Author: claimsbot

1. A microactuated head suspension assembly for a hard disk drive system comprising:
a baseplate;
a rotatable load; and
a single planar piezo actuator coupled between the baseplate and load, configured to expand, responsive to voltage excitation in a direction normal to the actuator plane, with greater magnitude in a first direction parallel to the plane, than in a second direction parallel to the plane and normal to the first direction, thereby causing rotation of the rotatable load with respect to the baseplate upon application of the voltage.
2. The assembly of claim 1 wherein the actuator comprises a triangular shape.
3. The assembly of claim 2 wherein the triangular actuator comprises a perimeter having a hypotenuse and two substantially perpendicular legs, and wherein the first and second directions coincide with the directions of the legs.
4. The assembly of claim 1 further comprising a load beam coupled between the baseplate and load, wherein the piezo actuator is coupled between the baseplate and the load beam.
5. The assembly of claim 1 further comprising:
a trace for carrying signals to the head; and
a lead connection for applying voltage to the piezo actuator;
wherein the trace and the lead connection lie in a common plane.
6. The assembly of claim 5 wherein one side of the piezo actuator is bonded to a bottom surface of the baseplate, and wherein the common plane coincides with a bottom surface of the load beam.
7. The assembly of claim 1 further comprising a flexure coupled between the baseplate and load, wherein the piezo actuator is coupled between the baseplate and the flexure.
8. The assembly of claim 1 further comprising:
a load beam coupled to the baseplate, the load beam having a spring area, wherein the piezo actuator is coupled to the load beam between the spring area and the baseplate.
9. The assembly of claim 1 wherein the piezo actuator is coupled by gluing.
10. In a head suspension assembly for a hard disk drive system including a baseplate coupled to one end of a load beam, a flexure coupled to an opposite end of the load beam, and a slider coupled to a distal end of the flexure, a hingeless microactuating system comprising:
a single, planar piezo actuator having a lead connection surface and a grounding surface opposite the lead connection surface, wherein the actuator is grounded to the assembly such that the actuator surface closest to the slider is the lead connection surface.
11. The system of claim 10 wherein the baseplate comprises a stator and a rotor and the actuator is mounted between the stator and the rotor.
12. The system of claim 10 wherein the piezo actuator is configured to expand, responsive to voltage excitation in a direction normal to the actuator plane, with greater magnitude in a first direction parallel to the plane, than in a second direction parallel to the plane and normal to the first direction, thereby causing rotation of the slider with respect to the load beam upon application of the voltage.
13. The system of claim 10 wherein the grounding surface is grounded to the assembly by conductive epoxy.
14. The system of claim 10 wherein electrical leads are connected to the lead connection surface by TAB bonding.
15. The system of claim 10 wherein the grounding surface is grounded to a raised portion of the load beam.
16. The system of claim 15 wherein the raised portion comprises one or more single wing configurations.
17. The system of claim 15 wherein the raised portion comprises one or more double sided wing configurations.
18. The system of claim 15 wherein the lead connection surface and an unraised portion of the load beam lie in a common plane.
19. The system of claim 15 wherein the lead connection surface and an unraised portion of the load beam lie in different planes.
20. The system of claim 12 wherein the piezo actuator comprises a triangular shape.
21. The system of claim 20 wherein the triangular piezo actuator comprises a perimeter having a hypotenuse and two substantially perpendicular legs, and wherein the first and second directions coincide with the directions of the legs.
22. The system of claim 21 further comprising:
a trace for carrying signals to the head; and
a lead connection for applying voltage to the piezo actuator;
wherein the trace and the lead connection lie in a common plane.
23. The system of claim 22 wherein one side of the piezo actuator is bonded to a bottom surface of the baseplate, and wherein the common plane coincides with a bottom surface of the load beam.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1.-8. (canceled)
9. A compound of Formulae (V)-(XIV):
wherein n is 1 or 2;
m is 1, 2, 3 or 4;
R1 is selected from the group consisting of hydrogen, methyl, isopropyl, isobutyl, sec-butyl, \u2014CH2OH, \u2014CH(OH)CH3, \u2014CH2CO2H, \u2014CH2CH2CO2H, \u2014CH2CONH2, \u2014CH2CH2CONH2, \u2014CH2CH2SCH3, CH2SH, \u2014CH2(CH2)3NH2 or \u2014CH2CH2CH2NHC(NH)NH2, phenyl, benzyl, 4-hydroxybenzyl, 2-imidazolyl and 2-indolyl;
R is selected from the group consisting of hydrogen, C1-6 alkyl, phenyl, benzyl, \u2014C(CH3)\u2550CH2 or \u2014CH2C(O)N(CH3)2;
either R4 is hydrogen and R5 is selected from the group consisting of methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, cyclopentyl, cyclohexyl, phenyl, benzyl, phenethyl or 3-pyridyl; or R4 is methyl and R5 is selected from the group consisting of methyl, methoxycarbonyl, ethoxycarbonyl, propoxycarbonyl, isopropoxycarbonyl, butoxycarbonyl, isobutoxycarbonyl, sec-butoxycarbonyl, tert-butoxycarbonyl and cyclohexyloxycarbonyl;
R7 is hydrogen;
R8 is substituted aryl; and
pharmaceutically acceptable salts thereof.
10. The compound of claim 9, wherein the compounds of Formula V and Formula VI are each L-amino acids or L-amino acid derivatives.
11. The compound of claim 10, wherein R8 is para-chloro-substituted phenyl.
12. (canceled)
13. (canceled)
14. A pharmaceutical composition comprising a pharmaceutically acceptable carrier and an effective amount of a compound or mixture of compounds according to claim 9.
15.-19. (canceled)

1. A system for analyzing hearing-related function in humans comprising:
a host processor having first and second personal computer memory card international association (PCMCIA) defined ports, said host processor including a memory system to store hearing aid programming instructions and hearing analysis instructions;
a first PCMCIA Card coupled to said first PCMCIA defined port, said first PCMCIA Card including first circuits interacting with said host processor to download said hearing aid programming instructions, and further including a first processor system coupled to said first circuits to execute said hearing aid programming instructions;
a second PCMCIA Card coupled to said second PCMCIA defined port, said second PCMCIA Card including second circuits interactive with said host processor to download said hearing-related analyzing instructions, and further including a second processor system coupled to said second circuits to execute said hearing-related analyzing instructions.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method comprising:
forming a plurality of photodiodes on a semiconductor substrate;
forming a color filter layer over the semiconductor substrate such that respective color filters of the color filter layer correspond to locations of respective photodiodes;
forming an overcoat layer over the color filter layer;
selectively removing portions of the overcoat layer to a prescribed thickness from a surface of the color filter layer to correspond to locations of the respective photodiodes to form trenches having a substantially rounded shape over corresponding photodiodes; and
forming microlenses, each having a convex lens shape, inside each of the trenches
wherein the forming microlenses comprises coating a resist on a surface of the trenches, selectively patterning the resist to form microlens patterns, and performing reflow on the microlens patterns at a prescribed temperature,
wherein the microlens patterns are formed only in the trench.
2. The method of claim 1, further comprising forming an interlayer insulating layer over the semiconductor substrate, and forming the color filter layer over the interlayer insulating layer.
3. The method of claim 2, wherein the interlayer insulating layer comprises at least one of a phosphosilicate glass layer, a borosilicate glass layer, and a borophosphosilicate glass layer.
4. The method of claim 1, wherein the overcoat layer comprises a transparent insulating layer.
5. The method of claim 4, wherein the overcoat layer comprises a low temperature oxide layer.
6. The method of claim 5, wherein the low temperature oxide layer is formed at a temperature of 300\xb0 C. or below.
7. The method of claim 5, further comprising decomposing a photo active compound remaining within the microlens patterns by performing a flood exposure to the microlens patterns.
8. The method of claim 4, wherein the overcoat layer is formed to have a thickness of 1000-6000 \u212b.
9. The method of claim 1, wherein the overcoat layer is removed using isotropic etching.
10. The method of claim 9, wherein the isotropic etching is wet etching.
11. The method of claim 1, wherein the prescribed temperature for the reflow on the microlens patterns is in a range of 150-300\xb0 C.
12. The method of claim 1, wherein the microlenses are substantially oblongly spherically shaped.
13. The method of claim 1, further comprising illuminating an ultraviolet light onto the microlenses.