Author: claimsbot

1. A process for preparing a dough or a baked product prepared from the dough, comprising incorporating into the dough a hybrid polypeptide comprising:
(a) a first amino acid sequence comprising an alpha-amylase catalytic domain which
i. has at least 70% identity to the amino acids 1 to 478 of SEQ ID NO: 2, or
ii. is encoded by a polynucleotide which hybridizes under at least medium stringency conditions with (i) nucleotides 1 to 1434 of SEQ ID NO: 1, (ii) the cDNA sequence contained in nucleotides 1 to 1434 of SEQ ID NO: 1, or (iii) a complementary strand of (i) or (ii); or
iii. is a polypeptide derived from SEQ ID NO: 2 by substitution, deletion or addition of one more amino acid; and

(b) a second amino acid sequence comprising a carbohydrate binding module which
i. has at least 70% identity to the amino acids 1 to 97 of SEQ ID NO: 4, or
ii. is encoded by a polynucleotide which hybridizes under at least medium stringency conditions with (i) nucleotides 1 to 294 of SEQ ID NO: 3, (ii) the cDNA sequence contained in nucleotides 1 to 294 of SEQ ID NO: 3, or (iii) a complementary strand of (i) or (ii);
iii. is a polypeptide derived from SEQ ID NO: 4 by substitution, deletion or addition of one more amino acid; and optionally

(c) a linker comprising 0 to 50 amino acids between the first amino acid sequence and the second amino acid sequence.
2. The process of claim 1 wherein the hybrid polypeptide
i. has at least 70% identity to the amino acids 1 to 586 of SEQ ID NO:8, or
ii. has at least 70% identity to the amino acids 1 to 586 of SEQ ID NO:14, or
iii. is encoded by a polynucleotide which hybridizes under at least medium stringency conditions with (i) nucleotides 1 to 1760 of SEQ ID NO: 7, (ii) the cDNA sequence contained in nucleotides 1 to 1760 of SEQ ID NO: 7, or (iii) a complementary strand of (i) or (ii); or
iv. is encoded by a polynucleotide which hybridizes under at least medium stringency conditions with (i) nucleotides 1 to 1760 of SEQ ID NO: 13, (ii) the cDNA sequence contained in nucleotides 1 to 1760 of SEQ ID NO: 13, or (iii) a complementary strand of (i) or (ii); or
v. is a polypeptide derived from SEQ ID NO: 8 by substitution, deletion or addition of one more amino acids, or
vi. is a polypeptide derived from SEQ ID NO: 14 by substitution, deletion or addition of one more amino acids.
3. The process of claim 1 wherein the first amino acid sequence of the hybrid polypeptide comprises
i. the amino acids 1 to 478 of SEQ ID NO: 10, or
ii. the amino acids 1 to 478 of SEQ ID NO: 12.
4. The process of claim 1 wherein the second amino acid sequence of the hybrid polypeptide is SEQ ID NO: 4.
5. The process of claim 1 wherein the optional linker of the hybrid polypeptide has the amino acid sequence of SEQ ID NO: 6.
6. The process of claim 1 where the hybrid polypeptide is dosed in the range of 0.1-5 mg proteinkg of flour.
7. A baking composition comprising the polypeptide of claim 1 and a baking ingredient.
8. A composition comprising the polypeptide of claim 1 and flour.
9. A composition comprising
a. the polypeptide of claim 1, and
b. one or more components selected from the group consisting of leavening agent, milk powder, gluten emulsifier, granulated fat and an oxidant.
10. The composition of claim 9 which is a dough.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An oxygen scavenging composition for polyester resins comprising a resin carrier; and
iron particles mixture dispersed in the said resin carrier
said iron particle mixture consisting of
i micron sized iron particles having particle size in the range of 1 to 50 microns;
ii nano sized iron particles having particle size in the range of 5 to 50 nano meters.
2. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the micron sized iron particles are in the range of 1 to 10 microns.
3. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the micron sized iron particles are in the range of 15 to 30 microns.
4. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the micron sized are a mixture of iron particles in the range of 1 to 10 microns and 15 to 30 microns.
5. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the micron sized are a mixture of iron particles in the range of 1 to 10 microns and 15 to 30 microns and the ratio of the quantity of iron particles in the range of 1 to 10 microns to the ratio of the particles in the range of 15 to 30 microns lies between 1:0.10 and 1:0.80.
6. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the ratio of the mass of the micron sized iron particles to the mass of the nano sized iron particles is in the range of 1:0.10 to 1:0.20.
7. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the ratio of the mass of carrier resin to the mass of said mixture of iron particles is in the range of 1:0.01 to 1:0.08.
8. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the carrier resin is a polyester resin having a maximum melting point temperature in the range of 228 to 230\xb0 C.
9. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the carrier resin is an alloy of PET with PTN, its co polyesters or its blends.
10. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the carrier resin is an alloy of PET with PBN, its co polyesters or its blends.
11. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the carrier resin is PET with PBN or PTN in a ratio of a maximum of 75:25%.
12. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the carrier resin is PTN.
13. An oxygen scavenging composition for polyester resins comprising a resin carrier;
iron particles mixture dispersed in the said carrier
said iron particle mixture consisting of
i micron sized iron particles having particle size in the range of 1 to 50 microns;
ii nano sized iron particles having particle size in the range of 5 to 50 nano meters; and

an oxidation reaction accelerator.
14. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is at least one alkali metal bisulfate selected from a group of alkali metal bisulfates consisting of sodium bisulfate, calcium bisulfate, potassium bisulfate, magnesium bisulfate.
15. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is at least one compound selected from a group consisting of sodium bisulfate and potassium bisulfate.
16. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is a metal halide.
17. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is at least one metal halide selected from a group of metal halides consisting of Barium chloride, Calcium chloride, Iron (II) chloride, Iron (III) chloride, Lithium chloride, Magnesium chloride, Magnesium fluoride, Potassium bromide, Potassium chloride, Potassium iodide, Sodium bromide, Sodium chloride, Sodium iodide, Strontium chloride, and Zinc chloride.
18. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is at least one metal halide selected from a group consisting of sodium chloride and potassium chloride.
19. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is a mixture of at least one alkali metal bisulfate, at least one metal halide.
20. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is ascorbic acid.
21. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is at least one metal ascorbate.
22. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is at least one metal ascorbate selected from a group consisting of sodium ascorbate, potassium ascorbate, sodium ascorbate, magnesium ascorbate, calcium ascorbate, zinc ascorbate, chromium ascorbate.
23. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is a mixture of at least one alkali metal bisulfate, and at least one metal ascorbate.
24. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is a mixture of at least one alkali metal halide and at least one metal ascorbate.
25. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the oxidation reaction accelerator is a mixture of at least one alkali metal bisulfate, at least one metal halide and at least one metal ascorbate.
26. An oxygen scavenging composition for polyester resins as claimed in claim 13, in which the ratio of the mass of the carrier resin to the mass of the oxidation reaction accelerator is in the range of 1:0.001 to 1:0.01.
27. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the iron particles are pre-treated with C3 to C8 alcohols selected from a group consisting of n-propanol, n-butanol, pentanol, hexanol, septanol and octanol, Isopropyl alcohol, Isobutyl alcohol, Sec-butyl alcohol, Tertiary butyl alcohol, Isopentyl alcohol, Tertiary pentyl alcohol, Neopentyl alcohol, Cyclopentyl alcohol, Cyslohexyl alcohol and Allyl alcohols.
28. An oxygen scavenging composition for polyester resins as claimed in claim 1, in which the iron particles are pre-treated with C3 to C8 alcohols under refluxing conditions.
29. An oxygen scavenging composition for polyester resins comprising a resin carrier;
iron particles mixture dispersed in the said carrier
said iron particle mixture consisting of
i micron sized iron particles having particle size in the range of 1 to 50 microns;
ii nano sized iron particles having particle size in the range of 5 to 50 nano meters;

an oxidation reaction accelerator; and
barrier additives.
30. An oxygen scavenging composition for polyester resins comprising a resin carrier;
iron particles mixture dispersed in the said carrier
said iron particle mixture consisting of
i micron sized iron particles having particle size in the range of 1 to 50 microns;
ii nano sized iron particles having particle size in the range of 5 to 50 nano meters;

an oxidation reaction accelerator;
barrier additives;
color imparting additives, and ultraviolet light absorbers.
31. An oxygen scavenging composition for polyester resins as claimed in claim 30, in which the barrier additive is at least one barrier additive selected from a group containing sub micronic size particles of clay and sub micronic sized particles of silica.
32. A method of preparing an oxygen scavenging composition for polyester resins comprising the steps of
(i) preparing an intimate mixture of dried micron sized iron particles having particle size in the range of 1 to 50 microns and dried nano sized iron particles having particle size in the range of 5 to 50 nano meters to form an iron particle mix;
(ii) uniformly dispersing the said iron particle mix up to a maximum of 25% in a resin carrier to form a master batch; and
(iii) storing the said master batch in an inert atmosphere until required for adding in a polyester resin for imparting oxygen scavenging property.
33. A method of preparing an oxygen scavenging composition for polyester resins comprising the steps of
(i) preparing an intimate mixture of dried micron sized iron particles having particle size in the range of 1 to 50 microns and dried nano sized iron particles having particle size in the range of 5 to 50 nano meters to form an iron particle mix adding at least one oxidation reaction accelerator to the iron particle mix to form a dry homogenous mixture;
(ii) uniformly dispersing the said homogenous mixture up to a maximum of 25% in a resin carrier to form a master batch;
(iii) storing the said master batch in an inert atmosphere until required for adding in a polyester resin for imparting oxygen scavenging property.
34. A method of preparing an oxygen scavenging composition for polyester resins as claimed in claim 33, wherein the homogenous mixture is refluxed with at least one alcohol from the C3 to C8 group of alcohols and the resultant mixture is dried at up to 75 degrees Celsius.
35. A method of preparing an oxygen scavenging composition for polyester resins as claimed in claim 33, in which the step of dispersing the said iron particle mix in the resin carrier is performed by adding the iron particle mix to the resin carrier in an extruder after thoroughly mixing the said iron particle mix, maintaining the extruder at a temperature between 260 degrees Celsius and 285 degrees Celsius, extruding the strand of iron mix dispersed carrier resin, cooling the strand and cutting strand into master batch chips.
36. A method of imparting oxygen scavenging properties to a polyester resin comprising the steps of
(i) preparing a master batch containing an oxygen scavenging composition comprising a resin carrier; and
iron particles mixture dispersed in the said resin carrier
said iron particle mixture consisting of
amicron sized iron particles having particle size in the range of 1 to 50 microns;
b nano sized iron particles having particle size in the range of 5 to 50 nano meters

(ii) adding the said master batch to dry polyester resin prior to extrusioninjection moldingstretch blow molding the polyester resin such that the final quantity of the iron particle mix in the polyester resin is in the region of 2500 ppm to 3500 ppm.
37. A method of imparting oxygen scavenging properties to a polyester resin as claimed in claim 36, in which the melting point of the carrier resin is at most between 228 degrees Celsius and 230 degrees Celsius and the melting point of the polyester resin lies between 246 degrees Celsius and 250 degrees Celsius.
38. A polyester resin having incorporated therein an oxygen scavenging composition as claimed in claim 1.
39. A polyester resin having incorporated therein an oxygen scavenging composition as claimed in claim 13.
40. A polyester resin having incorporated therein an oxygen scavenging composition as claimed in claim 29.
41. A container defined by at least one wall, wherein the wall comprises a polyester resin having an oxygen scavenging composition as claimed in claim 1.
42. A container defined by at least one wall, wherein the wall comprises a polyester resin having an oxygen scavenging composition as claimed in claim 13.
43. A container defined by at least one wall, wherein the wall comprises a polyester resin having an oxygen scavenging composition as claimed in claim 29.

1. An indicator light comprising: a body section defining a hole therethrough, clasps symmetrically protruding from opposite sides of the hole; a cover section detachably mounted to the body section, the cover section having a body portion, one side of the body portion including a protruding head portion, the head portion being received in the hole, opposite sides of the head portion defining symmetrical slits adjacent to the body portion and forming a stopping surface, the clasps for clasping the slits; a printed circuit body portion received in the body section; and a lamp electrically connected to the printed circuit body portion; wherein the lamp faces the cover section, so that the cover section guides lights from the lamp to the body section; wherein a body section defines a hole, the clasps symmetrically protrude from opposite sides of the hole, the cover section includes a head portion, symmetrical slits are defined at opposite sides of the head portion, the head portion is received in the hole, and the clasps clasp the slits; wherein the body section includes an interior surface defining two symmetrical slots on other opposite sides of the hole, the cover section includes a body portion being received in the slots.
2. The indicator light as claimed in claim 1, wherein the body section has an outer surface and an opposite interior surface, the printed circuit body portion adjacent to the interior surface.
3. The indicator light as claimed in claim 1, wherein the other side of the body portion includes a protruding tail portion, facing the lamp.
4. The indicator light as claimed in claim 1, wherein each clasp includes a clasping portion, the clasping portion has a guiding surface and a pressing surface opposite to the guiding surface, the pressing surface clasps the stopping surface.
5. The indicator light as claimed in claim 2, wherein the interior surface defines two symmetrical slots on other opposite sides of the hole, and the body portion is received in the slots.
6. The indicator light as claimed in claim 1, wherein the cover section is made of transparent and light-guiding material.
7. The indicator light as claimed in claim 1, wherein the lamp is an LED.
8. An indicator light, comprising: a body section being a part of a housing of an electronic device, the body section defining symmetrical clasps; a cover section detachably mounted to the body section, the cover section defining symmetrical slits, the clasps clasp the slits; a printed circuit body portion received in the body section; and a lamp electrically connected to the printed circuit body portion; wherein the lamp faces the cover section, so that the cover section guides lights from the lamp to the body section; wherein a body section defines a hole, the clasps symmetrically protrude from opposite sides of the hole, the cover section includes a head portion, symmetrical slits are defined at opposite sides of the head portion, the head portion is received in the hole, and the clasps clasp the slits; wherein the body section includes an interior surface defining two symmetrical slots on other opposite sides of the hole, the cover section includes a body portion being received in the slots.
9. The indicator light as claimed in claim 8, wherein each clasp includes a clasping portion, the clasping portion has a guiding surface and a pressing surface opposite to the guiding surface, each slit forms a stopping surface, and the pressing surface clasps the stopping surface.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for forming an intrinsic type microcrystalline silicon layer, comprising:
dynamically ramping up a silane gas supplied in a gas mixture to a surface of a substrate disposed in a processing chamber;
dynamically ramping down a RF power applied in the gas mixture supplied to the processing chamber, the gas mixture forming a plasma in the processing chamber; and
forming an intrinsic type microcrystalline silicon layer on the substrate in the presence of the plasma.
2. The method of claim 1, wherein the silane gas supplied in the gas mixture is ramped up linearly.
3. The method of claim 1, wherein the RF power applied in the gas mixture is ramped down linearly.
4. The method of claim 1, further comprising:
forming a seed layer prior to forming the intrinsic type microcrystalline silicon layer.
5. The method of claim 4, further comprising:
performing a hydrogen treatment process prior to forming the seed layer on the substrate surface.
6. The method of claim 4, wherein performing the hydrogen treatment process further comprises:
applying a RF power less than 150 milliWattscm2 in the hydrogen treatment process.
7. The method of claim 1, further comprising:
dynamically ramping up a process pressure of the gas mixture disposed in the processing chamber.
8. The method of claim 7, wherein dynamically ramping up the process pressure further comprises:
ramping up the process pressure from about 12 Torr to about 15 Torr.
9. The method of claim 1, wherein dynamically ramping up the silane gas supplied in the gas mixture further comprises:
ramping up a ratio of a flow rate of the silane gas to a hydrogen gas supplied in the gas mixture from about 1:70 to about 1:80.
10. The method of claim 1, wherein dynamically ramping down the RF power applied in the gas mixture further comprises:
ramping down the RF power from 800 milliWattscm2 to about 700 milliWattscm2.
11. The method of claim 1, further comprising:
dynamically increasing a spacing of the substrate from about 600 mils to about 700 mils.
12. The method of claim 4, wherein forming the seed layer further comprises:
ramping up a silane gas flow rate supplied in the gas mixture; and
maintaining a steady hydrogen gas flow rate supplied in the gas mixture while ramping up the silane gas flow rate.
13. The method of claim 5, wherein forming the seed layer further comprises:
applying a RF power less than 400 milliWattscm2 while forming the seed layer.
14. The method of claim 1, further comprising:
supplying the gas mixture to the processing chamber for a period between about 1000 seconds and about 1800 seconds.
15. A method for forming an intrinsic type microcrystalline silicon layer, comprising:
forming an intrinsic type seed layer on a substrate disposed in a processing chamber;
applying a RF power less than 400 milliWattscm2 to maintain a plasma formed from a gas mixture while forming the seed layer;
subsequently forming an intrinsic type microcrystalline silicon layer on the substrate in the presence of the plasma, wherein the intrinsic type microcrystalline silicon layer is formed by dynamically ramping up a silane gas supplied in the gas mixture; and
dynamically ramping down a RF power applied in the gas mixture supplied to the processing chamber to form a plasma in the gas mixture.
16. The method of claim 15, wherein the step of dynamically ramping up the silane gas supplied in the gas mixture further comprises:
ramping up a flow ratio of the silane gas to a hydrogen gas supplied in the gas mixture from about 1:70 to about 1:80.
17. The method of claim 15, wherein the step of dynamically ramping down the RF power further comprises:
ramping down the RF power from 800 milliWattscm2 to about 700 milliWattscm2.
18. The method of claim 15, the step of dynamically ramping up the silane gas supplied in the gas mixture further comprises:
ramping up the process pressure from about 12 Torr to about 15 Torr.
19. The method of claim 15, further comprising:
performing a hydrogen treatment process prior to forming the intrinsic type seed layer on the substrate surface.
20. A method for forming an intrinsic type microcrystalline silicon layer, comprising:
supplying a first gas mixture onto a surface of a substrate disposed in a processing chamber to form an intrinsic type seed layer on the substrate, wherein a first gas mixture includes a silane gas and a hydrogen gas, the silane gas flow rate is ramped up and the hydrogen gas flow rate is maintained steady while supplying the first gas mixture; and
supplying a second gas mixture onto the surface of the substrate to form an intrinsic type microcrystalline silicon layer on the intrinsic type seed layer, wherein the silane gas flow rate is ramped up while supplying the second gas mixture and a RF power applied to the second gas mixture is ramped down while forming the intrinsic type microcrystalline silicon layer.