Author: claimsbot

1. A computer program product embodied on a non-transitory computer readable medium, comprising:
code for receiving communications utilizing an IP protocol that are directed to at least one module including a first function;

code for intercepting the communications; and
code for modifying or creating at least one aspect of the communications for emulating a second function that is different from the first function of the at least one module.
2. The computer program product of claim 1, wherein the computer program product includes at least one abstraction layer in communication with the at least one module.
3. The computer program product of claim 1, wherein the at least one module includes a hardware module.
4. The computer program product of claim 1, wherein the at least one module includes a software module.
5. The computer program product of claim 1, wherein the code includes hardware code.
6. The computer program product of claim 1, wherein the code includes software code.
7. The computer program product of claim 1, wherein the computer program product is operable such that the communications are intercepted after the communications are communicated utilizing the IP protocol.
8. The computer program product of claim 1, wherein the computer program product is operable such that the communications are intercepted during the communication of the communications utilizing the IP protocol.
9. The computer program product of claim 1, wherein the computer program product is operable such that the modifying or creating includes modifying.
10. The computer program product of claim 1, wherein the computer program product is operable such that the modifying or creating includes creating.
11. The computer program product of claim 1, wherein the at least one module includes a software service or device associated with a client.
12. The computer program product of claim 1, wherein the at least one module includes a software service or device associated with a router.
13. The computer program product of claim 1, wherein the at least one module includes a software service or device associated with a server.
14. The computer program product of claim 1, wherein the at least one module includes a software service or device associated with a web server.
15. The computer program product of claim 1, wherein the at least one module includes a software service or device associated with a reverse proxy server.
16. The computer program product of claim 1, wherein the at least one aspect of the communications includes a level of security.
17. The computer program product of claim 1, wherein the first function involves a first type of connection and the second function that is emulated involves a second type of connection.
18. The computer program product of claim 1, wherein the first function involves a less-secure connection and the second function that is emulated involves a more-secure connection.
19. The computer program product of claim 1, wherein the at least one aspect of the communications includes a proxy name.
20. The computer program product of claim 1, wherein the at least one aspect of the communications includes a local host name.
21. The computer program product of claim 1, wherein the first function involves a first proxy name and the second function involves a second proxy name.
22. The computer program product of claim 1, wherein the computer program product is operable such that the modifying or creating of the at least one aspect of the communications includes creating at least one virtual device.
23. The computer program product of claim 1, wherein the first function involves a physical device without a virtual device and the second function involves at least one virtual device in association with the physical device.
24. The computer program product of claim 1, wherein the first function involves a physical device without a virtual device and the second function involves a plurality of virtual devices in association with the physical device.
25. The computer program product of claim 1, wherein the at least one aspect of the communications includes a number of endpoints.
26. The computer program product of claim 1, wherein the first function involves an n-way communication and the second function that is emulated involves an m-way communication.
27. The computer program product of claim 1, wherein the first function involves a 3-way communication and the second function that is emulated involves a 2-way communication.
28. The computer program product of claim 1, wherein the first function involves a first communication protocol and the second function involves a second communication protocol.
29. The computer program product of claim 1, wherein the computer program product is operable such that the modifying or creating of the at least one aspect of the communications includes creating at least one user interface.
30. The computer program product of claim 1, wherein the computer program product is operable such that the modifying or creating of the at least one aspect of the communications includes modifying at least one user interface.
31. The computer program product of claim 1, wherein the first function involves a first user interface and a second function involves a second user interface.
32. A method, comprising:
receiving communications utilizing an IP protocol that are directed to at least one module including a first function;

intercepting the communications; and
modifying or creating at least one aspect of the communications for emulating a second function that is different from the first function of the at least one module.
33. An apparatus, comprising:
circuitry for receiving communications utilizing an IP protocol that are directed to at least one module including a first function;

circuitry for intercepting the communications; and
circuitry for modifying or creating at least one aspect of the communications for emulating a second function that is different from the first function of the at least one module.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1-21. (canceled)
22. A system for directing and receiving information to and from relevant geographical locations, comprising:
a document that comprises information associated with a geographic region; and
a component that automatically directs the document to a user upon entrance into the geographic region.
23. The system of claim 22, the document comprising information associated with the geographic region dynamically linked from a database upon entrance into the geographic region.
24. The system of claim 23, the database is the Internet.
25. The system of claim 22, further comprising a component that receives a query, the document directed to the user based at least in part upon contents of the query.
26. The system of claim 22, further comprising a GPS component that dynamically determines a geographic region associated with the user.
27. The system of claim 22, further comprising a component that analyzes demographic information relating to the user, wherein the document is directed to the user based at least in part upon the analyzed demographic information.
28. The system of claim 27, the demographic information being one or more of income level, vehicle type driven by the user, search history on the Internet, time of day, day of a week, and past purchasing history.
29. A portable device comprising the system of claim 1.
30. An automobile comprising the system of claim 1.
31. The system of claim 1, a region identifier associated with the document.
32. The system of claim 1, the document is a web page.
33. The system of claim 1, further comprising a component that receives a query, wherein documents returned based upon the query are restricted to documents comprising information relating to a current geographic region of the user.
34. The system of claim 1, at least a portion of the information within the document directed audibly to the user.
35. The system of claim 1, the document pushed from a database assigned to the geographic region.
36. The system of claim 1, at least one of size and shape of the geographic region is defined by the user.
37. A system that facilitates deliverance of information based upon geographic location, comprising:
a plurality of documents associated with one or more of geographic regions, the documents comprising region identifiers that define one or more regions associated with each of the plurality of documents;
a component that dynamically determines a current geographic region associated with a user; and
a delivery component that analyzes the region identifiers associated with the plurality of documents and delivers to the user one or more of the documents that comprise region identifiers corresponding to the current geographic region associated with the user.
38. The system of claim 37, further comprising a query component that receives a query, the one or more documents delivered to the user is based at least in part upon contents of the query.
39. The system of claim 37, further comprising a component that analyzes demographic information corresponding to the user, the one or more documents delivered to the user is based at least in part upon the analyzed demographic information.
40. A portable communication device employing the system of claim 37.
41. The system of claim 37, the region identifiers embedded into the plurality of documents.
42. The system of claim 37, the documents resident upon the Internet.
43. A method for delivering geographically specific information to a user, comprising:
dynamically monitoring geographic location of a user;
automatically searching over a plurality of documents relevant to the geographic location of the user; and
dynamically delivering a document to the user that has been searched over based at least in part upon the monitored geographic location of the user.
44. The method of claim 43, further comprising delivering a disparate document to the user based at least in part upon a sensed alteration in geographic location of the user.
45. The method of claim 43, further comprising receiving a query, the document delivered based at least in part upon the monitored geographic location of the user and the query.
46. The method of claim 43, a GPS system employed to dynamically monitor the geographic location of the user.
47. The method of claim 43, further comprising:
assigning the current geographic location of the user to a geographic region; and
delivering the document to the user based upon the assigned geographic region.
48. The method of claim 47, further comprising embedding geographic region identifiers within the plurality of documents.
49. A system that facilitates information retrieval, comprising:
means for associating a document with a geographic region;
means for dynamically monitoring geographic location of a user;
means for determining a geographic region of the user based upon the monitored geographic location of the user; and
means for delivering the document to the user based at least in part upon the geographic region associated with the document and the determined geographic region of the user.
50. The system of claim 49, further comprising:
means for receiving a query; and
means for delivering the document to the user based at least in part upon the query.

1. A choline salt of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol.
2. A choline salt crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having an endothermic peak at 194 to 198\xb0 C. measured by differential scanning calorimetry (DSC analysis).
3. A choline salt crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having main peaks at about 2\u03b8 (\xb0) of 5.58, 14.72, 16.80, 17.82, 21.02, and 22.46 measured by X-ray powder diffraction.
4. A choline salt crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having an endothermic peak at 194 to 198\xb0 C. measured by differential scanning calorimetry (DSC analysis) and main peaks at about 2\u03b8 (\xb0) of 5.58, 14.72, 16.80, 17.82, 21.02, and 22.46 measured by X-ray powder diffraction.
5. A choline salt hydrate crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having a broad endothermic peak at about 78\xb0 C. and an endothermic peak at 195 to 199\xb0 C. measured by differential scanning calorimetry (DSC analysis).
6. A choline salt hydrate crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having main peaks at about 2\u03b8 (\xb0) of 5.66, 17.08, 17.66, 19.02, 19.58, and 22.14 measured by X-ray powder diffraction.
7. A choline salt hydrate crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having a broad endothermic peak at about 78\xb0 C. and an endothermic peak at 195 to 199\xb0 C. measured by differential scanning calorimetry (DSC analysis) and main peaks at about 2\u03b8 (\xb0) of 5.66, 17.08, 17.66, 19.02, 19.58, and 22.14 measured by X-ray powder diffraction.
8. (canceled)
9. (canceled)
10. (canceled)
11. A pharmaceutical composition comprising the choline salt crystal selected from the group consisting of a choline salt of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol, a choline salt crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having an endothermic peak at 194 to 198\xb0 C. measured by differential scanning calorimetry (DSC analysis), a choline salt crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having main peaks at about 2\u03b8 (\xb0) of 5.58, 14.72, 16.80, 17.82, 21.02, and 22.46 measured by X-ray powder diffraction, a choline salt crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having an endothermic peak at 194 to 198\xb0 C. measured by differential scanning calorimetry (DSC analysis) and main peaks at about 2\u03b8 (\xb0) of 5.58, 14.72, 16.80, 17.82, 21.02, and 22.46 measured by X-ray powder diffraction, a choline salt hydrate crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having a broad endothermic peak at about 78\xb0 C. and an endothermic peak at 195 to 199\xb0 C. measured by differential scanning calorimetry (DSC analysis), a choline salt hydrate crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having main peaks at about 2\u03b8 (\xb0) of 5.66, 17.08, 17.66, 19.02, 19.58, and 22.14 measured by X-ray powder diffraction, and a choline salt hydrate crystal of (1S)-1,5-anhydro-1-5-(azulen-2-ylmethyl)-2-hydroxyphenyl-D-glucitol having a broad endothermic peak at about 78\xb0 C. and an endothermic peak at 195 to 199\xb0 C. measured by differential scanning calorimetry (DSC analysis) and main peaks at about 2\u03b8 (\xb0) of 5.66, 17.08, 17.66, 19.02, 19.58, and 22.14 measured by X-ray powder diffraction as an effective ingredient.
12. The pharmaceutical composition according to claim 11, further comprising a pharmaceutically acceptable excipient.
13. The pharmaceutical composition according to claim 11, which is a diabetes treating agent.
14. The pharmaceutical composition according to claim 12, which is a diabetes treating agent.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

We claim as our invention:

1. A semiconductor device, comprising:
(a) a silicon nitride film disposed along the surface of a dielectric material within a recess formed in the dielectric material; and,
(b) a refractory metal film overlaying the silicon nitride film.
2. The semiconductor device of claim 1 in which the silicon nitride film is formed from a process in which the dielectric material comprises silicon and is exposed to a nitrogen-containing material converting the chemical composition of at least a portion of the dielectric material adjacent to the recess to silicon nitride.
3. The semiconductor device of claim 2 in which the dielectric material is exposed to the nitrogen source at a predetermined temperature and pressure, for a timed duration.
4. The semiconductor device of claim 1 wherein said semiconductor device further includes an etch stop layer overlaying the dielectric material and said recess is formed in the etch stop layer and the dielectric material, and said sidewalls of the recess include a surface of the etch stop layer, and said silicon nitride film is disposed along the surface of the dielectric material within the recess, but not along the surface of the etch stop layer within the recess.
5. The semiconductor device of claim 1 wherein said recess sidewalls include a plurality of surfaces of dielectric material spaced apart within the recess and the silicon nitride film is disposed along each said surface of the dielectric material.
6. The semiconductor device of claim 4 wherein said refractory metal film is conformally deposited within the recess, over the silicon nitride film and surfaces of the etch stop layer.
7. The semiconductor device of claim 1 wherein said recess is a trench formed in the dielectric material.
8. The semiconductor device of claim 1 wherein said feature includes a via and a trench formed in the dielectric material.
9. The semiconductor device of claim 1 wherein said recess includes a via formed in the dielectric material.
10. A semiconductor device, comprising:
(a) two metal layers separated by an insulating layer;
(b) a recess formed in the two metal layers and insulating layer, and exposing a surface of at least one dielectric material within the recess;
(c) a conductive metal deposited within, and filling said recess;
(d) a barrier layer formed in the recess between the dielectric material and the conductive metal, having a silicon nitride film disposed along the surface of the dielectric material and a refractory metal layer between the silicon nitride film and the conductive metal; and,
(e) said refractory metal layer interposed between the copper in the recess in one of the metal layers and the insulating layer.
11. The semiconductor device of claim 10 wherein said at least one dielectric material comprises a low-k dielectric material.
12. The semiconductor device of claim 10 further comprising two etch stop layers, and each etch stop layer is interposed between the insulating layer and a respective metal layer, and said recess having a plurality of surfaces of the dielectric material therein spaced apart by a surface of the etch stop layer, and said silicon nitride film is disposed along the surface of the dielectric material, but not along etch stop layer surface.
13. The semiconductor of claim 10 wherein in said recess comprises a trench formed in each of the two metal layers, and a via formed in the insulating layer interconnecting the trenches of the metal layers.
14. A process for the fabrication of a semiconductor device, comprising the steps of:
(a) forming a silicon nitride film within a recess formed within a dielectric material; and,
(b) forming a refractory metal film over the silicon nitride films within the recess formed in the dielectric material.
15. The process of claim 14 wherein said step of forming the silicon nitride film comprises converting the chemical composition of at least a portion of the dielectric material adjacent to the recess to silicon nitride by exposing the surface of the dielectric material to a nitrogen-containing material.
16. The process of claim 15 wherein the dielectric material is exposed to the nitrogen-containing material at a predetermined temperature and pressure, for a timed duration.
17. The process of claim 14 wherein said step of converting the chemical composition of the dielectric material comprises providing a deposition chamber in which the semiconductor device is fixed, generating a plasma within the reaction chamber adjacent to the semiconductor device and injecting nitrogen into the reaction chamber and plasma.
18. The process of claim 15 wherein the step of converting the chemical composition of the dielectric material further comprises elevating a temperature within the reaction chamber within the range of about 250 C. to about 270, maintaining the pressure within the chamber within the range of about 400 mtorr to about 1000 mtorr, and maintaining said temperature and pressure for about 120 seconds.
19. The process of claim 14 further comprising the step of forming at least one etch stop layer on the semiconductor adjacent the dielectric layer and said step of forming the recess includes forming the recess in said etch stop layer and dielectric layer whereby the sidewall of the recess includes a surface of the etch stop layer and the surface of the dielectric material.
20. The process of claim 19 wherein the step of forming a silicon nitride film comprises forming said silicon nitride film along the surface of the dielectric material within the recess, and not along the surface of the etch stop layer within the recess.
21. The process of claim 21 wherein the step of forming the refractory metal film includes depositing the refractory metal film over the silicon nitride film and the surface of the etch stop layer.