immediate release coating is talc.
22. The formulation as defined in claim 1 wherein the antiadherent in the immediate release coating is sodium lauryl sulfate.
23. The formulation as defined in claim 1 which exhibits the following antihistamine dissolution profile when tested in 900 ml of simulated gastric fluid buffer, pH 1.2, using a USP Type I apparatus at 100 rpm, 37\xb0 C..
a) from 40 to 80 wt % of the antihistamine is released after 0.25 hours;
b) from 65 to 95 wt % of the antihistamine is released after 0.5 hour;
c) not less than to 85 wt % of the antihistamine is released after 1.0 hour.
24. The formulation as defined in claim 1 which exhibits the following antihistamine dissolution profile when tested in 900 ml of simulated gastric fluid buffer, pH 1.2, using a USP Type I apparatus at 100 rpm, 37\xb0 C.
a) not less than 50 wt % of antihistamine released after 0.25 hour;
b) not less than 75 wt % of antihistamine released after 0.5 hour;
c) not less than 90 wt % of antihistamine released after 1.0 hour.
25. The formulation as defined in claim 1 which exhibits the following decongestant dissolution profile when tested in 900 ml of simulated gastric fluid buffer, pH 1.2, using a USP Type I apparatus at 100 rpm, 37\xb0 C.
(a) from 0 to 50 wt % of the decongestant is released after 1.0 hour;
(b) from 10 to 60 wt % of the decongestant is released after 2.0 hours;
(c) from 20 to 70 wt % of the decongestant is released after 4.0 hours;
(d) from 30 to 85 wt % of the decongestant is released after 8.0 hours;
(e) not less than 45 wt % of the decongestant is released after 12.0 hours;
(f) not less than 60 wt % of the decongestant is released after 20.0 hours.
26. The formulation as defined in claim 1 which exhibits the following decongestant dissolution profile when tested in 900 ml of simulated gastric fluid buffer at pH 1.2 using a USP Type I apparatus at 100 rpm at 37\xb0 C.
(a) from 10 to 40 wt % of the decongestant is released after 1.0 hours;
(b) from 15 to 45 wt % of the decongestant is released after 2.0 hours;
(c) from 25 to 60 wt % of the decongestant is released after 4.0 hours;
(d) from 35 to 80 wt % of the decongestant is released after 8.0 hours;
(e) not less than 50 wt % of the decongestant is released after 12.0 hours;
(f) not less than 70 wt % of the decongestant is released after 20.0 hours.