Author: claimsbot

We claim:

1. A binder-free shaped objected selected from the group consisting of microporous and mesoporous metal silicates, obtained by the hydrothermal reaction of a silicon and metal source in the presence of a template, wherein a pyrogenic metal-silicon mixed oxide is the silicon and metal source.
2. The binder-free shaped object according to claim 1 wherein the crystalline microporous and mesoporous metal silicates are represented by the composition
(SiO2)1x(AmOn)x (Ia), (SiO2)1x((AmOn)1-y(Am,On,)y)x (Ib)
or
(SiO2)1x(MrAmOn,)x (II)
in which
x is a number from 0.0001 to 0.25;
y is a number greater than 0 and less than 1;
A and A are a metal of valency p selected from the group consisting of B, Al, Ga, In, Ge, Sn, Pb, and subgroups 3 to 8 of the Periodic Table of Elements;
M is a cation of valency q selected from the group consisting of alkali metals, alkaline earth metals, H, NH4and N(alkyl)4
m, m, n, n, n and r are the number of atoms, where:
mp2n and mp2n and
mprq2n,
wherein a pyrogenic mixed oxide of composition (Ia) or (Ib) is used and the cation M of formula (II) is incorporated via the template or via alkali metal or alkaline earth metal hydroxide present in the hydrothermal reaction.
3. The binder-free shaped object according to claim 1 wherein said pyrogenic metal-silicon mixed oxide is prepared by flame hydrolysis.
4. The binder-free shaped object according to claim 1 wherein said pyrogenic mixed oxide is selected from the group consisting of
(SiO2)1x(TiO2)x, (SiO2)1x(Al2O3)x, (SiO2)1x(B2O3)x, (SiO2)1x(V2O5)x and (SiO2)1x (ZrO2)x.
5. The binder-free shaped object according to claim 4 which is
(SiO2)1x(TiO2)x
.
6. The binder-shaped object according to claim 1 wherein said template is an amine having one or more amino groups, an amino alcohol or a tetrasubstituted ammonium compound.
7. The binder-free shaped object according to claim 1 wherein said template is used in an amount of 0.05 to 2.0 mol per mol of SiO2 in the mixed oxide.
8. The binder-free shaped object according to claim 1 further comprising carrying out the hydrothermal reaction for the preparation of microporous metal silicates at a temperature from 100 to 220C.
9. The binder-free shaped object according to claim 1 further comprising carrying out the hydrothermal reaction for preparation of microporous metal silicates at a temperature from 150 to 190C.
10. The binder-free shaped object according to claim 1 wherein the preparation of mesoporous metal silicates is carried out at a temperature from 50 to 175C. under at least autogenous pressure.
11. A process for catalytic oxidation reactions, wherein a catalyst is present corresponding to an Al-free metal silicalite defined in claim 1.
12. The process according to claim 11 wherein the catalyst is (SiO2)1x(TiO2)x.
13. A process for the oxidation of an olefin wherein a catalyst is present, said catalyst being the binder-free shaped object of claim 1.
14. The process according to claim 13 wherein the catalyst is (SiO2)1x(TiO2)x.
15. The process according to claim 11 wherein propene is oxidized with hydrogen peroxide to give the corresponding epoxide.
16. The process according to claim 12 wherein propene is oxidized with hydrogen peroxide to give the corresponding expoxide.
17. A process for preparing a hydroxy aromatic compound comprising reacting an aromatic compound with hydrogen peroxide or an organic hydroperoxide in the presence of a binder-free shaped object according to claim 1.
18. A process for producing an alcohol or ketone comprising reacting an aliphatic hydrocarbon with hydrogen peroxide or an organic hydroperoxide in the presence of a binder-free shaped object according to claim 1.
19. The process according to claim 18, wherein a ketone is converted to an oxime by reacting with hydrogen peroxide and ammonia.
20. A process for the catalytic epoxidation of an olefin with hydrogen peroxide as the oxidant comprising carrying out the epoxidation in the presence of a catalyst which is a crystalline microporous titanium silicate of the composition (SiO2)1x(TiO2)x in which x is a number from 0.001 to 0.2 wherein a pyrogenic silicon-titanium mixed oxide is reacted with tetraalkylammonium hydroxide template in a hydrothermal reaction at a temperature from 100 to 220C., and wherein the pyrogenic silicon-titanium mixed oxide is shaped to microgranules by a spray drying process prior to the hydrothermal reaction and a crystalline microporous titanium silicate in the form at microgranules is formed.
21. The process of claim 20, wherein the olefin is propene.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An electronic module cooling apparatus for cooling a plurality of electronic modules, in particular memory modules, disposed on a substrate in spaced-apart parallel relationship, each module including a circuit board to which one or more electronic components are mounted, the apparatus comprising:
a row of parallel, spaced apart, thermally conductive, cold plates that extend longitudinally and define planar slots that are open top and bottom for receiving respective electronic modules, at least one of the cold plates having a thermally conducting, in particular planar, surface for contacting the one or more electronic components of a relatively adjacent electronic module;
a first fluid conduit providing a passageway for cooling fluid, the first fluid conduit extending along the row of cold plates outwardly in relation to the planar slots, the conduit being connected to adjacent first longitudinal ends of a plurality of the cold plates for transferring heat absorbed by the plurality of cold plates to the cooling fluid flowing through the first conduit; and
a second conduit providing a passageway for cooling fluid, wherein the second conduit is spaced apart from the first fluid conduit and is connected to second ends of the plurality of cold plates opposite the first ends.
2. The electronic module cooling apparatus of claim 1, wherein each planar slot is bounded by a respective pair of the cold plates, and means are provided for pressing the cold plates against respective sides of the electronic module received in the planar slot formed between the pair of cold plates.
3. The electronic module cooling apparatus of claim 2, wherein the means for pressing includes a resilient clip for engaging backsides of the cold plates for squeezing the cold plates together for holding the cold plates against respective sides of the electronic module received in the planar slot formed between the pair of cold plates.
4. The electronic module cooling apparatus of claim 2, wherein a front side of each cold plate of the pair of cold plates has the thermally conducting surface for contacting respective confronting surfaces of the electronic module disposed between the cold plates.
5. The electronic module cooling apparatus of claim 1, wherein the cold plates include a thermally conductive resilient dielectric material on surfaces of the cold plates for engaging the memory modules.
6. (canceled)
7. The electronic module cooling apparatus of claim 5, wherein the thermally conductive resilient dielectric material is in the form of a thin solid film.
8. The electronic module cooling apparatus of claim 1, wherein the first and second ends of the plurality of cold plates are held in spaced apart relationship by the first and second fluid conduits.
9-10. (canceled)
11. The electronic module cooling apparatus of claim 1, wherein at least one of the cold plates includes a fluid passage communicating at one end with the first conduit and at an opposite end with the second conduit for passage of cooling fluid through said one cold plate.
12-13. (canceled)
14. The apparatus of claim 1, in combination with the plurality of electronic modules disposed between respective pairs of the cold plates, the combination further comprising a base substrate to which the electronic modules are removably mounted by module receptacles, wherein the electronic module cooling apparatus is mounted to the base substrate independently of the electronic modules.
15. The combination of claim 14, wherein at least of the electronic modules is removable from the base substrate without removing the electronic module cooling apparatus.
16. The apparatus of claim 1, wherein the cold plates are fixed to each fluid conduit by brazing.
17. A cooling module for cooling a memory board, comprising:
a first heat absorbing element for removing heat from a memory board, the first heat absorbing element having an elongated surface for thermally contacting a first surface of the memory board;
a second heat absorbing element for removing heat from a memory board, the second heat absorbing element having an elongated surface for thermally contacting a second surface of the memory board, the elongated surface of the second heat absorbing element facing the elongated surface of the first heat absorbing element and being spaced therefrom to form a space into which the memory board is receivable; and
a conduit connecting the first heat absorbing element and the second heat absorbing element, the conduit providing a passageway for a fluid flow through the cooling module to remove heat absorbed by the first heat absorbing element and the second heat absorbing element; and
wherein means are used to enhance thermal contact between the heat absorbing elements and respective sides of the memory board.
18. The cooling module of claim 17, wherein the first heat absorbing element and the second heat absorbing element are part of an array of heat absorbing elements for absorbing heat from a plurality of memory boards disposed in spaces between the heat absorbing elements in the array.
19. The cooling module of claim 17, wherein the means used to enhance thermal contact includes a clip for sandwiching the memory board between the elongated surface of the first heat absorbing element and the elongated surface of the second heat absorbing element.
20. (canceled)
21. The cooling module of claim 17, further comprising a second conduit connecting the first heat absorbing element and the second heat absorbing element, the second conduit providing a passageway for a fluid flow through the cooling module to remove heat absorbed by the first heat absorbing element and the second heat absorbing element, and wherein the conduits are spaced apart from one another and located at opposite ends of the heat absorbing elements.
22-23. (canceled)
24. The cooling module of claim 17, wherein the heat absorbing elements are brazed to the conduit.
25-27. (canceled)
28. The cooling module of claim 17, in combination with a memory board having a first surface and a second surface, the memory board received in the space between the first heat absorbing element and the second heat absorbing element, wherein the elongated surface of the first heat absorbing element is in thermal contact with the first surface of the memory board and the elongated surface of the second heat absorbing element is in thermal contact with the second surface of the memory board.
29-30. (canceled)
31. A method of cooling a memory board, comprising:
providing a cooling apparatus or module including
a first cold plate for removing heat from a memory board, the first cold plate having an elongated surface for thermally contacting a first surface of the memory board,
a second cold plate for removing heat from a memory board, the second cold plate having an elongated surface for thermally contacting a second surface of the memory board, the elongated surface of the second cold plate facing the elongated surface of the first cold plate and being spaced therefrom to form a slot into which the memory board is receivable, and,
fluid conduits located at each end of the cold plates;

inserting a memory board into the slot between the cold plates; and
pumping a fluid through the conduits to remove heat from the cold plates.
32. The cooling module of claim 17, wherein the means used to enhance thermal contact includes a thermally conductive resilient dielectric material on surfaces of the heat absorbing elements for engaging the memory board.
33. The cooling module of claim 32, wherein the thermally conductive resilient dielectric material is in the form of a thin film.

1-19. (canceled)
20. A system for providing adaptive haptic feedback effects to a user of a user device in response to an incoming communication, said system comprising:
at least one sensor configured to capture data related to at least one of a user device and a surrounding environment of said user device;
at least one interface module configured to identify one or more contextual characteristics of said user device based on said captured data;
a context management module configured to evaluate said one or more contextual characteristics and to determine a local context assessment of said user device based on said evaluation;
a haptic feedback control module configured to adjust one or more parameters of one of a plurality of haptic effects based, at least in part, on said local context assessment and to generate a control signal having data related to said adjusted haptic effect; and
a haptic device configured to generate said adjusted haptic effect in response to receipt of said control signal from said haptic feedback control module.
21. The system of claim 20, wherein said at least one sensor is selected from the group consisting of a light sensor, a microphone, a touch sensor and a motion sensor, said light sensor and microphone configured to capture light and sound of the surrounding environment, respectively, and said touch sensor and motion sensor configured to capture user contact with and motion of the user device, respectively.
22. The system of claim 21, wherein said at least one recognition module is configured to identify said one or more contextual characteristics of said user device and said surrounding environment based on at least one of said light in the surrounding environment, sound in the surrounding environment, user contact with the user device and motion of the user device.
23. The system of claim 22, wherein said one or more contextual characteristics are selected from the group consisting of user possession of said user device, active user interaction with said user device, ambient light levels within surrounding environment and ambient noise levels within surrounding environment.
24. The system of claim 20, wherein each of said plurality of haptic effects includes a mechanical vibration effect.
25. The system of claim 24, wherein said one or more parameters of said haptic effect is selected from the group consisting of intensity, waveform and duration of said vibration effect.
26. The system of claim 24, wherein said haptic device includes a vibration actuator.
27. The system of claim 20, wherein each of said plurality of haptic effects corresponds to an associated one of a plurality of incoming communications to said user device from at least one of an internal notification system of said user device, a remote device and an external computing device, system, or server.
28. The system of claim 27, wherein one of said plurality of incoming communications is selected from the group consisting of a phone call, text message, user input, email, push notification from a social media platform, internally stored calendar event notification and home appliance alert notification.
29. A method for providing adaptive haptic effects to a user of a user device in response to an incoming communication, said method comprising:
receiving data related to at least one of a user device and a surrounding environment of said user device;
identifying one or more contextual characteristics of said user device based on said data;
evaluating said one or more contextual characteristics and determining a local context assessment of said user device based on said evaluation;
adjusting one or more parameters of one of a plurality of haptic effects based, at least in part, on said local context assessment; and
generating said adjusted haptic effect.
30. The method of claim 29, further comprising capturing said data related to said at least one of user device and said surrounding environment of said user device with at least one sensor.
31. The method of claim 30, wherein said at least one sensor is selected from the group consisting of a light sensor, a microphone, a touch sensor and a motion sensor, said light sensor and microphone to capture light and sound of the surrounding environment, respectively, and said touch sensor and motion sensor to capture user contact with and motion of the user device, respectively.
32. The method of claim 29, wherein said one or more contextual characteristics are selected from the group consisting of user possession of said user device, active user interaction with said user device, ambient light levels within surrounding environment and ambient noise levels within surrounding environment.
33. The method of claim 29, wherein each of said plurality of haptic effects includes a mechanical vibration effect.
34. The method of claim 33, wherein adjusting one or more parameters of a haptic effect comprises adjusting at least one of intensity, waveform and duration of said vibration effect.
35. The method of claim 29, wherein each of said plurality of haptic effects corresponds to an associated one of a plurality of incoming communications to said user device.
36. The method of claim 35, further comprising receiving one of a plurality of incoming communications from at least one of an internal notification system of said user device, a remote device and an external computing device, system, or server.
37. The method of claim 36, wherein one of said plurality of incoming communications is selected from the group consisting of a phone call, text message, user input, email, push notification from a social media platform, internally stored calendar event notification and home appliance alert notification.
38. A system including at least a device, the system being arranged to perform the method of claim 29.
39. A chipset arranged to perform the method of claim 29.
40. At least one computer accessible medium having instructions stored thereon which, when executed by a computing device, cause the computing device to carry out the method according to claim 29.
41. A device configured for providing adaptive haptic feedback effects, the device being arranged to perform the method of claim 29.
42. A system having means to perform the method of claim 29.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. In a land based gas turbine comprising a compressor, a combustor and turbine section including at least three stages, a cooling circuit comprising:
an inlet into a third stage nozzle from the compressor for feeding cooling air from the compressor to the third stage nozzle; at least one passageway running substantially radially through each airfoil of said third stage nozzle and an associated diaphragm, into an annular space between the rotor and the diaphragm; and passageways communicating between said annular space and individual buckets of said third stage.
2. The gas turbine of claim 1 wherein said at least one passageway includes a portion in said diaphragm configured to feed said cooling air into said annular space substantially tangent to the rotor.
3. The gas turbine of claim 2 wherein said portion of said at least one passageway contracts in the flow direction to accelerate the cooling air as it enters said annular space.
4. The gas turbine of claim 2 wherein said portion of at least one passageway in said diaphragm is provided in a part annular labyrinth seal segment secured to said diaphragm and cooperating with a corresponding seal on a rotor spacer wheel located radially inwardly of said third stage nozzle.
5. The gas turbine of claim 4 wherein means are provided to accommodate relative motion or mismatch between said portion of said at least one passageway in said seal segment and said diaphragm.
6. The gas turbine of claim 1 wherein said inlet to said third stage nozzle includes a manifold external to a casing of said gas turbine.
7. The gas turbine of claim 4 wherein said passageways communicating between said annular space and said individual buckets include plural sets of axial passages through said spacer wheel.
8. The gas turbine of claim 1 wherein said third stage nozzle includes a plurality of part annular segments, each segment having two nozzle airfoils, and wherein said inlet includes a pipe feeding cooling air to each segment, said pipe supplying cooling air to each of said two nozzle airfoils.
9. The gas turbine of claim 1 wherein stages 1 and 2 are primarily steam cooled.
10. The gas turbine of claim 4 including an annular seal between said spacer wheel and said third stage buckets to prevent leakage of cooling air passing into said third stage buckets.
11. A method of cooling one stage of a gas turbine comprising:
a) extracting cooling air from a turbine compressor;
b) supplying cooling air to a stationary nozzle adjacent said one stage of the gas turbine;
c) establishing a path for said cooling air from said stationary nozzle to a plurality of buckets in said one turbine stage; and
d) flowing said cooling air radially outwardly through said plurality of buckets and exhausting said cooling air from radially outer tips of said buckets.
12. The method of claim 11 wherein during step c), said cooling air is fed tangentially into an annular space surrounding a rotor of said gas turbine.
13. The method of claim 12 wherein said cooling air is accelerated into said annular space.
14. The method of claim 11 wherein said one turbine stage is a third stage.
15. The method of claim 11 wherein said cooling air is supplied to said stationary nozzle via a path outside said gas turbine.
16. In a land based gas turbine comprising a compressor, a combustor and turbine section including at least three stages, a cooling circuit comprising:
means for supplying cooling air from a gas turbine compressor to a stationary nozzle; and
means for establishing a cooling air flow path from said nozzle to individual buckets of a turbine stage downstream and adjacent said stationary nozzle.